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TWI650631B - Electronic device associated with the structure of the base portion of the computing device - Google Patents

Electronic device associated with the structure of the base portion of the computing device Download PDF

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Publication number
TWI650631B
TWI650631B TW103134082A TW103134082A TWI650631B TW I650631 B TWI650631 B TW I650631B TW 103134082 A TW103134082 A TW 103134082A TW 103134082 A TW103134082 A TW 103134082A TW I650631 B TWI650631 B TW I650631B
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TW
Taiwan
Prior art keywords
frame
channel
assembly
plane
base frame
Prior art date
Application number
TW103134082A
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Chinese (zh)
Other versions
TW201518911A (en
Inventor
米雪兒 于
吉勳 李
傑弗瑞 哈雅許達
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谷歌有限責任公司
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Filing date
Publication date
Priority claimed from US14/041,496 external-priority patent/US9069523B2/en
Priority claimed from US14/041,466 external-priority patent/US8811003B1/en
Priority claimed from US14/041,453 external-priority patent/US8821678B1/en
Priority claimed from US14/041,629 external-priority patent/US8861191B1/en
Application filed by 谷歌有限責任公司 filed Critical 谷歌有限責任公司
Publication of TW201518911A publication Critical patent/TW201518911A/en
Application granted granted Critical
Publication of TWI650631B publication Critical patent/TWI650631B/en

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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1662Details related to the integrated keyboard
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1601Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1615Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1616Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637Details related to the display arrangement, including those related to the mounting of the display in the housing
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G06F1/1658Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Casings For Electric Apparatus (AREA)
  • Circuit For Audible Band Transducer (AREA)
  • Liquid Crystal (AREA)

Abstract

在一個一般態樣中,一設備可包含一顯示器部分、耦合至該顯示器部分之一基座框架,其中該基座框架包含由與一底壁相對之一頂壁及耦合至該頂壁及該底壁之一側壁界定之一通道。該側壁可具有界定該基座框架之一外周長之至少一部分之一外表面。該通道可具有該基座框架之一第一側上之一第一部分及與該基座框架之該第一側相對之該基座框架之一第二側上之一第二部分。該設備可包含一中平面,其具有安置在該通道之該第一部分中之一第一邊緣及安置在該通道之該第二部分中之一第二邊緣。 In a general aspect, a device may include a display portion, a base frame coupled to the display portion, wherein the base frame includes a top wall opposite to a bottom wall, and coupled to the top wall and the A side wall of the bottom wall defines a channel. The side wall may have an outer surface defining at least a portion of an outer perimeter of the base frame. The channel may have a first portion on a first side of the base frame and a second portion on a second side of the base frame opposite the first side of the base frame. The device may include a midplane having a first edge disposed in the first portion of the channel and a second edge disposed in the second portion of the channel.

Description

與計算裝置之基座部分之結構相關之電子設備 Electronic equipment related to structure of base part of computing device 相關申請案Related applications

本申請案主張美國申請案第14/041,629號、美國申請案第14/041,453號、美國申請案第14/041,466號及美國申請案第14/041,496號之優先權及權利,所有該等申請案申請於2013年9月30日且全部內容以引用之方式併入本文。 This application claims priority and rights to U.S. Application No. 14 / 041,629, U.S. Application No. 14 / 041,453, U.S. Application No. 14 / 041,466, and U.S. Application No. 14 / 041,496, all such applications The application was on September 30, 2013 and the entire contents are incorporated herein by reference.

本發明大體上係關於計算裝置。特定言之,本發明係關於一種計算裝置之基座部分之結構。 The invention relates generally to computing devices. In particular, the present invention relates to the structure of a base portion of a computing device.

一般而言,使用者偏愛相對較輕且精緻的計算裝置。計算裝置組件(例如,硬碟、電路、電池等等)之微型化可促成減小一計算裝置之重量且可容許設計更薄、容許使用重量輕的材料之外殼更加微薄。然而,減小外殼的大小且對外殼使用重量輕的材料可導致非所要地降低所得計算裝置之結構完整性。因此,需要解決本技術之缺陷並提供其他新的且創新的特徵之系統、方法及設備。 Generally speaking, users prefer relatively light and sophisticated computing devices. Miniaturization of computing device components (eg, hard disks, circuits, batteries, etc.) can contribute to reducing the weight of a computing device and can allow for thinner designs and thinner housings that allow the use of lightweight materials. However, reducing the size of the housing and using lightweight materials for the housing can lead to an undesired reduction in the structural integrity of the resulting computing device. Therefore, there is a need for systems, methods, and devices that address the shortcomings of this technology and provide other new and innovative features.

在一個一般態樣中,一種設備可包含一顯示器部分、耦合至該顯示器部分之一基座框架,其中該基座框架包含由與一底壁相對之一頂壁及耦合至該頂壁及該底壁之一側壁界定之一通道。該側壁可具有 界定該基座框架之一外周長之至少一部分之一外表面。該通道可具有該基座框架之一第一側上之一第一部分及與該基座框架之該第一側相對之該基座框架之一第二側上之一第二部分。該設備可包含一中平面,該中平面具有安置在該通道之該第一部分中之一第一邊緣且具有安置在該通道之該第二部分中之一第二邊緣。 In a general aspect, a device may include a display portion, a base frame coupled to the display portion, wherein the base frame includes a top wall opposite to a bottom wall, and coupled to the top wall and the A side wall of the bottom wall defines a channel. The side wall may have An outer surface defining at least a portion of an outer perimeter of the base frame. The channel may have a first portion on a first side of the base frame and a second portion on a second side of the base frame opposite the first side of the base frame. The device may include a midplane having a first edge disposed in the first portion of the channel and a second edge disposed in the second portion of the channel.

在另一個一般態樣中,一種設備可包含一構架組件;耦合至該構架組件之一顯示器部分;及一基座框架,其包含由與一底壁相對之一頂壁及耦合至該頂壁及該底壁之一側壁界定之一通道。該側壁可具有界定該基座框架之一外周長之至少一部分之一外表面。該通道可在該基座框架之一第一側上界定一第一凹陷區域且在該基座框架之一第二側上界定一第二凹陷區域。該第二側可沿一縱軸對準,該縱軸實質上正交於該第一側沿著對準之一縱軸。該構架組件可具有安置在該第一凹陷區域中之至少一部分。 In another general aspect, a device may include a frame assembly; a display portion coupled to the frame assembly; and a base frame including a top wall opposite to a bottom wall and coupled to the top wall And a side wall of the bottom wall defines a channel. The side wall may have an outer surface defining at least a portion of an outer perimeter of the base frame. The channel may define a first recessed area on a first side of the base frame and a second recessed area on a second side of the base frame. The second side may be aligned along a longitudinal axis, the longitudinal axis being substantially orthogonal to the longitudinal axis aligned along the first side. The framework assembly may have at least a portion disposed in the first recessed area.

在又一個一般態樣中,一種方法可包含在一計算裝置之一基座框架內之一第一通道中移動一中平面之一第一邊緣。在插入該第一邊緣期間,該中平面可沿不平行於一第二平面之一第一平面對準,該基座框架沿著該第二平面對準。該方法可包含在插入該第一邊緣之後,使該中平面相對於該基座框架旋轉;及在該計算裝置之該基座框架內之一第二通道中移動該中平面之一第二邊緣。該方法亦可包含在包含於該中平面中之一凹陷中移動一構架組件。 In yet another general aspect, a method may include moving a first edge of a midplane in a first channel within a base frame of a computing device. During the insertion of the first edge, the mid-plane can be aligned along a first plane that is not parallel to a second plane, and the base frame is aligned along the second plane. The method may include rotating the midplane relative to the base frame after inserting the first edge; and moving a second edge of the midplane in a second channel in the base frame of the computing device. . The method may also include moving a frame component in a depression contained in the mid-plane.

下文的隨附圖式及描述中陳述一或多個實施方案之細節。將自該描述及圖式以及申請專利範圍明白其他特徵。 Details of one or more embodiments are set forth in the accompanying drawings and description below. Other features will be apparent from the description and drawings and the scope of the patent application.

10‧‧‧計算裝置 10‧‧‧ Computing Device

12‧‧‧基座總成 12‧‧‧ base assembly

14‧‧‧顯示器部分 14‧‧‧Display section

16‧‧‧顯示器螢幕 16‧‧‧ Display screen

18‧‧‧鉸鏈 18‧‧‧ hinge

24‧‧‧第一外殼 24‧‧‧First case

26‧‧‧第二外殼 26‧‧‧Second shell

28‧‧‧上表面 28‧‧‧ top surface

30‧‧‧鍵盤開口 30‧‧‧Keyboard opening

32‧‧‧凹陷 32‧‧‧ Depression

34‧‧‧接達開口 34‧‧‧Access opening

35‧‧‧下表面 35‧‧‧ lower surface

36‧‧‧壁 36‧‧‧ wall

39‧‧‧收納單元 39‧‧‧Storage unit

42‧‧‧外部外殼 42‧‧‧outer shell

44‧‧‧顯示器邊框 44‧‧‧Monitor frame

45‧‧‧表面 45‧‧‧ surface

46‧‧‧緊固件 46‧‧‧ Fasteners

50‧‧‧鍵盤支撐部件 50‧‧‧Keyboard support parts

52‧‧‧支撐部件邊框 52‧‧‧ support frame

54‧‧‧格子結構 54‧‧‧ Lattice structure

56‧‧‧開口 56‧‧‧ opening

62‧‧‧區域 62‧‧‧area

66‧‧‧軌跡板總成 66‧‧‧Trackpad Assembly

70‧‧‧鍵盤總成 70‧‧‧ keyboard assembly

72‧‧‧基板 72‧‧‧ substrate

74‧‧‧下表面 74‧‧‧ lower surface

76‧‧‧上表面 76‧‧‧ Top surface

80‧‧‧鍵 80‧‧‧ key

82‧‧‧第一材料層 82‧‧‧first material layer

84‧‧‧第二材料層 84‧‧‧Second material layer

100‧‧‧計算裝置 100‧‧‧ Computing Device

102‧‧‧開口/區域 102‧‧‧opening / area

110‧‧‧顯示器部分 110‧‧‧Display section

120‧‧‧基座部分 120‧‧‧ base section

130‧‧‧基座框架 130‧‧‧ base frame

132‧‧‧外表面 132‧‧‧ outer surface

134‧‧‧近端部分 134‧‧‧proximal part

135‧‧‧第一側部分 135‧‧‧first side

136‧‧‧第一遠端部分 136‧‧‧First distal part

137‧‧‧第二遠端部分 137‧‧‧Second distal part

138‧‧‧第二側部分 138‧‧‧Second part

140‧‧‧構架組件 140‧‧‧Framework components

150‧‧‧中平面 150‧‧‧Medium Plane

151‧‧‧邊緣 151‧‧‧Edge

160‧‧‧通道 160‧‧‧channel

161‧‧‧頂壁 161‧‧‧Top wall

162‧‧‧側壁 162‧‧‧ sidewall

163‧‧‧底壁 163‧‧‧ bottom wall

164‧‧‧凹陷區域 164‧‧‧ sunken area

165‧‧‧通道之部分 165‧‧‧part of the channel

230‧‧‧基座框架 230‧‧‧ base frame

234‧‧‧近端部分 234‧‧‧proximal part

235‧‧‧第一側部分 235‧‧‧first side

236‧‧‧第一遠端部分 236‧‧‧First distal part

237‧‧‧第二遠端部分 237‧‧‧Second distal part

238‧‧‧第二側部分 238‧‧‧Second part

250‧‧‧中平面 250‧‧‧ Midplane

251‧‧‧邊緣 251‧‧‧Edge

252‧‧‧邊緣 252‧‧‧Edge

260‧‧‧通道 260‧‧‧channel

261‧‧‧頂壁 261‧‧‧Top wall

262‧‧‧側壁 262‧‧‧ sidewall

263‧‧‧底壁 263‧‧‧ bottom wall

266‧‧‧開口 266‧‧‧ opening

267‧‧‧掌托區域 267‧‧‧ palm rest area

268‧‧‧內緣 268‧‧‧Inner edge

269‧‧‧內緣 269‧‧‧Inner edge

278‧‧‧內表面 278‧‧‧Inner surface

279‧‧‧內表面 279‧‧‧Inner surface

288‧‧‧外表面 288‧‧‧outer surface

289‧‧‧外表面 289‧‧‧outer surface

400‧‧‧方塊 400‧‧‧box

410‧‧‧方塊 410‧‧‧block

420‧‧‧方塊 420‧‧‧box

530‧‧‧基座框架 530‧‧‧ base frame

535‧‧‧第一延伸部 535‧‧‧First extension

538‧‧‧第二延伸部 538‧‧‧second extension

550‧‧‧中平面 550‧‧‧Medium Plane

551‧‧‧第一部分 551‧‧‧Part I

552‧‧‧第二部分 552‧‧‧Part II

554‧‧‧邊緣 554‧‧‧Edge

556‧‧‧邊緣 556‧‧‧Edge

558‧‧‧突部 558‧‧‧ protrusion

560‧‧‧通道 560‧‧‧channel

562‧‧‧側壁 562‧‧‧ sidewall

600‧‧‧方塊 600‧‧‧box

610‧‧‧方塊 610‧‧‧block

620‧‧‧方塊 620‧‧‧block

730‧‧‧基座框架 730‧‧‧ base frame

750‧‧‧中平面 750‧‧‧Medium plane

760‧‧‧通道 760‧‧‧channel

781‧‧‧熱結合膜部分 781‧‧‧Heat Bonding Film

782‧‧‧熱結合膜部分 782‧‧‧Heat Bonding Film

783‧‧‧熱結合膜部分 783‧‧‧Heat Bonding Film

810‧‧‧方塊 810‧‧‧box

820‧‧‧方塊 820‧‧‧block

930‧‧‧基座框架 930‧‧‧base frame

934‧‧‧近端部分 934‧‧‧proximal part

935‧‧‧第一側部分 935‧‧‧first side

936‧‧‧第一遠端部分 936‧‧‧First distal part

937‧‧‧第二遠端部分 937‧‧‧Second distal part

938‧‧‧第二側部分 938‧‧‧Second part

950‧‧‧中平面 950‧‧‧Medium Plane

951‧‧‧凹陷 951‧‧‧Sag

952‧‧‧凹陷 952‧‧‧ sunken

960‧‧‧通道 960‧‧‧channel

961‧‧‧頂壁 961‧‧‧ top wall

962‧‧‧側壁 962‧‧‧ side wall

970‧‧‧構架組件 970‧‧‧Framework components

971‧‧‧第一端部 971‧‧‧first end

972‧‧‧第二端部 972‧‧‧ second end

974‧‧‧突部 974‧‧‧ protrusion

975‧‧‧突部 975‧‧‧ protrusion

1030‧‧‧基座框架 1030‧‧‧ base frame

1036‧‧‧第一遠端部分 1036‧‧‧First distal part

1037‧‧‧第二遠端部分 1037‧‧‧Second distal part

1038‧‧‧間隙 1038‧‧‧Gap

1050‧‧‧中平面 1050‧‧‧Medium Plane

1051‧‧‧凹陷 1051‧‧‧Dent

1052‧‧‧凹陷 1052‧‧‧Dent

1070‧‧‧構架組件 1070‧‧‧Framework components

1071‧‧‧突部 1071‧‧‧ protrusion

1090‧‧‧顯示器部分 1090‧‧‧Display section

1092‧‧‧鉸鏈 1092‧‧‧ hinge

1110‧‧‧方塊 1110‧‧‧box

1120‧‧‧方塊 1120‧‧‧box

1130‧‧‧方塊 1130‧‧‧box

1140‧‧‧方塊 1140‧‧‧box

1202‧‧‧開口 1202‧‧‧ opening

1230‧‧‧基座框架 1230‧‧‧ base frame

1250‧‧‧中平面 1250‧‧‧Medium Plane

1260‧‧‧通道 1260‧‧‧channel

1270‧‧‧構架組件 1270‧‧‧Frame components

1290‧‧‧板 1290‧‧‧board

1310‧‧‧導電元件 1310‧‧‧ conductive element

1315‧‧‧腳墊 1315‧‧‧Foot pads

1350‧‧‧中平面 1350‧‧‧Medium Plane

1352‧‧‧突部 1352‧‧‧ protrusion

1370‧‧‧構架組件 1370‧‧‧Frame components

1390‧‧‧底板 1390‧‧‧ floor

1401‧‧‧開口 1401‧‧‧ opening

1430‧‧‧基座框架 1430‧‧‧Base Frame

1431‧‧‧彎曲角隅 1431‧‧‧Curved Horned Owl

1432‧‧‧外表面 1432‧‧‧outer surface

1434‧‧‧近端部分 1434‧‧‧proximal part

1436‧‧‧第一遠端部分 1436‧‧‧First distal part

1437‧‧‧第二遠端部分 1437‧‧‧Second distal part

1438‧‧‧第一延伸部部分 1438‧‧‧First extension

1439‧‧‧第二延伸部部分 1439‧‧‧second extension

1460‧‧‧通道 1460‧‧‧channel

1461‧‧‧頂壁 1461‧‧‧Top Wall

1462‧‧‧側壁 1462‧‧‧Sidewall

1463‧‧‧底壁 1463‧‧‧ bottom wall

1464‧‧‧內表面 1464‧‧‧Inner surface

1466‧‧‧開口/支撐部件 1466‧‧‧Opening / Supporting Parts

1467‧‧‧掌托區域 1467‧‧‧ palm rest area

1492‧‧‧開口 1492‧‧‧ opening

1550‧‧‧中平面 1550‧‧‧Medium Plane

1551‧‧‧凹陷 1551‧‧‧Dent

1552‧‧‧凹陷 1552‧‧‧Dent

1553‧‧‧凹陷 1553‧‧‧Dent

1554‧‧‧凹陷 1554‧‧‧Dent

1555‧‧‧凹陷 1555‧‧‧Dent

1556‧‧‧中平面之部分 1556‧‧‧Part of the mid-plane

1558‧‧‧中平面延伸部 1558‧‧‧Medium plane extension

1559‧‧‧開口 1559‧‧‧ opening

1582‧‧‧開口 1582‧‧‧ opening

1762A‧‧‧開口 1762A‧‧‧Opening

1762B‧‧‧開口 1762B‧‧‧Opening

1780‧‧‧蓋 1780‧‧‧cover

1781‧‧‧突部 1781‧‧‧ protrusion

1789‧‧‧遠端表面 1789‧‧‧Distal surface

1790‧‧‧構架組件 1790‧‧‧Frame components

1791‧‧‧突部 1791‧‧‧ protrusion

1792‧‧‧突部 1792‧‧‧ protrusion

1793‧‧‧突部 1793‧‧‧ protrusion

1794‧‧‧突部 1794‧‧‧ protrusion

1795‧‧‧突部/板 1795‧‧‧ protrusion / board

1796‧‧‧開口 1796‧‧‧ opening

1797‧‧‧間隙/開口 1797‧‧‧Gap / Opening

1798‧‧‧部分 1798‧‧‧part

1799‧‧‧部分 1799‧‧‧part

1800‧‧‧電腦顯示器 1800‧‧‧ computer monitor

1805‧‧‧顯示器殼體 1805‧‧‧display housing

1810‧‧‧顯示器殼體切口 1810‧‧‧Monitor housing cutout

1815‧‧‧邊框框架 1815‧‧‧border frame

1815-1‧‧‧第一部分 1815-1‧‧‧Part I

1815-2‧‧‧第二部分 1815-2‧‧‧ Part Two

1815-3‧‧‧第三部分 1815-3‧‧‧ Part III

1820‧‧‧邊框 1820‧‧‧border

1825‧‧‧腔/間隙 1825‧‧‧cavity / gap

1900‧‧‧電腦顯示器 1900‧‧‧Computer monitor

1905‧‧‧相機 1905‧‧‧Camera

1910‧‧‧麥克風 1910‧‧‧Microphone

1915-1‧‧‧鉸鏈 1915-1‧‧‧ hinge

1915-2‧‧‧鉸鏈 1915-2‧‧‧ hinge

1920‧‧‧第一導線束 1920‧‧‧ First wiring harness

1925‧‧‧連接器 1925‧‧‧ Connector

1930‧‧‧第二導線束 1930‧‧‧Second wiring harness

1935‧‧‧顯示器面板 1935‧‧‧Display Panel

2005‧‧‧邊框框架緊固件 2005‧‧‧Frame Frame Fastener

2010‧‧‧邊框導軌 2010‧‧‧Frame rail

2015‧‧‧顯示器面板框架 2015‧‧‧Monitor Panel Frame

2020‧‧‧顯示器面板緊固件 2020‧‧‧Display panel fastener

2105‧‧‧寬頻帶天線 2105‧‧‧Broadband Antenna

2110‧‧‧區域網路(LAN)天線 2110‧‧‧Local Area Network (LAN) Antenna

2115‧‧‧經路線安排之導線 2115‧‧‧ Routed route

2120‧‧‧邊框框架緊固件插孔 2120‧‧‧Frame frame fastener jack

2200‧‧‧電腦顯示器 2200‧‧‧Computer monitor

2205‧‧‧顯示器殼體 2205‧‧‧Monitor housing

2215‧‧‧邊框框架 2215‧‧‧border frame

2215-1‧‧‧第一部分 2215-1‧‧‧Part I

2215-2‧‧‧第二部分 2215-2‧‧‧ Part Two

2215-3‧‧‧第三部分 2215-3‧‧‧ Part III

2215-4‧‧‧第四部分 2215-4‧‧‧ Part IV

2215-5‧‧‧第五部分 2215-5‧‧‧ Part V

2215-6‧‧‧第六部分/邊框框架部分 2215-6‧‧‧Part VI / Border Frame

2220‧‧‧邊框 2220‧‧‧Border

2225‧‧‧腔 2225‧‧‧cavity

2230‧‧‧邊框框架緊固件插孔 2230‧‧‧Frame frame fastener jack

2235‧‧‧邊框框架緊固件 2235‧‧‧Frame frame fasteners

2240‧‧‧顯示器面板框架 2240‧‧‧display panel frame

2300‧‧‧電腦顯示器 2300‧‧‧Computer monitor

2305‧‧‧顯示器殼體 2305‧‧‧Monitor housing

2310‧‧‧顯示器殼體切口 2310‧‧‧Monitor housing cutout

2315‧‧‧邊框框架 2315‧‧‧border frame

2315-1‧‧‧第一部分 2315-1‧‧‧Part I

2315-2‧‧‧第二部分 2315-2‧‧‧ Part Two

2315-3‧‧‧第三部分 2315-3‧‧‧ Part III

2320‧‧‧邊框 2320‧‧‧Border

2325‧‧‧腔 2325‧‧‧cavity

2330‧‧‧插孔 2330‧‧‧jack

2335‧‧‧導軌 2335‧‧‧rail

2340‧‧‧突部 2340‧‧‧ protrusion

2345‧‧‧電纜 2345‧‧‧cable

2350‧‧‧黏著劑 2350‧‧‧Adhesive

2355‧‧‧顯示器面板框架 2355‧‧‧Monitor Panel Frame

2405‧‧‧顯示器殼體 2405‧‧‧Monitor housing

2410‧‧‧頂部殼體截面 2410‧‧‧Top case section

2415‧‧‧邊框框架 2415‧‧‧border frame

2415-1‧‧‧第一部分 2415-1‧‧‧Part I

2415-2‧‧‧第二部分 2415-2‧‧‧ Part Two

2415-3‧‧‧第三部分 2415-3‧‧‧ Part III

2415-4‧‧‧第四部分 2415-4‧‧‧ Part IV

2415-5‧‧‧第五部分 2415-5‧‧‧ Part Five

2420‧‧‧邊框 2420‧‧‧Border

2425-1‧‧‧腔 2425-1‧‧‧ cavity

2425-2‧‧‧腔 2425-2‧‧‧ cavity

2425-3‧‧‧腔 2425-3‧‧‧ cavity

2430-1‧‧‧撐桿 2430-1‧‧‧Pole

2430-2‧‧‧撐桿 2430-2‧‧‧Pole

2430-3‧‧‧撐桿 2430-3‧‧‧Pole

2435‧‧‧插孔 2435‧‧‧jack

2440‧‧‧突部 2440‧‧‧ protrusion

2445-1‧‧‧電纜 2445-1‧‧‧Cable

2445-2‧‧‧電纜 2445-2‧‧‧Cable

2450‧‧‧黏著劑 2450‧‧‧Adhesive

2455‧‧‧顯示器面板框架 2455‧‧‧Display panel frame

2500‧‧‧電腦顯示器 2500‧‧‧ computer monitor

2505‧‧‧顯示器殼體 2505‧‧‧Monitor housing

2515‧‧‧邊框框架 2515‧‧‧border frame

2515-1‧‧‧第一部分 2515-1‧‧‧Part I

2515-2‧‧‧第二部分 2515-2‧‧‧ Part Two

1520‧‧‧邊框 1520‧‧‧border

2525‧‧‧顯示器面板 2525‧‧‧Display Panel

2530‧‧‧顯示器面板框架 2530‧‧‧Display panel frame

2535‧‧‧天線 2535‧‧‧ Antenna

2600‧‧‧電腦顯示器 2600‧‧‧Computer monitor

2605‧‧‧顯示器殼體 2605‧‧‧Monitor housing

2610‧‧‧顯示器殼體切口 2610‧‧‧Monitor housing cutout

2615‧‧‧邊框框架 2615‧‧‧border frame

1615-1‧‧‧第一部分 1615-1‧‧‧Part I

1615-2‧‧‧第二部分 1615-2‧‧‧ Part Two

1615-3‧‧‧第三部分 1615-3‧‧‧ Part III

1615-4‧‧‧第四部分 1615-4‧‧‧ Part IV

1615-5‧‧‧第五部分 1615-5‧‧‧ Part V

2620‧‧‧邊框 2620‧‧‧Border

2625‧‧‧腔 2625‧‧‧cavity

2630‧‧‧相機模組 2630‧‧‧ Camera Module

2635‧‧‧相機鏡頭 2635‧‧‧Camera lens

2640‧‧‧顯示器面板框架 2640‧‧‧display panel frame

2645‧‧‧切口 2645‧‧‧ incision

2650‧‧‧固定結構 2650‧‧‧Fixed structure

2655‧‧‧腔 2655‧‧‧cavity

2705‧‧‧邊框 2705‧‧‧Border

2710‧‧‧鑲嵌切口 2710‧‧‧ inlay cut

2715‧‧‧凹穴 2715‧‧‧Dent

2720‧‧‧孔 2720‧‧‧hole

2800‧‧‧電腦顯示器 2800‧‧‧computer monitor

2805‧‧‧顯示器殼體 2805‧‧‧display housing

2810‧‧‧顯示器殼體切口 2810‧‧‧Monitor housing cutout

2815‧‧‧邊框框架 2815‧‧‧border frame

2815-1‧‧‧第一部分 2815-1‧‧‧Part I

2815-2‧‧‧第二部分 2815-2‧‧‧ Part Two

2815-3‧‧‧第三部分 2815-3‧‧‧ Part III

2820‧‧‧邊框 2820‧‧‧border

2825‧‧‧顯示器面板框架 2825‧‧‧Display panel frame

2830‧‧‧鑲嵌切口 2830‧‧‧ Mosaic cut

2835‧‧‧孔 2835‧‧‧hole

2840-1‧‧‧凹穴 2840-1‧‧‧Dent

2845‧‧‧麥克風模組 2845‧‧‧Microphone Module

2905‧‧‧孔 2905‧‧‧hole

2910‧‧‧第一輸入元件 2910‧‧‧First Input Element

2915‧‧‧第二元件 2915‧‧‧Second Element

3100‧‧‧熱壓機 3100‧‧‧Hot press

3110‧‧‧熱壓塊 3110‧‧‧Hot Briquette

3112‧‧‧熱壓塊 3112‧‧‧Hot Briquette

3120‧‧‧基板 3120‧‧‧ substrate

3130‧‧‧熱塑性黏著劑膜 3130‧‧‧thermoplastic adhesive film

3140‧‧‧基板 3140‧‧‧Substrate

3150‧‧‧加熱支撐塊 3150‧‧‧Heating Support Block

3221‧‧‧膝上型電腦 3221‧‧‧laptop

3222‧‧‧顯示器/頂部外殼 3222‧‧‧Display / Top Case

3223‧‧‧鍵盤/底部外殼 3223‧‧‧Keyboard / Bottom Case

3224‧‧‧鉸鏈總成 3224‧‧‧ hinge assembly

3310‧‧‧基座框架/蓋 3310‧‧‧Base frame / cover

3312‧‧‧鍵盤切口 3312‧‧‧Keyboard cutout

3314‧‧‧軌跡板切口/軌跡板區域 3314‧‧‧trackpad cutout / trackpad area

3315‧‧‧鄰接區域 3315‧‧‧adjacent area

3316‧‧‧凸緣 3316‧‧‧ flange

3318‧‧‧下切口 3318‧‧‧ incision

3320‧‧‧中平面板 3320‧‧‧Medium Plane Board

3400‧‧‧總成 3400‧‧‧Assembly

3410‧‧‧前側部分 3410‧‧‧Front section

3420‧‧‧後側部分 3420‧‧‧Rear side

3510‧‧‧區域 3510‧‧‧Area

3512‧‧‧垂直熱流路徑/垂直熱通道 3512‧‧‧Vertical Heat Flow Path / Vertical Heat Aisle

3520‧‧‧區域 3520‧‧‧area

3522‧‧‧橫向熱通道 3522‧‧‧transverse hot aisle

3530‧‧‧區域 3530‧‧‧Area

3532‧‧‧橫向熱通道 3532‧‧‧transverse hot aisle

3534‧‧‧路徑 3534‧‧‧path

3610‧‧‧步驟 3610‧‧‧step

3620‧‧‧步驟 3620‧‧‧step

3630‧‧‧步驟 3630‧‧‧step

3640‧‧‧步驟 3640‧‧‧step

3710‧‧‧步驟 3710‧‧‧step

3720‧‧‧步驟 3720‧‧‧step

3730‧‧‧步驟 3730‧‧‧step

3810‧‧‧步驟 3810‧‧‧step

3820‧‧‧步驟 3820‧‧‧step

3822‧‧‧步驟 3822‧‧‧step

3824‧‧‧步驟 3824‧‧‧step

3830‧‧‧步驟 3830‧‧‧step

3840‧‧‧步驟 3840‧‧‧step

3850‧‧‧步驟 3850‧‧‧step

4502‧‧‧步驟 4502‧‧‧step

4504‧‧‧步驟 4504‧‧‧step

4506‧‧‧步驟 4506‧‧‧step

4506-1‧‧‧步驟 4506-1‧‧‧step

4506-2‧‧‧步驟 4506-2‧‧‧step

A1‧‧‧長度 A1‧‧‧ length

A2‧‧‧長度 A2‧‧‧length

A3‧‧‧長度 A3‧‧‧ length

A4‧‧‧長度 A4‧‧‧ length

A5‧‧‧線 A5‧‧‧line

A6‧‧‧長度 A6‧‧‧ length

A7‧‧‧平面 A7‧‧‧plane

A9‧‧‧深度 A9‧‧‧ Depth

B1‧‧‧長度 B1‧‧‧ length

B2‧‧‧長度 B2‧‧‧ length

B3‧‧‧長度 B3‧‧‧ length

B4‧‧‧長度 B4‧‧‧ length

B5‧‧‧線 B5‧‧‧line

B6‧‧‧線 B6‧‧‧line

B7‧‧‧平面 B7‧‧‧plane

D1‧‧‧長度 D1‧‧‧ length

D2‧‧‧長度 D2‧‧‧ length

D3‧‧‧長度 D3‧‧‧ length

D4‧‧‧距離 D4‧‧‧distance

D6‧‧‧長度 D6‧‧‧ length

D8‧‧‧方向 D8‧‧‧ direction

D9‧‧‧方向 D9‧‧‧ direction

D10‧‧‧方向 D10‧‧‧ direction

D11‧‧‧方向 D11‧‧‧ direction

DA‧‧‧平面 DA‧‧‧plane

DB‧‧‧平面 DB‧‧‧plane

F1‧‧‧長度 F1‧‧‧ length

F2‧‧‧長度 F2‧‧‧ length

F3‧‧‧方向 F3‧‧‧ direction

F4‧‧‧方向 F4‧‧‧ direction

I1‧‧‧長度 I1‧‧‧ length

I2‧‧‧長度 I2‧‧‧ length

I3‧‧‧長度 I3‧‧‧ length

I6‧‧‧線 I6‧‧‧line

I7‧‧‧線 I7‧‧‧line

I8‧‧‧方向 I8‧‧‧ direction

I9‧‧‧線 I9‧‧‧line

J1‧‧‧方向 J1‧‧‧ direction

J2‧‧‧線 J2‧‧‧line

J3‧‧‧平面 J3‧‧‧plane

J4‧‧‧平面 J4‧‧‧plane

J8‧‧‧方向 J8‧‧‧ direction

J9‧‧‧方向 J9‧‧‧ direction

J10‧‧‧方向 J10‧‧‧ direction

K‧‧‧線 K‧‧‧ line

L1‧‧‧方向 L1‧‧‧ direction

L2‧‧‧方向 L2‧‧‧ direction

L3‧‧‧線 L3‧‧‧line

L4‧‧‧軸 L4‧‧‧axis

L5‧‧‧軸 L5‧‧‧axis

L6‧‧‧虛線 L6‧‧‧ dotted line

L7‧‧‧方向 L7‧‧‧ direction

L8‧‧‧方向 L8‧‧‧ direction

L9‧‧‧方向 L9‧‧‧ direction

S1305‧‧‧步驟 S1305‧‧‧step

S1310‧‧‧步驟 S1310‧‧‧step

S1315‧‧‧步驟 S1315‧‧‧step

S1320‧‧‧步驟 S1320‧‧‧step

S1325‧‧‧步驟 S1325‧‧‧step

圖1A係繪示一計算裝置之部分之一圖。 FIG. 1A is a diagram illustrating a portion of a computing device.

圖1B係繪示圖1A中所示之計算裝置之一側視圖之一圖。 FIG. 1B is a side view of a computing device shown in FIG. 1A. FIG.

圖1C係展示圖1A中所示之計算裝置之一部分的一截面之一圖。 FIG. 1C is a cross-sectional view showing a portion of the computing device shown in FIG. 1A.

圖2A至圖2D係繪示包含於一計算裝置之一基座部分中之組件之各個視圖之圖。 2A to 2D are diagrams showing various views of components included in a base portion of a computing device.

圖3A係繪示安置在圖2A至圖2D中所示之基座框架之至少一部分內之一中平面之一圖。 FIG. 3A is a view showing a middle plane disposed in at least a part of the base frame shown in FIGS. 2A to 2D.

圖3B係繪示圖3A中所示之中平面及基座框架之一截面圖之一圖。 FIG. 3B is a diagram showing a cross-sectional view of the middle plane and the base frame shown in FIG. 3A.

圖3C係繪示基座框架內部之中平面之至少一部分之插入的一截面圖之一圖。 FIG. 3C is a diagram showing a cross-sectional view of at least a portion of a plane in the interior of the base frame.

圖3D係繪示安置在基座框架內部之中平面之一圖。 FIG. 3D is a view showing a middle plane disposed inside the base frame.

圖4係繪示將一中平面耦合至一基座框架之一方法之一流程圖。 FIG. 4 is a flowchart illustrating a method for coupling a midplane to a base frame.

圖5A至圖5D係繪示包含一通道及一中平面之一基座框架之圖。 5A to 5D are diagrams showing a base frame including a channel and a midplane.

圖6係繪示將一中平面耦合至一基座框架之一方法之一流程圖。 FIG. 6 is a flowchart illustrating a method for coupling a midplane to a base frame.

圖7A係繪示耦合至一中平面之熱結合膜部分之一圖。 FIG. 7A is a diagram showing a portion of a thermal bonding film coupled to a midplane.

圖7B繪示圖7A中所示之具有安置在基座框架之一通道內之部分之中平面。 FIG. 7B illustrates the midplane shown in FIG. 7A with a portion disposed in a channel of the base frame.

圖8係繪示將一中平面熱結合至一基座框架之一方法之一圖。 FIG. 8 is a diagram illustrating a method for thermally bonding a midplane to a base frame.

圖9A係繪示具有安置在一基座框架之一通道內之至少一部分之一構架組件之一圖。 FIG. 9A is a diagram illustrating a frame assembly having at least a portion disposed in a channel of a base frame.

圖9B係繪示圖9A中所示之中平面之一截面圖之一圖。 FIG. 9B is a diagram showing a cross-sectional view of a middle plane shown in FIG. 9A.

圖9C係繪示圖9A中所示之構架組件之一截面圖之一圖。 FIG. 9C is a diagram illustrating a cross-sectional view of a frame assembly shown in FIG. 9A.

圖9D係繪示當突部安置在圖9A中所示之中平面之對應凹陷內時該構架組件之一圖。 FIG. 9D is a diagram of the frame assembly when the protrusions are disposed in the corresponding depressions in the middle plane shown in FIG. 9A.

圖9E係繪示圖9D之構架組件及中平面之一截面圖之一圖。 FIG. 9E is a diagram showing a cross-sectional view of the frame assembly and the mid-plane of FIG. 9D.

圖10A至圖10E繪示經由一構架組件耦合一計算裝置之一顯示器部分與一基座框架及中平面。 10A to 10E illustrate a display portion of a computing device coupled to a base frame and a midplane through a framework component.

圖11係繪示用於組裝一計算裝置之組件之一方法之一流程圖。 11 is a flowchart illustrating a method for assembling components of a computing device.

圖12係繪示根據一實施方案之一板之一圖。 FIG. 12 is a diagram showing a board according to an embodiment.

圖13係繪示耦合至一板之一中平面之一側截面圖之一圖。 13 is a diagram showing a side cross-sectional view coupled to a mid-plane of a board.

圖14A係繪示一計算裝置之一基座框架之一俯視透視圖之一圖。 14A is a top perspective view of a base frame of a computing device.

圖14B係繪示圖14A中所示之基座框架之一仰視透視圖之一圖。 14B is a bottom perspective view of one of the base frames shown in FIG. 14A.

圖15A係繪示一中平面之一透視俯視圖之一圖。 15A is a perspective view of a mid-plane and a top plan view.

圖15B繪示圖15A中所示之中平面之一部分之側截面圖。 FIG. 15B is a side cross-sectional view of a portion of the mid-plane shown in FIG. 15A.

圖16係繪示圖15A及圖15B中所示之中平面耦合至圖14A及圖14B中所示之基座框架之一圖。 FIG. 16 is a diagram illustrating a middle plane shown in FIGS. 15A and 15B coupled to the base frame shown in FIGS. 14A and 14B.

圖17A係繪示圖15A及圖15B中所示之中平面耦合至一構架組件之一圖。 FIG. 17A is a diagram illustrating a middle plane coupled to a frame assembly shown in FIGS. 15A and 15B.

圖17B係繪示圖17A中所示之構架組件及中平面之一部分之一截面圖之一圖。 FIG. 17B is a diagram illustrating a cross-sectional view of a frame assembly and a part of a midplane shown in FIG. 17A.

圖17C係繪示耦合至圖17A中所示之中平面及構架組件之一板之一透視圖之一圖。 FIG. 17C is a diagram showing a perspective view of a plate coupled to the midplane and frame assembly shown in FIG. 17A.

圖17D係繪示耦合至圖17C中所示之板之一蓋之一側之一透視圖之一圖。 FIG. 17D is a diagram showing a perspective view coupled to one side of a cover of the board shown in FIG. 17C.

圖17E係繪示圖17D中所示之蓋及板之一相對側之一透視圖之一圖。 FIG. 17E is a view showing a perspective view of an opposite side of a cover and a plate shown in FIG. 17D. FIG.

圖18繪示包含一邊框之一電腦顯示器之一截面之一方塊圖。 FIG. 18 is a block diagram of a cross section of a computer display including a frame.

圖19至圖21繪示一電腦顯示器在不同組裝階段之正視圖。 19 to 21 are front views of a computer monitor at different stages of assembly.

圖22繪示包含一邊框之一電腦顯示器之一截面之另一方塊圖。 FIG. 22 illustrates another block diagram of a cross section of a computer display including a frame.

圖23繪示包含一邊框之一電腦顯示器之一截面之又一方塊圖。 FIG. 23 is another block diagram of a cross section of a computer display including a frame.

圖24繪示包含一邊框之一電腦顯示器之一截面之又一方塊圖。 FIG. 24 shows another block diagram of a cross section of a computer display including a frame.

圖25繪示包含一邊框之一電腦顯示器之一截面之另一方塊圖。 FIG. 25 illustrates another block diagram of a cross section of a computer display including a frame.

圖26繪示包含一邊框之一電腦顯示器之一截面之又一方塊圖。 FIG. 26 shows another block diagram of a cross section of a computer display including a frame.

圖27繪示包含具有一麥克風之一邊框之一電腦顯示器之視圖。 FIG. 27 shows a view of a computer display including a frame with a microphone.

圖28繪示包含具有一麥克風之一邊框之一電腦顯示器之一截面之一方塊圖。 FIG. 28 is a block diagram of a cross section of a computer display including a frame with a microphone.

圖29繪示包含具有一麥克風之一邊框之一電腦顯示器之一截面之另一方塊圖。 FIG. 29 illustrates another block diagram of a cross section of a computer display including a frame with a microphone.

圖30繪示組裝一電腦顯示器之一方法。 FIG. 30 illustrates one method of assembling a computer monitor.

圖31A係使用一熱壓機將兩個基板熱結合在一起之一示意圖解。 FIG. 31A is a schematic illustration of thermally bonding two substrates together using a hot press.

圖31B係圖31A之用於將空間上變化的熱量施加於部分之一膠合總成之熱壓機之一例示性修改的示意圖解。 FIG. 31B is a schematic illustration of an exemplary modification of the heat press of FIG. 31A for applying spatially varying heat to a portion of a glue assembly.

圖32係一例示性膝上型電腦之一圖解。 FIG. 32 is an illustration of one exemplary laptop computer.

圖33A至圖33C係一膝上型電腦之一底部外殼之例示性部分的圖解,該等部分可藉由以一熱壓機施加空間上變化的熱量而熱結合在一起。 33A to 33C are diagrams illustrating exemplary portions of a bottom case of a laptop computer, and the portions may be thermally bonded together by applying a spatially varying heat by a heat press.

圖34A及圖34B係圖33A至圖33C之部分之一例示性總成的圖解。 34A and 34B are diagrams illustrating an exemplary assembly of a portion of FIGS. 33A to 33C.

圖35A至圖35C係圖34A及圖34B中繪示之總成之結合區域之不同機械及幾何特性的立體圖解。 FIG. 35A to FIG. 35C are three-dimensional illustrations of different mechanical and geometrical characteristics of the combined region of the assembly shown in FIGS. 34A and 34B.

圖36至圖38係用於熱結合一計算裝置外殼之部分之例示性方法的圖解。 36 to 38 are diagrams of an exemplary method for thermally bonding a portion of a computing device housing.

圖39繪示具有一敞開組態之一計算裝置。 FIG. 39 illustrates a computing device having an open configuration.

圖40繪示具有一封閉組態之計算裝置。 FIG. 40 illustrates a computing device having a closed configuration.

圖41繪示具有經組態以固持一鍵盤總成之一鍵盤支撐部件之計算裝置的一分解圖。 41 illustrates an exploded view of a computing device having a keyboard support member configured to hold a keyboard assembly.

圖42繪示鍵盤支撐部件之一較大視圖。 FIG. 42 illustrates a larger view of a keyboard supporting member.

圖43繪示計算裝置之一截面圖。 FIG. 43 is a cross-sectional view of a computing device.

圖44A繪示鍵盤支撐部件。 FIG. 44A illustrates a keyboard supporting member.

圖44B繪示圖44A之鍵盤支撐部件之一截面。 FIG. 44B illustrates a cross-section of a keyboard supporting member of FIG. 44A.

圖45繪示組裝計算裝置之一方法。 FIG. 45 illustrates a method of assembling a computing device.

圖1A係繪示根據一實施方案之一計算裝置100之部分之一圖。在此實施方案中,計算裝置100包含一顯示器部分110及一基座部分120。基座部分120包含一基座框架130及一中平面150。中平面150具有安置在基座部分120之至少一部分中之至少一部分。在此實施方案中,中平面150具有安置在由基座框架130界定之一通道160(或下切口)中之至少一部分。基座部分120亦包含耦合至基座框架130之一構架組件140。在一些實施方案中,構架組件140可具有安置在通道160之至少一部分內之至少一部分。例如結合圖1C描述與通道160相關之更多細節。 FIG. 1A is a diagram illustrating a portion of a computing device 100 according to an embodiment. In this embodiment, the computing device 100 includes a display portion 110 and a base portion 120. The base portion 120 includes a base frame 130 and a midplane 150. The midplane 150 has at least a portion disposed in at least a portion of the base portion 120. In this embodiment, the midplane 150 has at least a portion disposed in one of the channels 160 (or undercuts) defined by the base frame 130. The base portion 120 also includes a frame assembly 140 coupled to the base frame 130. In some embodiments, the framework assembly 140 may have at least a portion disposed within at least a portion of the channel 160. More details related to the channel 160 are described in connection with FIG. 1C, for example.

基座框架130具有界定計算裝置100之基座部分120之一外周長或輪廓之至少一部分之一外表面132。基座框架130可稱作一C殼體或一C殼體之一部分。在此實施方案中,計算裝置100係一膝上型計算裝置。顯示器部分110係用圖1A中之虛線加以繪示使得計算裝置100之其他組件可見。 The base frame 130 has an outer surface 132 that defines at least a portion of an outer perimeter or profile of the base portion 120 of the computing device 100. The base frame 130 may be referred to as a C case or a part of a C case. In this embodiment, the computing device 100 is a laptop computing device. The display portion 110 is shown with dashed lines in FIG. 1A to make other components of the computing device 100 visible.

圖1B中繪示計算裝置100之一側視圖,其繪示耦合至基座部分120(包含基座框架130)之顯示器部分110。計算裝置100經繪示處於一敞開組態。 FIG. 1B illustrates a side view of a computing device 100, which illustrates a display portion 110 coupled to a base portion 120 (including a base frame 130). The computing device 100 is shown in an open configuration.

基座框架130、構架組件140及中平面150可共同界定計算裝置100之基座部分120之基本結構。具體言之,基座框架130、構架組件140及中平面150可耦合在一起以作為提供剛性及/或結構完整性之計算裝置100之一結構。基座框架130、構架組件140及中平面150可為可與計算裝置100之其他組件(例如,鍵盤、電路板、顯示器部分110)耦合之結構或組件。例如,包含於基座框架130中之通道160可對計算裝置100提供剛性及/或結構完整性。特定言之,通道160在耦合至中平面150時可共同界定可與計算裝置100之組件(例如,電子組件)耦合之 一剛性結構。 The base frame 130, the frame assembly 140, and the midplane 150 may collectively define the basic structure of the base portion 120 of the computing device 100. Specifically, the base frame 130, the frame assembly 140, and the midplane 150 may be coupled together as a structure of the computing device 100 that provides rigidity and / or structural integrity. The base frame 130, the frame component 140, and the midplane 150 may be structures or components that can be coupled with other components of the computing device 100 (e.g., keyboard, circuit board, display portion 110). For example, the channels 160 included in the base frame 130 may provide rigidity and / or structural integrity to the computing device 100. In particular, the channels 160, when coupled to the midplane 150, may collectively define those that may be coupled with components (e.g., electronic components) of the computing device 100 A rigid structure.

計算裝置100之一近端側或背側係朝向圖1A之一頂部(朝向計算裝置100之顯示器部分110)。計算裝置100之一遠端側或前側係朝向圖1A之一底部(遠離計算裝置100之顯示器部分110)。可使用近端(或背側)及遠端(或前側)名稱來指代計算裝置100之部分。結合至少圖18至圖30描述與計算裝置100之顯示器部分及邊框相關之更多細節。 One of the proximal or back sides of the computing device 100 faces toward the top of one of FIG. 1A (toward the display portion 110 of the computing device 100). One of the distal or front sides of the computing device 100 faces a bottom of FIG. 1A (away from the display portion 110 of the computing device 100). Proximal (or dorsal) and distal (or anterior) names may be used to refer to portions of the computing device 100. More details related to the display portion and the bezel of the computing device 100 are described with reference to at least FIGS. 18 to 30.

如圖1A中所示,基座框架130具有一近端部分134、一第一遠端部分136及一第二遠端部分137。基座框架130亦具有一第一側部分135(安置在近端部分134與第一遠端部分136之間)及一第二側部分138(安置在近端部分134與第二遠端部分137之間)。在一些實施方案中,近端部分134、第一遠端部分136及第二遠端部分137可稱作一側部分。第一遠端部分136可沿一軸對準,該軸實質上正交於第一側部分135沿著對準之一軸。類似地,第二遠端部分137可沿一軸對準,該軸實質上正交於第二側部分138沿著對準之一軸。雖然繪示為一單件式組件,但是在一些實施方案中,基座框架130可包含使用諸如一螺釘、一鉚釘、一焊點及/或等等之一或多個耦合機構耦合在一起之一或多個組件(或單獨部分)。 As shown in FIG. 1A, the base frame 130 has a proximal end portion 134, a first distal end portion 136, and a second distal end portion 137. The base frame 130 also has a first side portion 135 (positioned between the proximal portion 134 and the first distal portion 136) and a second side portion 138 (positioned between the proximal portion 134 and the second distal portion 137) between). In some embodiments, the proximal portion 134, the first distal portion 136, and the second distal portion 137 may be referred to as a side portion. The first distal portion 136 may be aligned along an axis that is substantially orthogonal to the first side portion 135 along one of the aligned axes. Similarly, the second distal portion 137 may be aligned along an axis that is substantially orthogonal to the second side portion 138 along one of the aligned axes. Although shown as a one-piece component, in some embodiments, the base frame 130 may include a coupling mechanism coupled together using one or more coupling mechanisms such as a screw, a rivet, a solder joint, and / or the like. One or more components (or separate parts).

構架組件140具有安置在第一遠端部分136與第二遠端部分137之間之至少一部分。如圖1A中所示,在其中構架組件140耦合在第一遠端部分136與第二遠端部分137之間之一區域中,不包括基座框架130之一部分。因為構架組件140可耦合至第一遠端部分136及/或第二遠端部分137,所以第一遠端部分136及/或第二遠端部分137可各(或共同地)稱作基座框架130之一(多個)構架耦合部分。 The frame assembly 140 has at least a portion disposed between the first distal portion 136 and the second distal portion 137. As shown in FIG. 1A, in a region where the frame assembly 140 is coupled between the first distal portion 136 and the second distal portion 137, a portion of the base frame 130 is not included. Because the framework assembly 140 may be coupled to the first distal portion 136 and / or the second distal portion 137, the first distal portion 136 and / or the second distal portion 137 may each (or collectively) be referred to as a base One or more of the frames 130 are structurally coupled portions.

在一些實施方案中,構架組件140可提供可與電子組件耦合在耦合裝置100內之額外剛性及結構。雖然繪示為一單件式組件,但是在一些實施方案中,構架組件140可包含使用諸如一螺釘、一鉚釘、一 焊點及/或等等之一或多個耦合機構耦合在一起之一或多個組件(或單獨部分)。 In some implementations, the framework assembly 140 can provide additional rigidity and structure that can be coupled with the electronic components within the coupling device 100. Although illustrated as a one-piece assembly, in some embodiments, the frame assembly 140 may include the use of, for example, a screw, a rivet, a One or more coupling mechanisms of solder joints and / or the like are coupled together to one or more components (or separate parts).

構架組件140及基座框架130共同界定一開口102。中平面150耦合至基座框架130及/或構架組件140使得透過開口102曝露中平面150之至少一部分。 The frame assembly 140 and the base frame 130 together define an opening 102. The mid-plane 150 is coupled to the base frame 130 and / or the frame assembly 140 such that at least a portion of the mid-plane 150 is exposed through the opening 102.

如圖1A中所示,中平面150具有大於由開口102界定之一面積或周長之一表面積或周長。具體言之,中平面具有一長度A3(亦可稱作一距離、尺寸或寬度),該長度A3大於開口102之一長度A1(沿或平行於長度A3對準)。類似地,中平面150具有一長度A4,該長度A4大於開口102之一長度A2(沿或平行於長度A4對準)。 As shown in FIG. 1A, the mid-plane 150 has a surface area or perimeter that is greater than an area or perimeter defined by the opening 102. Specifically, the midplane has a length A3 (also referred to as a distance, size, or width), which is longer than a length A1 of one of the openings 102 (aligned along or parallel to the length A3). Similarly, the midplane 150 has a length A4 that is greater than a length A2 of one of the openings 102 (aligned along or parallel to the length A4).

在一些實施方案中,中平面150之表面積(或周長)可小於或等於由開口102界定之面積(或周長)。在一些實施方案中,中平面150之一或多個部分之一或多個長度可小於或等於開口102之一或多個長度(沿相同方向或平行於中平面150之長度之一或多者)。雖然繪示為一單件式組件,但是在一些實施方案中,中平面150可包含使用諸如一螺釘、一鉚釘、一焊點及/或等等之一或多個耦合機構耦合在一起之一或多個組件(或單獨部分)。 In some embodiments, the surface area (or perimeter) of the midplane 150 may be less than or equal to the area (or perimeter) defined by the opening 102. In some embodiments, one or more lengths of one or more portions of the midplane 150 may be less than or equal to one or more lengths of the openings 102 (one or more of the lengths in the same direction or parallel to the midplane 150 ). Although illustrated as a one-piece assembly, in some embodiments, the midplane 150 may include one coupled together using one or more coupling mechanisms such as a screw, a rivet, a solder joint, and / or the like. Or multiple components (or separate parts).

圖1C係展示沿圖1A中所示之線A5之基座框架130之至少該第一側部分135之一截面(或截面輪廓)之一圖。如圖1C中所示,第一側部分135包含被識別為安置在一頂壁161與一底壁163之間之一側壁162之多個壁(例如,第一壁、第二壁、第三壁)。頂壁161、側壁162及底壁163一般可各稱作一壁。第一側部分135之壁161、162、163界定通道160之一部分165或通道160之部分165之內表面。通道160之部分165(或其內表面)可圍繞用一虛線繪示之一凹陷區域164(亦可稱作一腔)安置或界定該凹陷區域164。 FIG. 1C is a diagram showing a cross-section (or cross-sectional profile) of at least the first side portion 135 of the base frame 130 along the line A5 shown in FIG. 1A. As shown in FIG. 1C, the first side portion 135 includes a plurality of walls (e.g., a first wall, a second wall, a third wall, and the like) that are identified as being disposed between a top wall 161 and a bottom wall 163. wall). The top wall 161, the side wall 162, and the bottom wall 163 may each be generally referred to as a wall. The walls 161, 162, 163 of the first side portion 135 define a portion 165 of the channel 160 or an inner surface of the portion 165 of the channel 160. The portion 165 (or its inner surface) of the channel 160 may place or define a recessed area 164 around a recessed area 164 (also referred to as a cavity) depicted with a dashed line.

在一些實施方案中,通道160之一部分可稱作一通道部分。因 此,通道160之一第一部分可稱作一第一通道部分,且通道160之一第二部分可為一第二通道部分。在一些實施方案中,通道160之第一部分及通道160之第二部分可為相同通道160之部分。在一些實施方案中,一第一通道部分及一第二通道部分可為單獨或非鄰接通道之部分。 In some embodiments, a portion of the channel 160 may be referred to as a channel portion. because Therefore, a first portion of the channel 160 may be referred to as a first channel portion, and a second portion of the channel 160 may be a second channel portion. In some embodiments, the first portion of the channel 160 and the second portion of the channel 160 may be part of the same channel 160. In some embodiments, a first channel portion and a second channel portion may be portions of separate or non-adjacent channels.

在一些實施方案中,頂壁161可與底壁163相對。換言之,頂壁161可具有面向底壁163之一內表面之一內表面。在一些實施方案中,可單件式形成基座框架130。因此,可單件式形成頂壁161、側壁162及底壁163。 In some embodiments, the top wall 161 may be opposite the bottom wall 163. In other words, the top wall 161 may have an inner surface facing one of the inner surfaces of the bottom wall 163. In some embodiments, the base frame 130 may be formed in one piece. Therefore, the top wall 161, the side wall 162, and the bottom wall 163 can be formed in one piece.

由壁161、162及163界定之通道160之形狀可對基座框架130之結構提供剛性。此結構完整性可促成包含基座框架130之一計算裝置之結構完整性。具體言之,基座框架130之單件式形成可進一步增強基座框架130之剛性。 The shape of the channel 160 defined by the walls 161, 162, and 163 may provide rigidity to the structure of the base frame 130. This structural integrity may contribute to the structural integrity of a computing device including a base frame 130. Specifically, the one-piece formation of the base frame 130 can further enhance the rigidity of the base frame 130.

如圖1C中所示,中平面150之一邊緣151安置在凹陷區域164內。換言之,中平面150之至少一部分安置在凹陷區域164內。在一些實施方案中,中平面150之一或多個部分可耦合至(例如,接觸、結合至)由第一側部分135界定之通道160之部分165之一或多個內表面。 As shown in FIG. 1C, one edge 151 of the midplane 150 is disposed within the recessed area 164. In other words, at least a portion of the mid-plane 150 is disposed within the recessed area 164. In some implementations, one or more portions of the midplane 150 can be coupled (eg, contacted, bonded to) one or more inner surfaces of the portion 165 of the channel 160 defined by the first side portion 135.

在一些實施方案中,中平面150之邊緣151可為一第一邊緣,且通道160之凹陷區域164可為一第一凹陷區域。雖然圖1C中未展示,但是中平面150可具有安置在通道160之一第二凹陷區域中之一第二邊緣(例如,一相對邊緣及相鄰邊緣)。 In some embodiments, the edge 151 of the mid-plane 150 may be a first edge, and the recessed area 164 of the channel 160 may be a first recessed area. Although not shown in FIG. 1C, the midplane 150 may have a second edge (eg, an opposite edge and an adjacent edge) disposed in a second recessed area of one of the channels 160.

圖1C中所示之第一側部分135之截面形狀可稱作一C型或一U型。換言之,頂壁161、底壁163及側壁162可共同界定一彎曲截面輪廓或一c型截面輪廓。第一側部分135之截面經定向使得通道160之部分165沿平行於(例如,實質上平行於)一平面A7之一軸對準,中平面150沿著該軸對準。換言之,第一側部分135經定向使得由通道160之部分 165界定之一開口側向(或橫向)面向而非垂直面向中平面150。在此實施方案中,第一側部分135之截面繞穿過側壁162之一水平線或軸對稱。 The cross-sectional shape of the first side portion 135 shown in FIG. 1C may be referred to as a C-shape or a U-shape. In other words, the top wall 161, the bottom wall 163, and the side wall 162 may collectively define a curved cross-sectional profile or a c-shaped cross-sectional profile. The cross section of the first side portion 135 is oriented such that the portion 165 of the channel 160 is aligned along an axis parallel to (eg, substantially parallel to) a plane A7, and the midplane 150 is aligned along the axis. In other words, the first side portion 135 is oriented such that by the portion of the channel 160 165 defines one of the openings facing laterally (or laterally) rather than vertically facing the midplane 150. In this embodiment, the cross-section of the first side portion 135 is symmetrical about a horizontal line or an axis passing through the side wall 162.

在此實施方案中,通道160沿基座框架130或在基座框架130周圍具有一相對恆定深度。圖1C中展示通道160之部分165之一深度A9。在此實施方案中,深度A9沿一線對準,該線實質上沿平面A7對準或平行於平面A7(中平面150沿該平面A7對準)。作為一實例,與第二側部分138相關聯之通道160之一部分可具有一深度,該深度與相關聯於第二遠端部分137之通道160之一部分之一深度及/或相關聯於近端部分134之通道160之一部分之一深度相同(或實質上相同)。 In this embodiment, the channel 160 has a relatively constant depth along or around the base frame 130. A depth A9 of one of the portions 165 of the channel 160 is shown in FIG. 1C. In this embodiment, the depth A9 is aligned along a line that is substantially aligned along or parallel to the plane A7 (the midplane 150 is aligned along the plane A7). As an example, a portion of the channel 160 associated with the second side portion 138 may have a depth that is associated with a depth of a portion of the channel 160 associated with the second distal portion 137 and / or associated with the proximal end. A portion of the channel 160 of the portion 134 has the same (or substantially the same) depth.

在一些實施方案中,第一側部分135可具有不同於圖1C中所示之之一形狀。在一些實施方案中,第一側部分135可具有一或多個彎曲形狀、一三角形形狀、多於圖1C中所示之多個壁、少於圖1C中所示之多個壁及/或等等。在一些實施方案中,第一側部分135之截面可繞穿過側壁162之一水平線或軸對稱。 In some implementations, the first side portion 135 may have a shape different from one shown in FIG. 1C. In some embodiments, the first side portion 135 may have one or more curved shapes, a triangular shape, more than the plurality of walls shown in FIG. 1C, less than the plurality of walls shown in FIG. 1C, and / or and many more. In some embodiments, the cross-section of the first side portion 135 may be symmetrical about a horizontal line or an axis passing through the side wall 162.

在此實施方案中,第一側部分135之一長度A6(例如,一寬度、一距離、一尺寸)經界定使得頂壁161之一長度及底壁163之一長度近似相同或相等。因此,頂壁161之一邊緣及底壁163之一邊緣可沿正交於平面A7之一單平面(或線)對準,中平面150沿平面A7對準。在一些實施方案中,頂壁161之長度可不同於底壁163之一長度。 In this embodiment, a length A6 (eg, a width, a distance, a size) of the first side portion 135 is defined such that a length of the top wall 161 and a length of the bottom wall 163 are approximately the same or equal. Therefore, one edge of the top wall 161 and one edge of the bottom wall 163 may be aligned along a single plane (or line) orthogonal to the plane A7, and the midplane 150 is aligned along the plane A7. In some embodiments, the length of the top wall 161 may be different from the length of one of the bottom walls 163.

在一些實施方案中,第二側部分138、近端部分134、第一遠端部分136及/或第二遠端部分137可具有與第一側部分135之截面輪廓相同之一截面輪廓。例如,基座框架130之近端部分134可具有與基座框架130之第一側部分135相同之一截面輪廓。 In some embodiments, the second side portion 138, the proximal portion 134, the first distal portion 136, and / or the second distal portion 137 may have a cross-sectional profile that is the same as the cross-sectional profile of the first side portion 135. For example, the proximal portion 134 of the base frame 130 may have the same cross-sectional profile as the first side portion 135 of the base frame 130.

返回參考圖1A,在此實施方案中,第一側部分之通道160之部分165(及凹陷區域164)鄰接或連接至基座框架130之其他部分(例如,近 端部分134、第一遠端部分136、第二側部分138、第二遠端部分137)之一或多者之通道160之一或多個部分(及(多個)相關聯之凹陷區域)。換言之,通道160可具有基座框架130之一第一側或部分上之一第一部分,該第一部分耦合至基座框架130之一第二側或部分上之通道160之一第二部分。在此等實施方案中,通道160之第一部分可正交於通道160之第二部分,且可在基座框架130之一角隅處耦合。在此等實施方案中,一凹陷區域可沿通道160之不同部分鄰接。 Referring back to FIG. 1A, in this embodiment, the portion 165 (and recessed area 164) of the channel 160 of the first side portion abuts or connects to other portions of the base frame 130 (e.g., near One or more of the end portion 134, the first distal portion 136, the second side portion 138, the second distal portion 137) of one or more of the channels 160 (and the associated recessed area (s)) . In other words, the channel 160 may have a first portion on a first side or portion of the base frame 130 that is coupled to a second portion of the channel 160 on a second side or portion of the base frame 130. In these implementations, the first portion of the channel 160 may be orthogonal to the second portion of the channel 160 and may be coupled at one corner of the base frame 130. In these embodiments, a recessed area may abut along different portions of the channel 160.

例如,由近端部分134之截面輪廓界定之通道160之一部分可耦合至由第一側部分135之截面輪廓界定之通道160之部分165。因此,由近端部分134之通道160之部分界定之一凹陷區域可耦合至第一側部分135之通道160之部分165之凹陷區域164。 For example, a portion of the channel 160 defined by the cross-sectional profile of the proximal portion 134 may be coupled to a portion 165 of the channel 160 defined by the cross-sectional profile of the first side portion 135. Accordingly, a recessed area defined by a portion of the channel 160 of the proximal portion 134 may be coupled to the recessed area 164 of the portion 165 of the channel 160 of the first side portion 135.

在一些實施方案中,第二側部分138、近端部分134、第一遠端部分136及/或第二遠端部分137可具有不同於第一側部分135之截面輪廓之一截面輪廓。例如,近端部分134可具有不同於第一側部分135之截面輪廓之一截面輪廓。在此等實施方案中,近端部分134之截面輪廓可逐漸改變(例如,逐漸變小)或突然改變至第一側部分135之截面輪廓。 In some embodiments, the second side portion 138, the proximal portion 134, the first distal portion 136, and / or the second distal portion 137 may have a cross-sectional profile that is different from the cross-sectional profile of the first side portion 135. For example, the proximal portion 134 may have a cross-sectional profile that is different from the cross-sectional profile of the first side portion 135. In such embodiments, the cross-sectional profile of the proximal portion 134 may gradually change (eg, become smaller) or suddenly change to the cross-sectional profile of the first side portion 135.

雖然未展示,但是在一些實施方案中,可隔離或解耦基座框架130之各個部分內界定之一通道之部分。換言之,基座框架130可具有多個不鄰接通道。例如,第一側部分135之通道160之部分165可與基座框架130之第一遠端部分136之一單獨通道(未展示)隔離。在此等實施方案中,第一側部分135之通道160之部分165可具有不同於基座框架130之第一遠端部分136之通道之一截面形狀。換言之,在一些實施方案中,不同通道可具有相同或不同截面輪廓。 Although not shown, in some embodiments, a portion of a channel defined within each portion of the base frame 130 may be isolated or decoupled. In other words, the base frame 130 may have a plurality of non-adjacent channels. For example, the portion 165 of the channel 160 of the first side portion 135 may be isolated from a separate channel (not shown) of the first distal portion 136 of the base frame 130. In such embodiments, the portion 165 of the channel 160 of the first side portion 135 may have a cross-sectional shape different from that of the channel of the first distal portion 136 of the base frame 130. In other words, in some embodiments, different channels may have the same or different cross-sectional profiles.

在此實施方案中,並未展示計算裝置100之許多部分(諸如一鍵盤、一電路板、一軌跡板、輸入/輸出(I/O)組件及/或等等)。然而,此 等電子組件之一或多者可包含在(例如)計算裝置100之區域102中。例如,可耦合至中平面150之電子組件可安置在例如第一側部分135之側壁162中之一開口(未展示)中或突出穿過該開口。因為中平面150安置在凹陷區域內,所以耦合至中平面150之電子組件可經安置相對靠近通道160之一內表面且不自中平面150懸垂(或自距中平面150突出一相對較大距離)。結合至少圖39至圖45描述與可包含於計算裝置100之區域102中之組件相關之更多細節。 In this implementation, many parts of the computing device 100 (such as a keyboard, a circuit board, a trackpad, input / output (I / O) components, and / or the like) are not shown. However, this One or more of the electronic components may be included in, for example, the region 102 of the computing device 100. For example, an electronic component that can be coupled to the midplane 150 can be placed in or protruded through one of the openings (not shown) in the side wall 162 of the first side portion 135, for example. Because the mid-plane 150 is disposed in the recessed area, the electronic components coupled to the mid-plane 150 can be positioned relatively close to one of the inner surfaces of the channel 160 and not dangling from the mid-plane 150 (or protruding a relatively large distance from the mid-plane 150 ). More details related to the components that may be included in the region 102 of the computing device 100 are described in connection with at least FIGS. 39-45.

圖2A至圖2D係繪示包含於一計算裝置之一基座部分中之組件之各個視圖之圖。具體言之,圖2A係繪示一基座框架230之一俯視圖之一圖,且圖2B繪示基座框架230之一仰視圖。 2A to 2D are diagrams showing various views of components included in a base portion of a computing device. Specifically, FIG. 2A is a plan view of a base frame 230, and FIG. 2B is a bottom view of a base frame 230.

基座框架230包含一近端部分234、一第一遠端部分236及一第二遠端部分237。基座框架230亦包含耦合在第一遠端部分236與近端部分234之間之一第一側部分235及耦合在第二遠端部分237與近端部分234之間之一第二側部分238。 The base frame 230 includes a proximal end portion 234, a first distal end portion 236, and a second distal end portion 237. The base frame 230 also includes a first side portion 235 coupled between the first distal portion 236 and the proximal portion 234 and a second side portion coupled between the second distal portion 237 and the proximal portion 234 238.

圖2A繪示一頂壁261且圖2B繪示一底壁263。一側壁262耦合在頂壁261與底壁263之間。頂壁261、側壁262及底壁263共同界定一通道260。在此實施方案中,頂壁261包含與軌跡板相關聯之一開口266(亦可稱作一觸控板或一軌跡板開口)及掌托區域267。用虛線繪示安置在掌托區域267下方之通道260之部分。在一些實施方案中,自掌托區域267延伸之基座框架230之第一側部分235之一部分可稱作第一側部分235之一延伸部(或基座框架230之一延伸部部分)。類似地,自掌托區域267延伸之基座框架230之第二側部分238之一部分可稱作第二側部分238之一延伸部(或基座框架230之一延伸部部分)。 FIG. 2A illustrates a top wall 261 and FIG. 2B illustrates a bottom wall 263. A side wall 262 is coupled between the top wall 261 and the bottom wall 263. The top wall 261, the side wall 262 and the bottom wall 263 together define a channel 260. In this embodiment, the top wall 261 includes an opening 266 (also referred to as a touchpad or a trackpad opening) and a palm rest area 267 associated with the trackpad. The portion of the channel 260 disposed below the palm rest area 267 is shown in dotted lines. In some embodiments, a portion of the first side portion 235 of the base frame 230 extending from the palm rest region 267 may be referred to as an extension of the first side portion 235 (or an extension portion of the base frame 230). Similarly, a portion of the second side portion 238 of the base frame 230 extending from the palm rest region 267 may be referred to as an extension of the second side portion 238 (or an extension portion of the base frame 230).

圖2A中繪示基座框架230之各種尺寸。如圖2A中所示,第一遠端部分236之一長度B1小於基座框架230之近端部分234之一長度B2。類似地,第二遠端部分237具有小於近端部分234之長度B2之一長度。 Various sizes of the base frame 230 are shown in FIG. 2A. As shown in FIG. 2A, a length B1 of one of the first distal portions 236 is shorter than a length B2 of one of the proximal portions 234 of the base frame 230. Similarly, the second distal portion 237 has a length that is less than the length B2 of the proximal portion 234.

雖然圖2A中未展示,但是一構架組件(未展示)可耦合至第一遠端部分236及/或第二遠端部分237。在此等實施方案中,構架組件可具有安置在與第一遠端部分236相關聯之通道260之一部分內之至少一部分及/或可具有安置在與第二遠端部分237相關聯之通道260之一部分內之至少一部分。因為構架組件可耦合至第一遠端部分236及/或第二遠端部分237,所以第一遠端部分236及/或第二遠端部分237可稱作基座框架230之構架耦合部分。 Although not shown in FIG. 2A, a framework assembly (not shown) may be coupled to the first distal portion 236 and / or the second distal portion 237. In such embodiments, the framework assembly may have at least a portion disposed within a portion of the channel 260 associated with the first distal portion 236 and / or may have a channel 260 disposed with the second distal portion 237 At least a part of a part. Because the framework assembly may be coupled to the first distal portion 236 and / or the second distal portion 237, the first distal portion 236 and / or the second distal portion 237 may be referred to as the framework coupling portion of the base frame 230.

如圖2A中所示,底壁263之一長度B3小於頂壁261之一長度B4。因此,與掌托區域267及軌跡板區域(其包含開口266)相關聯之通道260之部分可各具有一不對稱截面輪廓(沿一水平面,該水平面沿基座框架230對準)。此外,與耦合至第一側部分235之掌托區域相關聯之通道260之至少一部分具有一不對稱輪廓,而第一側部分235之延伸部部分具有一對稱截面輪廓。 As shown in FIG. 2A, a length B3 of one of the bottom walls 263 is shorter than a length B4 of one of the top walls 261. Accordingly, portions of the channels 260 associated with the palm rest area 267 and the trackpad area (which includes the opening 266) may each have an asymmetric cross-sectional profile (along a horizontal plane, which is aligned along the base frame 230). In addition, at least a portion of the channel 260 associated with the palm rest area coupled to the first side portion 235 has an asymmetrical profile, and the extension portion of the first side portion 235 has a symmetrical cross-sectional profile.

圖2C繪示沿線B5切割之第一側部分235之延伸部部分之對稱截面輪廓。如圖2C中所示,第一側部分235之延伸部部分(及/或第一側部分235之通道260之一部分)具有繞一平面B7(或線)之一對稱截面輪廓。頂壁261及底壁263具有一相等(或實質上相等)長度。相比之下,圖2D繪示與掌托區域267相關聯之第一側部分235之不對稱截面輪廓,其係沿線B6切割。如圖2D中所示,與掌托區域267相關聯之第一側部分235(及/或第一側部分235之通道260之一部分)具有繞平面B7(或線)之一不對稱截面輪廓。在此實施方案中,頂壁261及底壁263具有一不相等(或不同)長度,因此界定不對稱截面輪廓。 FIG. 2C illustrates a symmetrical cross-sectional profile of the extension portion of the first side portion 235 cut along the line B5. As shown in FIG. 2C, the extension portion of the first side portion 235 (and / or a portion of the channel 260 of the first side portion 235) has a symmetrical cross-sectional profile around a plane B7 (or line). The top wall 261 and the bottom wall 263 have an equal (or substantially equal) length. In contrast, FIG. 2D illustrates the asymmetrical cross-sectional profile of the first side portion 235 associated with the palm rest area 267, which is cut along line B6. As shown in FIG. 2D, the first side portion 235 (and / or a portion of the channel 260 of the first side portion 235) associated with the palm rest area 267 has an asymmetrical cross-sectional profile about the plane B7 (or line). In this embodiment, the top wall 261 and the bottom wall 263 have an unequal (or different) length, and thus define an asymmetric cross-sectional profile.

圖3A係繪示安置在圖2A至圖2D中所示之基座框架230之至少一部分內之一中平面250之一圖。在圖3A中,中平面沿一平面對準,該平面實質上平行於基座框架230沿著對準之一平面。在此實施方案中,看不見掌托區域267及與軌跡板相關聯之開口266,此係因為中平 面250係安置在基座框架230內。 FIG. 3A is a diagram illustrating a midplane 250 disposed within at least a portion of the base frame 230 shown in FIGS. 2A to 2D. In FIG. 3A, the mid-plane is aligned along a plane that is substantially parallel to the base frame 230 along one of the aligned planes. In this embodiment, the palm rest area 267 and the opening 266 associated with the trackpad are not visible, because The surface 250 is disposed in the base frame 230.

圖3B係繪示沿圖3A中所示之線D1切割之中平面250及基座框架230之一截面圖之一圖。如圖3B中所示,中平面250具有一長度D3,長度D3長於與第一側部分235相關聯之頂壁261之一部分(例如,延伸部部分)之一內緣268與相關聯於第二側部分238之頂壁261之一部分(例如,延伸部部分)之一內緣269之間之一長度D2。中平面250之長度D3短於側壁262之一第一部分之一內表面278(在基座框架230之一側上)與一內表面(在基座框架230之相對側上)之間之一距離D4。此外,中平面250之長度D3短於側壁262之第一部分之一外表面288與側壁262之第二部分之一外表面289之間之一距離。 FIG. 3B is a diagram showing a cross-sectional view of the middle plane 250 and the base frame 230 cut along the line D1 shown in FIG. 3A. As shown in FIG. 3B, the midplane 250 has a length D3 that is longer than an inner edge 268 of a portion (eg, an extension portion) of the top wall 261 associated with the first side portion 235 and associated with the second A length D2 between an inner edge 269 of a portion (eg, an extension portion) of the top wall 261 of the side portion 238. The length D3 of the midplane 250 is shorter than a distance between an inner surface 278 (on one side of the base frame 230) and an inner surface (on the opposite side of the base frame 230) of one of the first portions of the side walls 262 D4. In addition, the length D3 of the mid-plane 250 is shorter than a distance between an outer surface 288 of a first portion of the side wall 262 and an outer surface 289 of a second portion of the side wall 262.

圖3C係繪示基座框架230內部之中平面250之至少一部分之插入之一截面圖之一圖。如圖3C中所示,中平面250之一邊緣251(或端部)係沿方向D11(大約沿方向D11)插入至由與基座框架230之第二側部分238相關聯之通道260之一部分界定之一腔(或凹陷區域)中。在此操作之後,中平面250沿不平行於一平面DB之一平面DA對準,基座框架230沿平面DB對準。 FIG. 3C is a diagram illustrating a cross-sectional view of the insertion of at least a part of the plane 250 inside the base frame 230. As shown in FIG. 3C, one edge 251 (or end) of the midplane 250 is inserted in a direction D11 (approximately in the direction D11) into a portion of the channel 260 associated with the second side portion 238 of the base frame 230 Define a cavity (or recessed area). After this operation, the mid-plane 250 is aligned along a plane DA that is not parallel to a plane DB, and the base frame 230 is aligned along the plane DB.

在中平面250之邊緣251插入至腔中之後,中平面250可沿方向D8旋轉使得中平面250之一邊緣252(其與中平面250之邊緣251相對)可朝由與基座框架230之第一側部分235相關聯之通道260之一部分界定之一腔(或凹陷區域)旋轉。隨後,在中平面250之邊緣252與腔對準(例如,面向該腔、與該腔對應)(且旋轉超出頂壁261之內緣268)之後,中平面250之邊緣252可被插入至由與第一側部分235相關聯之通道260之部分界定之腔中。換言之,中平面250可(在插入中平面250之邊緣251之後)旋轉使得中平面250沿著對準之平面DA平行於(或實質上平行於)基座框架230沿著對準之平面DB。在一些實施方案中,此過程可稱作一傾斜插入過程。 After the edge 251 of the mid-plane 250 is inserted into the cavity, the mid-plane 250 can be rotated in the direction D8 so that one of the edges 252 of the mid-plane 250 (which is opposite to the edge 251 of the mid-plane 250) can be turned toward A portion of the channel 260 associated with the side portion 235 defines a cavity (or recessed area) to rotate. Subsequently, after the edge 252 of the mid-plane 250 is aligned with the cavity (eg, facing the cavity and corresponding to the cavity) (and rotated beyond the inner edge 268 of the top wall 261), the edge 252 of the mid-plane 250 may be inserted into the cavity In a cavity defined by a portion of the channel 260 associated with the first side portion 235. In other words, the mid-plane 250 can be rotated (after inserting the edge 251 of the mid-plane 250) such that the mid-plane 250 along the aligned plane DA is parallel to (or substantially parallel to) the base frame 230 along the aligned plane DB. In some embodiments, this process may be referred to as an oblique insertion process.

如圖3C中所示,中平面250之長度D3(其在邊緣251與邊緣252之間延伸)小於第一側部分235之內緣268與第二側部分238之內表面279之間之一長度D6,使得中平面250之邊緣251可被插入至基座框架230中,且中平面250之邊緣252可隨後旋轉至基座框架230中。如圖3D中所示,中平面250可在基座框架230內沿(例如)方向D9及/或方向D10移動(例如,偏移、可滑動移動)。在一些實施方案中,方向D9及/或方向D10可稱作一平移方向。在一些實施方案中,中平面250可在基座框架230內移動至基座框架230內之一所要位置。在一些實施方案中,中平面250可在基座框架230內移動使得中平面250之至少兩個邊緣(例如,正交邊緣、相對邊緣)可安置在基座框架230之通道260之兩個或更多個部分內。 As shown in FIG. 3C, the length D3 of the midplane 250 (which extends between the edge 251 and the edge 252) is less than one length between the inner edge 268 of the first side portion 235 and the inner surface 279 of the second side portion 238 D6, so that the edge 251 of the mid-plane 250 can be inserted into the base frame 230, and the edge 252 of the mid-plane 250 can be subsequently rotated into the base frame 230. As shown in FIG. 3D, the mid-plane 250 can be moved (eg, offset, slidably moved) in, for example, the direction D9 and / or the direction D10 within the base frame 230. In some embodiments, the direction D9 and / or the direction D10 may be referred to as a translation direction. In some embodiments, the midplane 250 can be moved within the base frame 230 to one of the desired positions within the base frame 230. In some embodiments, the mid-plane 250 can be moved within the base frame 230 such that at least two edges (e.g., orthogonal edges, opposite edges) of the mid-plane 250 can be placed on two or Within more sections.

如結合圖3C及圖3D繪示,中平面250可在傾斜過程期間移動至基座框架230中使得中平面250之一邊緣沿一第一方向(例如,方向D11)移動至通道260中,且中平面250之另一邊緣沿不同於第一方向之一第二方向(例如,方向D10、方向D9)移動至通道260中。在一些實施方案中,第一方向可正交於第二方向。在一些實施方案中,第一方向及/或第二方向係一方向組合。 As shown in conjunction with FIG. 3C and FIG. 3D, the mid-plane 250 can be moved into the base frame 230 during the tilting process such that one edge of the mid-plane 250 moves into the channel 260 in a first direction (eg, direction D11), and The other edge of the mid-plane 250 moves into the channel 260 in a second direction (eg, direction D10, direction D9) different from the first direction. In some embodiments, the first direction may be orthogonal to the second direction. In some embodiments, the first direction and / or the second direction are a combination of directions.

圖4係繪示將一中平面耦合至一基座框架之一方法之一流程圖。在一些實施方案中,流程圖中繪示之方法(其可稱作一傾斜過程)可用以將中平面250耦合至基座框架230。 FIG. 4 is a flowchart illustrating a method for coupling a midplane to a base frame. In some implementations, the method illustrated in the flowchart (which may be referred to as a tilting process) may be used to couple the midplane 250 to the base frame 230.

如圖4中所示,一中平面之一第一邊緣在計算裝置之一基座框架內之一第一通道之一凹陷區域中移動,使得中平面在插入第一邊緣期間沿不平行於基座框架沿著對準之第二平面之一第一平面對準(方塊400)。在一些實施方案中,凹陷區域可為一腔。在一些實施方案中,第一通道可與一基座框架之一側部分及/或一延伸部相關聯。 As shown in FIG. 4, a first edge of a mid-plane moves in a recessed area of a first channel in a base frame of a computing device such that the mid-plane is not parallel to the The seat frame is aligned along a first plane, one of the aligned second planes (block 400). In some embodiments, the recessed area may be a cavity. In some embodiments, the first channel may be associated with a side portion of a base frame and / or an extension.

在移動第一邊緣之後,中平面相對於基座框架旋轉(方塊410)。 在一些實施方案中,中平面可旋轉直至中平面沿著對準之第一平面平行於基座框架沿著對準之第二平面。 After moving the first edge, the midplane is rotated relative to the base frame (block 410). In some embodiments, the median plane is rotatable until the median plane is aligned along the aligned first plane and parallel to the base frame along the aligned second plane.

中平面之一第二邊緣在由計算裝置之基座框架內之第二通道界定之一凹陷區域中移動(方塊420)。在一些實施方案中,中平面之第二邊緣移動至凹陷區域中可包含在完成旋轉之後可滑動地移動第二邊緣。在一些實施方案中,第二邊緣之移動可包含沿兩個或更多個不同方向移動。在一些實施方案中,第二邊緣之移動可包含中平面之平移。 A second edge of a mid-plane moves in a recessed area defined by a second channel within the base frame of the computing device (block 420). In some embodiments, moving the second edge of the mid-plane into the recessed region may include slidably moving the second edge after completing the rotation. In some embodiments, movement of the second edge may include movement in two or more different directions. In some embodiments, the movement of the second edge may include a translation of a midplane.

圖5A係繪示包含一通道560及一側壁562之一基座框架530之一圖。圖5A亦繪示插入至基座框架530中之一中平面550。具體言之,中平面550具有插入至基座框架530之通道560中之外緣。基座框架530包含一第一延伸部535及一第二延伸部538。 FIG. 5A is a diagram of a base frame 530 including a channel 560 and a side wall 562. FIG. 5A also illustrates a midplane 550 inserted into the base frame 530. Specifically, the midplane 550 has an outer edge inserted into the channel 560 of the base frame 530. The base frame 530 includes a first extending portion 535 and a second extending portion 538.

如圖5A中所示,中平面550包含一第一部分551,第一部分551具有大於中平面550之一第二部分552之一長度F2之一長度F1。在此實施方案中,中平面550之第二部分552之長度F2防止僅使用上文描述之傾斜過程將中平面550插入至基座框架之通道560中。換言之,中平面550包含防止使用上文描述之傾斜過程將中平面550插入至通道560中之一突部558。在此實施方案中,在中平面550插入至基座框架530期間可使用包含移動(例如,彎折)第一延伸部535及/或第二延伸部538之一經修改傾斜過程。 As shown in FIG. 5A, the midplane 550 includes a first portion 551, and the first portion 551 has a length F1 that is greater than a length F2 of a second portion 552 of a midplane 550. In this embodiment, the length F2 of the second portion 552 of the midplane 550 prevents the midplane 550 from being inserted into the channel 560 of the base frame using only the tilting process described above. In other words, the midplane 550 includes a protrusion 558 that prevents the midplane 550 from being inserted into the channel 560 using the tilting process described above. In this embodiment, a modified tilting process that includes moving (eg, bending) one of the first extension 535 and / or the second extension 538 during insertion of the midplane 550 into the base frame 530 may be used.

如圖5B中所示,中平面550之一邊緣554可插入至與第一延伸部535相關聯之通道560之一部分中。在一些實施方案中,中平面550之邊緣554在插入至第一延伸部535中時可接觸通道560之一內表面。在中平面550之邊緣554插入至與第一延伸部535相關聯之通道560之部分中之後,第二延伸部538(或其之一部分)可移動遠離中平面550使得中平面550之第二部分552之一邊緣556(或突部558之邊緣556)可移動至 由基座框架530界定之一開口502中。在一些實施方案中,在此過程期間,中平面550之第二部分552之邊緣556可旋轉至頁面中。 As shown in FIG. 5B, one edge 554 of the midplane 550 may be inserted into a portion of the channel 560 associated with the first extension 535. In some embodiments, the edge 554 of the mid-plane 550 can contact one of the inner surfaces of the channel 560 when inserted into the first extension 535. After the edge 554 of the midplane 550 is inserted into the portion of the channel 560 associated with the first extension 535, the second extension 538 (or a portion thereof) can be moved away from the midplane 550 such that the second portion of the midplane 550 One edge 556 of the 552 (or the edge 556 of the protrusion 558) can be moved to An opening 502 is defined by the base frame 530. In some embodiments, during this process, the edge 556 of the second portion 552 of the midplane 550 may be rotated into the page.

例如,可沿方向F3施加一力於第二延伸部538(或其之一部分)使得第二延伸部538可經延伸,使得(突部558之)邊緣556可經移動鄰近由通道560界定之一腔或凹陷區域(未標記)。第二延伸部538可自圖5A中所示之一第一位置(或第一組態)移動至圖5B中所示之一第二位置(或第二組態)。在一些實施方案中,第二延伸部538可偏向第一位置。 For example, a force may be applied to the second extension 538 (or a portion thereof) in the direction F3 so that the second extension 538 may be extended so that the edge 556 (of the protrusion 558) may be moved adjacent to one of the defined by the channel 560 Cavity or recessed area (not labeled). The second extension 538 can be moved from one of the first positions (or the first configuration) shown in FIG. 5A to one of the second positions (or the second configuration) shown in FIG. 5B. In some embodiments, the second extension 538 can be biased toward the first position.

如圖5C中所示,在中平面550之第二部分552之邊緣556旋轉至頁面中之後,可釋放第二延伸部538(或不再施加一力)使得第二延伸部538之通道560在中平面550之第二部分552(或突部558)之邊緣556周圍移動。換言之,當第二延伸部538被釋放且移回至第一位置(或第一組態)時,中平面550之第二部分552之邊緣556可移動至通道560中。 As shown in FIG. 5C, after the edge 556 of the second portion 552 of the midplane 550 is rotated into the page, the second extension portion 538 may be released (or no longer applying a force) so that the channel 560 of the second extension portion 538 is at The edge 556 of the second portion 552 (or the protrusion 558) of the mid-plane 550 moves around. In other words, when the second extension 538 is released and moved back to the first position (or the first configuration), the edge 556 of the second portion 552 of the mid-plane 550 can be moved into the channel 560.

在一些實施方案中,中平面550可包含多個突部(諸如突部558)或長度變動。在此等實施方案中,除第二延伸部538之外,第一延伸部535亦可經移動使得中平面550可移動至基座框架530中。在此等實施方案中,可在移動第二延伸部538之前及/或之後移動第一延伸部535。 In some implementations, the midplane 550 may include multiple protrusions (such as protrusions 558) or length variations. In these embodiments, in addition to the second extension 538, the first extension 535 can also be moved so that the midplane 550 can be moved into the base frame 530. In such embodiments, the first extension 535 may be moved before and / or after the second extension 538 is moved.

如圖5D中所示,簡單地說,中平面550沿方向F4移動至通道560內之一最終位置。在一些實施方案中,中平面550可在不平行於方向F4之多個方向(包含垂直方向)上移動,使得中平面550可放置於基座框架530內之一所要位置中。 As shown in FIG. 5D, in short, the midplane 550 moves in a direction F4 to a final position within the channel 560. In some embodiments, the mid-plane 550 can be moved in multiple directions (including vertical directions) that are not parallel to the direction F4, so that the mid-plane 550 can be placed in a desired position within the base frame 530.

圖6係繪示將一中平面耦合至一基座框架之一方法之一流程圖。在一些實施方案中,流程圖中繪示之方法(其可稱作一經修改傾斜過程)可用以將中平面550耦合至基座框架530。 FIG. 6 is a flowchart illustrating a method for coupling a midplane to a base frame. In some embodiments, the method illustrated in the flowchart (which may be referred to as a modified tilting process) may be used to couple the midplane 550 to the base frame 530.

如圖6中所示,一中平面之一第一邊緣在計算裝置之一基座框架 內之一第一通道之一凹陷區域中移動(方塊600)。在一些實施方案中,凹陷區域可為一腔。在一些實施方案中,第一通道可與基座框架之一側部分及/或一延伸部相關聯。 As shown in FIG. 6, a first edge of a midplane is on a base frame of a computing device. Move inside a recessed area of one of the first channels (block 600). In some embodiments, the recessed area may be a cavity. In some embodiments, the first channel may be associated with a side portion of the base frame and / or an extension.

在移動第一邊緣之後,施加一力於計算裝置之基座框架之一延伸部(方塊610)。可施加該力於延伸部使得中平面之一突部可插入至基座框架之延伸部中。在一些實施方案中,延伸部可自一第一位置移動至一第二位置。在一些實施方案中,延伸部可偏向第一位置。 After moving the first edge, a force is applied to an extension of the base frame of the computing device (block 610). This force can be applied to the extension so that a protrusion in the mid-plane can be inserted into the extension of the base frame. In some embodiments, the extension is movable from a first position to a second position. In some embodiments, the extension may be biased toward the first position.

中平面相對於基座框架之延伸部旋轉(方塊620)。在一些實施方案中,中平面可旋轉直至中平面沿著對準之一平面平行於基座框架沿著對準之一平面。 The mid-plane is rotated relative to the extension of the base frame (block 620). In some embodiments, the mid-plane is rotatable until the mid-plane is aligned along one of the planes parallel to the base frame along one of the aligned planes.

中平面之一突部在由計算裝置之基座框架內之第二通道界定之一凹陷區域中移動(方塊630)。在一些實施方案中,當釋放基座框架之延伸部時或當不再施加力於延伸部時,中平面之突部可移動至凹陷區域中。中平面之突部移動至凹陷區域中可包含在完成旋轉之後可滑動地移動突部。在一些實施方案中,突部之移動可包含沿兩個或更多個不同方向移動。在一些實施方案中,突部之移動可包含平移中平面。 A protrusion in the mid-plane moves in a recessed area defined by a second channel within the base frame of the computing device (block 630). In some embodiments, when the extension of the base frame is released or when no more force is applied to the extension, the protrusion of the midplane can be moved into the recessed area. Moving the protrusion of the mid-plane into the recessed region may include slidably moving the protrusion after completing the rotation. In some embodiments, the movement of the protrusion may include movement in two or more different directions. In some embodiments, the movement of the protrusion may include translating a mid-plane.

圖7A係繪示耦合至一中平面750之熱結合膜部分之一圖。具體言之,熱結合膜部分781、782、783係耦合至中平面750。熱結合膜部分781至783可用以將中平面750結合至圖7B中所示之一基座框架730。在一些實施方案中,中平面750可包含多於或少於圖7A中所示之熱結合膜部分。在一些實施方案中,熱結合膜部分781至783可具有不同表面積、厚度及/或等等。例如,熱結合膜部分781可具有不同於熱結合膜部分782之一表面積。作為另一實例,熱結合膜部分781可具有不同於熱結合膜部分782之一厚度。 FIG. 7A is a diagram showing a portion of a thermal bonding film coupled to a midplane 750. FIG. Specifically, the thermal bonding film portions 781, 782, and 783 are coupled to the mid-plane 750. The thermal bonding film portions 781 to 783 may be used to bond the mid-plane 750 to one of the base frames 730 shown in FIG. 7B. In some implementations, the midplane 750 may include more or less than the thermal bonding film portion shown in FIG. 7A. In some embodiments, the thermally bonded film portions 781 to 783 may have different surface areas, thicknesses, and / or the like. For example, the heat-bonded film portion 781 may have a surface area different from that of the heat-bonded film portion 782. As another example, the heat-bonded film portion 781 may have a thickness different from that of the heat-bonded film portion 782.

熱結合膜部分781至783可經組態以在施加熱量時熔化,此活化 熱結合膜部分781至783。在活化(且隨後冷卻並凝固)熱結合膜部分781至783之後,可使用熱結合膜部分781至783以將中平面750耦合至基座框架730。在一些實施方案中,熱結合膜部分781至783之一或多者可具有一黏著劑,該黏著劑促進在經由加熱活化熱結合膜部分781至783之一或多者之前將中平面750耦合至基座框架730之通道760之一內表面。在一些實施方案中,熱結合膜部分781至783之一或多者可在熔化時被活化。在一些實施方案中,熱結合膜部分781至783之一或多者之熔點可大於100℃(例如110℃、130℃、180℃、250℃)。 The thermally bonded film portions 781 to 783 can be configured to melt upon application of heat, and this activation Thermally bonded film portions 781 to 783. After activating (and subsequently cooling and solidifying) the thermal bonding film portions 781 to 783, the thermal bonding film portions 781 to 783 may be used to couple the midplane 750 to the base frame 730. In some embodiments, one or more of the thermally bonded film portions 781 to 783 may have an adhesive that facilitates coupling the midplane 750 before activating one or more of the thermally bonded film portions 781 to 783 via heating. To one of the inner surfaces of the channel 760 of the base frame 730. In some embodiments, one or more of the thermally bonded film portions 781-783 may be activated upon melting. In some embodiments, the melting point of one or more of the thermally bonded film portions 781 to 783 may be greater than 100 ° C (eg, 110 ° C, 130 ° C, 180 ° C, 250 ° C).

圖7B繪示具有安置在基座框架730之一通道760內之部分之中平面750。如圖7B中所示,用虛線繪示熱結合膜部分781、782、783。中平面750之至少一部分及/或基座框架730之一部分可經加熱使得熱結合膜部分781、782、783之一或多者可熔化,使得基座框架730可經由熱結合膜部分781、782、783耦合至中平面750。 FIG. 7B illustrates a midplane 750 having a portion disposed within a channel 760 of the base frame 730. As shown in FIG. 7B, the heat-bonded film portions 781, 782, and 783 are shown with dotted lines. At least a portion of the mid-plane 750 and / or a portion of the base frame 730 may be heated such that one or more of the thermally bonded film portions 781, 782, 783 can be melted such that the base frame 730 can pass through the thermally bonded film portions 781, 782 , 783 are coupled to the mid-plane 750.

在此實施方案中,可施加熱量使得熱結合膜部分781至783以一所要方式黏著。例如,可在施加熱量於基座框架730之前施加熱量於中平面750,或反之亦然。換言之,可以一兩級方式施加熱量。在一些實施方案中,可在長於施加熱量於基座框架730之一時間週期期間施加熱量於中平面750,或反之亦然。在一些實施方案中,可將不同於施加於基座框架730之一熱量溫度之一熱量溫度施加於中平面750。在一些實施方案中,可加熱中平面750之不同表面積及/或基座框架730之表面積。施加熱量之差異可歸因於中平面750及/或基座框架730具有不同(例如,非均勻)導熱性、不同(例如,非均勻)厚度、不同(例如,非均勻)長度等等。藉由以不同於施加熱量於基座框架730之一方式施加熱量於中平面750,可使用熱結合膜部分781、782、783以依一所要方式將中平面750黏著至基座框架730。 In this embodiment, heat may be applied so that the heat-bonding film portions 781 to 783 are adhered in a desired manner. For example, the heat may be applied to the mid-plane 750 before the heat is applied to the base frame 730, or vice versa. In other words, heat can be applied in a two-stage manner. In some embodiments, heat may be applied to the mid-plane 750 for a period of time longer than applying heat to the base frame 730, or vice versa. In some implementations, a thermal temperature different from one applied to the base frame 730 can be applied to the mid-plane 750. In some embodiments, different surface areas of the mid-plane 750 and / or the surface area of the base frame 730 can be heated. The difference in the applied heat can be attributed to different (e.g., non-uniform) thermal conductivity, different (e.g., non-uniform) thickness, different (e.g., non-uniform) length of the mid-plane 750 and / or base frame 730. By applying heat to the mid-plane 750 in a manner different from applying heat to the base frame 730, the mid-plane 750 can be adhered to the base frame 730 in a desired manner using the thermal bonding film portions 781, 782, 783.

圖8係繪示將一中平面熱結合至一基座框架之一方法之一圖。在 一些實施方案中,可使用該方法以耦合上述基座框架及中平面組態之任一者。 FIG. 8 is a diagram illustrating a method for thermally bonding a midplane to a base frame. in In some embodiments, the method can be used to couple any of the above-mentioned base frames and mid-plane configurations.

如圖8中所示,包含一熱結合膜之中平面之一部分移動至一基座框架之一通道中(方塊810)。熱結合膜可安置在中平面之該部分與基座框架之通道之一內表面之間。在一些實施方案中,熱結合膜可包含熱結合膜之多個部分。在一些實施方案中,中平面之該部分可使用上述傾斜方法之一或多者移動至通道中。在一些實施方案中,熱結合膜可包含一黏著劑(例如,一暫時黏著劑)使得中平面可至少暫時耦合至基座框架之通道之內表面直至可施加熱量以活化熱結合膜。 As shown in FIG. 8, a portion of the midplane containing a thermally bonded film is moved into a channel of a base frame (block 810). The thermal bonding film may be disposed between the portion of the mid-plane and an inner surface of a channel of the base frame. In some embodiments, a thermally bonded film can include multiple portions of a thermally bonded film. In some embodiments, the portion of the midplane can be moved into the channel using one or more of the above-mentioned tilting methods. In some embodiments, the thermal bonding film can include an adhesive (eg, a temporary adhesive) such that the midplane can be coupled to the inner surface of the channel of the base frame at least temporarily until heat can be applied to activate the thermal bonding film.

施加熱量於基座框架之一表面使得熱結合膜活化(方塊820)。在一些實施方案中,當熱結合膜熔化時可活化熱結合膜。在一些實施方案中,可以一兩級過程施加熱量。在一些實施方案中,可施加熱量於基座框架之表面以及中平面之一表面。在一些實施方案中,可施加熱量於中平面而非基座框架以活化熱結合膜。結合至少圖31A至圖38描述與熱處理相關之更多細節。 Applying heat to one surface of the base frame activates the thermal bonding film (block 820). In some embodiments, the heat-bondable film can be activated when the heat-bonded film is melted. In some embodiments, heat can be applied in a two-stage process. In some embodiments, heat can be applied to the surface of the base frame and one surface of the midplane. In some embodiments, heat may be applied to the mid-plane rather than the base frame to activate the thermally bonded membrane. More details related to the heat treatment are described in connection with at least FIGS. 31A to 38.

圖9A係繪示具有安置在一基座框架930之一通道960內之至少一部分之一構架組件970之一圖。如圖9A中所示,一中平面950亦具有安置在通道960及基座框架930內之至少一些部分。基座框架930包含一頂壁961及一側壁962。用虛線繪示中平面950之至少一些邊緣。 FIG. 9A is a diagram illustrating a frame assembly 970 having at least a portion disposed within a channel 960 of a base frame 930. As shown in FIG. 9A, a midplane 950 also has at least some portions disposed within the channel 960 and the base frame 930. The base frame 930 includes a top wall 961 and a side wall 962. At least some edges of the midplane 950 are depicted with dashed lines.

構架組件970具有安置在基座框架930之一第一遠端部分936中之一第一端部971,且具有安置在基座框架930之一第二遠端部分937中之一第二端部972。具體言之,第一端部971之一部分安置在第一遠端部分936之通道960之一部分中,且第二端部972之一部分安置在第二遠端部分937之通道960之一部分中。 The frame assembly 970 has a first end portion 971 disposed in one of the first distal end portions 936 of the base frame 930 and a second end portion disposed in one of the second distal portions 937 of the base frame 930 972. Specifically, a portion of the first end portion 971 is disposed in a portion of the channel 960 of the first distal portion 936, and a portion of the second end portion 972 is disposed in a portion of the channel 960 of the second distal portion 937.

在一些實施方案中,構架組件970可耦合至或接觸通道960之一或多個部分之一內表面。在一些實施方案中,構架組件970之一或多 個部分可使用諸如一螺釘、一鉚釘及/或等等之一或多個耦合機構耦合至基座框架930。在一些實施方案中,構架組件970可具有壓入配合至基座框架930之通道960中之一或多個部分。 In some implementations, the framework assembly 970 can be coupled to or contact an inner surface of one or more portions of the channel 960. In some embodiments, one or more of the framework components 970 The portions may be coupled to the base frame 930 using one or more coupling mechanisms such as a screw, a rivet, and / or the like. In some implementations, the frame assembly 970 may have one or more portions that are press-fitted into the channels 960 of the base frame 930.

第一遠端部分936及第二遠端部分937與基座框架930之一近端部分934相對。基座框架930具有安置在第一遠端部分936與近端部分934之間之一第一側部分935且具有安置在第二遠端部分937與近端部分934之間之一第二側部分938。 The first distal end portion 936 and the second distal end portion 937 are opposite to a proximal end portion 934 of the base frame 930. The base frame 930 has a first side portion 935 disposed between the first distal portion 936 and the proximal portion 934 and has a second side portion disposed between the second distal portion 937 and the proximal portion 934 938.

如圖9A中所示,構架組件970可接觸中平面950之至少一部分。在一些實施方案中,構架組件970可使用諸如一螺釘、一鉚釘、一焊點及/或等等之一或多個耦合機構耦合至(例如,固定地耦合至)中平面950。雖然圖9A中未展示,但是在一些實施方案中,可在構架組件970與中平面950之間安置一間隙。在一些實施方案中,構架組件970可使用諸如一螺釘、一鉚釘、一焊點及/或等等之一耦合機構耦合至中平面950使得構架組件970不以其他方式固定地耦合至基座框架930。 As shown in FIG. 9A, the frame assembly 970 may contact at least a portion of the midplane 950. In some implementations, the frame assembly 970 can be coupled to (eg, fixedly coupled to) the midplane 950 using one or more coupling mechanisms such as a screw, a rivet, a solder joint, and / or the like. Although not shown in FIG. 9A, in some embodiments, a gap may be placed between the frame assembly 970 and the midplane 950. In some embodiments, the frame assembly 970 may be coupled to the midplane 950 using a coupling mechanism such as a screw, a rivet, a solder joint, and / or the like so that the frame assembly 970 is not otherwise fixedly coupled to the base frame 930.

如圖9A中所示,構架組件970之一長度I1(或距離)大於第一遠端部分936之一端與第二遠端部分937之一端之間之一長度I2(或距離)。構架組件970之長度I1可大於或等於相關聯於第一側部分935之通道960之一部分之一內表面與相關聯於第二側部分938之通道960之一部分之一內表面之間之一長度(未展示)。構架組件970之長度I1小於中平面950之一長度I3。在一些實施方案中,構架組件970之長度I1可大於或等於中平面950之長度I3。 As shown in FIG. 9A, one length I1 (or distance) of the frame assembly 970 is greater than one length I2 (or distance) between one end of the first distal portion 936 and one end of the second distal portion 937. The length I1 of the frame component 970 may be greater than or equal to a length between an inner surface of a portion of the channel 960 associated with the first side portion 935 and an inner surface of a portion of the channel 960 associated with the second side portion 938. (Not shown). The length I1 of the frame component 970 is smaller than the length I3 of one of the mid-planes 950. In some embodiments, the length I1 of the framework component 970 may be greater than or equal to the length I3 of the mid-plane 950.

雖然未展示,但是在一些實施方案中,構架組件970之第一端部971之至少一部分可安置在第一側部分935之通道960內。此外,構架組件970之第二端部972之至少一部分可安置在第二側部分938之通道960內。在此等實施方案中,構架組件970之長度I1可長於圖9A中所示 之長度。 Although not shown, in some embodiments, at least a portion of the first end portion 971 of the frame assembly 970 may be disposed within the channel 960 of the first side portion 935. In addition, at least a portion of the second end portion 972 of the frame assembly 970 may be disposed within the channel 960 of the second side portion 938. In these embodiments, the length I1 of the frame assembly 970 may be longer than that shown in FIG. 9A Its length.

如圖9A中所示,中平面950包含凹陷951、952。在一些實施方案中,凹陷951、952可稱作狹槽。中平面950之凹陷951、952可用以促進將中平面950耦合至基座框架930及/或構架組件970。 As shown in FIG. 9A, the mid-plane 950 includes depressions 951, 952. In some embodiments, the depressions 951, 952 may be referred to as slots. The depressions 951, 952 of the mid-plane 950 may be used to facilitate coupling the mid-plane 950 to the base frame 930 and / or the frame assembly 970.

圖9B係繪示沿圖9A中所示之線I6取得之中平面950之一截面圖之一圖。圖9B繪示中平面950之凹陷951、952。中平面950之至少一部分安置在第一側部分935之通道960內,且中平面950之至少一部分安置在第二側部分938之通道960內。 FIG. 9B is a diagram showing a cross-sectional view of a midplane 950 taken along line I6 shown in FIG. 9A. FIG. 9B illustrates the depressions 951 and 952 of the mid-plane 950. At least a portion of the mid-plane 950 is disposed in the channel 960 of the first side portion 935, and at least a portion of the mid-plane 950 is disposed in the channel 960 of the second side portion 938.

圖9C係繪示沿圖9A中所示之線I7取得之構架組件970之一截面圖之一圖。圖9C繪示對應於(且可接合)中平面950之凹陷951、952之突部974、975。當(沿進入圖9A中之一方向)插入至基座框架930中時,突部974、975(亦在圖9A、圖9D及圖9E中加以展示)可插入至凹陷951、952中。在突部974、975插入至凹陷951、952中之後,構架組件970可(沿圖9A中所示之方向I8)滑動地移動。 FIG. 9C is a diagram showing a cross-sectional view of the frame assembly 970 taken along the line I7 shown in FIG. 9A. FIG. 9C illustrates the protrusions 974, 975 corresponding to (and engageable) the depressions 951, 952 of the midplane 950. When inserted into the base frame 930 (in a direction entering one of FIG. 9A), the protrusions 974, 975 (also shown in FIGS. 9A, 9D, and 9E) can be inserted into the recesses 951, 952. After the protrusions 974, 975 are inserted into the depressions 951, 952, the frame assembly 970 can be slidably moved (in the direction I8 shown in FIG. 9A).

圖9D係繪示當突部974、975安置在中平面950之對應凹陷951、952內時該構架組件970之一圖。構架組件970靠近遠端部分936及遠端部分937。 FIG. 9D is a diagram of the frame assembly 970 when the protrusions 974 and 975 are disposed in the corresponding depressions 951 and 952 of the mid-plane 950. The frame assembly 970 is near the distal portion 936 and the distal portion 937.

圖9E係繪示沿圖9D之線I9切割之構架組件970及中平面950之一截面圖之一圖。如圖9D中所示,突部974安置在凹陷951中,且突部975安置在凹陷952中。在此實施方案中,在第一端部971與第一側部分935之一表面之間安置一間隙,且在第二端部972與第二側部分938之一表面之間安置一間隙。在如圖9D及圖9E中所示般耦合之後,構架組件970可相對於中平面950及基座框架930沿方向I8自圖9D及圖9E中所示之組態可滑動地移動至圖9A中所示之組態(自一第一位置移動至一第二位置)。 FIG. 9E is a diagram showing a cross-sectional view of the frame assembly 970 and the mid-plane 950 cut along the line I9 of FIG. 9D. As shown in FIG. 9D, the protrusion 974 is disposed in the depression 951, and the protrusion 975 is disposed in the depression 952. In this embodiment, a gap is disposed between the first end portion 971 and one surface of the first side portion 935, and a gap is disposed between the second end portion 972 and one surface of the second side portion 938. After coupling as shown in FIGS. 9D and 9E, the frame assembly 970 can be slidably moved from the configuration shown in FIGS. 9D and 9E to FIG. 9A relative to the midplane 950 and the base frame 930 in the direction I8 The configuration shown in (moving from a first position to a second position).

雖然繪示為具有一突部,但是在一些實施方案中,一構架組件 可不包含一突部。在一些實施方案中,一中平面亦可不包含一突部。在此等實施方案中,構架組件可在不具有接合中平面之一凹陷之一突部的情況下沿中平面可滑動地移動。 Although shown as having a protrusion, in some embodiments, a framework component It may not include a protrusion. In some embodiments, a midplane may not include a protrusion. In these embodiments, the frame assembly is slidably movable along the midplane without having a protrusion that engages one of the depressions of the midplane.

圖10A至圖10E繪示經由一構架組件1070耦合一計算裝置之一顯示器部分1090與一基座框架1030及中平面1050。具體言之,圖10A係繪示耦合至構架組件1070之計算裝置之顯示器部分1090之一圖。在此實施方案中,顯示器部分1090耦合至構架組件1070,同時構架組件1070接觸安置在基座框架1030內之中平面1050。可在中平面1050之凹陷1051、1052內安置突部(未展示)。用一虛線繪示構架組件1070,此係因為其安置在顯示器部分1090與中平面1050之間。 10A to 10E illustrate a display portion 1090 of a computing device coupled to a base frame 1030 and a midplane 1050 via a frame assembly 1070. Specifically, FIG. 10A is a diagram illustrating a display portion 1090 of a computing device coupled to the frame assembly 1070. In this embodiment, the display portion 1090 is coupled to the frame assembly 1070 while the frame assembly 1070 contacts a midplane 1050 disposed within the base frame 1030. Projections (not shown) can be placed in the depressions 1051, 1052 of the mid-plane 1050. The frame assembly 1070 is shown with a dashed line because it is disposed between the display portion 1090 and the mid-plane 1050.

顯示器部分1090及構架組件1070可沿方向J1可滑動地移動使得顯示器部分1090可以一所要方式相對於基座框架1030定向。顯示器部分1090及構架組件1070可以圖10A中繪示之方式耦合,使得顯示器部分1090可被組裝為計算裝置之部分。換言之,顯示器部分1090可經由構架組件1070及中平面1050組裝為具有基座框架1030之計算裝置的部件。換言之,構架組件1070可用作藉以將顯示器部分1090耦合至基座框架1030之一組件。 The display portion 1090 and the frame assembly 1070 are slidably movable in the direction J1 so that the display portion 1090 can be oriented relative to the base frame 1030 in a desired manner. The display portion 1090 and the frame assembly 1070 can be coupled in the manner shown in FIG. 10A, so that the display portion 1090 can be assembled as a part of a computing device. In other words, the display portion 1090 can be assembled as a component of a computing device having a base frame 1030 via the frame assembly 1070 and the mid-plane 1050. In other words, the frame assembly 1070 can be used as one of the components by which the display portion 1090 is coupled to the base frame 1030.

在一些實施方案中,方向J1可正交於(例如,實質上正交於)一橫向方向(繪示為方向J8或方向J9),中平面1050沿該橫向方向插入至基座框架1030之通道之一或多者中(如結合上述圖式描述)。 In some embodiments, the direction J1 may be orthogonal to (eg, substantially orthogonal to) a lateral direction (shown as direction J8 or direction J9), along which the midplane 1050 is inserted into the channel of the base frame 1030 One or more of them (as described in conjunction with the above drawings).

圖10B係繪示沿計算裝置之線J2切割之一截面圖之一圖。如圖10B中所示,顯示器部分1090沿一平面J3對準,平面J3實質上平行於一平面J4,基座框架1030與中平面1050沿平面J4對準。因此,當顯示器部分1090經由中平面1050及構架組件1070耦合至基座框架1030時,顯示器部分1090可沿方向J1相對於基座框架1030平移。在一些實施方案中,圖10B中所示之組件可經構造使得當平面J3(顯示器部分1090沿 其對準)平行於或實質上平行於平面J4(基座框架1030沿其對準)時,顯示器部分1090可相對於基座部分1030可滑動地移動。 FIG. 10B is a diagram showing a cross-sectional view taken along line J2 of the computing device. As shown in FIG. 10B, the display portion 1090 is aligned along a plane J3, the plane J3 is substantially parallel to a plane J4, and the base frame 1030 and the midplane 1050 are aligned along the plane J4. Therefore, when the display portion 1090 is coupled to the base frame 1030 via the mid-plane 1050 and the frame assembly 1070, the display portion 1090 can be translated relative to the base frame 1030 in the direction J1. In some embodiments, the components shown in FIG. 10B can be configured such that when the plane J3 (display portion 1090 along When its alignment) is parallel to or substantially parallel to the plane J4 (the base frame 1030 is aligned along it), the display portion 1090 can be slidably moved relative to the base portion 1030.

圖10C係繪示構架組件1070插入至中平面1050及基座框架1030中之前耦合至該構架組件1070之顯示器部分1090之一側視圖之一圖。在此圖中,展示構架組件1070之一突部1071。在一些實施方案中,突部1071可以不同於圖10C中所示之一方式相對於構架1070定向。例如,突部1071可定向在不同於圖10C中所示之構架組件1070之一側上。 10C is a side view of a display unit 1090 coupled to the frame assembly 1070 before the frame assembly 1070 is inserted into the mid-plane 1050 and the base frame 1030. FIG. In this figure, one protrusion 1071 of the frame assembly 1070 is shown. In some embodiments, the protrusions 1071 may be oriented relative to the frame 1070 in a manner different from that shown in FIG. 10C. For example, the protrusion 1071 may be oriented on a side different from the framework assembly 1070 shown in FIG. 10C.

返回參考圖10A,一間隙1038安置在第一遠端部分1036與第二遠端部分1037之間(或開裂於基座框架1030中)。換言之,基座框架1030在第一遠端部分1036與第二遠端部分1037之間界定一間隙1038使得通道1060未鄰接在第一遠端部分1036與第二遠端部分1037之間。基座框架1030可具有間隙1038使得與顯示器部分1090相關聯之一鉸鏈1092(或其之一部分)可安置在間隙1038內。在一些實施方案中,當由一使用者操作計算裝置100時,鉸鏈1092可具有旋轉進入或穿過間隙1038之一部分。顯示器部分1090之至少一部分可經組態以經由一軸使用鉸鏈1092旋轉遠離基座框架1030。一旋轉方向之一實例被繪示為圖10E中之方向J10。圖1B中展示一顯示器部分經旋轉遠離一基座部分(其包含一基座框架)之一實例。 Referring back to FIG. 10A, a gap 1038 is disposed between the first distal portion 1036 and the second distal portion 1037 (or cracked in the base frame 1030). In other words, the base frame 1030 defines a gap 1038 between the first distal portion 1036 and the second distal portion 1037 so that the channel 1060 does not abut between the first distal portion 1036 and the second distal portion 1037. The base frame 1030 may have a gap 1038 such that one of the hinges 1092 (or a portion thereof) associated with the display portion 1090 may be disposed within the gap 1038. In some embodiments, when the computing device 100 is operated by a user, the hinge 1092 may have a portion that rotates into or through the gap 1038. At least a portion of the display portion 1090 may be configured to rotate away from the base frame 1030 using a hinge 1092 via an axis. An example of a rotation direction is shown as the direction J10 in FIG. 10E. An example of a display portion rotated away from a base portion (which includes a base frame) is shown in FIG. 1B.

圖10D係繪示顯示器部分1090沿方向J1移動之後計算裝置之一俯視圖之一圖。基座框架1030及耦合至其之組件在此視圖中不可見,此係因為其等被顯示器部分1090隱藏。圖10E係繪示沿圖10D之J2切割之計算裝置之一截面圖之一圖。如圖10E中所示,顯示器部分1090係安置在基座框架1030上。 10D is a plan view of a computing device after the display portion 1090 is moved in the direction J1. The base frame 1030 and the components coupled to it are not visible in this view because they are hidden by the display portion 1090. FIG. 10E is a diagram illustrating a cross-sectional view of a computing device cut along J2 in FIG. 10D. As shown in FIG. 10E, the display portion 1090 is disposed on the base frame 1030.

圖11係繪示用於組裝一計算裝置之組件之一方法之一流程圖。具體言之,該流程圖繪示用於經由一中平面及一構架組件組裝一顯示器部分與一基座框架之一方法。 11 is a flowchart illustrating a method for assembling components of a computing device. Specifically, the flowchart illustrates a method for assembling a display portion and a base frame via a mid-plane and a frame assembly.

如圖11中所示,一中平面之至少一邊緣沿一第一方向移動至一計算裝置之一基座框架內之一通道中(方塊1110)。在一些實施方案中,該移動可類似於上文結合(例如)圖3A至圖8描述之移動方法。 As shown in FIG. 11, at least one edge of a mid-plane is moved in a first direction into a channel in a base frame of a computing device (block 1110). In some embodiments, the movement may be similar to the movement method described above in connection with, for example, FIGS. 3A-8.

一顯示器部分耦合至一構架組件(方塊1120)。在一些實施方案中,顯示器部分可包含耦合至構架組件之一鉸鏈。在一些實施方案中,鉸鏈可使用諸如一螺釘及/或等等之一或多個耦合機構耦合至構架組件。 A display portion is coupled to a frame assembly (block 1120). In some embodiments, the display portion may include a hinge coupled to one of the frame components. In some embodiments, the hinge may be coupled to the frame assembly using one or more coupling mechanisms such as a screw and / or the like.

構架組件之一突部在包含於中平面中之一凹陷中移動使得中平面沿實質上平行於顯示器部分沿著對準之一平面之平面對準(方塊1130)。在一些實施方案中,中平面可不具有一突部及/或構架可不具有一凹陷。在一些實施方案中,顯示器部分可在構架組件接觸中平面之後耦合至構架組件。 A protrusion of the frame assembly moves in a recess included in the mid-plane such that the mid-plane is aligned along a plane substantially parallel to the display portion along a plane aligned with one of the planes (block 1130). In some embodiments, the mid-plane may not have a protrusion and / or the frame may not have a depression. In some implementations, the display portion can be coupled to the frame assembly after the frame assembly contacts the midplane.

顯示器部分相對於中平面沿實質上正交於第一方向之一第二方向可滑動地移動(方塊1140)。在一些實施方案中,顯示器部分可在構架組件相對於中平面可滑動地移動之後耦合至構架組件。在一些實施方案中,顯示器部分可滑動地移動直至顯示器部分相對於基座框架處於一所要位置中。在一些實施方案中,顯示器部分可滑動地移動直至基座組件在一所要位置中相對於中平面對準使得基座組件可耦合至(例如,固定地耦合至)中平面。在一些實施方案中,顯示器部分可滑動地移動直至基座組件安置在基座框架之一或多個通道內(或接觸該一或多個通道之一內表面)。 The display portion is slidably movable with respect to the midplane in a second direction that is substantially orthogonal to the first direction (block 1140). In some embodiments, the display portion may be coupled to the frame assembly after the frame assembly is slidably moved relative to the mid-plane. In some embodiments, the display portion is slidably moved until the display portion is in a desired position relative to the base frame. In some embodiments, the display portion is slidably moved until the base assembly is aligned relative to the midplane in a desired position such that the base assembly can be coupled to (eg, fixedly coupled to) the midplane. In some embodiments, the display portion is slidably moved until the base assembly is seated in (or contacts an inner surface of) the one or more channels of the base frame.

圖12係繪示根據一實施方案之一板1290之一圖。可稱作一底板、一導電板(例如,一導熱板)或一背板之板1290可耦合至(或接觸)一中平面1250及一構架組件1270,其等耦合至一基座框架1230。例如,板1290可具有耦合至中平面1250之一第一部分及耦合至構架組件1270之一第二部分。換言之,板1290之至少一部分可自中平面1250懸 垂且可如圖12中所示般安置在構架組件1270之至少一部分上方。在一些實施方案中,板1290可使用諸如一螺釘、一鉚釘、一焊點、一黏著劑及/或等等之一或多個耦合機構固定地耦合至中平面1250及/或構架組件1270。 FIG. 12 is a diagram of a plate 1290 according to an embodiment. A plate 1290, which may be referred to as a base plate, a conductive plate (eg, a thermally conductive plate), or a back plate, may be coupled (or contact) a mid-plane 1250 and a frame assembly 1270, which are coupled to a base frame 1230. For example, plate 1290 may have a first portion coupled to a midplane 1250 and a second portion coupled to a frame assembly 1270. In other words, at least a portion of the plate 1290 can be suspended from the midplane 1250 It is vertical and can be positioned over at least a portion of the frame assembly 1270 as shown in FIG. 12. In some embodiments, the plate 1290 may be fixedly coupled to the midplane 1250 and / or the frame assembly 1270 using one or more coupling mechanisms such as a screw, a rivet, a solder joint, an adhesive, and / or the like.

在一些實施方案中,板1290可耦合至(或接觸)中平面1250但不耦合至(或接觸)構架組件1270。在一些實施方案中,板1290可耦合至(或接觸)構架組件1270但不耦合至(或接觸)中平面1250。 In some implementations, the board 1290 may be coupled (or contacting) the midplane 1250 but not coupled (or contacting) the frame assembly 1270. In some implementations, the board 1290 may be coupled (or contacting) the frame assembly 1270 but not coupled (or contacting) the midplane 1250.

在一些實施方案中,板1290可與中平面1250及構架組件1270兩者分離(例如,藉由一間隙與中平面1250及構架組件1270兩者絕緣)。在此等實施方案中,包含於計算裝置中之其他組件可安置在板1290與中平面1250之間,及/或可安置在板1290與構架組件1270之間。在一些實施方案中,板1290可在具有一相對較小表面積之幾個位置處耦合至中平面1250及/或構架組件1270。 In some implementations, the board 1290 can be separated from both the mid-plane 1250 and the frame assembly 1270 (eg, insulated from both the mid-plane 1250 and the frame assembly 1270 by a gap). In these implementations, other components included in the computing device may be disposed between the plate 1290 and the midplane 1250, and / or may be disposed between the plate 1290 and the frame component 1270. In some embodiments, the plate 1290 may be coupled to the mid-plane 1250 and / or the frame assembly 1270 at several locations having a relatively small surface area.

如圖12中所示,板1290可安置在基座框架1230之一或多個通道1260外部。板1290包含在由基座框架1230界定之一開口1202之至少一部分中(例如,安置在該至少一部分內)。 As shown in FIG. 12, the plate 1290 may be disposed outside one or more of the channels 1260 of the base frame 1230. The plate 1290 is contained in at least a portion of one of the openings 1202 defined by the base frame 1230 (eg, disposed within the at least a portion).

在一些實施方案中,板1290可用作用於包含基座框架1230及其組件之一計算裝置之一散熱片。例如,一或多個電子組件可耦合至中平面1250。可經由中平面1250透過中平面1250直接耦合至板1290將熱量轉移至板1290(或反之亦然)。類似地,可透過構架組件1270直接耦合至板1290將來自耦合至構架組件1270之一或多個電子組件之熱量轉移至板1290(或反之亦然)。 In some embodiments, the board 1290 can be used as a heat sink for a computing device containing a base frame 1230 and one of its components. For example, one or more electronic components may be coupled to the midplane 1250. Heat can be transferred to the plate 1290 via the mid-plane 1250 through the mid-plane 1250 directly coupled to the plate 1290 (or vice versa). Similarly, heat from one or more electronic components coupled to the frame component 1270 can be transferred to the plate 1290 (or vice versa) through the frame component 1270 directly coupled to the plate 1290.

一導電元件或材料(未展示)可用以轉移中平面1250與板1290之間之熱量(或促進其等之間的熱量轉移)及/或轉移構架組件1270與板1290之間之熱量(或促進其等之間的熱量轉移)。雖然圖12中未展示,但是在一些實施方案中,導電元件或材料可包含諸如石墨或另一材料之一 或多種材料。 A conductive element or material (not shown) may be used to transfer the heat between the midplane 1250 and the plate 1290 (or promote the heat transfer between them) and / or transfer the heat between the frame component 1270 and the board 1290 (or promote Heat transfer between them). Although not shown in FIG. 12, in some implementations, the conductive element or material may include one such as graphite or another material Or multiple materials.

中平面1250、構架組件1270及板1290可各由一導電材料製成或可包含一導電材料。在一些實施方案中,中平面1250、構架組件1270及板1290之一或多者可由一絕緣材料製成或可包含一絕緣材料。在一些實施方案中,板1290可由不同於中平面1250及/或構架組件1270之一材料製成。例如,板1290可由鋁材料(或合金)製成,且中平面1250可由鎂材料(或合金)製成。作為另一實例,板1290可由鋁材料(或合金)製成,且構架組件1270可由鎂材料(或合金)製成。 The midplane 1250, the frame assembly 1270, and the plate 1290 may each be made of a conductive material or may include a conductive material. In some implementations, one or more of the midplane 1250, the frame assembly 1270, and the plate 1290 can be made of or include an insulating material. In some embodiments, the plate 1290 may be made of a material other than the mid-plane 1250 and / or the frame assembly 1270. For example, the plate 1290 may be made of an aluminum material (or alloy), and the mid-plane 1250 may be made of a magnesium material (or alloy). As another example, the plate 1290 may be made of an aluminum material (or alloy), and the frame assembly 1270 may be made of a magnesium material (or alloy).

如圖12中所示,板1290之一表面積可不同於中平面1250之一表面積。板1290之表面積可小於中平面1250之表面積。 As shown in FIG. 12, a surface area of the plate 1290 may be different from a surface area of the mid-plane 1250. The surface area of the plate 1290 may be smaller than the surface area of the mid-plane 1250.

雖然圖12中未展示,但是在一些實施方案中,與計算裝置相關聯之一或多個腳墊(未展示)可耦合至板1290。在此等實施方案中,亦可經由腳墊將轉移至板1290之熱量轉移至另一結構,諸如上面放置電腦裝置之一桌子。 Although not shown in FIG. 12, in some implementations, one or more foot pads (not shown) associated with the computing device may be coupled to the board 1290. In such embodiments, the heat transferred to the board 1290 can also be transferred to another structure via a foot pad, such as a table on which a computer device is placed.

圖13係繪示耦合至一板1390之一中平面1350之一側截面圖之一圖。如圖13中所示,一構架組件1370耦合至中平面1350。在此實施方案中,中平面1350經由係中平面1350之部分之一突部1352耦合至板1390。在一些實施方案中,突部1352可具有不同於圖13中所示之一組態。在一些實施方案中,板1390可具有一或多個突部,板1390可透過該一或多個突部耦合至中平面1350。 FIG. 13 is a diagram showing a side cross-sectional view coupled to a midplane 1350 of a plate 1390. As shown in FIG. 13, a frame assembly 1370 is coupled to the midplane 1350. In this embodiment, the midplane 1350 is coupled to the plate 1390 via a protrusion 1352 that is a portion of the midplane 1350. In some embodiments, the protrusions 1352 may have a different configuration than that shown in FIG. 13. In some embodiments, the plate 1390 may have one or more protrusions through which the plate 1390 may be coupled to the midplane 1350.

在此側截面圖中,一導電元件1310耦合至中平面1350並耦合至板1390。導電元件1310可經組態以促進將熱量自中平面1350轉移至底板1390,或反之亦然。 In this side sectional view, a conductive element 1310 is coupled to a midplane 1350 and is coupled to a board 1390. The conductive element 1310 may be configured to facilitate the transfer of heat from the mid-plane 1350 to the base plate 1390, or vice versa.

此外,如圖13之此側截面圖中所示,一腳墊1315耦合至板1390。在一些實施方案中,腳墊1315可經由一電腦裝置之一殼體或外殼(未展示)耦合至板1390。 Further, as shown in this side sectional view of FIG. 13, a foot pad 1315 is coupled to the board 1390. In some embodiments, the foot pad 1315 may be coupled to the board 1390 via a housing or housing (not shown) of a computer device.

圖14A係繪示根據一實施方案之一計算裝置之一基座框架1430之一俯視透視圖之一圖。基座框架1430可連同(例如)一構架組件(未展示)及一中平面(未展示)耦合在一起作為計算裝置之一結構。 FIG. 14A illustrates a top perspective view of a base frame 1430 of a computing device according to an embodiment. The base frame 1430 may be coupled as, for example, a framework component (not shown) and a midplane (not shown) as a structure of a computing device.

如圖14A中所示,基座框架1430(其具有一外表面1432)具有沿基座框架1430之整個周長延伸之一通道1460。具體言之,通道1460係由一側壁1462、一頂壁1461及一底壁1463界定。圖14A中繪示通道1460之一內表面1464。 As shown in FIG. 14A, the base frame 1430 (which has an outer surface 1432) has a channel 1460 extending along the entire circumference of the base frame 1430. Specifically, the channel 1460 is defined by a side wall 1462, a top wall 1461, and a bottom wall 1463. An inner surface 1464 of one of the channels 1460 is shown in FIG. 14A.

通道1460包含於一第一遠端部分1436(亦可稱作一構架耦合部分)及一第二遠端部分1437(亦可稱作一構架耦合部分)。通道1460亦包含於基座框架1430之一近端部分1434中。 The channel 1460 is included in a first distal portion 1436 (also referred to as a frame coupling portion) and a second distal portion 1437 (also referred to as a frame coupling portion). The channel 1460 is also contained in a proximal portion 1434 of the base frame 1430.

基座框架1430亦包含一第一延伸部部分1438及一第二延伸部部分1439。與第一延伸部部分1438相關聯之通道1460之一部分鄰接與第一遠端部分1436相關聯之通道1460之一部分。類似地,與第二延伸部部分1439相關聯之通道1460之一部分鄰接與第二延伸部部分1439相關聯之通道1460之一部分。 The base frame 1430 also includes a first extension portion 1438 and a second extension portion 1439. A portion of the channel 1460 associated with the first extension portion 1438 abuts a portion of the channel 1460 associated with the first distal portion 1436. Similarly, a portion of the channel 1460 associated with the second extension portion 1439 abuts a portion of the channel 1460 associated with the second extension portion 1439.

在此實施方案中,基座框架1430包含用於(例如)一軌跡板或其他類型的輸入裝置之一開口1466。基座框架1430亦界定其中可插入一中平面之一開口1401。此外,一鍵盤或其他類型的輸入裝置可安置在開口1401內。基座框架1430之頂壁1461具有包含或界定掌托區域1467之一頂面。 In this embodiment, the base frame 1430 includes an opening 1466 for, for example, a trackpad or other type of input device. The base frame 1430 also defines an opening 1401 into which a midplane can be inserted. In addition, a keyboard or other type of input device may be disposed in the opening 1401. The top wall 1461 of the base frame 1430 has a top surface that includes or defines a palm rest region 1467.

如圖14A中所示,一開口1492包含於基座框架1430之至少一部分中(例如,由該至少一部分界定)。具體言之,開口1492安置在側壁1462之至少一部分內。開口1492可為可透過其安置一或多個電子組件之一開口。例如,一USB埠、一電源埠、一信號埠、一音訊埠、一記憶體埠及/或等等可經由開口1492曝露在基座框架1430外部。 As shown in FIG. 14A, an opening 1492 is included in at least a portion of the base frame 1430 (eg, defined by the at least a portion). Specifically, the opening 1492 is disposed within at least a portion of the side wall 1462. The opening 1492 may be one of the openings through which one or more electronic components may be disposed. For example, a USB port, a power port, a signal port, an audio port, a memory port, and / or the like can be exposed outside the base frame 1430 through the opening 1492.

如圖14A中所示,基座框架1430可具有諸如彎曲角隅1431之一或多個彎曲角隅。彎曲角隅可安置在基座框架1430之多側中的兩側之 間,該兩側可彼此正交。具體言之,彎曲角隅1431安置在第二延伸部部分1439與第二遠端部分1437之間。第二遠端部分1437沿一軸對準,該軸正交於第二延伸部部分1439沿著對準之一軸。在一些實施方案中,基座框架之一或多個角隅可呈銳角或尖角而非彎曲。 As shown in FIG. 14A, the base frame 1430 may have one or more curved corners 诸如 such as one of the curved corners 1431. The bent corners can be placed on both sides of the multiple sides of the base frame 1430 In the meantime, the two sides may be orthogonal to each other. Specifically, the curved corner 隅 1431 is disposed between the second extension portion 1439 and the second distal portion 1437. The second distal portion 1437 is aligned along an axis that is orthogonal to the second extension portion 1439 along one of the aligned axes. In some embodiments, one or more corners of the base frame may be acute or sharp rather than curved.

圖14B係繪示根據一實施方案之圖14A中所示之基座框架1430之一仰視透視圖之一圖。在基座框架1430之此視圖中,可見的通道1460多於圖14A。 FIG. 14B illustrates a bottom perspective view of one of the base frames 1430 shown in FIG. 14A according to an embodiment. In this view of the base frame 1430, more channels 1460 are visible than in Figure 14A.

如圖14B中所示,一支撐部件1466安置在通道1460內。支撐部件1466安置在頂壁1461與底壁1463之間或在其等之間延伸。支撐部件1466亦可接觸側壁1462之一部分。在一些實施方案中,支撐部件1466可接觸通道1460之內表面1464之至少一部分。在一些實施方案中,支撐部件1466可將通道1460分段或劃分為不同部分。 As shown in FIG. 14B, a support member 1466 is disposed in the channel 1460. The support member 1466 is disposed between the top wall 1461 and the bottom wall 1463 or extends therebetween. The support member 1466 may also contact a portion of the side wall 1462. In some embodiments, the support member 1466 may contact at least a portion of the inner surface 1464 of the channel 1460. In some embodiments, the support member 1466 may segment or divide the channel 1460 into different sections.

圖15A係繪示一中平面1550之一透視俯視圖之一圖。中平面1550包含例如用於諸如一軌跡板之一輸入裝置或另一輸入裝置之一開口1559。中平面1550亦包含若干凹陷1551至1555。凹陷1551至1555之各者可經組態以收納與一構架組件(未展示)相關聯之一突部。中平面1550包含可與一構架組件之一或多個部分(例如,一構架組件之突部)耦合之一中平面延伸部1558。中平面延伸部1558可包含一或多個開口(例如,花紋開口),諸如一螺釘、一鉚釘、一焊點及/或等等之一或多個耦合機構可透過該一或多個開口插入以將一構架組件或另一組件耦合至中平面1550。 FIG. 15A is a perspective plan view of a mid-plane 1550. FIG. The midplane 1550 contains, for example, an opening 1559 for an input device such as a trackpad or one of the other input devices. The mid-plane 1550 also includes a number of depressions 1551 to 1555. Each of the recesses 1551 to 1555 may be configured to receive a protrusion associated with a framework component (not shown). The mid-plane 1550 includes a mid-plane extension 1558 that can be coupled to one or more portions of a framework component (eg, a protrusion of a framework component). The mid-plane extension 1558 may include one or more openings (eg, patterned openings) through which one or more coupling mechanisms such as a screw, a rivet, a solder joint, and / or the like may be inserted. To couple a framework component or another component to the midplane 1550.

圖15B中展示沿圖15A之線K切割之中平面延伸部1558之一側截面圖。如圖15B中所示,中平面延伸部1558沿一平面對準,該平面平行於(例如,實質上平行於)中平面1550沿著對準之一平面。 FIG. 15B shows a side cross-sectional view of the middle plane extending portion 1558 cut along the line K of FIG. 15A. As shown in FIG. 15B, the mid-plane extensions 1558 are aligned along a plane that is parallel to (eg, substantially parallel to) the mid-plane 1550 along one of the aligned planes.

圖16係繪示圖15A及圖15B中所示之中平面1550耦合至圖14A及圖14B中所示之基座框架1430之一圖。中平面1550可使用上述方法之 任一者(例如,傾斜方法、熱結合方法)耦合至基座框架1430。如圖16中所示,中平面1550之至少一部分(例如,部分1556)安置在基座框架1430之通道1460之至少一部分內。 FIG. 16 is a diagram illustrating a middle plane 1550 shown in FIGS. 15A and 15B coupled to a base frame 1430 shown in FIGS. 14A and 14B. Mid-plane 1550 can use the above methods Any one (for example, a tilt method, a thermal bonding method) is coupled to the base frame 1430. As shown in FIG. 16, at least a portion (eg, a portion 1556) of the midplane 1550 is disposed within at least a portion of the channel 1460 of the base frame 1430.

圖17A係繪示圖15A及圖15B中所示之中平面1550耦合至一構架組件1790之一圖。中平面1550亦耦合至圖14A及圖14B中所示之基座框架1430。 FIG. 17A is a diagram illustrating a middle plane 1550 shown in FIGS. 15A and 15B coupled to a frame assembly 1790. The mid-plane 1550 is also coupled to the base frame 1430 shown in FIGS. 14A and 14B.

如圖17A中所示,構架組件1790包含一部分1799,部分1799至少部分安置在與基座框架1430之第一遠端部分1436(或構架耦合部分)相關聯之通道1460之一部分內。構架組件1790亦包含一部分1798,部分1798至少部分安置在與基座框架1430之第二遠端部分1437(或構架耦合部分)相關聯之通道1460之一部分內。 As shown in FIG. 17A, the frame assembly 1790 includes a portion 1799 that is at least partially disposed within a portion of the channel 1460 associated with the first distal portion 1436 (or frame coupling portion) of the base frame 1430. The frame assembly 1790 also includes a portion 1798 that is at least partially disposed within a portion of the channel 1460 associated with the second distal portion 1437 (or frame coupling portion) of the base frame 1430.

構架組件1790亦包含突部1791至1795。突部1791至1795之各者分別對應於中平面1550之凹陷1551至1555。 The frame assembly 1790 also includes protrusions 1791 to 1795. Each of the protrusions 1791 to 1795 corresponds to the depressions 1551 to 1555 of the mid-plane 1550, respectively.

如圖17A中所示,構架組件1790可藉由沿方向L1移動構架組件1790而移動至中平面1550中(且耦合至中平面1550)。方向L1可為法向於一平面之一垂直方向,基座框架1430與中平面1550沿該平面對準。構架組件1790接著可沿方向L2移動至圖17A中所示之位置,其中部分1798、1799至少部分安置在通道1460內。方向L2可正交於(或實質上正交於)方向L1。在一些實施方案中,方向L2可稱作一遠端方向,此係因為方向L2係沿遠離基座框架1430之近端部分1434之一方向。方向L2亦可沿基座框架1430與中平面1550沿著對準之一平面對準(或可在該平面內對準)。 As shown in FIG. 17A, the frame assembly 1790 can be moved into (and coupled to the mid-plane 1550) by moving the frame assembly 1790 in the direction L1. The direction L1 may be a normal direction normal to a plane along which the base frame 1430 and the midplane 1550 are aligned. The frame assembly 1790 can then be moved in the direction L2 to the position shown in FIG. 17A, where portions 1798, 1799 are at least partially disposed within the channel 1460. The direction L2 may be orthogonal (or substantially orthogonal) to the direction L1. In some embodiments, the direction L2 may be referred to as a distal direction because the direction L2 is in a direction away from the proximal portion 1434 of the base frame 1430. The direction L2 can also be aligned along the plane of the base frame 1430 and the midplane 1550 (or can be aligned in this plane).

在一些實施方案中,方向L2可不同於一方向L7、一方向L8及/或一方向L9,中平面1550之邊緣沿該方向L7、該方向L8及/或該方向L9移動至通道1460之部分中。例如,方向L2可與方向L8相反,方向L8可為中平面1550之一近端邊緣沿著插入至與基座框架1430之近端部分 1434相關聯之通道1460之一部分中之一方向。類似地,方向L2可與方向L7正交,方向L7可為中平面1550之一側邊緣沿著插入至與基座框架1430之一側相關聯之通道1460之一部分中之一方向。 In some embodiments, the direction L2 may be different from a direction L7, a direction L8, and / or a direction L9, and an edge of the midplane 1550 moves along the direction L7, the direction L8, and / or the direction L9 to a portion of the channel 1460 in. For example, the direction L2 may be opposite to the direction L8, and the direction L8 may be a proximal edge of a mid-plane 1550 inserted along the proximal portion of the base frame 1430 1434 One direction of a portion of the associated channel 1460. Similarly, the direction L2 may be orthogonal to the direction L7, and the direction L7 may be one of a side edge of the midplane 1550 along a portion inserted into a portion of the channel 1460 associated with one side of the base frame 1430.

如圖17A中所示,一間隙1797安置在構架組件1790與中平面1550之間。具體言之,當構架組件1790耦合至中平面1550之中平面延伸部1558時,間隙1797安置在構架組件1790與中平面1550之間。 As shown in FIG. 17A, a gap 1797 is placed between the frame assembly 1790 and the midplane 1550. Specifically, when the frame component 1790 is coupled to the mid-plane extension 1558 of the mid-plane 1550, the gap 1797 is disposed between the frame component 1790 and the mid-plane 1550.

在此實施方案中,突部1791至1795之各者包含至少一開口(例如,穿過其中之一開口)。例如,突部1794包含開口1762(個別地標記為1762A及1762B)。開口(例如,開口1762)可為可透過其插入(例如,安置)諸如一螺釘、一鉚釘、一焊點、一黏著劑及/或等等之一耦合機構使得構架組件1790可耦合至中平面1550之開口。因此,開口之一或多者可對應於包含在中平面1550(例如,中平面1550之中平面延伸部1558)中之開口。在一些實施方案中,包含在一構架組件中之一或多個突部可不包含一開口。 In this embodiment, each of the protrusions 1791 to 1795 includes at least one opening (eg, through one of the openings). For example, the protrusion 1794 includes an opening 1762 (individually labeled 1762A and 1762B). The opening (eg, opening 1762) may be a mechanism through which a coupling mechanism such as a screw, a rivet, a solder joint, an adhesive, and / or the like may be inserted (eg, disposed) such that the frame assembly 1790 may be coupled to a midplane 1550 opening. Thus, one or more of the openings may correspond to an opening contained in a mid-plane 1550 (eg, a mid-plane extension 1558 in the mid-plane 1550). In some embodiments, one or more of the protrusions included in a framework assembly may not include an opening.

圖17B係繪示沿線L3切割之構架組件1790及中平面1550之一部分之一截面圖之一圖。如圖17B中所示,構架組件1790之突部1794接觸中平面延伸部1558(其係中平面1550之部分)之一頂面。至少1762A與包含於中平面延伸部1558中之開口1582對準。雖然圖17B中未展示,但是在一些實施方案中,一耦合機構可用以經由開口1582及開口1762A將構架組件1790之至少一部分耦合至中平面1550。 FIG. 17B is a cross-sectional view of a portion of the frame assembly 1790 and the mid-plane 1550 cut along the line L3. As shown in FIG. 17B, the protrusion 1794 of the frame assembly 1790 contacts a top surface of one of the mid-plane extensions 1558 (which is a portion of the mid-plane 1550). At least 1762A is aligned with the opening 1582 included in the mid-plane extension 1558. Although not shown in FIG. 17B, in some embodiments, a coupling mechanism may be used to couple at least a portion of the framework assembly 1790 to the midplane 1550 via the openings 1582 and 1762A.

如圖17A中所示,突部1794沿一軸L4對準,軸L4平行於使得中平面1550(或中平面延伸部1558)沿著對準之一線L5(或平面)。在此實施方案中,突部1791至1795之各者經對準平行於中平面1550(及基座框架1530)。 As shown in FIG. 17A, the protrusions 1794 are aligned along an axis L4, and the axis L4 is parallel so that the midplane 1550 (or the midplane extension 1558) is aligned along a line of alignment L5 (or plane). In this embodiment, each of the protrusions 1791 to 1795 is aligned parallel to the mid-plane 1550 (and the base frame 1530).

圖17C係繪示耦合至中平面1550及構架組件1790之一板1795之一透視圖之一圖。板1795可經由一或多個耦合機構(未展示)經由板1795 中之一或多個開口(諸如開口1796)耦合至構架組件1790。類似地,板1795可經由一或多個耦合機構(未展示)經由板1795中之一或多個開口(諸如開口1797)耦合至中平面1550。 FIG. 17C shows a perspective view of a plate 1795 coupled to a midplane 1550 and a frame assembly 1790. FIG. The plate 1795 may be passed through the plate 1795 via one or more coupling mechanisms (not shown). One or more of the openings, such as the opening 1796, are coupled to the frame assembly 1790. Similarly, plate 1795 may be coupled to midplane 1550 via one or more coupling mechanisms (not shown) via one or more openings in plate 1795, such as opening 1797.

如圖17C中所示,構架組件1790之一遠端表面1789可相對於基座框架1430之一遠端表面凹陷,此係由虛線L6加以繪示。構架組件1790之遠端表面1789可凹陷使得與一顯示器部分(未展示)相關聯之一鉸鏈可耦合至構架組件1790且耦合在基座框架1430之遠端部分1436、1437之間。 As shown in FIG. 17C, a distal surface 1789 of the frame assembly 1790 may be recessed relative to a distal surface of the base frame 1430, which is depicted by a dotted line L6. The distal surface 1789 of the frame assembly 1790 may be recessed such that a hinge associated with a display portion (not shown) may be coupled to the frame assembly 1790 and coupled between the distal portions 1436, 1437 of the base frame 1430.

圖17D係繪示耦合至圖17C中所示之板1795之一蓋1780之一側之一透視圖之一圖。可稱作一底蓋之蓋1780可界定一計算裝置之一外殼之至少一部分或D殼體。在一些實施方案中,蓋1780可界定計算裝置之外殼之一裝飾蓋。在一些實施方案中,可將熱量自板1795轉移至蓋1780。雖然未展示,但是蓋1780可耦合至圖17C中所示之總成。 FIG. 17D is a diagram showing a perspective view coupled to one side of a cover 1780 of the plate 1795 shown in FIG. 17C. A cover 1780, which may be referred to as a bottom cover, may define at least a portion of a housing of a computing device or a D case. In some embodiments, the cover 1780 may define a decorative cover that is one of the housings of the computing device. In some embodiments, heat may be transferred from plate 1795 to cover 1780. Although not shown, the cover 1780 may be coupled to the assembly shown in FIG. 17C.

圖17E係繪示圖17D中所示之蓋1780及板1795之一相對側之一透視圖之一圖。蓋1780包含可用以將蓋1780及板1795耦合至圖17C中所示之總成之突片或突部(例如,突部1781)。板1795亦包含可用以使板1795之塊體與中平面1550分離之突部(例如,一突部1792)。板1795可經由突部(例如,突部1792)耦合至中平面1550。 FIG. 17E is a diagram showing a perspective view of an opposite side of one of the cover 1780 and the plate 1795 shown in FIG. 17D. Cover 1780 includes a tab or protrusion (eg, protrusion 1781) that can be used to couple cover 1780 and plate 1795 to the assembly shown in FIG. 17C. The plate 1795 also includes a protrusion (eg, a protrusion 1792) that can be used to separate the block of the plate 1795 from the midplane 1550. The plate 1795 may be coupled to the midplane 1550 via a protrusion (eg, the protrusion 1792).

如上文提及,下文結合至少圖18至圖30描述與一計算裝置之一顯示器部分及一邊框相關之細節。結合圖18至圖30描述之實施方案可與結合圖1至圖17E及/或圖31A至圖45描述之實施方案之任一者組合。 As mentioned above, details related to a display portion and a frame of a computing device are described below with reference to at least FIG. 18 to FIG. 30. The embodiment described in connection with FIGS. 18 to 30 may be combined with any of the embodiments described in connection with FIGS. 1 to 17E and / or FIGS. 31A to 45.

圖18繪示包含根據至少一例示性實施方案之一邊框之一電腦顯示器之一截面之一方塊圖。如圖18中所示,一電腦顯示器1800之截面包含一顯示器殼體1805、一顯示器殼體切口1810、一邊框框架1815及一邊框1820。邊框框架1815可包含一第一部分1815-1、一第二部分1815-2及一第三部分1815-3。第一部分1815-1、第二部分1815-2及第 三部分1815-3可經組態以界定一腔或間隙1825。 18 illustrates a block diagram of a cross-section of a computer display including a frame according to at least one exemplary embodiment. As shown in FIG. 18, a cross-section of a computer monitor 1800 includes a display case 1805, a display case cutout 1810, a bezel frame 1815, and a bezel 1820. The border frame 1815 may include a first portion 1815-1, a second portion 1815-2, and a third portion 1815-3. Part I 1815-1, Part II 1515-2 and Part I Three sections 1815-3 may be configured to define a cavity or gap 1825.

第一部分1815-1可平行或實質上平行於邊框1820。第一部分1815-1可接觸邊框1820且定位於顯示器殼體1805與邊框1820之間。第二部分1815-2及第三部分1815-3可遠離第一部分1815-1朝顯示器殼體1805延伸。第二部分1815-2及第三部分1815-3可接觸顯示器殼體1805之一表面(例如,一內表面)。第二部分1815-2及/或第三部分1815-3之一端可成角度以符合顯示器殼體1805之形狀。第二部分1815-2及第三部分1815-3可為一不同長度。然而,若顯示器殼體1805(或顯示器殼體1805之一部分)係直立(或實質上直立),則第二部分1815-2及第三部分1815-3可為一相同(或實質上相同)長度。 The first portion 1815-1 may be parallel or substantially parallel to the frame 1820. The first part 1815-1 can contact the bezel 1820 and is positioned between the display housing 1805 and the bezel 1820. The second portion 1815-2 and the third portion 1815-3 may extend away from the first portion 1815-1 toward the display case 1805. The second portion 1815-2 and the third portion 1815-3 may contact one surface (eg, an inner surface) of the display case 1805. One end of the second portion 1815-2 and / or the third portion 1815-3 may be angled to conform to the shape of the display housing 1805. The second part 1815-2 and the third part 1815-3 can be a different length. However, if the display case 1805 (or a portion of the display case 1805) is upright (or substantially upright), the second portion 1815-2 and the third portion 1815-3 may be the same (or substantially the same) length .

邊框框架1815可經組態以支撐邊框1820且界定腔1825。腔1825可經組態以提供用於使其他組件通過之一路線(例如,導線或電纜)。腔1825可經組態以提供用於固定其他組件(例如,相機及天線)之一區域。邊框1820及/或邊框框架可經組態以固持或有助於固持其他組件(例如,一顯示器面板)於一固定位置中。邊框1820可經組態以使得包含一電腦顯示器1800之截面之一電腦裝置呈現一美觀合意的加工表面。雖然腔1825被視為實質上矩形,但是例示性實施方案不限於此。例如,腔1825可為三角形或圓形。因此,第一部分1815-1、第二部分1815-2及第三部分1815-3之形狀因此可改變以界定腔1825之所要形狀。 The bezel frame 1815 may be configured to support the bezel 1820 and define a cavity 1825. The cavity 1825 may be configured to provide a route for passing other components (eg, wires or cables). The cavity 1825 may be configured to provide an area for fixing other components, such as a camera and an antenna. The bezel 1820 and / or the bezel frame may be configured to hold or facilitate holding other components (eg, a display panel) in a fixed position. The bezel 1820 may be configured so that a computer device including a cross-section of a computer display 1800 presents an aesthetically pleasing surface. Although the cavity 1825 is considered to be substantially rectangular, the exemplary embodiment is not limited thereto. For example, the cavity 1825 may be triangular or circular. Therefore, the shapes of the first portion 1815-1, the second portion 1815-2, and the third portion 1815-3 can be changed to define a desired shape of the cavity 1825.

圖19至圖21繪示根據至少一例示性實施方案之一電腦顯示器在不同組裝階段之正視圖。圖19繪示處於一組裝狀態使得邊框1820圍封電腦顯示器1900之其他元件之電腦顯示器之一正視圖。如圖19中所示,電腦顯示器1900可與(例如)一膝上型電腦相關聯。電腦顯示器1900可包含顯示器殼體1805及邊框1820。電腦顯示器1900可進一步包含一相機1905、一麥克風1910、鉸鏈1915-1、1915-2、一第一導線束 1920、一連接器1925、一第二導線束1930及一顯示器面板1935。 19 to 21 are front views of a computer display according to at least one exemplary embodiment at different stages of assembly. FIG. 19 shows a front view of one of the computer monitors in an assembled state such that the bezel 1820 encloses other components of the computer monitor 1900. FIG. As shown in FIG. 19, the computer display 1900 may be associated with, for example, a laptop computer. The computer display 1900 may include a display case 1805 and a frame 1820. The computer monitor 1900 may further include a camera 1905, a microphone 1910, hinges 1915-1, 1915-2, and a first wire harness. 1920, a connector 1925, a second wire harness 1930, and a display panel 1935.

在一些實施方案中,顯示器面板1935可為(例如)一觸敏顯示器。在一些實施方案中,顯示器面板1935可為或可包含(例如)一靜電觸控裝置、一電阻式觸控螢幕裝置、一表面聲波(SAW)裝置、一電容式觸控螢幕裝置、一壓敏裝置、一表面電容式裝置、一投影電容式觸控(PCT)裝置及/或等等。若顯示器面板1935係一觸敏裝置,則第二導線束1930可包含連接至(例如)一壓力感測器以將觸控相關信號傳送至與計算裝置相關聯之一處理器之導線。若顯示器面板1935係一觸敏裝置,則顯示器面板1935可用作一輸入裝置。例如,顯示器面板1935可經組態以顯示可由一使用者用作一輸入裝置之一虛擬鍵盤(例如,模擬一鍵盤)。 In some implementations, the display panel 1935 can be, for example, a touch-sensitive display. In some implementations, the display panel 1935 may be or may include, for example, an electrostatic touch device, a resistive touch screen device, a surface acoustic wave (SAW) device, a capacitive touch screen device, and a pressure sensitive device. Devices, a surface capacitive device, a projected capacitive touch (PCT) device, and / or the like. If the display panel 1935 is a touch-sensitive device, the second wire harness 1930 may include wires connected to, for example, a pressure sensor to transmit touch-related signals to a processor associated with the computing device. If the display panel 1935 is a touch-sensitive device, the display panel 1935 can be used as an input device. For example, the display panel 1935 can be configured to display a virtual keyboard (eg, emulate a keyboard) that can be used by a user as an input device.

在一些實施方案中,電腦顯示器1900包含於具有一傳統的膝上型外觀尺寸之一傳統的膝上型裝置中。在一些實施方案中,電腦顯示器1900可為(例如)一有線裝置及/或一無線裝置(例如,Wi-Fi啟用裝置)(或可包含於其中),且可為(例如)一計算實體(例如,一個人計算裝置)、一伺服器裝置(例如,一網頁伺服器)、一行動電話、一個人數位助理(PDA)、一平板裝置、電子書閱讀器及/或等等。電腦顯示器1900可包含於一計算裝置中,該計算裝置經組態以基於可包含一或多個類型的硬體、軟體、韌體、作業系統、運行時庫及/或等等之一或多個平台(例如,一或多個類似或不同平台)而操作。 In some embodiments, the computer display 1900 is included in a conventional laptop device having one of the conventional laptop form factors. In some embodiments, the computer display 1900 may be (or may be included in) a wired device and / or a wireless device (e.g., a Wi-Fi enabled device), and may be, for example, a computing entity ( For example, a personal computing device), a server device (eg, a web server), a mobile phone, a personal assistant (PDA), a tablet device, an e-book reader, and / or the like. Computer display 1900 may be included in a computing device that is configured to be based on one or more of hardware, software, firmware, operating systems, runtime libraries, and / or the like that may include one or more types Platforms (eg, one or more similar or different platforms).

相機1905可經操作以擷取影像(例如,靜止及/或移動影像)。在一些實施方案中,由相機1905擷取之影像可為單個靜態影像(諸如一照片),或可為來自定義一視訊(例如,一循序掃描視訊、一國家電視系統委員會(NTSC)視訊、一動態圖像專家群組(MPEG)視訊)之一系列(一組)影像之影像。在一些實施方案中,該系列影像(可定義(例如,產生)視訊)可與音訊(例如,一音訊信號)同步或以其他方式與音訊(例 如,一音訊信號)相關聯。感測器可偵測(例如)周圍光強以有助於一影像處理器(未展示)處理由相機1905擷取之影像。相機1905可包含隱藏在邊框1820下方之元件。例如,相機1905可包含腔1825內之元件。麥克風1910可經組態以擷取音訊。麥克風1910可包含腔1825內之元件。 The camera 1905 may be operated to capture images (eg, still and / or moving images). In some embodiments, the image captured by the camera 1905 can be a single still image (such as a photo), or a video can be customized (e.g., a sequential scan video, a National Television System Committee (NTSC) video, a An image of a series (set) of moving picture expert group (MPEG) video). In some implementations, the series of images (definable (e.g., generated) video) can be synchronized with or otherwise (e.g., an audio signal) with audio (e.g., an audio signal) For example, an audio signal) is associated. The sensor can detect, for example, the intensity of ambient light to help an image processor (not shown) process the image captured by the camera 1905. The camera 1905 may include components hidden under the bezel 1820. For example, camera 1905 may include elements within cavity 1825. The microphone 1910 can be configured to capture audio. The microphone 1910 may include elements within the cavity 1825.

第一導線束1920及連接器1925可一起用以將信號自電腦顯示器1900傳送至(例如)一膝上型電腦之一基座部分(未展示)。例如,第一導線束1920及連接器1925可一起用以將如由相機1905擷取之影像資料傳送至膝上型電腦之基座部分,該基座部分包含一影像處理器。第一導線束1920可包含來自第二導線束1930之一或多個導線。與第一導線束1920及/或第二導線束1930相關聯之導線可經路線安排在邊框1820下方。例如,與第一導線束1920及/或第二導線束1930相關聯之導線可經路線安排穿過腔1825。膝上型電腦之基座部分可使用鉸鏈1915-1、1915-2附接至電腦顯示器1900。 The first wire harness 1920 and the connector 1925 can be used together to transmit signals from the computer display 1900 to, for example, a base portion (not shown) of a laptop computer. For example, the first wire harness 1920 and the connector 1925 can be used together to transmit image data, such as captured by the camera 1905, to a base portion of a laptop computer, the base portion including an image processor. The first wire harness 1920 may include one or more wires from the second wire harness 1930. The wires associated with the first wire harness 1920 and / or the second wire harness 1930 may be routed under the frame 1820 via a route. For example, wires associated with the first wire harness 1920 and / or the second wire harness 1930 may be routed through the cavity 1825. The base portion of the laptop can be attached to the computer monitor 1900 using hinges 1915-1, 1915-2.

圖20繪示無邊框1820之電腦顯示器1900之一正視圖。如圖20中所示,電腦顯示器1900進一步包含邊框框架緊固件2005、邊框導軌2010、一顯示器面板框架2015及顯示器面板緊固件2020。邊框框架緊固件2005可經組態以將邊框框架1815緊固至顯示器殼體。此外,邊框框架緊固件2005可經組態以有助於將其他元件(例如,相機1905)緊固在一所要位置中。例如,邊框框架緊固件2005可為一螺釘、一鉚釘、一銷及/或一夾具之一或多者。 FIG. 20 shows a front view of one of the computer monitors 1900 without a bezel 1820. As shown in FIG. 20, the computer display 1900 further includes a frame frame fastener 2005, a frame rail 2010, a display panel frame 2015, and a display panel fastener 2020. The bezel frame fastener 2005 may be configured to fasten the bezel frame 1815 to the display housing. Further, the bezel frame fastener 2005 may be configured to help secure other elements (eg, the camera 1905) in a desired location. For example, the bezel frame fastener 2005 may be one or more of a screw, a rivet, a pin, and / or a clamp.

邊框導軌2010可經組態以有助於將邊框1820定位在一所要位置中。此外,邊框導軌2010可經組態以有助於將邊框1820固定在一所要位置中。邊框導軌2010可為邊框框架1815中可部分延伸至邊框框架1815中及/或完全延伸穿過邊框框架1815之狹槽、孔、凹坑及/或切口。替代地或此外,邊框導軌2010可為延伸至邊框框架1815外之突部、突部及/或結節。邊框導軌2010可為邊框框架1815中之狹槽、 孔、凹坑及/或切口與延伸至邊框框架1815外之突部、突部及/或結節之任何組合。 The bezel rail 2010 may be configured to help position the bezel 1820 in a desired location. In addition, the bezel rail 2010 may be configured to help secure the bezel 1820 in a desired position. The frame guide 2010 may be a slot, a hole, a recess, and / or a cutout in the frame frame 1815 that may partially extend into the frame frame 1815 and / or extend completely through the frame frame 1815. Alternatively or in addition, the bezel guide 2010 may be a protrusion, a protrusion, and / or a nodule extending outside the bezel frame 1815. The bezel guide 2010 may be a slot in the bezel frame 1815, Any combination of holes, dimples, and / or cutouts and protrusions, protrusions, and / or nodules that extend beyond the bezel frame 1815.

顯示器面板框架2015可經組態以給顯示器面板1935之元件加框架或纏繞顯示器面板1935之元件。顯示器面板框架2015可包含孔,顯示器面板緊固件2020穿過孔以將顯示器面板緊固至顯示器殼體。顯示器面板緊固件2020可為一螺釘、一鉚釘、一銷及/或一夾具之一或多者。顯示器面板框架2015可在與邊框框架1815相同之平面上方、下方及/或之上。 The display panel frame 2015 may be configured to frame or wrap elements of the display panel 1935. The display panel frame 2015 may include a hole through which the display panel fastener 2020 passes to fasten the display panel to the display case. The display panel fastener 2020 may be one or more of a screw, a rivet, a pin, and / or a clamp. The display panel frame 2015 may be above, below and / or above the same plane as the frame frame 1815.

圖21繪示無邊框1820且無邊框框架1815之電腦顯示器1900之一正視圖。如圖21中所示,電腦顯示器1900進一步包含一或多個寬頻帶天線2105、一或多個區域網路(LAN)天線2110、一或多個經路線安排之導線2115及邊框框架緊固件插孔2120。 FIG. 21 illustrates a front view of one of the computer monitors 1900 without a bezel 1820 and a bezel 1815. As shown in FIG. 21, the computer monitor 1900 further includes one or more wideband antennas 2105, one or more local area network (LAN) antennas 2110, one or more routed wires 2115, and frame frame fasteners. Hole 2120.

一或多個寬頻帶天線2105可經組態以傳輸及/或接收第三代(3G)及第四代(4G)及類似信號。例如,一或多個寬頻帶天線2105可在各種模式或協定(諸如LTE、GSM、SMS、EMS或MMS傳訊、PCS、CDMA、TDMA、PDC、WCDMA、CDMA2000及/或GPRS等等)下提供無線通信。一或多個寬頻帶天線2105可為(例如)一印刷電路板天線。一或多個區域網路(LAN)天線2110可經組態以傳輸及/或接收短程通信信號。短程通信可在各種模式或協定(諸如NFC、藍芽及/或Wi-Fi等等)下提供無線通信。一或多個區域網路(LAN)天線2110可為(例如)一印刷電路板天線。 One or more wideband antennas 2105 may be configured to transmit and / or receive third generation (3G) and fourth generation (4G) and similar signals. For example, one or more wideband antennas 2105 may provide wireless in various modes or protocols such as LTE, GSM, SMS, EMS or MMS messaging, PCS, CDMA, TDMA, PDC, WCDMA, CDMA2000 and / or GPRS, etc. Communication. The one or more wideband antennas 2105 may be, for example, a printed circuit board antenna. One or more local area network (LAN) antennas 2110 may be configured to transmit and / or receive short-range communication signals. Short-range communication may provide wireless communication in various modes or protocols, such as NFC, Bluetooth and / or Wi-Fi, and so on. The one or more local area network (LAN) antennas 2110 may be, for example, a printed circuit board antenna.

一或多個經路線安排之導線2115可經由連接器1925將信號自電腦顯示器1900中之其他組件(例如,相機1905)傳送至一處理器(未展示)。一或多個經路線安排之導線2115可經路線安排在邊框1820下方。例如,與第一導線束1920及/或第二導線束1930相關聯之導線可經經路線安排穿過腔1825。邊框框架緊固件插孔2120可經組態以收納 邊框框架緊固件2005以有助於將邊框框架1815固定至顯示器殼體。邊框框架緊固件插孔2120可包含內螺紋、一外唇緣及/或內唇緣、內部溝槽等等以有助於將邊框框架緊固件2005固定在一所要位置中。 One or more routed wires 2115 may transmit signals from other components (eg, camera 1905) in computer display 1900 to a processor (not shown) via connector 1925. One or more routed wires 2115 may be routed below the frame 1820. For example, the wires associated with the first wire bundle 1920 and / or the second wire bundle 1930 may be routed through the cavity 1825. Bezel frame fastener receptacle 2120 can be configured to accommodate The bezel frame fastener 2005 helps to secure the bezel frame 1815 to the display case. The bezel frame fastener receptacle 2120 may include internal threads, an outer lip and / or inner lip, an internal groove, and the like to help secure the bezel frame fastener 2005 in a desired position.

圖22繪示包含根據至少一例示性實施方案之一邊框之一電腦顯示器之一截面之另一方塊圖。如圖22中所示,一電腦顯示器2200之截面包含一顯示器殼體2205、一邊框框架2215、一邊框2220、一邊框框架緊固件插孔2230、一邊框框架緊固件2235及顯示器面板框架2240之一部分。邊框框架2215可包含一第一部分2215-1、一第二部分2215-2及一第三部分2215-3。第一部分2215-1、第二部分2215-2及第三部分2215-3可經組態以界定一腔2225。第二部分2215-2可平行或實質上平行於邊框2220。第二部分2215-2可接觸邊框2220且定位於顯示器殼體2205與邊框2220之間。第一部分2215-1及第三部分2215-3可遠離第二部分2215-2朝顯示器殼體2205延伸。第一部分2215-1及第三部分2215-3可接觸顯示器殼體2205之一表面。第一部分2215-1及/或第三部分2215-3之一端可成角度以符合顯示器殼體2205之形狀。第一部分2215-1與第三部分2215-3可為一不同長度。然而,若顯示器殼體2205(或顯示器殼體2205之一部分)係直立(或實質上直立),則第一部分2215-1及第三部分2215-3可為一相同(或實質上相同)長度。 22 illustrates another block diagram of a cross section of a computer display including a frame according to at least one exemplary embodiment. As shown in FIG. 22, the cross-section of a computer monitor 2200 includes a display housing 2205, a frame frame 2215, a frame 2220, a frame frame fastener jack 2230, a frame frame fastener 2235, and a display panel frame 2240. portion. The frame 2215 may include a first portion 2215-1, a second portion 2215-2, and a third portion 2215-3. The first part 2215-1, the second part 2215-2, and the third part 2215-3 may be configured to define a cavity 2225. The second portion 2215-2 may be parallel or substantially parallel to the frame 2220. The second portion 2215-2 can contact the frame 2220 and is positioned between the display housing 2205 and the frame 2220. The first portion 2215-1 and the third portion 2215-3 may extend away from the second portion 2215-2 toward the display housing 2205. The first portion 2215-1 and the third portion 2215-3 may contact one surface of the display case 2205. One end of the first part 2215-1 and / or the third part 2215-3 may be angled to conform to the shape of the display housing 2205. The first portion 2215-1 and the third portion 2215-3 may be of different lengths. However, if the display case 2205 (or a portion of the display case 2205) is upright (or substantially upright), the first portion 2215-1 and the third portion 2215-3 may be the same (or substantially the same) length.

雖然腔2225被示為實質上矩形,但是例示性實施方案不限於此。例如,腔2225可為三角形、圓形或某個其他形狀。因此,第一部分2215-1、第二部分2215-2及第三部分2215-3之形狀因此可改變以界定腔2225之所要形狀。 Although the cavity 2225 is shown as being substantially rectangular, the exemplary embodiment is not limited thereto. For example, the cavity 2225 may be triangular, circular, or some other shape. Therefore, the shapes of the first portion 2215-1, the second portion 2215-2, and the third portion 2215-3 can be changed to define a desired shape of the cavity 2225.

邊框框架2215可包含一第四部分2215-4及一第五部分2215-5。第四部分2215-4及第五部分2215-5可界定一固持部分,該固持部分連同邊框框架緊固件插孔2230及邊框框架緊固件2235一起將邊框框架2215固定在一所要位置中。第四部分2215-4及第五部分2215-5以及邊框框 架緊固件插孔2230及邊框框架緊固件2235被示為包含機械螺紋以相對於顯示器殼體2205將邊框框架2215固持在一位置中。雖然圖22將邊框框架緊固件2235示為將邊框框架2215及邊框框架緊固件插孔2230固持在一起之機構,但是例示性實施方案不限於此。例如,第四部分2215-4及第五部分2215-5可包含一壓入配合,該壓入配合經組態以被推入至邊框框架緊固件插孔2230中,從而導致固持邊框框架2215與邊框框架緊固件插孔2230。 The frame 2215 may include a fourth portion 2215-4 and a fifth portion 2215-5. The fourth portion 2215-4 and the fifth portion 2215-5 may define a holding portion, which fixes the frame frame 2215 in a desired position together with the frame frame fastener insertion hole 2230 and the frame frame fastener 2235. The fourth part 2215-4 and the fifth part 2215-5 and the border frame The shelf fastener receptacle 2230 and the bezel frame fastener 2235 are shown as including mechanical threads to hold the bezel frame 2215 in a position relative to the display housing 2205. Although FIG. 22 illustrates the bezel frame fastener 2235 as a mechanism for holding the bezel frame 2215 and the bezel frame fastener insertion hole 2230 together, the exemplary embodiment is not limited thereto. For example, the fourth portion 2215-4 and the fifth portion 2215-5 may include a press-fit, which is configured to be pushed into the frame frame fastener insertion hole 2230, thereby causing the frame frame 2215 to be retained and Bezel frame fastener socket 2230.

邊框框架2215可包含經組態以有助於將顯示器面板框架2240定位且有助於固定在一所要位置中之一第六部分2215-6。例如,第六部分2215-6被示為具有一L形狀。如圖22中所示,顯示器面板框架可放置於接觸第六部分2215-6之一位置中。當邊框2220附接至邊框框架2215時,邊框框架2215接著防止顯示器面板框架2240改變其位置。因此,將顯示器面板框架2240維持在所要位置中。進一步言之,第六部分2215-6可為C型。換言之,第六部分2215-6可包含自第六部分2215-6且在邊框2220與顯示器面板框架2240之間延伸之一額外部分(未展示)。此額外部分(未展示)可接觸顯示器面板框架2240及/或邊框2220。因此,運用該額外部分(未展示),第六部分2215-6可將顯示器面板框架2240固定在所要位置中,但是邊框2220不在適當位置。 The bezel frame 2215 may include a sixth portion 2215-6 that is configured to help position the display panel frame 2240 and to help secure one of a desired position. For example, the sixth portion 2215-6 is shown as having an L shape. As shown in FIG. 22, the display panel frame may be placed in one of the positions contacting the sixth portion 2215-6. When the bezel 2220 is attached to the bezel frame 2215, the bezel frame 2215 then prevents the display panel frame 2240 from changing its position. Therefore, the display panel frame 2240 is maintained in a desired position. Further, the sixth part 2215-6 may be a C type. In other words, the sixth portion 2215-6 may include an additional portion (not shown) extending from the sixth portion 2215-6 and extending between the bezel 2220 and the display panel frame 2240. This additional portion (not shown) may contact the display panel frame 2240 and / or the bezel 2220. Therefore, using this additional part (not shown), the sixth part 2215-6 can fix the display panel frame 2240 in a desired position, but the bezel 2220 is not in place.

邊框框架2215可經組態以支撐邊框2220且界定腔2225。邊框框架2215可經組態以藉由包含接觸顯示器殼體2205及邊框2220兩者之部分(例如,第一部分2215-1及2215-3)來支撐邊框2220。例如,若在邊框框架2215之方向上(或實質上該方向上)施加一力於邊框框架2215之相對側上之邊框2220,則邊框框架2215可支撐邊框2220使得邊框2220不會摺疊至顯示器面板之一邊緣與顯示器殼體2205之一邊緣之間之一腔中。腔2225可經組態以提供用於使其他組件通過之一路線(例如,導線或電纜)。腔2225可經組態以提供用於固定其他組件(例如,相機 及天線)之一區域。 The bezel frame 2215 may be configured to support the bezel 2220 and define a cavity 2225. The bezel frame 2215 may be configured to support the bezel 2220 by including portions that contact both the display housing 2205 and the bezel 2220 (eg, the first portions 2215-1 and 2215-3). For example, if a force is applied in the direction of the frame frame 2215 (or substantially the direction) to the frame 2220 on the opposite side of the frame frame 2215, the frame frame 2215 can support the frame 2220 so that the frame 2220 does not fold to the display panel. In one cavity between one edge and one edge of the display housing 2205. The cavity 2225 may be configured to provide a route for other components to pass (eg, wires or cables). The cavity 2225 may be configured to provide for holding other components (e.g., a camera And antenna).

邊框框架緊固件插孔2230可固定至顯示器殼體2205。例如,邊框框架緊固件插孔2230可形成為顯示器殼體2205之部分。換言之,邊框框架緊固件插孔2230及顯示器殼體2205可為一成型(例如,射出成型)塑膠結構。除其他緊固機構以外,邊框框架緊固件2235亦可螺合(如所示)、按壓及/或鉚接至邊框框架緊固件插孔2230中以有助於將邊框框架2215固定至一所要位置中。 The bezel frame fastener jack 2230 may be fixed to the display case 2205. For example, the bezel frame fastener insertion hole 2230 may be formed as part of the display case 2205. In other words, the frame frame fastener insertion hole 2230 and the display housing 2205 can be a molded (eg, injection molded) plastic structure. Among other fastening mechanisms, the frame frame fastener 2235 can also be screwed (as shown), pressed and / or riveted into the frame frame fastener socket 2230 to help secure the frame frame 2215 in a desired position. .

圖23繪示包含根據至少一例示性實施方案之一邊框之一電腦顯示器之一截面之又一方塊圖。如圖23中所示,一電腦顯示器2300之截面包含一顯示器殼體2305、一顯示器殼體切口2310、一邊框框架2315、一邊框2320、一插孔2330、一導軌2335、一突部2340、電纜2345、一黏著劑2350及一顯示器面板框架2355。邊框框架2315可包含一第一部分2315-1、一第二部分2315-2及一第三部分2315-3。第一部分2315-1、第二部分2315-2及第三部分2315-3可經組態以界定一腔2325,電纜2345可經路線安排穿過腔2325。 FIG. 23 illustrates yet another block diagram of a cross section of a computer display including a frame according to at least one exemplary embodiment. As shown in FIG. 23, the cross-section of a computer monitor 2300 includes a display housing 2305, a display housing cutout 2310, a bezel frame 2315, a bezel 2320, a jack 2330, a guide rail 2335, a protrusion 2340, The cable 2345, an adhesive 2350, and a display panel frame 2355. The border frame 2315 may include a first portion 2315-1, a second portion 2315-2, and a third portion 2315-3. The first part 2315-1, the second part 2315-2, and the third part 2315-3 may be configured to define a cavity 2325, and the cable 2345 may be routed through the cavity 2325.

第二部分2315-2可平行或實質上平行於邊框2320。第二部分2315-2可接觸邊框2320且定位於顯示器殼體2305與邊框2320之間。第一部分2315-1及第三部分2315-3可遠離第二部分2315-2朝顯示器殼體2305延伸。第一部分2315-1及第三部分2315-3可接觸顯示器殼體2305之一表面。第一部分2315-1及/或第三部分2315-3之一端可成角度以符合顯示器殼體2305之形狀。第一部分2315-1及第三部分2315-3可為一不同長度。然而,若顯示器殼體2305(或顯示器殼體2305之一部分)係直立(或實質上直立),則第一部分2315-1及第三部分2315-3可為一相同(或實質上相同)長度。 The second portion 2315-2 may be parallel or substantially parallel to the frame 2320. The second portion 2315-2 can contact the frame 2320 and is positioned between the display housing 2305 and the frame 2320. The first portion 2315-1 and the third portion 2315-3 may extend away from the second portion 2315-2 toward the display housing 2305. The first portion 2315-1 and the third portion 2315-3 may contact one surface of the display case 2305. One end of the first portion 2315-1 and / or the third portion 2315-3 may be angled to conform to the shape of the display housing 2305. The first part 2315-1 and the third part 2315-3 may be of different lengths. However, if the display case 2305 (or a portion of the display case 2305) is upright (or substantially upright), the first portion 2315-1 and the third portion 2315-3 may be the same (or substantially the same) length.

雖然腔2325被示為實質上矩形,但是例示性實施方案不限於此。例如,腔2325可為三角形、圓形或某個其他形狀。因此,第一部 分2315-1、第二部分2315-2及第三部分2315-3之形狀因此可改變以界定腔2325之所要形狀。 Although the cavity 2325 is shown as being substantially rectangular, the exemplary embodiment is not limited thereto. For example, the cavity 2325 may be triangular, circular, or some other shape. So the first part The shapes of the points 2315-1, the second portion 2315-2, and the third portion 2315-3 can therefore be changed to define the desired shape of the cavity 2325.

邊框框架2315可經組態以支撐邊框2320且界定腔2325。邊框框架2315可經組態以藉由包含接觸顯示器殼體2305及邊框2320兩者之部分(例如,第一部分2315-1及2315-3)來支撐邊框2320。顯示器殼體切口2310連同邊框框架2315一起可有助於支撐且有助於定位邊框2320。邊框2320可使用一黏著劑2350(例如,膠水及/或黏著帶)附接至邊框框架2315。 The bezel frame 2315 may be configured to support the bezel 2320 and define a cavity 2325. The bezel frame 2315 may be configured to support the bezel 2320 by including portions that contact both the display housing 2305 and the bezel 2320 (eg, the first portions 2315-1 and 2315-3). The display case cutout 2310 along with the bezel frame 2315 may help support and help position the bezel 2320. The bezel 2320 may be attached to the bezel frame 2315 using an adhesive 2350 (eg, glue and / or adhesive tape).

腔2325可經組態以提供用於使其他組件通過之一路線(例如,電纜2345)。例如,在用於電腦顯示器2300之一組裝過程中,電纜2345可抵著顯示器殼體2305之一表面鬆散地放置。邊框框架2315可經定位使得電纜2345介於第一部分2315-1與2315-3之間,且接著放置邊框框架2315使其接觸顯示器殼體2305,從而形成腔2325。邊框框架2315可如上文關於圖22論述固定在適當位置。因此,腔2325可用以界定一路徑,電纜2345可透過該路徑經路線安排在電腦顯示器2300內。進一步言之,藉由將電纜2345路線安排在腔2325中,在用於電腦顯示器2300之組裝過程之剩餘部分期間電纜2345可受保護以免損壞。 The cavity 2325 may be configured to provide a route for other components to pass (eg, the cable 2345). For example, during assembly for one of the computer monitors 2300, the cable 2345 may be loosely placed against one surface of the display housing 2305. The bezel frame 2315 may be positioned such that the cable 2345 is between the first portions 2315-1 and 2315-3, and then the bezel frame 2315 is placed in contact with the display housing 2305 to form a cavity 2325. The bezel frame 2315 may be fixed in place as discussed above with respect to FIG. 22. Therefore, the cavity 2325 can be used to define a path through which the cables 2345 can be routed within the computer display 2300 via the route. Further, by arranging the cables 2345 in the cavity 2325, the cables 2345 can be protected from damage during the remainder of the assembly process for the computer display 2300.

邊框2320可包含至少一突部2340。例如,突部2340可形成為邊框2320之部分。換言之,邊框2320及突部2340可為一成型(例如,射出成型)塑膠結構。突部2340可配合至導軌2335中以有助於將邊框2320定位在一所要位置中。雖然未展示,但是突部2340及導軌2335可搭扣在一起以有助於將邊框2320固定在所要位置中。導軌2335可為一邊框框架緊固件(例如,上述邊框框架緊固件2235)之一結構元件。因此,導軌2335可連同插孔2330及突部一起作用以有助於將邊框2320固定至一所要位置中。其他元件及結構亦可有助於將邊框2320固定至一所要位置中。例如,黏著劑2350可有助於將邊框2320固定至一所要位 置中。 The frame 2320 may include at least one protrusion 2340. For example, the protrusion 2340 may be formed as a part of the frame 2320. In other words, the frame 2320 and the protrusion 2340 can be a molded (eg, injection molded) plastic structure. The protrusion 2340 can fit into the guide rail 2335 to help position the bezel 2320 in a desired position. Although not shown, the protrusions 2340 and the guide rails 2335 can be snapped together to help secure the bezel 2320 in a desired position. The guide rail 2335 may be a structural element of a frame frame fastener (for example, the frame frame fastener 2235 described above). Therefore, the guide rail 2335 can work together with the insertion hole 2330 and the protrusion to help fix the bezel 2320 in a desired position. Other components and structures can also help secure the bezel 2320 in a desired position. For example, adhesive 2350 can help secure the bezel 2320 to a desired position Set in.

圖24繪示包含根據至少一例示性實施方案之一邊框之一電腦顯示器之一截面之又一方塊圖。如圖24中所示,一電腦顯示器2400之截面包含一顯示器殼體2405、一頂部殼體截面2410、一邊框框架2415、一邊框2420及一顯示器面板框架2455。顯示器殼體2405包含一或多個撐桿2430-1至2430-3。邊框框架2415可包含一第一部分2415-1、一第二部分2415-2及一第三部分2415-3。第二部分2415-2可平行或實質上平行於邊框2420。第二部分2415-2可定位於顯示器殼體2405與邊框2420之間。第一部分2415-1及第三部分2415-3可遠離第二部分2415-2朝顯示器殼體2405延伸。第一部分2415-1及第三部分2415-3可接觸顯示器殼體2405之一表面。第一部分2415-1及/或第三部分2415-3之一端可成角度以符合顯示器殼體2405之形狀。 FIG. 24 illustrates yet another block diagram of a cross section of a computer display including a frame according to at least one exemplary embodiment. As shown in FIG. 24, the cross section of a computer monitor 2400 includes a display case 2405, a top case section 2410, a frame frame 2415, a frame 2420, and a display panel frame 2455. The display case 2405 includes one or more stays 2430-1 to 2430-3. The frame frame 2415 may include a first portion 2415-1, a second portion 2415-2, and a third portion 2415-3. The second portion 2415-2 may be parallel or substantially parallel to the frame 2420. The second portion 2415-2 can be positioned between the display case 2405 and the frame 2420. The first portion 2415-1 and the third portion 2415-3 may extend away from the second portion 2415-2 toward the display housing 2405. The first portion 2415-1 and the third portion 2415-3 may contact one surface of the display case 2405. One end of the first portion 2415-1 and / or the third portion 2415-3 may be angled to conform to the shape of the display housing 2405.

第一部分2415-1、第二部分2415-2及第三部分2415-3可界定具有一第一體積之一腔。第一部分2415-1、第二部分2415-2、第三部分2415-3及一或多個撐桿2430-1至2430-3可經組態以界定各者之體積小於第一體積之一或多個腔2425-1至2425-3。一或多個腔2425-1至2425-3可定向或定位在由第一部分2415-1、第二部分2415-2及第三部分2415-3界定之腔內。一或多個腔2425-1至2425-3可界定使得電纜2440-1至2440-2可經路線安排穿過之路徑。邊框框架2415可進一步包含一第四部分2415-4、一第五部分2415-5。邊框2420可包含一突部2440。第三部分2415-3、第四部分2415-4及第五部分2415-5可界定其中可插入突部之一插孔2435。 The first portion 2415-1, the second portion 2415-2, and the third portion 2415-3 may define a cavity having a first volume. The first part 2415-1, the second part 2415-2, the third part 2415-3, and one or more braces 2430-1 to 2430-3 may be configured to define that each has a volume smaller than one of the first volumes or Multiple cavities 2425-1 to 2425-3. One or more cavities 2425-1 to 2425-3 can be oriented or positioned within the cavities defined by the first portion 2415-1, the second portion 2415-2, and the third portion 2415-3. One or more cavities 2425-1 to 2425-3 may define a path through which cables 2440-1 to 2440-2 may be routed. The border frame 2415 may further include a fourth portion 2415-4 and a fifth portion 2415-5. The frame 2420 may include a protrusion 2440. The third portion 2415-3, the fourth portion 2415-4, and the fifth portion 2415-5 may define an insertion hole 2435 into which a protrusion can be inserted.

邊框框架2415可經組態以支撐邊框2420且有助於界定腔2425-1至2425-3。邊框框架2415可經組態以藉由包含接觸顯示器殼體2405及/或撐桿2430-1至2430-3及邊框2420兩者之部分(例如,第一部分2415-1)來支撐邊框2420。顯示器殼體切口2410可連同邊框框架2415一起有 助於支撐且有助於定位邊框2420。邊框2420可使用一黏著劑2450(例如,膠水及/或黏著帶)附接至邊框框架2415。 The bezel frame 2415 may be configured to support the bezel 2420 and help define the cavities 2425-1 to 2425-3. The bezel frame 2415 may be configured to support the bezel 2420 by including portions (eg, the first portion 2415-1) that contact both the display housing 2405 and / or the struts 2430-1 to 2430-3 and the bezel 2420. The display case cutout 2410 may be provided together with the bezel frame 2415 Helps support and help position frame 2420. The bezel 2420 may be attached to the bezel frame 2415 using an adhesive 2450 (eg, glue and / or adhesive tape).

腔2425-1至2425-3可經組態以提供用於使其他組件通過之一路線(例如,電纜2445-1及2445-2)。例如,在用於電腦顯示器2400之一組裝過程中,電纜2445-1及2445-2可抵著顯示器殼體2405之一表面放置在腔2425-1及2425-2中。邊框框架2415可定位於一或多個撐桿2430-1至2430-3上。邊框框架2415可如上文關於圖22論述般固定在適當位置。因此,腔2425-1及2425-2可用以在電腦顯示器2400內界定使得電纜2445-1及2445-2可經路線安排穿過之一路徑。進一步言之,藉由將電纜2445-1及2445-2經路線安排在腔2425-1及2425-2中且如所述般定位邊框框架,在用於電腦顯示器2400之組裝過程之剩餘部分期間電纜2445-1及2445-2可受保護以免損壞。 The cavities 2425-1 to 2425-3 can be configured to provide a route for other components to pass (eg, cables 2445-1 and 2445-2). For example, during an assembly process for a computer monitor 2400, the cables 2445-1 and 2445-2 may be placed in the cavities 2425-1 and 2425-2 against one surface of the display housing 2405. The bezel frame 2415 may be positioned on one or more of the stays 2430-1 to 2430-3. The bezel frame 2415 may be fixed in place as discussed above with respect to FIG. 22. Therefore, the cavities 2425-1 and 2425-2 can be defined within the computer display 2400 so that the cables 2445-1 and 2445-2 can be routed through a path. Further, by arranging the cables 2445-1 and 2445-2 in the cavities 2425-1 and 2425-2 and positioning the bezel frame as described, during the remainder of the assembly process for the computer monitor 2400 The cables 2445-1 and 2445-2 can be protected from damage.

撐桿2430-1至2430-3可遠離顯示器殼體2405朝第二部分2415-2延伸(若安裝有邊框框架)。撐桿2430-1至2430-3可平行或實質上平行於第一部分2415-1、第三部分2415-3及第五部分2415-5之一或多者。撐桿2430-1至2430-3可垂直或實質上垂直於第二部分2415-2及第四部分2415-4之一或多者。然而,撐桿2430-1至2430-3可成一角度使得腔2425-1至2425-3為除圖24中所示以外之某個其他形狀(例如,一三角形形狀)。撐桿2430-1至2430-3可形成為顯示器殼體2405之部分。換言之,顯示器殼體2405及撐桿2430-1至2430-3可為一成型(例如,射出成型)塑膠結構。撐桿2430-1至2430-3之間之腔2425-1至2425-3可導引電纜2445-1及2445-2以有助於將電纜2445-1及2445-2定位在一所要位置中。 The stays 2430-1 to 2430-3 may extend away from the display case 2405 toward the second portion 2415-2 (if a bezel frame is installed). The struts 2430-1 to 2430-3 may be parallel or substantially parallel to one or more of the first portion 2415-1, the third portion 2415-3, and the fifth portion 2415-5. The struts 2430-1 to 2430-3 may be perpendicular or substantially perpendicular to one or more of the second portion 2415-2 and the fourth portion 2415-4. However, the struts 2430-1 to 2430-3 may be angled such that the cavities 2425-1 to 2425-3 have some other shape (for example, a triangular shape) other than that shown in FIG. 24. The stays 2430-1 to 2430-3 may be formed as a part of the display case 2405. In other words, the display case 2405 and the supporting rods 2430-1 to 2430-3 may be a molded (eg, injection molded) plastic structure. The cavities 2425-1 to 2425-3 between the braces 2430-1 to 2430-3 can guide the cables 2445-1 and 2445-2 to help position the cables 2445-1 and 2445-2 in the desired position .

邊框2420可包含至少一突部2440。例如,突部2440可形成為邊框2420之部分。換言之,邊框2420及突部2440可為一成型(例如,射出成型)塑膠結構。突部2440可配合至插孔2435中以有助於將邊框 2420定位在一所要位置中。雖然未展示,但是突部2440及插孔2435可搭扣在一起以有助於將邊框2420固定在所要位置中。 The frame 2420 may include at least one protrusion 2440. For example, the protrusion 2440 may be formed as a part of the frame 2420. In other words, the frame 2420 and the protrusion 2440 can be a molded (eg, injection molded) plastic structure. The protrusion 2440 can be fitted into the socket 2435 to help the frame The 2420 is positioned in a desired position. Although not shown, the protrusions 2440 and the sockets 2435 can be snapped together to help secure the bezel 2420 in the desired position.

圖25繪示包含根據至少一例示性實施方案之一邊框之一電腦顯示器之一截面之另一方塊圖。如圖25中所示,一電腦顯示器2500之截面包含一顯示器殼體2505、一邊框框架2515、一邊框2520、一顯示器面板2525、一顯示器面板框架2530及一天線2535。邊框框架2515可包含一第一部分2515-1及一第二部分2515-2。第二部分2515-2可平行或實質上平行於邊框2520。第二部分2515-2可定位於顯示器殼體2505與邊框2520之間。天線2535可定位於顯示器殼體2505與第二部分2515-2之間。第一部分2515-1可遠離第二部分2515-2朝天線2535及顯示器殼體2505延伸。第一部分2515-1可接觸天線2535之一表面。第一部分2515-1之一端可成角度以符合天線2535之一角度。 FIG. 25 illustrates another block diagram of a cross-section of a computer display including a frame according to at least one exemplary embodiment. As shown in FIG. 25, a cross section of a computer monitor 2500 includes a display housing 2505, a frame frame 2515, a frame 2520, a display panel 2525, a display panel frame 2530, and an antenna 2535. The frame frame 2515 may include a first portion 2515-1 and a second portion 2515-2. The second portion 2515-2 may be parallel or substantially parallel to the frame 2520. The second portion 2515-2 may be positioned between the display case 2505 and the frame 2520. The antenna 2535 may be positioned between the display housing 2505 and the second portion 2515-2. The first portion 2515-1 may extend away from the second portion 2515-2 toward the antenna 2535 and the display housing 2505. The first portion 2515-1 may contact one surface of the antenna 2535. One end of the first portion 2515-1 may be angled to conform to an angle of the antenna 2535.

第一部分2515-1及第二部分2515-2可支撐邊框2520且有助於將天線2535固定在一所要位置中。例如,天線2535可經放置與顯示器殼體2505與天線2535之側上之間之一間隙成一角度。邊框框架2515可經定位使得第一部分2515-1以及第二部分2515-2之一端如所示般接觸天線2535。邊框框架2515可如上文關於圖22論述般固定在適當位置。結果係天線2535可楔入至適當位置使得天線2535固定在一所要位置中。 The first part 2515-1 and the second part 2515-2 can support the frame 2520 and help to fix the antenna 2535 in a desired position. For example, the antenna 2535 may be placed at an angle to a gap between the display housing 2505 and the side of the antenna 2535. The bezel frame 2515 may be positioned such that one end of the first portion 2515-1 and the second portion 2515-2 contacts the antenna 2535 as shown. The bezel frame 2515 may be fixed in place as discussed above with respect to FIG. 22. As a result, the antenna 2535 can be wedged in place so that the antenna 2535 is fixed in a desired position.

邊框框架2515可經組態以藉由包含接觸邊框2520及天線2535之部分(例如,第一部分2515-1及2515-2)來支撐邊框2520,天線2535接觸顯示器殼體2505。天線2535可為一印刷電路板(PCB)天線。天線可經充分結構化(例如,剛性)以提供前述提及之支撐。替代地,天線2535可為一可撓PCB,當其經放置接觸顯示器殼體2505時呈現顯示器殼體2505之形狀。在此一組態中,當第一部分2515-1接觸天線2535時,顯示器殼體2505為第一部分2515-1提供結構支撐。 The bezel frame 2515 may be configured to support the bezel 2520 by including portions that contact the bezel 2520 and the antenna 2535 (eg, the first portions 2515-1 and 2515-2), and the antenna 2535 contacts the display housing 2505. The antenna 2535 may be a printed circuit board (PCB) antenna. The antenna may be sufficiently structured (eg, rigid) to provide the aforementioned support. Alternatively, the antenna 2535 may be a flexible PCB that assumes the shape of the display case 2505 when placed in contact with the display case 2505. In this configuration, when the first portion 2515-1 contacts the antenna 2535, the display housing 2505 provides structural support for the first portion 2515-1.

圖25展示稍微位於第二部分2515-2中心上之第一部分2515-1。然 而,例示性實施方案不限於此。例如,第一部分2515-1可經定位朝向一端(例如,最靠近顯示器面板框架2530之一端)。進一步言之,第一部分2515-1及第二部分2515-2可組合為一似楔子形狀之一實質上單個部分。 FIG. 25 shows the first portion 2515-1 slightly centered on the second portion 2515-2. Of course However, the exemplary embodiment is not limited thereto. For example, the first portion 2515-1 may be positioned toward one end (eg, one end closest to the display panel frame 2530). Further, the first portion 2515-1 and the second portion 2515-2 may be combined into a substantially single portion having a wedge-like shape.

替代地,邊框框架2515可僅有助於將天線2535固定在所要位置中。換言之,邊框框架2515(在包含天線2535之電腦顯示器2500之區域中)可並非經組態以將邊框2520支撐至以下程度:接觸邊框2520及顯示器殼體2505之一邊框框架之其他部分可經組態以支撐邊框2520。即使在此替代實施方案中,根據例示性實施方案之一(整個)邊框框架經組態以支撐邊框2520。 Alternatively, the bezel frame 2515 may only help secure the antenna 2535 in a desired position. In other words, the bezel frame 2515 (in the area of the computer monitor 2500 including the antenna 2535) may not be configured to support the bezel 2520 to the extent that other parts of the bezel frame that contact the bezel 2520 and one of the display housings 2505 may be assembled State to support the frame 2520. Even in this alternative embodiment, the (entire) bezel frame is configured to support the bezel 2520 according to one of the exemplary embodiments.

圖26繪示包含根據至少一例示性實施方案之一邊框之一電腦顯示器之一截面之又一方塊圖。如圖26中所示,一電腦顯示器2600之截面包含一顯示器殼體2605、一顯示器殼體切口2610、一邊框框架2615、一邊框2620、一相機模組2630、一相機鏡頭2635及一顯示器面板框架2640。邊框框架2615可包含一第一部分2615-1、一第二部分2615-2及一第三部分2615-3。第一部分2615-1、第二部分2615-2及第三部分2615-3可經組態以界定一腔2625,腔2625經組態以有助於將相機模組2630固定在一所要位置中。 FIG. 26 illustrates yet another block diagram of a cross section of a computer display including a frame according to at least one exemplary embodiment. As shown in FIG. 26, a cross-section of a computer monitor 2600 includes a display housing 2605, a display housing cutout 2610, a bezel frame 2615, a bezel 2620, a camera module 2630, a camera lens 2635, and a display panel. Frame 2640. The border frame 2615 may include a first portion 2615-1, a second portion 2615-2, and a third portion 2615-3. The first portion 2615-1, the second portion 2615-2 and the third portion 2615-3 may be configured to define a cavity 2625 that is configured to help secure the camera module 2630 in a desired position.

邊框框架2615可包含一第四部分2615-4及一第五部分2615-5,其等經組態以有助於將顯示器面板框架2640定位且固定在一所要位置中。例如,第四部分2615-4及第五部分2615-5一起被示為具有一L形狀。如圖26中所示,顯示器面板框架可置於接觸第四部分2615-4及第五部分2615-5之一位置中。當邊框2620附接至邊框框架2615時,邊框框架2615接著防止顯示器面板框架2640改變其位置。因此,將顯示器面板框架2640維持在所要位置中。進一步言之,第四部分2615-4及第五部分2615-5可一起為C型。換言之,第四部分2615-4可包含自第四 部分2615-4且在邊框2620與顯示器面板框架2640之間延伸之一額外部分(未展示)。此額外部分(未展示)可接觸顯示器面板框架2640及/或邊框2620。因此,運用該額外部分(未展示),第四部分2615-4及第五部分2615-5可一起將顯示器面板框架2640固定在所要位置中,但是邊框2620不在適當位置。 The bezel frame 2615 may include a fourth portion 2615-4 and a fifth portion 2615-5, which are configured to help position and secure the display panel frame 2640 in a desired position. For example, the fourth portion 2615-4 and the fifth portion 2615-5 are shown together as having an L shape. As shown in FIG. 26, the display panel frame may be placed in one of the positions contacting the fourth portion 2615-4 and the fifth portion 2615-5. When the bezel 2620 is attached to the bezel frame 2615, the bezel frame 2615 then prevents the display panel frame 2640 from changing its position. Therefore, the display panel frame 2640 is maintained in a desired position. Further, the fourth portion 2615-4 and the fifth portion 2615-5 may be C-type together. In other words, the fourth part 2615-4 may include The portion 2615-4 and an additional portion (not shown) extending between the bezel 2620 and the display panel frame 2640. This additional portion (not shown) may contact the display panel frame 2640 and / or the bezel 2620. Therefore, using this additional part (not shown), the fourth part 2615-4 and the fifth part 2615-5 can together fix the display panel frame 2640 in the desired position, but the bezel 2620 is not in place.

邊框框架2615可經組態以支撐邊框2620且有助於將相機模組2630固定在一所要位置中。該邊框框架可藉由具有接觸或部分接觸相機模組2630之第一部分2615-1及第三部分2615-3之一或多者而有助於將相機模組固定在一所要位置中。因此,邊框框架2615可施加指向顯示器殼體2605之一力於相機模組2630上以將或有助於將相機模組2630固定在所要位置中。替代地或除此之外,可基於相機模組2630之大小調整由第一部分2615-1及第三部分2615-3(如相機模組2630之左側及右側上所示)且由第二部分2615-2及顯示器殼體2605(如相機模組2630之頂部及底部上所示)界定之一腔的大小。接著可將相機模組2630置於腔中且可如上文關於圖22論述般將邊框框架2615固定在適當位置,從而導致相機模組2630固定在所要位置中。 The bezel frame 2615 may be configured to support the bezel 2620 and help secure the camera module 2630 in a desired position. The bezel frame can help to fix the camera module in a desired position by having one or more of the first portion 2615-1 and the third portion 2615-3 that contact or partially contact the camera module 2630. Therefore, the bezel frame 2615 may apply a force directed at the display housing 2605 on the camera module 2630 to fix or help fix the camera module 2630 in a desired position. Alternatively or in addition, based on the size adjustment of the camera module 2630, the first section 2615-1 and the third section 2615-3 (as shown on the left and right sides of the camera module 2630) and the second section 2615 -2 and the display housing 2605 (as shown on the top and bottom of the camera module 2630) define the size of a cavity. The camera module 2630 can then be placed in the cavity and the bezel frame 2615 can be fixed in place as discussed above with respect to FIG. 22, resulting in the camera module 2630 being fixed in the desired position.

邊框框架2615可經組態以藉由包含接觸邊框2620及顯示器殼體2605之部分(例如,第一部分2615-1及2615-2)來支撐邊框2620。顯示器殼體切口2610可連同邊框框架2615一起有助於支撐且有助於定位邊框2620。例如,顯示器殼體切口2610可將邊框2620之一端支撐在顯示器殼體2605中。進一步言之,第二部分2615-2可平行或實質上平行於邊框2620。第二部分2615-2可接觸邊框2620且定位於顯示器殼體2605與邊框2620之間。第一部分2615-1及第三部分2615-3可遠離第二部分2615-2朝顯示器殼體2605延伸。第一部分2615-1及第三部分2615-3可接觸顯示器殼體2605之一表面(或替代地,相機模組2630之一部分,其繼而接觸顯示器殼體2605)。第一部分2615-1及/或第三部分2615-3 之一端可成角度以符合顯示器殼體2605之形狀。第一部分2615-1及第三部分2615-3可為一不同長度。然而,若顯示器殼體2605(或顯示器殼體2605之一部分)係直立(或實質上直立),則第一部分2615-1及第三部分2615-3可為一相同(或實質上相同)長度。 The bezel frame 2615 may be configured to support the bezel 2620 by including portions (eg, the first portions 2615-1 and 2615-2) that contact the bezel 2620 and the display housing 2605. The display case cutout 2610 may help support and help position the bezel 2620 along with the bezel frame 2615. For example, the display case cutout 2610 may support one end of the bezel 2620 in the display case 2605. Further, the second portion 2615-2 may be parallel or substantially parallel to the frame 2620. The second portion 2615-2 can contact the bezel 2620 and is positioned between the display housing 2605 and the bezel 2620. The first portion 2615-1 and the third portion 2615-3 may extend away from the second portion 2615-2 toward the display housing 2605. The first portion 2615-1 and the third portion 2615-3 may contact one surface of the display case 2605 (or alternatively, a portion of the camera module 2630, which in turn contacts the display case 2605). Part I 2615-1 and / or Part III 1515-3 One end may be angled to conform to the shape of the display housing 2605. The first portion 2615-1 and the third portion 2615-3 may be of different lengths. However, if the display case 2605 (or a portion of the display case 2605) is upright (or substantially upright), the first portion 2615-1 and the third portion 2615-3 may be the same (or substantially the same) length.

邊框2620可包含一切口2645,切口2645界定可透過其定位相機鏡頭2635之一位置。相機鏡頭2635可用一固定結構2650固定在適當位置。固定結構2650可為(例如)藉由形成於邊框2620中之一腔2655固持在適當位置中之一壓入配合。 The bezel 2620 can include a cutout 2645 that defines a position through which the camera lens 2635 can be positioned. The camera lens 2635 can be fixed in place by a fixing structure 2650. The fixing structure 2650 may be, for example, a press fit by holding a cavity 2655 formed in the frame 2620 in one of the positions.

圖27繪示包含具有根據至少一例示性實施方案之一麥克風之一邊框之一電腦顯示器之視圖。如圖27中所示,一邊框2705之一截面包含一鑲嵌切口2710。鑲嵌切口2710可經組態以界定聲音埠至麥克風(例如,麥克風1910)中。例如,鑲嵌切口可包含邊框2705之截面中之一凹穴2715及一孔2720。孔2720可通向麥克風(例如,麥克風1910)之一輸入。孔2720可偏離凹穴2715,因此防止一使用者刺穿孔2720並損壞麥克風。 FIG. 27 illustrates a view of a computer display including a frame with a microphone according to at least one exemplary embodiment. As shown in FIG. 27, a section of a frame 2705 includes a mosaic cutout 2710. Mosaic cutout 2710 may be configured to define a sound port into a microphone (eg, microphone 1910). For example, the mosaic cutout may include a recess 2715 and a hole 2720 in a cross section of the frame 2705. The hole 2720 can lead to one of the microphones (eg, microphone 1910) input. The hole 2720 may be offset from the recess 2715, thereby preventing a user from puncturing the perforation 2720 and damaging the microphone.

圖28繪示包含具有根據至少一例示性實施方案之一麥克風之一邊框之一電腦顯示器之一截面之方塊圖。如圖28中所示,一電腦顯示器2800之截面包含一顯示器殼體2805、一顯示器殼體切口2810、一邊框框架2815、一邊框2820、一顯示器面板框架2825、一鑲嵌切口2830、一孔2835、一凹穴2840-1及一麥克風模組2845。邊框框架2815可包含一第一部分2815-1、一第二部分2815-2及一第三部分2815-3。第一部分2815-1、第二部分2815-2及第三部分2815-3可經組態以界定一腔,該腔經組態以有助於將麥克風模組2845固定在一所要位置中。 28 is a block diagram of a cross-section of a computer display including a frame with a microphone according to at least one exemplary embodiment. As shown in FIG. 28, the cross-section of a computer monitor 2800 includes a display case 2805, a display case cutout 2810, a frame frame 2815, a frame 2820, a display panel frame 2825, a mosaic cutout 2830, and a hole 2835. , A recess 2840-1 and a microphone module 2845. The frame 2815 may include a first portion 2815-1, a second portion 2815-2, and a third portion 2815-3. The first part 2815-1, the second part 2815-2, and the third part 2815-3 may be configured to define a cavity that is configured to help secure the microphone module 2845 in a desired position.

圖29繪示包含具有圖28中所示之根據至少一例示性實施方案之一麥克風之一邊框之電腦顯示器之截面之另一方塊圖。如圖29中所示,一電腦顯示器2800之截面進一步包含一孔2905、一麥克風模組之 一第一輸入元件2910及一麥克風模組之一第二元件2915。在一些實施方案中,一麥克風模組之第一輸入元件2910及一麥克風模組之第二元件2915組合為一單個輸入元件。孔2835、凹穴2840-1(由邊框框架2815切割而成)及孔2905(切穿邊框框架2815)可偏移,因此防止一使用者刺穿孔2835且損壞麥克風模組2845。孔2835、凹穴2840-1及孔2905可界定自電腦顯示器之一外部區域至麥克風模組2845中之一聲音埠。 FIG. 29 illustrates another block diagram of a cross-section of a computer display including a frame with a microphone shown in FIG. 28 according to at least one exemplary embodiment. As shown in FIG. 29, the cross-section of a computer monitor 2800 further includes a hole 2905, a microphone module A first input element 2910 and a second element 2915 of a microphone module. In some embodiments, a first input element 2910 of a microphone module and a second element 2915 of a microphone module are combined into a single input element. The hole 2835, the recess 2840-1 (cut from the frame frame 2815), and the hole 2905 (cut through the frame frame 2815) can be offset, thereby preventing a user from puncturing the perforation 2835 and damaging the microphone module 2845. The hole 2835, the recess 2840-1, and the hole 2905 may be defined from an external area of the computer display to a sound port in the microphone module 2845.

上文關於圖22至圖29論述之邊框框架(例如,邊框框架2215、2315、2415、2515及/或2615)可為一單個邊框框架之部分。換言之,邊框框架可形成為一孤立結構,該孤立結構具有:經組態具有腔之部分,該等腔經組態以對電纜或導線進行路線安排;經組態以支撐及/或定位其他裝置(例如,天線、麥克風及/或相機)之部分。邊框可由一金屬(例如,鋁)或塑膠(例如,成型塑膠)形成。邊框可定位在一電腦顯示器之一側或多側周圍。例如,電腦顯示器之各側(例如,頂側、底側、左側及右側)可存在一單獨邊框。例如,電腦顯示器之兩個連接側(例如,頂側與左側及/或底側與右側)可存在一邊框。例如,電腦顯示器之三個連接側(例如,頂側、右側及左側)可存在一邊框。 The border frames discussed above with respect to FIGS. 22-29 (eg, the border frames 2215, 2315, 2415, 2515, and / or 2615) may be part of a single border frame. In other words, the bezel frame can be formed as an isolated structure having: portions configured with cavities configured to route cables or wires; configured to support and / or position other devices (E.g., antenna, microphone, and / or camera). The frame may be formed of a metal (for example, aluminum) or a plastic (for example, molded plastic). The bezel can be positioned around one or more sides of a computer monitor. For example, a separate frame may exist on each side of the computer display (eg, top, bottom, left, and right). For example, a border may exist on two connected sides (eg, top side and left side and / or bottom side and right side) of a computer display. For example, a border may exist on three connected sides (eg, top, right, and left) of a computer display.

圖30繪示組裝根據至少一例示性實施方案之一電腦顯示器之一方法。如圖30中所示,在步驟S1305中,在形成於一顯示器殼體上之一撐桿旁插入一導線。例如,如圖24中所示,可在撐桿2430-3旁插入一導線(例如,電纜2445-2)。 FIG. 30 illustrates a method of assembling a computer display according to at least one exemplary embodiment. As shown in FIG. 30, in step S1305, a wire is inserted beside a stay formed on a display case. For example, as shown in FIG. 24, a wire (e.g., cable 2445-2) may be inserted next to the brace 2430-3.

在步驟S1310中,一邊框框架位於撐桿上。例如,如圖24中所示,邊框框架2415固定在撐桿2430-1、2430-2及/或2430-3上。進一步言之,如圖22中所示,邊框框架2215使用邊框框架緊固件2235及邊框框架緊固件插孔2230固定在適當位置。例如,除其他緊固機構以外,邊框框架緊固件2235可螺合(如所示)、按壓及/或鉚接至邊框框架緊固件插孔2230中以有助於將邊框框架2215固定至一所要位置中。 In step S1310, a frame frame is located on the stay. For example, as shown in FIG. 24, the bezel frame 2415 is fixed on the stays 2430-1, 2430-2, and / or 2430-3. Further, as shown in FIG. 22, the frame frame 2215 is fixed in place using a frame frame fastener 2235 and a frame frame fastener insertion hole 2230. For example, among other fastening mechanisms, the frame frame fastener 2235 can be screwed (as shown), pressed and / or riveted into the frame frame fastener socket 2230 to help secure the frame frame 2215 to a desired position. in.

在步驟S1315中,將一顯示器面板插入至邊框框架之一部分中。例如,如圖29及圖22中所示,顯示器面板(例如,顯示器面板235)可包含可插入至邊框框架2215之一部分(例如,邊框框架部分2215-6)中之一顯示器面板框架2240。 In step S1315, a display panel is inserted into a part of the frame. For example, as shown in FIGS. 29 and 22, a display panel (for example, the display panel 235) may include one of the display panel frames 2240 that can be inserted into a part of the bezel frame 2215 (for example, the bezel frame part 2215-6).

在步驟S1320中,塗敷一黏著劑於邊框框架之一表面。例如,如圖24中所示,一黏著劑2450可插入在邊框2420與邊框框架2415之間。黏著劑2450可有助於將邊框2420固定至邊框框架2415。 In step S1320, an adhesive is applied to one surface of the frame. For example, as shown in FIG. 24, an adhesive 2450 may be inserted between the frame 2420 and the frame frame 2415. The adhesive 2450 may help secure the bezel 2420 to the bezel frame 2415.

在步驟S1325中,將一邊框附接至邊框框架及顯示器殼體。例如,如圖24中所示,使用黏著劑2450,將邊框2420固定至邊框框架2415。替代地或除此之外,邊框2420可使用突部2440連同插孔2435一起固定至邊框框架2415。 In step S1325, a frame is attached to the frame frame and the display case. For example, as shown in FIG. 24, the bezel 2420 is fixed to the bezel frame 2415 using an adhesive 2450. Alternatively or in addition, the bezel 2420 may be fixed to the bezel frame 2415 using a protrusion 2440 together with the socket 2435.

如上文提及,下文結合至少圖31A至圖38描述與熱處理相關之細節。結合圖31A至圖38描述之實施方案可與結合圖1至圖30及/或圖39至圖45描述之實施方案之任一者組合。 As mentioned above, details related to the heat treatment are described below in conjunction with at least FIGS. 31A to 38. The embodiment described in connection with FIGS. 31A to 38 may be combined with any of the embodiments described in connection with FIGS. 1 to 30 and / or FIGS. 39 to 45.

熱塑性黏著劑膜(例如,熱結合膜)可用以連結由不同材料(例如,塑膠、金屬等等)製成之外殼部分(「基板」)。為在兩個基板之間作出一結合,可在兩個基板之相對表面之間安置呈一熱結合膜之形式之一熱塑性黏著劑。熱塑性黏著劑膜可為幾密耳(例如,4密耳)厚。接著,可藉由使用一加熱靜壓或類似設備施加熱量及壓力在兩個基板之間作出結合。替代地,可首先使用低熱量將熱塑性黏著劑黏住或稍微結合至基板之一者。接著可將第二基板放置於曝露的黏著劑表面上,且藉由使用加熱靜壓或類似設備施加熱量及壓力在第一基板與第二基板之間作出結合。 Thermoplastic adhesive films (eg, heat-bonded films) can be used to join housing portions ("substrates") made of different materials (eg, plastic, metal, etc.). To make a bond between two substrates, a thermoplastic adhesive in the form of a heat-bonded film can be placed between the opposite surfaces of the two substrates. The thermoplastic adhesive film can be several mils (eg, 4 mils) thick. Next, a bond can be made between the two substrates by applying heat and pressure using a heated static pressure or similar device. Alternatively, the thermoplastic adhesive may be first adhered or slightly bonded to one of the substrates using low heat. Then, the second substrate can be placed on the exposed surface of the adhesive, and a combination of heat and pressure can be applied between the first substrate and the second substrate by using heat and pressure or similar equipment.

圖31A以分解圖示意地展示使用一熱壓機3100將兩個基板(例如,基板3120及3140)熱結合在一起。首先,在基板3120及3140之相對表面之間安置一熱塑性黏著劑膜3130以形成基板之一膠合總成。接 著可將基板3120及3140之膠合總成放置於熱壓機3100中之一加熱支撐塊3150上。接著,在壓力下將可加熱至一溫度T1之一熱壓塊3110施加於基板3120及3140之膠合總成。熱壓塊3110之熱量及壓力可軟化熱塑性黏著劑膜3130使得其黏著至基板3120及3140並將基板3120及3140結合在一起。所施加之熱量及壓力以及用於有效結合之熱壓塊3110之駐留時間除取決於熱塑性黏著劑膜之流動性質以外,亦可取決於結合在一起之基板之類型及厚度。 FIG. 31A schematically illustrates in an exploded view that two substrates (for example, substrates 3120 and 3140) are thermally bonded together using a hot press 3100. First, a thermoplastic adhesive film 3130 is disposed between the opposite surfaces of the substrates 3120 and 3140 to form a glue assembly of the substrate. Then, the glue assembly of the substrates 3120 and 3140 can be placed on one of the heating support blocks 3150 in the hot press 3100. Next, a hot-pressing block 3110 that can be heated to a temperature T 1 is applied to the glue assemblies of the substrates 3120 and 3140 under pressure. The heat and pressure of the hot-pressing block 3110 can soften the thermoplastic adhesive film 3130 so that it adheres to the substrates 3120 and 3140 and bonds the substrates 3120 and 3140 together. The heat and pressure applied and the dwell time of the thermal briquette 3110 for effective bonding, in addition to the flow properties of the thermoplastic adhesive film, can also depend on the type and thickness of the substrates bonded together.

用於有效結合之熱塑性黏著劑膜之一軟化溫度範圍可較為狹窄(例如,在幾攝氏度之一範圍中)。對於某些應用(例如,一膝上型電腦外殼總成),基板3120及3140可跨該等基板之膠合總成之一橫向範圍具有結構不均勻性及非均勻熱質量分佈。此等不均勻性可使得難以藉由施加加熱至溫度T1之熱壓塊3110來跨基板之膠合總成之橫向範圍達成用於有效結合之狹窄範圍中之均勻軟化溫度。 One of the thermoplastic adhesive films used for effective bonding may have a narrower softening temperature range (for example, in a range of a few degrees Celsius). For some applications (eg, a laptop computer case assembly), the substrates 3120 and 3140 may have structural non-uniformity and non-uniform thermal mass distribution across a lateral range of the glued assembly of the substrates. These inhomogeneities can make it difficult to achieve a uniform softening temperature in a narrow range for effective bonding across the lateral range of the glue assembly of the substrate by applying a hot compact 3110 heated to a temperature T 1 .

用於熱結合一電子裝置外殼之部分之一方法涉及根據本文之發明原理跨該等部分之一膠合總成之一橫向範圍施加空間上變化的熱量於該總成。 One method for thermally bonding a portion of an electronic device enclosure involves applying spatially varying heat to the assembly in accordance with the principles of the invention herein across a lateral range of one of the glued assemblies.

本文描述之方法可用以結合部分,該等部分跨其等之一膠合總成之一橫向範圍具有結構不均勻性且呈現非均勻熱質量分佈。施加空間上變化的熱量可補償結構不均勻性及非均勻熱質量分佈以跨部分之膠合總成之橫向範圍達成熱塑性黏著劑之一更均勻軟化溫度。 The method described herein can be used to combine sections that have structural inhomogeneity and exhibit a non-uniform thermal mass distribution across one of the lateral extents of one of the glue assemblies. Applying spatially varying heat can compensate for structural non-uniformity and non-uniform thermal mass distribution to achieve a more uniform softening temperature of one of the thermoplastic adhesives across the lateral extent of the glue assembly.

圖31B展示用於施加空間上變化的熱量於部分之一膠合總成之熱壓機3100之一例示性修改。如圖中所示,熱壓機3100可包含一熱壓塊3112,熱壓塊3112具有兩個空間不同加熱區一加熱至一溫度T1之區1及加熱至一不同溫度T2之區2。使用此一熱壓塊3112,可在熱壓機3100中將基板3120及3140之膠合總成之一第一空間部分加熱至溫度T1且將基板3120及3140之膠合總成之一第二空間部分加熱至一不同溫度 T2FIG. 31B shows an exemplary modification of a heat press 3100 for applying a spatially varying amount of heat to a portion of a gluing assembly. As shown, a hot press 3100 may comprise a hot briquetted 3112, 3112 HBI having a two spatially distinct heating zones is heated to a temperature T 1 of the region 1 and is heated to a different temperature T 2 of Zone 2 . Using this hot pressing block 3112, the first space of one of the glue assemblies of the substrates 3120 and 3140 can be heated to the temperature T 1 in the hot press 3100 and the second space of one of the glue assemblies of the substrates 3120 and 3140. Partially heated to a different temperature T 2 .

為繪示目的,下文參考圖32至圖35使用一膝上型電腦外殼之特定部分作為一實例來描述用於藉由施加空間上變化的熱量於該等部分之一膠合總成熱結合一電子裝置外殼之部分之揭示方法。然而,應瞭解,該方法不限於膝上型電腦外殼之特定部分,但是可用以結合其他膝上型電腦或電子裝置外殼部分。 For illustration purposes, a specific portion of a laptop casing is used below as an example with reference to FIGS. 32 to 35 to describe a method for thermally bonding an electron to a glue assembly of one of these portions by applying spatially varying heat. Method for revealing part of device casing. It should be understood, however, that the method is not limited to a particular portion of a laptop computer case, but may be used in conjunction with other laptop or electronic device housing portions.

圖32繪示一例示性膝上型電腦3221。可具有一翻蓋式外觀尺寸之膝上型電腦可由兩個外殼形成-一「顯示器」或頂部外殼3222及一「鍵盤」或底部外殼3223。頂部外殼3222可(例如)包含一顯示器、一觸控螢幕、一玻璃蓋等等。底部外殼3223可(例如)包含電路板,該等電路板包含若干電組件、一鍵盤、一軌跡板等等。可由一鉸鏈總成3224樞轉地連接至底部外殼之頂部外殼可用作膝上型電腦之一封閉位置中之頂部外殼之一蓋罩。 FIG. 32 illustrates an exemplary laptop computer 3221. A laptop computer, which may have a clamshell form factor, may be formed of two casings-a "display" or top casing 3222 and a "keyboard" or bottom casing 3223. The top case 3222 may, for example, include a display, a touch screen, a glass cover, and the like. The bottom housing 3223 may, for example, contain circuit boards that include several electrical components, a keyboard, a trackpad, and the like. The top case, which can be pivotally connected to the bottom case by a hinge assembly 3224, can be used as a cover for the top case in a closed position in a laptop computer.

圖33A至圖33C展示可根據本文之發明原理藉由以一熱壓機施加空間上變化的熱量而熱結合在一起之一膝上型電腦之一底部外殼(例如,底部外殼3223)之例示性部分(例如,一基座框架或蓋3310及中平面板3320)。應注意,圖33A及圖33B分別展示基座框架或蓋3310之一仰視圖及一俯視圖,且圖33B展示中平面板3320之一仰視圖。 33A-33C show an exemplary bottom case (eg, bottom case 3223) of a laptop computer that can be thermally bonded together by applying spatially varying heat with a hot press in accordance with the principles of the invention herein Portions (eg, a base frame or cover 3310 and a midplane plate 3320). It should be noted that FIGS. 33A and 33B show a bottom view and a top view of a base frame or cover 3310, respectively, and FIG. 33B shows a bottom view of a mid-plane plate 3320.

參考圖33A及圖33B,例示性基座框架或蓋3310可為底部外殼3223之一裝飾蓋部分。蓋3310可由塑膠材料(例如,聚碳酸酯、聚氯乙烯(PVC)、丙烯睛-丁二烯-苯乙烯(ABS)、金屬填充之PVC/ABS或其等之摻合物)製成。在一例示性實施方案中,蓋3310可具有標稱上約1.4mm厚之壁。蓋3310可包含分別用於膝上型電腦之一鍵盤及一軌跡板之切口3312及3314。蓋3310可包含靠近軌跡板切口3314之相對堅固或鄰接區域3315,該等區域可用作膝上型電腦之一使用者之一掌托區域。進一步言之,蓋3310可具有一凸緣3316,凸緣3316具有一面向裡 的下切口3318,該下切口3318可形成一大體上C型狹槽或通道以固持或支撐圍封在底部外殼3223中之膝上型電腦組件(例如,中平面板3320)之邊緣。 Referring to FIGS. 33A and 33B, an exemplary base frame or cover 3310 may be one of the decorative cover portions of the bottom case 3223. The cover 3310 may be made of a plastic material (for example, polycarbonate, polyvinyl chloride (PVC), acrylic-butadiene-styrene (ABS), metal-filled PVC / ABS, or a blend thereof). In an exemplary embodiment, the cover 3310 may have walls that are nominally about 1.4 mm thick. The cover 3310 may include cutouts 3312 and 3314 for a keyboard and a trackpad of a laptop computer, respectively. The cover 3310 may include a relatively solid or abutting area 3315 near the trackpad cutout 3314, which may be used as a palm rest area for a user of a laptop computer. Further, the cover 3310 may have a flange 3316, and the flange 3316 has a side facing inward. The undercut 3318 may form a substantially C-shaped slot or channel to hold or support an edge of a laptop computer component (eg, a midplane plate 3320) enclosed in the bottom housing 3223.

參考圖33C,可由金屬或一金屬合金製成之例示性中平面板3320可被設計為用於在結構上支撐各種電子組件(例如,鍵盤開關、電路板、軌跡板等等)及圍封在底部外殼3223中之相關聯之佈線(未展示)之一基座或機座。中平面板3320可(例如)具有一非均勻拓撲結構且包含若干切口以容納各種電子組件及相關聯之佈線等等。各種電子組件可(例如)用諸如螺釘、螺栓或緊固件(未展示)之機械工具安裝在中平面3320上。在一例示性實施方案中,中平面板3320可由鋁、鎂或鎂鋁合金製成。中平面板3320可具有約1.4mm之一標稱厚度,但是可跨其橫向範圍具有更大厚度變化。 Referring to FIG. 33C, an exemplary mid-plane board 3320, which may be made of metal or a metal alloy, may be designed to structurally support various electronic components (e.g., keyboard switches, circuit boards, trackpads, etc.) and enclosed in One of the bases or bases of the associated wiring (not shown) in the bottom housing 3223. The mid-plane board 3320 may, for example, have a non-uniform topology and include several cutouts to accommodate various electronic components and associated wiring, and so on. Various electronic components may be mounted on the midplane 3320, for example, with a mechanical tool such as a screw, bolt, or fastener (not shown). In an exemplary embodiment, the mid-plane plate 3320 may be made of aluminum, magnesium, or a magnesium aluminum alloy. The mid-plane plate 3320 may have one of the nominal thicknesses of about 1.4 mm, but may have greater thickness variations across its lateral extent.

圖34A及圖34B係根據本文之發明原理之基座框架或蓋3310及中平面板3320之一例示性總成3400之圖解。應注意,圖34A及圖34B分別展示具有面朝下及面朝上之蓋3310及中平面板3320之總成3400之視圖。 34A and 34B are diagrams of an exemplary assembly 3400 of a base frame or cover 3310 and a midplane plate 3320 according to the principles of the invention herein. It should be noted that FIGS. 34A and 34B show views of an assembly 3400 with a face-down and face-up cover 3310 and a mid-plane plate 3320, respectively.

在組裝底部外殼3223時,中平面板3320可傾斜且滑動至蓋3310中使得中平面板3320之邊緣擱在下切口3318中以形成總成3400(圖34A)。在一例示性實施方案中,總成3400可具有約300mm乘以200mm之橫向尺寸及約5mm至10mm之一厚度。 When assembling the bottom case 3223, the midplane plate 3320 can be tilted and slid into the cover 3310 so that the edge of the midplane plate 3320 rests in the undercut 3318 to form the assembly 3400 (FIG. 34A). In an exemplary embodiment, the assembly 3400 may have a lateral dimension of about 300 mm by 200 mm and a thickness of about 5 mm to 10 mm.

繼續參考用於熱結合蓋3310及中平面板3320之過程,應瞭解,在中平面板3320滑動至蓋3310之前可在中平面板3320之接觸或結合區域上方塗敷一熱塑性黏著劑膜(例如,膜3130)以形成總成3400。展示總成3400之一俯視圖之圖34B繪示中平面板3320與蓋3310之間之結合區域(例如,結合區域1、2及3)。為將中平面板3320結合至蓋3310,可透過蓋3310之一敞開面將一熱壓機之一熱壓塊直接施加於中平面板 3320之曝露區域以加熱並按壓總成3400。然而,蓋3310之下切口凸緣3316中之結合區域(例如,結合區域2及3)不一定容易直接接觸加熱塊且可僅藉由透過中平面板3320進行橫向熱傳導來加熱。進一步言之,中平面板3320中之厚度變動、切口及其他結構不均勻性可導致跨總成3400之非均勻熱質量分佈。非均勻熱質量分佈可使得當使用諸如加熱至一單個溫度T1之熱壓機3100之熱壓塊3110之一加熱塊時難以跨總成3400之結合區域達成均勻軟化溫度。 Continue to refer to the process for thermally bonding the lid 3310 and the mid-plane plate 3320. It should be understood that before the mid-plane plate 3320 slides to the lid 3310, a thermoplastic adhesive film (such as Film 3130) to form an assembly 3400. FIG. 34B, which shows a top view of one of the assembly 3400, illustrates a bonding area (for example, bonding areas 1, 2, and 3) between the mid-plane plate 3320 and the cover 3310. In order to couple the mid-plane plate 3320 to the cover 3310, a hot press block of a heat press can be directly applied to the exposed area of the mid-plane plate 3320 through an open surface of the cover 3310 to heat and press the assembly 3400. However, the bonding areas (for example, bonding areas 2 and 3) in the cutout flange 3316 under the cover 3310 are not necessarily easy to directly contact the heating block and can be heated only by lateral heat conduction through the mid-plane plate 3320. Further, variations in thickness, notches, and other structural inhomogeneities in the mid-plane plate 3320 can result in a non-uniform thermal mass distribution across the assembly 3400. The non-uniform thermal mass distribution can make it difficult to achieve a uniform softening temperature across the bonding area of the assembly 3400 when using a heating block such as the thermal block 3110 of a hot press 3100 heated to a single temperature T 1 .

參考圖34B,結合區域1、2及3可關於經由穿過中平面板3320之熱通道自一熱壓塊(例如,熱壓塊3110或3112)之熱流具有不同熱特性。結合區域1至3之不同熱特性可為結合區域附近之中平面板3320之不同機械及幾何特性之一結果。圖35A至圖35C分別立體地描繪圖34B中所示之區域3510至3530中之結合區域1至3之不同機械及幾何特性。 Referring to FIG. 34B, the bonding regions 1, 2 and 3 may have different thermal characteristics with respect to the heat flow from a thermal briquette (for example, the thermal briquette 3110 or 3112) via a heat passage through the mid-plane plate 3320. The different thermal characteristics of the bonding regions 1 to 3 may be a result of different mechanical and geometrical characteristics of the midplane plate 3320 near the bonding region. 35A to 35C depict three-dimensionally different mechanical and geometrical characteristics of the bonding regions 1 to 3 in the regions 3510 to 3530 shown in FIG. 34B, respectively.

可接達一垂直移動熱壓塊之區域3510中之結合區域1(圖35A)可具有穿過中平面板3320之垂直熱流路徑3512,該路徑3152可具有跨結合區域1之一相對均勻厚度。與結合區域1相比,可在凸緣3316之下切口區域3318中之區域3520中之結合區域2(圖35B)及區域3530中之結合區域3(圖35C)無法接達一垂直移動熱壓塊。至區域3520中之結合區域2之熱流路徑3522及至區域3530中之結合區域3之熱流路徑3532可橫向延伸穿過中平面板3320。進一步言之,如圖35B及圖35C中所示,結合區域2及3附近之中平面板3320之厚度可存在大的局部變動,此可使得至結合區域2及3之橫向熱流不均勻。結合區域3亦可面臨沿路徑3534將軟化熱塑性黏著劑壓出或擠出至軌跡板切口3314中之一風險。 Bonding region 1 (FIG. 35A) of region 3510 that can access a vertically moving thermocompression block may have a vertical heat flow path 3512 passing through the mid-plane plate 3320, and the path 3152 may have a relatively uniform thickness across one of the bonding regions 1. Compared with bonding area 1, bonding area 2 (Figure 35B) in area 3520 in cutout area 3318 under flange 3316 and bonding area 3 (Figure 35C) in area 3530 cannot reach a vertical moving hot press Piece. The heat flow path 3522 to the bonding region 2 in the region 3520 and the heat flow path 3532 to the bonding region 3 in the region 3530 may extend laterally through the mid-plane plate 3320. Further, as shown in FIG. 35B and FIG. 35C, the thickness of the planar plate 3320 in the vicinity of the bonding regions 2 and 3 may have a large local variation, which may make the lateral heat flow to the bonding regions 2 and 3 uneven. The bonding region 3 may also face one of the risks of pressing out or extruding the softened thermoplastic adhesive into the track plate cutout 3314 along the path 3534.

藉由在熱壓機之一熱壓塊中使用多區加熱元件,可根據本文之發明原理將總成3400之不同部分加熱至不同溫度。將總成3400之不同部分加熱至不同溫度可補償非均勻熱質量分佈且跨包含蓋3310之切口附近或下切口凸緣中之結合區域(例如,結合區域2及3)之總成3400之 結合區域達成相對均勻黏著劑軟化溫度。 By using a multi-zone heating element in one of the hot press blocks of the hot press, different parts of the assembly 3400 can be heated to different temperatures in accordance with the principles of the invention herein. Heating different parts of the assembly 3400 to different temperatures can compensate for a non-uniform thermal mass distribution and span the joint 3400 of the joint region (e.g., joint regions 2 and 3) near the cutout containing the cover 3310 or in the undercut flange. The bonding area achieves a relatively uniform adhesive softening temperature.

在一例示性熱結合過程中,總成3400可在具有類似於圖31B中所示之熱壓機3100之一加熱底座及一熱壓座或熱壓塊之一熱壓機中加熱處理及加壓處理。總成3400可放置於可加熱至約50℃之加熱底座中。此加熱程度可輔助將熱塑性黏著劑黏住或稍微結合在總成3400中之蓋3310與中平面板3320之間。接著,可在約20秒鐘之一駐留時間內用約90kgf之一力透過總成3400中之蓋3310之敞開面將熱壓座或熱壓塊(例如,熱壓塊3112)垂直施加於中平面板3320。熱壓座中之加熱元件可經配置使得熱壓座存在兩個加熱區(例如,區1及區2)。對應於熱壓座之一前側部分之區1可在結合區域1上接觸總成3400之一前側部分3410(圖34B)且毗鄰軌跡板區域3314。對應於熱壓座之一後側部分之區2可在對應於結合區域2附近之蓋3310中之鍵盤切口3312處接觸總成3400之一後側部分3420(圖34B)。為施加空間上變化的熱量於總成3400,可將區1加熱至約190℃,同時可將區2加熱至約240℃。施加於總成3400之前側部分3410之較低溫度(190℃)可容許透過跨中平面板3320之垂直熱通道3512將足夠多的熱量傳導至結合區域1以適當地軟化用於有效結合之熱塑性黏著劑。施加於總成3400之後側部分3420之較高溫度可容許透過中平面板3320中之橫向熱通道3522將足夠多的熱量傳導至結合區域2(圖35B)以適當地軟化用於有效結合之熱塑性黏著劑。接著可在約20秒鐘內用約85kgf之一力在一冷卻座下將總成3400冷卻至約室溫。 In an exemplary thermal bonding process, the assembly 3400 may be heat treated and heated in a hot press having a heating base and a hot pressing base or a hot pressing block similar to that shown in FIG. 31B.压 处理。 Pressure processing. The assembly 3400 can be placed in a heating base that can be heated to about 50 ° C. This degree of heating can assist in bonding or slightly bonding the thermoplastic adhesive between the cover 3310 and the mid-plane plate 3320 in the assembly 3400. Then, a hot pressing seat or a hot pressing block (for example, a hot pressing block 3112) may be vertically applied to the middle through a open surface of the cover 3310 in the assembly 3400 with a force of about 90 kgf for a dwell time of about 20 seconds. Flat panel 3320. The heating element in the hot-pressing seat can be configured so that the hot-pressing seat has two heating zones (eg, zone 1 and zone 2). The area 1 corresponding to one of the front side portions of the hot pressing seat may contact one of the front side portions 3410 (FIG. 34B) of the assembly 3400 on the bonding area 1 and be adjacent to the track plate area 3314. The area 2 corresponding to one of the rear side portions of the heat-pressing seat may contact one of the rear side portions 3420 of the assembly 3400 at the keyboard cutout 3312 in the cover 3310 near the bonding area 2 (FIG. 34B). To apply spatially varying heat to the assembly 3400, zone 1 can be heated to about 190 ° C, and zone 2 can be heated to about 240 ° C. The lower temperature (190 ° C) applied to the front side portion 3410 of the assembly 3400 may allow sufficient heat to be conducted to the bonding area 1 through the vertical heat passage 3512 across the mid-plane plate 3320 to appropriately soften the thermoplastic for effective bonding Adhesive. The higher temperature applied to the rear side portion 3420 of the assembly 3400 may allow sufficient heat to be conducted to the bonding area 2 (FIG. 35B) through the lateral heat channel 3522 in the mid-plane plate 3320 to properly soften the thermoplastic for effective bonding. Adhesive. The assembly 3400 can then be cooled to about room temperature with a force of about 85 kgf under a cooling seat in about 20 seconds.

圖36至圖38分別展示用於根據本文之發明原理將一計算裝置外殼之部分熱結合在一起之例示性方法3600、3700及3800。結合在一起之部分可(例如)包含一基座框架或蓋及一中平面板。基座框架或蓋可由塑膠材料(例如,聚乙烯基碳酸酯、丙烯睛-丁二烯-苯乙烯或其等之摻合物)製成。中平面板可由一金屬或金屬合金(例如,鋁、鎂或一鎂 鋁合金)製成。 36 to 38 illustrate exemplary methods 3600, 3700, and 3800 for thermally bonding portions of a computing device housing together according to the principles of the invention herein. The combined parts may, for example, include a base frame or cover and a mid-plane plate. The base frame or cover may be made of a plastic material (eg, polyvinyl carbonate, acrylic-butadiene-styrene, or a blend thereof). The mid-plane plate may be made of a metal or metal alloy (e.g., aluminum, magnesium, or magnesium Aluminum alloy).

參考圖36,方法3600包含將具有一熱塑性黏著劑層之中平面板插入至計算裝置外殼之基座框架中(3610)、使中平面板之熱塑性黏著劑層接觸計算裝置外殼之基座框架之一內表面(3620)及將具有一第一部分及一第二部分之一熱壓塊施加於中平面板(3630)。 Referring to FIG. 36, method 3600 includes inserting a midplane plate having a thermoplastic adhesive layer into a base frame of a computing device housing (3610), and contacting the thermoplastic adhesive layer of the midplane plate with a base frame of the computing device housing. An inner surface (3620) and a hot-pressing block having a first portion and a second portion are applied to a mid-plane plate (3630).

方法3600進一步包含將熱壓塊之第一部分加熱至一第一溫度且將熱壓塊之第二部分加熱至高於第一溫度之一第二溫度(3640)。第一溫度可為(例如)約190℃。第二溫度可為(例如)約240℃。在方法3600中,加熱至第一溫度之第一部分可接觸中平面板之毗鄰計算裝置外殼之一軌跡板區域之一前側部分,而加熱至第二溫度之第二部分可接觸中平面板之毗鄰計算裝置外殼之一鍵盤區域之一後側部分。 Method 3600 further includes heating a first portion of the hot briquette to a first temperature and heating a second portion of the hot briquette to a second temperature that is higher than one of the first temperatures (3640). The first temperature may be, for example, about 190 ° C. The second temperature may be, for example, about 240 ° C. In method 3600, a first portion heated to a first temperature may contact a front side portion of a trackpad region adjacent to a computing device housing and a second portion heated to a second temperature may contact a midplane plate. A rear portion of a keyboard area of a computing device housing.

方法3600可進一步包含將基座框架置於一底座中,當將熱壓塊施加於中平面板時該底座被加熱至約50℃。 The method 3600 may further include placing the base frame in a base, and the base is heated to about 50 ° C. when the heat-pressed block is applied to the mid-plane plate.

參考圖37,方法3700包含使用一介入熱塑性黏著劑層將一中平面板之一表面部分與一膝上型外殼之一基座框架之一表面部分膠合或耦合在一起(3710),及將第一熱量施加於中平面板之一前側部分且將第二熱量施加於中平面板之一後側部分以軟化介入熱塑性黏著劑層(3720)。將第一熱量施加於中平面板之一前側部分且將第二熱量施加於中平面板之一後側部分(3720)可包含將一熱壓塊施加於中平面板,該熱壓塊具有加熱至一第一溫度且接觸中平面板之一第一部分及加熱至一第二溫度且接觸中平面板之一第二部分(3730)。 Referring to FIG. 37, method 3700 includes gluing or coupling a surface portion of a mid-plane plate with a surface portion of a base frame of a laptop casing using an intervening thermoplastic adhesive layer (3710), and bonding the first A heat is applied to a front side portion of a mid-plane plate and a second heat is applied to a back side portion of the mid-plane plate to soften the intervening thermoplastic adhesive layer (3720). Applying first heat to a front side portion of a mid-plane plate and applying second heat to a rear side portion (3720) of the mid-plane plate may include applying a heat-pressing block to the mid-plane plate having heating To a first temperature and contacting a first portion of a mid-plane plate and heating to a second temperature and contacting a second portion of a mid-plane plate (3730).

參考圖38,方法3800包含藉由在一計算裝置外殼之一第一部分之一表面部分與計算裝置外殼之一第二部分之一相對表面部分之間安置一熱塑性黏著劑層形成該第一部分與該第二部分之一總成(3810)。第一部分之表面部分及第二部分之相對表面部分可跨總成之一橫向範圍界定第一部分及第二部分之一或多個結合區域。總成可跨其橫向範 圍具有一非均勻熱質量分佈。方法3800進一步包含跨總成之橫向範圍施加空間上變化的熱量於總成以與跨總成之橫向範圍施加一非空間變化的熱量相比跨總成之橫向範圍相對均勻地軟化結合區域中之熱塑性黏著劑層(3820)。 Referring to FIG. 38, a method 3800 includes forming a first adhesive layer with a thermoplastic adhesive layer between a surface portion of a first portion of a computing device housing and an opposite surface portion of a second portion of a computing device housing. One of the second part assembly (3810). The surface portion of the first portion and the opposite surface portion of the second portion may define one or more bonding areas of the first portion and the second portion across a lateral extent of the assembly. Assembly can cross its horizontal model The enclosure has a non-uniform thermal mass distribution. Method 3800 further includes applying spatially varying heat across the lateral extent of the assembly to the assembly to soften relatively evenly across the lateral extent of the assembly compared to applying a non-spatially varying amount of heat across the lateral extent of the assembly. Thermoplastic adhesive layer (3820).

跨總成之橫向範圍施加空間上變化的熱量於總成(3820)可包含補償總成跨其橫向範圍之非均勻熱質量分佈(3822)。進一步言之,跨總成之橫向範圍施加空間上變化的熱量於總成(3820)可包含使總成中之第一部分之一部分與一加熱塊接觸(3824)。加熱塊可具有接觸第一部分之部分之多個區,其等各者加熱至一不同溫度。在一例示性實施方案中,加熱塊具有接觸第一部分之部分之兩個區,其等各者加熱至一不同溫度。 Applying spatially varying heat across the lateral extent of the assembly to the assembly (3820) may include compensating for the non-uniform thermal mass distribution of the assembly across its lateral extent (3822). Further, applying spatially varying heat across the lateral extent of the assembly to the assembly (3820) may include contacting a portion of the first part of the assembly with a heating block (3824). The heating block may have a plurality of zones contacting a portion of the first portion, each of which is heated to a different temperature. In an exemplary embodiment, the heating block has two zones contacting the portion of the first portion, each of which is heated to a different temperature.

在方法3800中,結合區域之至少一者可在該總成之一區域中,該區域不容易直接接觸加熱塊且可由來自加熱塊接觸之第一部分之部分之橫向熱傳導而加熱。相反地,結合區域之至少一者可在該總成之一區域中,該區域可容易直接接觸加熱塊且可由垂直熱傳導透過加熱塊接觸之第一部分之部分而加熱。 In method 3800, at least one of the bonding regions may be in a region of the assembly that is not easily in direct contact with the heating block and may be heated by lateral heat conduction from a portion of the first portion that the heating block contacts. Conversely, at least one of the bonding regions may be in a region of the assembly, the region may be in direct contact with the heating block and may be heated by vertical heat conduction through a portion of the first portion that the heating block contacts.

方法3800可進一步包含施加壓力於總成並同時跨總成之橫向範圍施加空間上變化的熱量於總成(3830)、預熱總成以將熱塑性黏著劑層黏至第一部分之表面部分及第二部分之相對表面部分之至少一者(3840)及在軟化結合區域中之熱塑性黏著劑層之後冷卻總成(3850)。 The method 3800 may further include applying pressure to the assembly and simultaneously applying spatially varying heat to the assembly (3830), preheating the assembly to adhere the thermoplastic adhesive layer to the surface portion of the first portion, and the first At least one of the two opposing surface portions (3840) and the assembly is cooled after softening the thermoplastic adhesive layer in the bonding area (3850).

如本文中至少圖39至圖45所述,一鍵盤支撐部件可耦合至一計算裝置之一基座總成,藉此將一鍵盤總成固定至基座總成。例如,基座總成可界定基座總成內之一開口,且鍵盤總成可放置於基座總成之開口內。如參考該等圖式進一步描述,從一使用者俯視計算裝置之角度來看,基座總成之結構可允許自頂部插入鍵盤總成。 As described in at least FIGS. 39 to 45 herein, a keyboard support member may be coupled to a base assembly of a computing device, thereby fixing a keyboard assembly to the base assembly. For example, the base assembly may define an opening in the base assembly, and the keyboard assembly may be placed in the opening in the base assembly. As further described with reference to these drawings, the structure of the base assembly allows the keyboard assembly to be inserted from the top, from the perspective of a user looking down at the computing device.

鍵盤支撐部件可包含界定一支撐部件邊框之一外圓周部分及具 有界定經組態以配合在鍵盤總成之鍵周圍之複數個開口之一格子結構之一內部部分。鍵盤支撐部件可藉由熱鉚接、干涉配合或緊固件(例如,螺紋式緊固件)耦合至基座總成,藉此將鍵盤總成固定地圍封至基座總成。換言之,鍵盤支撐部件可耦合至基座總成使得鍵盤總成位於鍵盤支撐部件與基座總成之間。此結構允許輕易地移除鍵盤總成,且允許各種鍵盤支撐部件之互換,該等鍵盤支撐部件可在支撐部件邊框及/或格子結構周圍具有不同材料(例如,塑膠、木材、金屬等等)或色彩。 The keyboard support member may include an outer peripheral portion defining a frame of the support member and a There is an internal portion defining a lattice structure configured to fit a plurality of openings around the keys of the keyboard assembly. The keyboard support member may be coupled to the base assembly by thermal caulking, interference fit, or a fastener (eg, a threaded fastener), thereby fixedly enclosing the keyboard assembly to the base assembly. In other words, the keyboard support member may be coupled to the base assembly such that the keyboard assembly is located between the keyboard support member and the base assembly. This structure allows for easy removal of the keyboard assembly, and allows the interchange of various keyboard support components that can have different materials (such as plastic, wood, metal, etc.) around the frame and / or lattice structure of the support component. Or color.

在一實施方案中,鍵盤支撐部件可使用螺釘孔(screw boss)耦合至基座總成。例如,螺釘孔(例如,塑膠孔)可位於鍵盤支撐部件上,且螺紋式緊固件(例如,螺釘)可螺紋式地引導至鍵盤支撐部件中。螺釘孔可自鍵盤支撐部件邊框區域及/或格子結構區域延伸。進一步言之,鍵盤支撐部件可包含可成型或插入至鍵盤支撐部件之材料中之螺紋式金屬插入件。接著,可將螺釘直接緊固至螺紋式金屬插入件(例如,成型至塑膠孔中之黃銅螺紋式插入件)中。 In one embodiment, the keyboard support member may be coupled to the base assembly using a screw boss. For example, screw holes (eg, plastic holes) may be located on the keyboard support member, and threaded fasteners (eg, screws) may be threaded into the keyboard support member. The screw holes may extend from the frame area and / or the lattice structure area of the keyboard support member. Further, the keyboard support member may include a threaded metal insert that can be formed or inserted into a material of the keyboard support member. The screw can then be tightened directly into a threaded metal insert (for example, a brass threaded insert molded into a plastic hole).

進一步言之,鍵盤支撐部件可使用使鍵盤支撐部件成型之一雙射方法而產生。例如,在一第一次射出中,可將鍵盤支撐部件成型為其格子結構,且接著在一後續射出中,可使鍵盤支撐部件之支撐部件邊框進一步成型以界定其形狀。在一實施方案中,支撐部件邊框可包含不同於內部格子之一色彩。結合圖39至圖45描述之實施方案可與結合圖1至圖38描述之實施方案之任一者組合。 Further, the keyboard support member may be produced using a two-shot method of molding the keyboard support member. For example, in a first shot, the keyboard support member may be formed into a lattice structure, and then in a subsequent shot, the support member frame of the keyboard support member may be further formed to define its shape. In one embodiment, the supporting member frame may include a color different from that of the inner grid. The embodiment described in connection with FIGS. 39 to 45 may be combined with any of the embodiments described in connection with FIGS. 1 to 38.

圖39及圖40繪示一計算裝置10,其呈一筆記型電腦、膝上型電腦或翻蓋電腦之形式,具有經組態以擱在一表面上且支撐具有一顯示器螢幕16之一顯示器部分14之一基座總成12。顯示器部分14可藉由一鉸鏈18連接至基座總成12,鉸鏈18容許顯示器部分14如圖40中所示般抵著基座總成12封閉且如圖39所示般藉由遠離其旋轉敞開至一使用者 可選擇查看位置中。 39 and 40 illustrate a computing device 10 in the form of a laptop, laptop, or flip computer with a display portion configured to rest on a surface and support a display screen 16 14One of the base assembly 12. The display portion 14 may be connected to the base assembly 12 by a hinge 18 that allows the display portion 14 to be closed against the base assembly 12 as shown in FIG. 40 and rotated away from it as shown in FIG. 39. Open to a user You can choose to view the location.

例如,鉸鏈18可連接基座總成12與顯示器部分14。鉸鏈18可經組態以容許顯示器部分14相對於基座總成12旋轉以提供所要範圍的旋轉以容許顯示器部分14定位於封閉位置中或一系列敞開位置中。鉸鏈18亦可經組態以提供內部摩擦力以維持顯示器部分14相對於基座總成12之一選定敞開位置。 For example, the hinge 18 may connect the base assembly 12 and the display portion 14. The hinge 18 may be configured to allow the display portion 14 to rotate relative to the base assembly 12 to provide a desired range of rotation to allow the display portion 14 to be positioned in a closed position or a series of open positions. The hinge 18 may also be configured to provide internal friction to maintain a selected open position of the display portion 14 relative to one of the base assemblies 12.

基座總成12可經組態以收納並固持一鍵盤總成70及一軌跡板總成66以接收計算裝置10之使用者輸入。鍵盤總成70可包含複數個鍵80以及其他鍵盤組件。鍵盤總成70進一步參考圖41加以解釋。複數個鍵80可包含任何數目個鍵80,其等可根據任何已知鍵盤組態(舉例而言,諸如德沃夏克鍵盤(Dvorak Simplified Keyboard)或QWERTY)而配置。 The base assembly 12 may be configured to receive and hold a keyboard assembly 70 and a trackpad assembly 66 to receive user input from the computing device 10. The keyboard assembly 70 may include a plurality of keys 80 and other keyboard components. The keyboard assembly 70 is further explained with reference to FIG. 41. The plurality of keys 80 may include any number of keys 80, which may be configured according to any known keyboard configuration, such as, for example, a Dvorak Simplified Keyboard or QWERTY.

軌跡板總成66亦可稱作一觸控板,且可包含由電容式、磁性、電阻式、表面聲波或其他形式的觸敏操作之任何類型的觸敏輸入。鍵盤總成70及軌跡板總成66兩者皆安裝至基座總成12使得鍵盤總成70及軌跡板總成66曝露在基座總成12之一上部處(或可以其他方式用於該上部處之使用者互動)。例如,鍵盤總成70及軌跡板總成66可由基座總成12之一上表面28界定之一開口曝露於使用者。應注意,術語上、下及其他術語係關於如該等圖式中描繪之組件或元件之相對位置。若重新定位裝置,則此等術語係出於方便而使用且不限制元件或組件之實際位置。 The trackpad assembly 66 may also be referred to as a touchpad, and may include any type of touch-sensitive input by capacitive, magnetic, resistive, surface acoustic wave, or other forms of touch-sensitive operation. Both the keyboard assembly 70 and the trackpad assembly 66 are installed to the base assembly 12 so that the keyboard assembly 70 and the trackpad assembly 66 are exposed at an upper part of the base assembly 12 (or can be used in other ways User interaction at the top). For example, the keyboard assembly 70 and the trackpad assembly 66 may be exposed to the user by an opening defined by an upper surface 28 of the base assembly 12. It should be noted that the terms up, down, and other terms relate to the relative positions of components or elements as depicted in the drawings. If the device is repositioned, these terms are used for convenience and do not limit the actual location of the component or assembly.

基座總成12可包含具有一單件式材料結構之一第一外殼24及一第二外殼26,第二外殼26與基座總成12之第一外殼24組裝以圍封計算裝置10之一些內部組件。內部組件可包含一印刷電路板,該印刷電路板承載電腦的中央處理器及任何額外處理器(諸如圖形處理器等等以及電腦的隨機存取記憶體(RAM))。如圖39中所示,第一外殼24可為 位於基座總成12之上部之一上部外殼,且第二外殼26可為位於基座總成12之下部之一下部外殼。第一外殼24可界定一上表面28。例如,基座總成12之上表面28可界定與鍵盤總成70及軌跡板總成66相鄰之一區域62。如圖41中進一步繪示,上表面28之一部分可界定經組態以收納鍵盤總成70之一開口。 The base assembly 12 may include a first housing 24 and a second housing 26 having a one-piece material structure. The second housing 26 and the first housing 24 of the base assembly 12 are assembled to enclose the computing device 10. Some internal components. The internal components may include a printed circuit board that carries the computer's central processing unit and any additional processors (such as a graphics processor, etc., as well as the computer's random access memory (RAM)). As shown in FIG. 39, the first housing 24 may be An upper case located at an upper portion of the base assembly 12, and the second case 26 may be a lower case located at a lower portion of the base assembly 12. The first casing 24 may define an upper surface 28. For example, the upper surface 28 of the base assembly 12 may define an area 62 adjacent to the keyboard assembly 70 and the trackpad assembly 66. As further illustrated in FIG. 41, a portion of the upper surface 28 may define an opening configured to receive a keyboard assembly 70.

如同第一外殼24,第二外殼26可具有一單件式材料結構。在一些實例中,第二外殼26可包含額外外部組件,諸如用於可外部接達電池之蓋。在一實例中,第一外殼24可由一單塊塑膠或金屬或多塊塑膠或金屬製成。此外,第二外殼26可由一單塊塑膠或金屬或多塊塑膠或金屬製成。塑膠材料可包含任何類型的塑膠或半塑膠材料。金屬材料可包含任何類型的金屬或半金屬材料,舉例而言,諸如鋁、鋁合金、鎂合金、不鏽鋼。第一外殼24及第二外殼26可藉由射出成型金屬或塑膠及/或壓鑄金屬而製成。 Like the first casing 24, the second casing 26 may have a one-piece material structure. In some examples, the second housing 26 may contain additional external components, such as a cover for externally accessible batteries. In one example, the first casing 24 may be made of a single piece of plastic or metal or multiple pieces of plastic or metal. In addition, the second casing 26 may be made of a single piece of plastic or metal or a plurality of pieces of plastic or metal. Plastic materials can include any type of plastic or semi-plastic material. The metallic material may include any type of metallic or semi-metallic material, such as, for example, aluminum, aluminum alloy, magnesium alloy, stainless steel. The first casing 24 and the second casing 26 can be made by injection molding of metal or plastic and / or die-cast metal.

在一實施方案中,第二外殼26可經組態以在與第一外殼24組裝時圍封基座總成12之內部組件。第二外殼26亦可經組態以容許計算裝置10擱在一表面上。因此,第二外殼26可包含一大體上平坦下表面,該下表面具有容許基座總成12擱在該表面上且在正常使用期間防滑之複數個支腳或手柄部件。第二外殼26可經組態以使用螺釘或其他緊固件附接第一外殼24以圍封內部組件,諸如一或多個電池、CPU板總成及相關電路,及通信結構、連接組件(諸如USB插頭或電源插頭)以及軌跡板總成66及鍵盤總成70之內部部分。第一外殼24及第二外殼26可經組態使得內部組件在該兩個外殼附接在一起之前可附接第一外殼24或第二外殼26。 In one embodiment, the second housing 26 may be configured to enclose the internal components of the base assembly 12 when assembled with the first housing 24. The second housing 26 may also be configured to allow the computing device 10 to rest on a surface. Accordingly, the second housing 26 may include a substantially flat lower surface having a plurality of feet or handle members that allow the base assembly 12 to rest on the surface and be non-slip during normal use. The second housing 26 may be configured to attach the first housing 24 using screws or other fasteners to enclose internal components such as one or more batteries, a CPU board assembly and related circuits, and communication structures, connection components such as USB plug or power plug) and internal parts of trackpad assembly 66 and keyboard assembly 70. The first housing 24 and the second housing 26 may be configured such that the internal components may be attached to the first housing 24 or the second housing 26 before the two housings are attached together.

顯示器部分14可包含一外部外殼42及附接至顯示器部分14之外部外殼42之一顯示器邊框44。顯示器部分14之外部外殼42及顯示器邊框44可一起圍封顯示器部分14之額外組件(諸如顯示器螢幕16)以及任 何類型的內部組件(舉例而言,諸如內部顯示驅動器)。 The display portion 14 may include an outer casing 42 and a display bezel 44 attached to the outer casing 42 of the display portion 14. The outer casing 42 and the display bezel 44 of the display section 14 may together enclose additional components of the display section 14 (such as the display screen 16) and any other components Any type of internal component (for example, such as an internal display driver).

顯示器邊框44可經組態以包圍顯示器螢幕16之至少部分。進一步言之,顯示器邊框44可輔助固持經組態以定位在顯示器部分14內之內部組件。例如,顯示器邊框44可界定一顯示器開口,使用者可透過該顯示器開口觀看至少該顯示器螢幕16。顯示器邊框44向里延伸之距離可取決於(例如)顯示器部分14之組態及/或構造顯示器部分14之材料。顯示器部分14之外部外殼42以及顯示器邊框44可使用(例如)膠水、壓敏黏著劑或諸如螺釘之機械緊固件或扣合元件組裝在一起。在另一實例中,顯示器部分14之外部外殼42以及基座總成12之第一外殼24及第二外殼26可與邊框44一體式形成作為經組態具有一單塊材料之多個堅固的連結壁之一單件式外殼。 The display bezel 44 may be configured to surround at least a portion of the display screen 16. Further, the display bezel 44 may assist in retaining internal components configured to be positioned within the display portion 14. For example, the display frame 44 may define a display opening through which a user can view at least the display screen 16. The distance that the display bezel 44 extends inwardly may depend on, for example, the configuration of the display portion 14 and / or the material from which the display portion 14 is constructed. The outer casing 42 of the display portion 14 and the display bezel 44 may be assembled together using, for example, glue, pressure-sensitive adhesive, or mechanical fasteners or fastening elements such as screws. In another example, the outer casing 42 of the display portion 14 and the first casing 24 and the second casing 26 of the base assembly 12 may be integrally formed with the bezel 44 as a plurality of sturdy One-piece housing with one connection wall.

圖41繪示具有經組態以固持根據一實施方案之鍵盤總成70之一鍵盤支撐部件50之計算裝置10之一分解圖。 41 illustrates an exploded view of a computing device 10 having a keyboard support member 50 configured to hold a keyboard assembly 70 according to an embodiment.

如圖41中所示,計算裝置10可包含經組態以將鍵盤總成70固定至基座總成12之鍵盤支撐部件50。鍵盤支撐部件50可包含界定一支撐部件邊框52之一外圓周部分及界定複數個開口56之一格子結構54。鍵盤支撐部件50可經組態以在由基座總成12之第一外殼24界定之一凹陷32內將鍵盤總成70固定至基座總成12使得複數個鍵80配合在由格子結構54界定之複數個開口56內。例如,鍵盤支撐部件50之格子結構54可經組態以透過鍵盤支撐部件50之開口56配合在鍵盤總成70之鍵80周圍。因此,格子結構之一配置(例如,開口56之大小)可取決於鍵盤組態之類型,使得開口56可經組態以收納鍵80。一旦將鍵盤支撐部件50固定至基座總成12(其中鍵盤總成70位於鍵盤支撐部件50與基座總成12之間),鍵盤支撐部件50的包含應不干擾鍵80之操作。 As shown in FIG. 41, the computing device 10 may include a keyboard support member 50 configured to secure the keyboard assembly 70 to the base assembly 12. The keyboard supporting member 50 may include an outer circumferential portion defining a frame 52 of a supporting member and a lattice structure 54 defining a plurality of openings 56. The keyboard support member 50 may be configured to fix the keyboard assembly 70 to the base assembly 12 within a recess 32 defined by the first housing 24 of the base assembly 12 such that a plurality of keys 80 fit in a grid structure 54 A plurality of openings 56 are defined. For example, the lattice structure 54 of the keyboard support member 50 may be configured to fit around the keys 80 of the keyboard assembly 70 through the opening 56 of the keyboard support member 50. Therefore, one configuration of the lattice structure (for example, the size of the opening 56) may depend on the type of keyboard configuration, so that the opening 56 may be configured to receive the key 80. Once the keyboard support member 50 is fixed to the base assembly 12 (where the keyboard assembly 70 is located between the keyboard support member 50 and the base assembly 12), the inclusion of the keyboard support member 50 should not interfere with the operation of the key 80.

在一實施方案中,鍵盤支撐部件50之開口56之數目對應於鍵盤總成70之鍵80之數目。在其他實施方案中,鍵盤支撐部件50之開口56 之數目小於鍵盤總成70上之鍵80之數目。例如,一開口56可包括一個、兩個、三個或更多個鍵80。因此,雖然格子結構54可取決於鍵組態,但是由格子結構界定之開口56之數目及大小可大幅改變。 In one embodiment, the number of the openings 56 of the keyboard support member 50 corresponds to the number of the keys 80 of the keyboard assembly 70. In other embodiments, the opening 56 of the keyboard support member 50 The number is smaller than the number of keys 80 on the keyboard assembly 70. For example, an opening 56 may include one, two, three, or more keys 80. Therefore, although the lattice structure 54 may depend on the key configuration, the number and size of the openings 56 defined by the lattice structure may vary greatly.

計算裝置10可經組態使得鍵盤總成70可在外部與基座總成12組裝,該組裝獨立於內部電腦組件之組裝或第一外殼24與第二外殼26之組裝。如圖41中所示,計算裝置10可經組態使得在鍵盤總成70與基座總成12組裝在一起之前可將計算裝置10之實質上全部組件(不包括鍵盤總成70)組裝在一起。在此實例中,藉由計算裝置10之結構(包含定位於第一外殼24之上表面28內之一鍵盤開口30之併入)促進此組裝。 The computing device 10 can be configured so that the keyboard assembly 70 can be assembled externally with the base assembly 12, which assembly is independent of the assembly of the internal computer components or the assembly of the first casing 24 and the second casing 26. As shown in FIG. 41, the computing device 10 may be configured such that substantially all of the components of the computing device 10 (excluding the keyboard assembly 70) may be assembled before the keyboard assembly 70 and the base assembly 12 are assembled together. together. In this example, this assembly is facilitated by the structure of the computing device 10, including the incorporation of a keyboard opening 30 positioned within the upper surface 28 of the first housing 24.

鍵盤開口30可由凹陷32界定,凹陷32係由包含大體上平行於上表面28且定位於上表面28下方之一下表面35之第一外殼24界定。一壁36可延伸在上表面28與下表面35之間且可界定自鍵盤開口30界定之周邊延伸之凹陷32之一外周邊。凹陷32可沿第一外殼24之壁36形成,其深度自上表面28延伸至下表面35。因此,來自上表面28之凹陷32界定鍵盤開口30。在一實施方案中,支撐部件邊框52可經組態以接合基座總成12之壁36與鍵盤總成70。 The keyboard opening 30 may be defined by a recess 32 defined by a first housing 24 including a lower surface 35 substantially parallel to the upper surface 28 and positioned below the upper surface 28. A wall 36 may extend between the upper surface 28 and the lower surface 35 and may define an outer periphery of a recess 32 extending from a periphery defined by the keyboard opening 30. The recess 32 may be formed along the wall 36 of the first housing 24, and its depth extends from the upper surface 28 to the lower surface 35. Therefore, the recess 32 from the upper surface 28 defines the keyboard opening 30. In one embodiment, the support member frame 52 may be configured to engage the wall 36 of the base assembly 12 and the keyboard assembly 70.

一般而言,鍵盤開口30之一大小係基於鍵盤總成70之結構(以及支撐部件邊框52之大小)使得鍵盤總成70可組裝在其中而使得鍵盤支撐部件50放置於鍵盤總成70上方,其放置方式係容許鍵盤支撐部件50固定至第一外殼24。此外,基座總成12之上表面28可界定與鍵盤總成70及軌跡板總成66相鄰之區域62。基座總成12內部之多個周邊連接開口(未展示)亦可包含在第一外殼24及/或第二外殼26中,且可容許接達周邊連接件,舉例而言,諸如一電源配接器插頭、一USB裝置、一或多個記憶體卡、音訊裝置。 Generally speaking, one of the sizes of the keyboard opening 30 is based on the structure of the keyboard assembly 70 (and the size of the support member frame 52) so that the keyboard assembly 70 can be assembled therein so that the keyboard support member 50 is placed above the keyboard assembly 70. The placement method allows the keyboard support member 50 to be fixed to the first casing 24. In addition, the upper surface 28 of the base assembly 12 may define an area 62 adjacent to the keyboard assembly 70 and the trackpad assembly 66. Multiple peripheral connection openings (not shown) inside the base assembly 12 may also be included in the first housing 24 and / or the second housing 26, and may allow access to peripheral connections, such as a power supply Connector plug, a USB device, one or more memory cards, audio devices.

鍵盤總成70可包含呈一基板72之形式之一主體,基板72界定實質上平行且分隔開的上表面76及下表面74。基板72在上表面76上方進 一步附接,該複數個鍵80經組態以將一般為電腦鍵盤共有之各種輸入提供給計算裝置10。如所示,基板72可界定其自身的外周邊,其延伸超出由基板72支撐之鍵80之最外面的鍵。 The keyboard assembly 70 may include a main body in the form of a substrate 72 that defines an upper surface 76 and a lower surface 74 that are substantially parallel and spaced apart. The substrate 72 advances above the upper surface 76 Attached in one step, the plurality of keys 80 are configured to provide the computing device 10 with various inputs generally common to a computer keyboard. As shown, the substrate 72 may define its own outer perimeter, which extends beyond the outermost keys of the keys 80 supported by the substrate 72.

凹陷32之壁36及基板72之周邊可經組態使得基板72可收納在凹陷32內,其中基板72之下表面74擱在凹陷32之下表面35上。基板72與凹陷32之間之特定配合可改變,但是在本實例中可致使鍵盤總成70可在無明顯阻力的情況下移動至凹陷32中,但致使限制鍵盤總成70在凹陷32內之橫向移動。 The wall 36 of the recess 32 and the periphery of the substrate 72 can be configured so that the substrate 72 can be received in the recess 32, wherein the lower surface 74 of the substrate 72 rests on the lower surface 35 of the recess 32. The specific cooperation between the base plate 72 and the recess 32 may be changed, but in this example may cause the keyboard assembly 70 to move into the recess 32 without significant resistance, but cause the keyboard assembly 70 to be limited to within the recess 32 Move laterally.

基板72及凹陷32之相對大小可經調整以考量用於其等形成之各種製程中之容差。基板72及凹陷32之其他組態係可行的,包含其中在基板72與凹陷32之間達成一壓入配合或抵抗配合之組態或其中用其他特徵(諸如黏著劑或用以維持鍵盤總成70在凹陷32內之橫向位置之其他緊固件)允許鍵盤總成70在凹陷32內之某一程度的橫向移動之組態。進一步言之,凹陷32之深度相對於鍵盤總成70之總高度可致使複數個鍵80實質上與第一外殼24之上表面28齊平或稍微突出高於上表面28。 The relative sizes of the substrate 72 and the recess 32 can be adjusted to take into account tolerances used in various processes for their formation. Other configurations of the substrate 72 and the recess 32 are feasible, including configurations in which a press-fit or resistance fit is achieved between the substrate 72 and the recess 32 or in which other features such as an adhesive or to maintain the keyboard assembly Other fasteners with a lateral position of 70 in the recess 32) a configuration that allows the keyboard assembly 70 to move to a certain extent in the recess 32. Further, the depth of the recess 32 relative to the total height of the keyboard assembly 70 may cause the plurality of keys 80 to be substantially flush with the upper surface 28 of the first housing 24 or to protrude slightly above the upper surface 28.

進一步言之,凹陷32可包含凹陷32內之一接達開口34以容許鍵盤總成70與基座總成12之內部組件(舉例而言,諸如印刷電路板)連接。雖然該等圖式為簡單起見省略此等特徵,但是此等特徵之一般結構可類似於其他可攜式電腦應用中使用之特徵。在一實例中,一連接電纜(未展示)可自鍵盤總成70延伸且可延伸穿過接達開口34以連接基座總成12內部之一對應連接。在另一實例中,一電纜可自基座總成12內之一內部組件延伸,該內部組件經組態以自鍵盤總成70接收輸入且可行進穿過接達開口34以在鍵盤總成70放置於凹陷32內之前連接鍵盤總成70。 Further, the recess 32 may include one of the access openings 34 in the recess 32 to allow the keyboard assembly 70 to connect with internal components of the base assembly 12, such as a printed circuit board, for example. Although the drawings omit these features for simplicity, the general structure of these features may be similar to the features used in other portable computer applications. In one example, a connection cable (not shown) may extend from the keyboard assembly 70 and may extend through the access opening 34 to connect one of the interiors of the base assembly 12 correspondingly. In another example, a cable may extend from an internal component within the base assembly 12 that is configured to receive input from the keyboard assembly 70 and may pass through the access opening 34 to the keyboard assembly 70 is connected to the keyboard assembly 70 before being placed in the recess 32.

鍵盤開口30內之第一外殼24之部分之其他組態係可行的。在一 實例中,基座總成12之第一外殼24可實質上朝鍵盤開口30內之基座總成12內部敞開,其中複數個經適當定位之突片或其他支撐結構相對於鍵盤開口30向裡延伸以相對於鍵盤開口30及基座總成12之上表面28將鍵盤總成70固持在一適當位置中。在另一實例中,凹陷32可包含類似於接達開口34之複數個開口以提供額外直通口以用於在鍵盤總成70與基座總成12之內部組件之間進行連接或容許冷卻、減重或來自內部揚聲器之聲音之傳輸。在此一組態中,複數個開口可經大小調整且經定位使得實質上朝基座總成12內部敞開之一網狀支撐結構界定凹陷32。 Other configurations of the portion of the first housing 24 within the keyboard opening 30 are possible. In a In an example, the first housing 24 of the base assembly 12 may be substantially open toward the interior of the base assembly 12 within the keyboard opening 30, wherein a plurality of appropriately positioned tabs or other support structures are oriented inward relative to the keyboard opening 30 Extending to hold the keyboard assembly 70 in place relative to the keyboard opening 30 and the upper surface 28 of the base assembly 12. In another example, the recess 32 may include a plurality of openings similar to the access openings 34 to provide additional through openings for connecting or allowing cooling between the keyboard assembly 70 and the internal components of the base assembly 12, Weight reduction or transmission of sound from internal speakers. In this configuration, the plurality of openings can be resized and positioned such that a mesh support structure that substantially opens toward the interior of the base assembly 12 defines the recess 32.

在另一實施方案中,凹陷32可經界定使得不同類型的鍵盤可放置於凹陷32內且接著經由鍵盤支撐部件50耦合至基座總成。例如,凹陷32之結構可允許各種鍵盤之互換。此外,鍵盤支撐部件50可經組態使得其可固定各種類型的鍵盤。在此態樣中,格子結構54可足夠通用以配合在各種類型的鍵盤之鍵80周圍。 In another embodiment, the recess 32 may be defined such that a different type of keyboard may be placed within the recess 32 and then coupled to the base assembly via the keyboard support member 50. For example, the structure of the recess 32 may allow interchangeability of various keyboards. In addition, the keyboard support member 50 may be configured so that it can fix various types of keyboards. In this aspect, the lattice structure 54 may be universal enough to fit around the keys 80 of various types of keyboards.

圖42繪示根據一實施方案之鍵盤支撐部件50之一較大視圖。如圖42中所示,鍵盤支撐部件50可包含支撐部件邊框52及界定複數個開口56之格子結構54。在一實例中,鍵盤支撐部件50可為界定支撐部件邊框52及格子結構54之一鄰接框架狀結構。圖42繪示鍵盤支撐部件50之一側,例如曝露於使用者之表面。鍵盤支撐部件50之相對側(未展示)包含曝露於鍵盤總成70及基座總成12之一表面,該表面可包含支撐部件邊框52上用於收納緊固件之收納單元(例如,螺釘孔),如圖43中進一步描繪。替代地,鍵盤支撐部件50曝露於使用者(例如,如圖42中所示)之表面可包含經組態以收納緊固件之複數個開口,緊固件接著固定至基座總成12。在此組態中,基座總成12可包含經組態以收納透過鍵盤支撐部件50曝露之緊固件之一部分之收納單元。因此,緊固件可自曝露於使用者之表面插入至基座總成12。此外,應注意,若鍵盤支撐部件50藉由熱鉚接或干涉配合耦合至基座總成12,則鍵盤支 撐部件50不包含收納單元。 FIG. 42 illustrates a larger view of a keyboard support member 50 according to an embodiment. As shown in FIG. 42, the keyboard supporting member 50 may include a supporting member frame 52 and a lattice structure 54 defining a plurality of openings 56. In one example, the keyboard support member 50 may be a frame-like structure that defines one of the support member frame 52 and the lattice structure 54. FIG. 42 illustrates one side of the keyboard supporting member 50, for example, exposed to the user's surface. The opposite side (not shown) of the keyboard support member 50 includes a surface exposed to the keyboard assembly 70 and the base assembly 12, which surface may include a storage unit (e.g., a screw hole) on the support member frame 52 for receiving fasteners. ), As further depicted in FIG. 43. Alternatively, the surface of the keyboard support member 50 exposed to a user (eg, as shown in FIG. 42) may include a plurality of openings configured to receive fasteners, which are then secured to the base assembly 12. In this configuration, the base assembly 12 may include a storage unit configured to receive a portion of a fastener exposed through the keyboard support member 50. Therefore, the fastener can be inserted into the base assembly 12 from the surface exposed to the user. In addition, it should be noted that if the keyboard support member 50 is coupled to the base assembly 12 by thermal riveting or interference fit, the keyboard support The support member 50 does not include a storage unit.

格子結構54可包含彼此連接且形成一交錯結構或圖案之材料帶狀物。特定言之,格子結構54可包含自鍵80之一端延伸至鍵80之另一端之複數個第一長形部件(具有某一厚度)及自第一長形部件之各者延伸且可連接至另一第一長形部件之一系列較小的第二長形部件(具有某一厚度)。在一實例中,第一長形部件可係水平且實質上彼此平行,且第二長形部件可係垂直。此外,第一長形部件可具有相同或不同於第二長形部件之厚度。第一長形部件及第二長形部件可經一體式形成使得其等在格子結構54中之配置表現為一鄰接材料。 The lattice structure 54 may include strips of material connected to each other and forming a staggered structure or pattern. In particular, the lattice structure 54 may include a plurality of first elongated members (having a certain thickness) extending from one end of the key 80 to the other end of the key 80 and extending from each of the first elongated members and connectable to One of the other first elongated members is a series of smaller second elongated members (having a certain thickness). In one example, the first elongated members may be horizontal and substantially parallel to each other, and the second elongated members may be vertical. In addition, the first elongated member may have the same or different thickness from the second elongated member. The first elongated member and the second elongated member can be integrally formed so that their arrangement in the lattice structure 54 behaves as an adjacent material.

此外,支撐部件邊框52之材料可具有不同於格子結構54之材料之一厚度。在一實施方案中,支撐部件邊框52可具有大於格子結構54之材料之一厚度。在一實例中,支撐部件邊框52可包含安置在一第二材料層上之一第一材料層,而格子結構54可包含第一材料層。此等特徵參考圖45加以進一步解釋。 In addition, the material of the supporting member frame 52 may have a thickness different from that of the material of the lattice structure 54. In one embodiment, the supporting member frame 52 may have a thickness larger than one of the materials of the lattice structure 54. In one example, the supporting member frame 52 may include a first material layer disposed on a second material layer, and the lattice structure 54 may include a first material layer. These features are explained further with reference to FIG. 45.

根據另一實施方案,鍵盤支撐部件50可包含界定開口56之格子結構54,但是不包含支撐部件邊框52。例如,格子結構54可包含配合在至少一些鍵周圍之部分。然而,鍵盤支撐部件50可不包含安置在最外面的鍵80的外部上之一外圓周部分。在此實例中,格子結構54(例如,該系列第一長形部件及第二長形部件)可延伸至鍵盤開口30(或第一外殼24)之邊緣,且格子結構54與基座總成12之間的干涉可將鍵盤總成70固定至適當位置。 According to another embodiment, the keyboard support member 50 may include a grid structure 54 that defines an opening 56, but does not include a support member frame 52. For example, the lattice structure 54 may include portions that fit around at least some of the keys. However, the keyboard support member 50 may not include an outer circumferential portion disposed on an outer portion of the outermost key 80. In this example, the lattice structure 54 (for example, the first elongated member and the second elongated member of the series) can extend to the edge of the keyboard opening 30 (or the first casing 24), and the lattice structure 54 and the base assembly The interference between 12 can fix the keyboard assembly 70 in place.

返回參考圖41,鍵盤支撐部件50可經組態使得支撐部件邊框52之一外圓周固定地配合在壁36及/或鍵盤開口30內且進一步使得鍵盤支撐部件50之一部分延伸超過基板72之外周邊且接觸基板72之上表面76之一部分。因此,鍵盤支撐部件50可在鍵盤總成70定位於凹陷32內之後與基座總成12組裝在一起以將鍵盤總成70固定至基座總成12。 Referring back to FIG. 41, the keyboard support member 50 may be configured such that one outer periphery of the support member frame 52 is fixedly fitted in the wall 36 and / or the keyboard opening 30 and further a portion of the keyboard support member 50 extends beyond the base plate 72. The periphery contacts a part of the upper surface 76 of the substrate 72. Therefore, the keyboard support member 50 may be assembled with the base assembly 12 after the keyboard assembly 70 is positioned in the recess 32 to fix the keyboard assembly 70 to the base assembly 12.

鍵盤支撐部件50可為一可撓或半可撓材料。在一實例中,鍵盤支撐部件50係由一聚合物材料(舉例而言,諸如塑膠)製成。鍵盤支撐部件50亦可使用其他材料,舉例而言,諸如各種橡膠或金屬。鍵盤支撐部件50可撓或可壓縮使得其可在鍵盤開口30內作出一適當緊密配合且使得其可抵著基板72施加一力以維持基板72之下表面74與凹陷32之下表面35之間之接觸。 The keyboard support member 50 may be a flexible or semi-flexible material. In one example, the keyboard support member 50 is made of a polymer material, such as plastic, for example. The keyboard support member 50 may also use other materials, such as various rubbers or metals, for example. The keyboard support member 50 is flexible or compressible so that it can make a proper close fit in the keyboard opening 30 and allow it to apply a force against the substrate 72 to maintain the lower surface 74 of the substrate 72 and the lower surface 35 of the recess 32. Of contact.

圖43繪示根據一實施方案之計算裝置10之一截面圖。如圖43中所示,鍵盤支撐部件50耦合至基座總成12使得鍵盤總成70位於鍵盤支撐部件50與基座總成12之間。例如,鍵盤支撐部件50可經組態以在由基座總成12界定之鍵盤開口30內將鍵盤總成70固定至基座總成12使得複數個鍵80係在由格子結構54界定之開口56內。 FIG. 43 illustrates a cross-sectional view of a computing device 10 according to an embodiment. As shown in FIG. 43, the keyboard support member 50 is coupled to the base assembly 12 such that the keyboard assembly 70 is located between the keyboard support member 50 and the base assembly 12. For example, the keyboard support member 50 may be configured to secure the keyboard assembly 70 to the base assembly 12 within a keyboard opening 30 defined by the base assembly 12 such that a plurality of keys 80 are tied to the opening defined by the lattice structure 54. Within 56.

特定言之,鍵盤總成70安置在由壁36界定之凹陷32內以接觸下表面35。接著,鍵盤支撐部件50放置於鍵盤總成70之頂部上使得由格子結構54界定之複數個開口56配合在鍵80周圍。鍵盤支撐部件50之至少一部分(例如,支撐部件邊框52之一部分)可接觸凹陷32之下表面35。 In particular, the keyboard assembly 70 is disposed in a recess 32 defined by a wall 36 to contact the lower surface 35. Next, the keyboard support member 50 is placed on the top of the keyboard assembly 70 so that a plurality of openings 56 defined by the lattice structure 54 fit around the keys 80. At least a portion of the keyboard support member 50 (for example, a portion of the support member frame 52) may contact the lower surface 35 of the recess 32.

在一實施方案中,鍵盤支撐部件50可使用複數個緊固件46耦合至基座總成12(例如,第一外殼24)。緊固件46可包含螺紋式緊固件,諸如螺釘或能夠將兩個組件連接在一起之大體上任何類型的緊固件。在一實例中,鍵盤支撐部件50之支撐部件邊框52可耦合至基座總成12之第一外殼24。如下文進一步解釋,緊固件46可經定位或螺紋式地穿過第一外殼24且穿過鍵盤支撐部件50之一部分。 In one embodiment, the keyboard support member 50 may be coupled to the base assembly 12 (eg, the first housing 24) using a plurality of fasteners 46. The fastener 46 may include a threaded fastener, such as a screw or substantially any type of fastener capable of connecting two components together. In one example, the support member frame 52 of the keyboard support member 50 may be coupled to the first housing 24 of the base assembly 12. As explained further below, the fastener 46 may be positioned or threaded through the first housing 24 and through a portion of the keyboard support member 50.

雖然圖43中繪示一緊固件46,但是鍵盤支撐部件50可使用任何數目個緊固件46固定至基座總成12。例如,緊固件46可在第一外殼24周圍之對應於支撐部件邊框52之位置處將鍵盤支撐部件50固定至基座總成12。參考第一外殼24(其包含下表面35及曝露於第二外殼26之一 表面45),緊固件46可經定位或螺紋式穿過第一外殼24(例如,穿過表面45而至下表面35)且接合鍵盤支撐部件50。支撐部件邊框52可經組態以收納緊固件46之至少一部分。 Although a fastener 46 is shown in FIG. 43, the keyboard support member 50 may be fixed to the base assembly 12 using any number of fasteners 46. For example, the fastener 46 may fix the keyboard support member 50 to the base assembly 12 at a position around the first housing 24 corresponding to the support member frame 52. Reference to the first housing 24 (which includes one of the lower surface 35 and the second housing 26 exposed Surface 45), the fastener 46 may be positioned or threaded through the first housing 24 (eg, through the surface 45 to the lower surface 35) and engage the keyboard support member 50. The support member frame 52 may be configured to receive at least a portion of the fastener 46.

在一實例中,若耦合係基於緊固件46,則鍵盤支撐部件50可包含複數個收納單元,其等之一者係由收納單元39加以繪示。例如,收納單元39可經組態以收納緊固件46之一部分。在一實例中,收納單元39可為支撐部件邊框52中接受或收納緊固件46之一通道或空隙。在一實例中,收納單元39可被視為一螺釘孔。在此背景下,收納單元39之通道或空隙可包含可對應於對應緊固件46之結構之一結構。在一實例中,若緊固件46係螺釘,則收納單元39可包含能夠隨著螺釘旋轉而收納螺釘之螺紋。根據一實例,複數個收納單元可定位於支撐部件邊框52周圍。收納單元39可僅延伸至鍵盤支撐部件50之一部分中使得鍵盤支撐部件50曝露於使用者之表面不會曝露收納單元39之任何部分。實情係,收納單元39曝露在鍵盤支撐部件50面向下表面35之表面上。 In an example, if the coupling is based on the fastener 46, the keyboard support member 50 may include a plurality of storage units, one of which is illustrated by the storage unit 39. For example, the receiving unit 39 may be configured to receive a portion of the fastener 46. In one example, the receiving unit 39 may be a channel or a gap in the supporting member frame 52 for receiving or receiving a fastener 46. In one example, the receiving unit 39 can be regarded as a screw hole. In this context, the channel or space of the storage unit 39 may include a structure that may correspond to the structure of the corresponding fastener 46. In one example, if the fastener 46 is a screw, the receiving unit 39 may include a thread capable of receiving the screw as the screw rotates. According to an example, a plurality of storage units may be positioned around the support member frame 52. The storage unit 39 may only extend into a portion of the keyboard support member 50 such that the keyboard support member 50 is exposed on the user's surface without exposing any portion of the storage unit 39. In fact, the storage unit 39 is exposed on the surface of the keyboard support member 50 facing the lower surface 35.

此外,收納單元39可為位於鍵盤支撐部件50上之螺釘孔(例如,塑膠孔),且螺紋式緊固件(例如,螺釘)可螺紋式地引導至鍵盤支撐部件50中。螺釘孔可自鍵盤支撐部件邊框區域及/或格子結構區域延伸。進一步言之,鍵盤支撐部件50可包含可成型或插入至鍵盤支撐部件50之材料中之螺紋式金屬插入件。接著,可將螺釘直接緊固至螺紋式金屬緊固件(例如,成型至塑膠孔中之黃銅螺紋式插入件)中。 In addition, the storage unit 39 may be a screw hole (for example, a plastic hole) located on the keyboard support member 50, and a threaded fastener (for example, a screw) may be threaded into the keyboard support member 50. The screw holes may extend from the frame area and / or the lattice structure area of the keyboard support member. Further, the keyboard support member 50 may include a threaded metal insert that can be formed or inserted into the material of the keyboard support member 50. The screw can then be tightened directly into a threaded metal fastener (for example, a brass threaded insert molded into a plastic hole).

在另一實施方案中,如上文指示,鍵盤支撐部件50可包含定位於支撐部件邊框52周圍之複數個開口,其等經組態以首先收納緊固件46。例如,緊固件46可首先由鍵盤支撐部件50之曝露於使用者之表面收納。接著,緊固件46經組態以經由開口自鍵盤支撐部件50突出至基座總成12中。在此組態中,第一外殼24可包含複數個收納單元,其等包含收納單元39,該等收納單元經組態以收納緊固件46之延伸超出鍵 盤支撐部件50之部分。 In another embodiment, as indicated above, the keyboard support member 50 may include a plurality of openings positioned around the support member frame 52, which are configured to first receive the fasteners 46. For example, the fastener 46 may be first stored on the exposed surface of the keyboard support member 50 by the user. The fastener 46 is then configured to protrude from the keyboard support member 50 into the base assembly 12 via the opening. In this configuration, the first housing 24 may include a plurality of storage units, including a storage unit 39 that is configured to store the extension of the fastener 46 beyond the key Part of the disk support member 50.

在另一實施方案中,鍵盤支撐部件50可基於熱塑性鉚接耦合至基座總成12。例如,熱塑性鉚接(亦稱作熱鉚接)係使用熱量連接兩個組件之一過程。在此實例中,鍵盤支撐部件50之部分(例如,支撐部件邊框52之部分)及/或第一外殼24之部分可經加熱以將鍵盤支撐部件50連接至基座總成12。 In another embodiment, the keyboard support member 50 may be coupled to the base assembly 12 based on a thermoplastic riveting. For example, thermoplastic riveting (also known as hot riveting) is a process that uses heat to join two components. In this example, a portion of the keyboard support member 50 (eg, a portion of the support member frame 52) and / or a portion of the first housing 24 may be heated to connect the keyboard support member 50 to the base assembly 12.

在又一實施方案中,鍵盤支撐部件50可基於一干涉配合耦合至基座總成12。例如,鍵盤支撐部件50之結構可經定尺寸使得鍵盤支撐部件50可配合在鍵80周圍及鍵盤總成70與第一外殼24之間。特定言之,支撐部件邊框52可接合鍵盤總成70及壁36使得牢固地固定鍵盤支撐部件50。 In yet another embodiment, the keyboard support member 50 may be coupled to the base assembly 12 based on an interference fit. For example, the structure of the keyboard support member 50 may be sized so that the keyboard support member 50 can fit around the keys 80 and between the keyboard assembly 70 and the first casing 24. In particular, the support member frame 52 may engage the keyboard assembly 70 and the wall 36 so that the keyboard support member 50 is firmly fixed.

特定言之,鍵盤支撐部件50可由諸如尼龍、塑膠等等之一彈性可撓材料製成。使用一可撓材料可容許鍵盤支撐部件50之尺寸相對於其延伸至凹陷32中之深度過大而使得其在經按壓接觸鍵盤總成70之上表面76及凹陷之下表面35時發生撓曲。此可導致鍵盤支撐部件50施加一恆定向下的力於基板72上,該力可有助於將鍵盤總成70之位置垂直且橫向地固持在凹陷32內。可使用鍵盤支撐部件50之其他形狀及組態且可調整或以其他方式設計鍵盤支撐部件50之其他形狀及組態以給定變化的裝飾外觀以提供與凹陷32及鍵盤總成70之變化配合或互動且利用各種材料性質。 In particular, the keyboard support member 50 may be made of an elastically flexible material such as nylon, plastic, or the like. The use of a flexible material may allow the size of the keyboard support member 50 to be too large relative to the depth it extends into the recess 32 so that it will flex when contacting the upper surface 76 and the lower surface 35 of the keyboard assembly 70 by pressing. This may cause the keyboard support member 50 to exert a constant downward force on the substrate 72, which may help to hold the position of the keyboard assembly 70 vertically and laterally within the recess 32. Other shapes and configurations of the keyboard support member 50 can be used and other shapes and configurations of the keyboard support member 50 can be adjusted or otherwise designed to give a varying decorative appearance to provide changes to fit the recesses 32 and the keyboard assembly 70 Or interact and take advantage of various material properties.

進一步言之,鍵盤支撐部件50可使用一雙射成型方法而產生。例如,在一第一次射出中,可將鍵盤支撐部件50成型為其格子結構54,且接著在一後續射出中,可將鍵盤支撐部件50之支撐部件邊框52進一步成型至其結構。在一實施方案中,支撐部件邊框52可包含不同於格子結構54之一色彩。 Further, the keyboard supporting member 50 may be produced using a two-shot molding method. For example, in a first shot, the keyboard support member 50 may be formed into a lattice structure 54, and then in a subsequent shot, the support member frame 52 of the keyboard support member 50 may be further formed into its structure. In one embodiment, the supporting member frame 52 may include a color different from that of the lattice structure 54.

圖44A繪示根據一實施方案之鍵盤支撐部件50。除包含沿線A取 得之截面以外,鍵盤支撐部件50與圖41及圖42中繪示之鍵盤支撐部件相同。 FIG. 44A illustrates a keyboard support member 50 according to an embodiment. In addition to taking along A Except for the obtained cross section, the keyboard support member 50 is the same as the keyboard support member shown in FIGS. 41 and 42.

圖44B繪示根據一實施方案之沿圖44A之線A取得之鍵盤支撐部件50之一截面。如上文論述,鍵盤支撐部件50可使用一雙射成型方法而產生,其中鍵盤支撐部件50首先由一第一次射出成型而形成,且接著藉由第二次射出成型進一步界定支撐部件邊框52。因此,支撐部件邊框52可包含兩個材料層(一材料層來自第一次射出且另一材料層來自第二次射出)。如圖44B中所示,支撐部件邊框52可包含來自第一次射出成型之一第一材料層82。在一實例中,如圖44B中所示,整個鍵盤支撐部件50包含(例如,如由縱橫交錯線所示之)第一材料層82。此外,支撐部件邊框52包含來自第二次射出成型之一第二材料層84,其可射出在第一材料層82下方。第二材料層84可進一步界定支撐部件邊框52之結構。 FIG. 44B illustrates a cross-section of a keyboard support member 50 taken along line A of FIG. 44A according to an embodiment. As discussed above, the keyboard support member 50 may be produced using a two-shot molding method, where the keyboard support member 50 is first formed by a first injection molding, and then the support member frame 52 is further defined by a second injection molding. Therefore, the supporting member frame 52 may include two material layers (one material layer from the first injection and the other material layer from the second injection). As shown in FIG. 44B, the support member frame 52 may include a first material layer 82 from one of the first injection moldings. In one example, as shown in FIG. 44B, the entire keyboard support member 50 includes (eg, as shown by a crisscross line) a first material layer 82. In addition, the support member frame 52 includes a second material layer 84 from one of the second injection moldings, which can be injected below the first material layer 82. The second material layer 84 may further define the structure of the supporting member frame 52.

在一實例中,內部格子結構54可不包含第二材料層84。因此,格子結構54可具有小於支撐部件邊框52之一深度。此外,在一實例中,第一材料層82可不同於第二材料層84。在另一實例中,第一材料層82可與第二材料層84相同。在另一實例中,第一材料層82可為不同於第二材料層84之一色彩。 In an example, the internal lattice structure 54 may not include the second material layer 84. Therefore, the lattice structure 54 may have a depth smaller than one of the supporting member frame 52. Further, in an example, the first material layer 82 may be different from the second material layer 84. In another example, the first material layer 82 may be the same as the second material layer 84. In another example, the first material layer 82 may be a different color than the second material layer 84.

圖45繪示組裝計算裝置10之一方法。在4502中,可將鍵盤總成70插入至鍵盤開口30中。例如,計算裝置10可經組態使得鍵盤總成70可在外部與基座總成12組裝在一起,該組裝獨立於內部電腦組件之組裝或第一外殼24與第二外殼26之組裝。計算裝置10可經組態使得在鍵盤總成70與基座總成12組裝在一起之前可將計算裝置10之實質上全部組件(不包括鍵盤總成70)組裝在一起。 FIG. 45 illustrates a method of assembling the computing device 10. In 4502, a keyboard assembly 70 may be inserted into the keyboard opening 30. For example, the computing device 10 may be configured such that the keyboard assembly 70 can be assembled externally with the base assembly 12, which assembly is independent of the assembly of internal computer components or the assembly of the first casing 24 and the second casing 26. The computing device 10 may be configured so that substantially all of the components of the computing device 10 (excluding the keyboard assembly 70) can be assembled together before the keyboard assembly 70 and the base assembly 12 are assembled together.

接著,可將鍵盤總成70插入至鍵盤開口30中。鍵盤開口30可由凹陷32界定,凹陷32係由包含大體上平行於上表面28且位於上表面28 下方之一下表面35之第一外殼24界定。一壁36可延伸在上表面28與下表面35之間且可界定自鍵盤開口30界定之周邊延伸之凹陷32之一外周邊。凹陷32可沿第一外殼24之壁36形成,其深度自上表面28延伸至下表面35。因此,來自上表面28之凹陷32界定鍵盤開口30。 Then, the keyboard assembly 70 can be inserted into the keyboard opening 30. The keyboard opening 30 may be defined by a recess 32 that includes a substantially parallel to the upper surface 28 and located on the upper surface 28. A first casing 24 of a lower surface 35 is defined below. A wall 36 may extend between the upper surface 28 and the lower surface 35 and may define an outer periphery of a recess 32 extending from a periphery defined by the keyboard opening 30. The recess 32 may be formed along the wall 36 of the first housing 24, and its depth extends from the upper surface 28 to the lower surface 35. Therefore, the recess 32 from the upper surface 28 defines the keyboard opening 30.

接著,凹陷32之壁36及鍵盤總成70之基板72之周邊可經組態使得基板72可收納在凹陷32內,其中基板72之下表面74擱在凹陷32之下表面35上。基板72與凹陷32之間之特定配合可改變,但是在本實例中可致使鍵盤總成70可在無明顯阻力的情況下移動至凹陷32中,但致使限制鍵盤總成70在凹陷32內之橫向移動。 Then, the wall 36 of the recess 32 and the periphery of the substrate 72 of the keyboard assembly 70 can be configured so that the substrate 72 can be received in the recess 32, wherein the lower surface 74 of the substrate 72 rests on the lower surface 35 of the recess 32. The specific cooperation between the base plate 72 and the recess 32 may be changed, but in this example may cause the keyboard assembly 70 to move into the recess 32 without significant resistance, but cause the keyboard assembly 70 to be limited to within the recess 32 Move laterally.

在4504中,鍵盤支撐部件50放置於鍵盤總成70上方使得鍵盤總成70之鍵80配合在由格子結構54界定之開口56內。例如,鍵盤支撐部件50放置於鍵盤總成70之頂部上使得由格子結構54界定之複數個開口56配合在鍵80周圍。鍵盤支撐部件50之至少一部分(例如,支撐部件邊框52之一部分)可接觸凹陷32之下表面35。 In 4504, the keyboard support member 50 is placed above the keyboard assembly 70 so that the keys 80 of the keyboard assembly 70 fit within the opening 56 defined by the lattice structure 54. For example, the keyboard support member 50 is placed on top of the keyboard assembly 70 so that a plurality of openings 56 defined by the lattice structure 54 fit around the keys 80. At least a portion of the keyboard support member 50 (for example, a portion of the support member frame 52) may contact the lower surface 35 of the recess 32.

在4506中,鍵盤支撐部件50可固定至基座總成12。例如,鍵盤支撐部件50耦合至基座總成12使得鍵盤總成70位於鍵盤支撐部件50與基座總成12之間。在一實施方案中,支撐部件邊框52可經組態以接合基座總成12之壁36及鍵盤總成70。鍵盤支撐部件50可根據多種不同組態固定至基座總成12。 In 4506, the keyboard support member 50 may be fixed to the base assembly 12. For example, the keyboard support member 50 is coupled to the base assembly 12 such that the keyboard assembly 70 is located between the keyboard support member 50 and the base assembly 12. In one embodiment, the support member frame 52 may be configured to engage the wall 36 of the base assembly 12 and the keyboard assembly 70. The keyboard support member 50 may be fixed to the base assembly 12 according to a variety of different configurations.

在一實例中,在4506-1中,可施加壓力於鍵盤支撐部件50,藉此在鍵盤支撐部件50與基座總成12之間產生一干涉配合。例如,鍵盤支撐部件50之結構可經定尺寸使得鍵盤支撐部件50可配合在鍵80周圍及鍵盤總成70與第一外殼24之間。特定言之,當施加向下的力於鍵盤支撐部件50上時,支撐部件邊框52可接合鍵盤總成70及壁36使得牢固地固定鍵盤支撐部件50。 In an example, in 4506-1, pressure may be applied to the keyboard support member 50, thereby creating an interference fit between the keyboard support member 50 and the base assembly 12. For example, the structure of the keyboard support member 50 may be sized so that the keyboard support member 50 can fit around the keys 80 and between the keyboard assembly 70 and the first casing 24. Specifically, when a downward force is applied to the keyboard support member 50, the support member frame 52 may engage the keyboard assembly 70 and the wall 36 so as to firmly fix the keyboard support member 50.

在另一實例中,在4506-2中,鍵盤支撐部件50可使用複數個緊固 件46耦合至基座總成12(例如,第一外殼24)。緊固件46可包含螺紋式緊固件,諸如螺釘或能夠將兩個組件連接在一起之大體上任何類型的緊固件。在一實例中,鍵盤支撐部件50之支撐部件邊框52可耦合至基座總成12之第一外殼24。如下文進一步解釋。緊固件46可經定位或螺紋式地穿過第一外殼24且穿過鍵盤支撐部件50之一部分。 In another example, in 4506-2, the keyboard support member 50 may use a plurality of fastenings The piece 46 is coupled to the base assembly 12 (eg, the first housing 24). The fastener 46 may include a threaded fastener, such as a screw or substantially any type of fastener capable of connecting two components together. In one example, the support member frame 52 of the keyboard support member 50 may be coupled to the first housing 24 of the base assembly 12. As explained further below. The fastener 46 may be positioned or threaded through the first housing 24 and through a portion of the keyboard support member 50.

緊固件46可在第一外殼24周圍之對應於支撐部件邊框52之位置處將鍵盤支撐部件50固定至基座總成12。緊固件46可經定位或螺紋式穿過第一外殼24(例如,穿過表面45而至下表面35)且接合鍵盤支撐部件50。支撐部件邊框52可經組態以收納緊固件46之至少一部分。 The fastener 46 may fix the keyboard support member 50 to the base assembly 12 at a position around the first housing 24 corresponding to the support member frame 52. The fastener 46 may be positioned or threaded through the first housing 24 (eg, through the surface 45 to the lower surface 35) and engage the keyboard support member 50. The support member frame 52 may be configured to receive at least a portion of the fastener 46.

根據一實例,鍵盤支撐部件50可包含複數個收納單元,其等包含收納單元39。例如,收納單元39可經組態以收納緊固件46之一部分。在一實例中,收納單元39可為支撐部件邊框52中接受或收納緊固件46之一通道或空隙。在一實例中,收納單元39可被視為一螺釘孔。 According to an example, the keyboard support member 50 may include a plurality of storage units, including a storage unit 39. For example, the receiving unit 39 may be configured to receive a portion of the fastener 46. In one example, the receiving unit 39 may be a channel or a gap in the supporting member frame 52 for receiving or receiving a fastener 46. In one example, the receiving unit 39 can be regarded as a screw hole.

在另一實施方案中,如上文指示,鍵盤支撐部件50可包含定位於支撐部件邊框52周圍之多個開口,其等經組態以首先收納緊固件46。例如,緊固件46可首先由鍵盤支撐部件50之曝露於使用者之表面收納。接著,緊固件46經組態以經由開口自鍵盤支撐部件50突出至基座總成12中。在此組態中,第一外殼24可包含複數個收納單元,該等收納單元經組態以收納緊固件46之延伸超出鍵盤支撐部件50之部分。 In another embodiment, as indicated above, the keyboard support member 50 may include a plurality of openings positioned around the support member frame 52, which are configured to first receive the fasteners 46. For example, the fastener 46 may be first stored on the exposed surface of the keyboard support member 50 by the user. The fastener 46 is then configured to protrude from the keyboard support member 50 into the base assembly 12 via the opening. In this configuration, the first housing 24 may include a plurality of storage units configured to receive a portion of the fastener 46 extending beyond the keyboard support member 50.

全部申請於2013年9月30日之下列專利申請案美國第14/041,496號、美國第14/041,453號、美國第14/041,466號及美國第14/041,483號的全部內容以引用之方式全部併入本文。 The following patent applications, all filed on September 30, 2013: U.S. No. 14 / 041,496, U.S. No. 14 / 041,453, U.S. No. 14 / 041,466, and U.S. No. 14 / 041,483 Into this article.

本文描述之各種技術之實施方案可實施於數位電子電路中或電腦硬體、韌體、軟體或其等之組合中。實施方案可被實施為一電腦程式產品,即,有形地具體實施於一資訊載體(例如,一機器-可讀儲存裝置(電腦可讀媒體、一非暫時電腦可讀儲存媒體、一有形電腦可讀 儲存媒體))或一傳播信號(用於由資料處理設備(例如,一可程式化處理器、一電腦或多個電腦)處理或控制資料處理設備之操作)中之一電腦程式。諸如上述電腦程式之一電腦程式可以任何形式的程式設計語言(包含編譯或解譯語言)而寫入且可以任何形式部署,包含部署為一獨立程式或一模組、組件、子常式或適於在一計算環境中使用之其他單元。可在一電腦或多個電腦上於一站點處部署一電腦程式以進行處理或跨多個站點分佈一電腦程式且由一通信網路互連該電腦程式。 Implementations of the various technologies described herein may be implemented in digital electronic circuits or computer hardware, firmware, software, or a combination thereof. Embodiments may be implemented as a computer program product, that is, tangibly embodied on an information carrier (e.g., a machine-readable storage device (computer-readable medium, a non-transitory computer-readable storage medium, a tangible computer read Storage media)) or a computer program that transmits a signal for processing or controlling the operation of the data processing device by a data processing device (eg, a programmable processor, a computer or computers). A computer program such as one of the above computer programs can be written in any form of programming language (including compiled or interpreted languages) and can be deployed in any form, including as a stand-alone program or as a module, component, subroutine, or suitable Other units used in a computing environment. A computer program can be deployed at a site on one computer or multiple computers for processing or a computer program can be distributed across multiple sites and interconnected by a communication network.

方法步驟可由執行一電腦程式之一或多個可程式化處理器來執行以藉由操作輸入資料及產生輸出執行功能。方法步驟亦可由專用邏輯電路(例如,一場可程式化閘陣列(FPGA)或一特定應用積體電路(ASIC))執行且一設備可被實施為該專用邏輯電路。 The method steps may be performed by executing one or more programmable processors of a computer program to perform functions by manipulating input data and generating output. The method steps may also be performed by a dedicated logic circuit (for example, a programmable gate array (FPGA) or an application specific integrated circuit (ASIC)) and a device may be implemented as the dedicated logic circuit.

適用於處理一電腦程式之處理器包含(例如)通用及專用微處理器兩者及任何種類的數位電腦之任何一或多個處理器。一般而言,一處理器將自一唯讀記憶體或一隨機存取記憶體或其兩者接收指令及資料。一電腦之元件可包含用於執行指令之至少一處理器及用於儲存指令及資料之一或多個記憶體裝置。一般而言,一電腦亦可包含用於儲存資料之一或多個大容量儲存裝置(例如,磁碟、磁-光碟或光碟)或經操作地耦合以自該一或多個大容量儲存裝置接收資料或將資料傳送至該一或多個大容量儲存裝置或經操作地耦合以進行其兩者。適用於具體實施電腦程式指令及資料之資訊載體包含全部形式的非揮發性記憶體(例如,包含半導體記憶體裝置(例如,EPROM、EEPROM及快閃記憶體裝置);磁碟(例如,內部硬碟或可抽換式磁碟);磁-光碟;及CD-ROM及DVD-ROM光碟)。處理器及記憶體可由專用邏輯電路補充或併入專用邏輯電路中。 Processors suitable for processing a computer program include, for example, both general and special purpose microprocessors and any one or more processors of any kind of digital computer. Generally, a processor will receive instructions and data from a read-only memory or a random access memory or both. The components of a computer may include at least one processor for executing instructions and one or more memory devices for storing instructions and data. Generally, a computer may also include one or more mass storage devices (e.g., magnetic disks, magneto-optical disks, or optical disks) for storing data or operatively coupled to and from the one or more mass storage devices. The data is received or transmitted to the one or more mass storage devices or operatively coupled for both. Information carriers suitable for the implementation of computer program instructions and data include all forms of non-volatile memory (for example, including semiconductor memory devices (for example, EPROM, EEPROM, and flash memory devices); magnetic disks (for example, internal hard drives Disks or removable disks); magnetic-optical disks; and CD-ROM and DVD-ROM disks). The processor and the memory may be supplemented by or incorporated in a dedicated logic circuit.

為提供與一使用者之互動,可在具有用於向使用者顯示資訊之一顯示器裝置(例如,一陰極射線管(CRT)或液晶顯示器(LCD)監視器) 及使用者可憑藉其將輸入提供給電腦之一鍵盤及一指標裝置(例如,一滑鼠或一軌跡球)之一電腦上實施若干實施方案。其他種類的裝置亦可用以提供與一使用者之互動;例如,提供給使用者之回饋可呈任何形式的感覺回饋,例如視覺回饋、聽覺回饋或觸覺回饋;且來自使用者之輸入可以任何形式(包含聲音、語音或觸覺輸入)接收。 To provide interaction with a user, a display device (e.g., a cathode ray tube (CRT) or liquid crystal display (LCD) monitor) may be provided to display information to the user. And the user can implement several implementations on a computer by means of which he provides input to a keyboard of a computer and a pointing device (for example, a mouse or a trackball). Other types of devices can also be used to provide interaction with a user; for example, the feedback provided to the user can be in any form of sensory feedback, such as visual feedback, auditory feedback, or tactile feedback; and input from the user can be in any form (Including sound, voice, or tactile input).

實施方案可實施於一計算系統中,該計算系統包含一後端組件(例如,作為一資料伺服器)或包含一中間體組件(例如,一應用程式伺服器)或包含一前端組件(例如,具有一圖形使用者介面或一使用者可透過其與一實施方案互動之一網頁瀏覽器之一用戶端電腦)或此等後端、中間體或前端組件之任何組合。組件可由任何形式或媒體之數位資料通信(例如,一通信網路)互連。通信網路之實例包含一區域網路(LAN)或一廣域網路(WAN),例如,網際網路。 Implementations may be implemented in a computing system that includes a back-end component (for example, as a data server) or an intermediate component (for example, an application server) or a front-end component (for example, Have a graphical user interface or a user (a client computer of a web browser through which a user can interact with an implementation) or any combination of these back-end, intermediate, or front-end components. The components may be interconnected by any form or medium of digital data communication (eg, a communication network). Examples of communication networks include a local area network (LAN) or a wide area network (WAN), such as the Internet.

雖然已如本文所述般繪示所述實施方案之某些特徵,但是熟習此項技術者現在將想到許多修改、替代、改變及等效物。因此,應瞭解,隨附申請專利範圍旨在涵蓋諸如落在實施方案之範疇內之全部此等修改及改變。應瞭解,其等僅藉由實例方式呈現、無限制之意且可作出形式及細節上的各種改變。除相互排斥之組合以外,本文描述之設備及/或方法之任何部分可組合成任何組合。本文描述之實施方案可包含所述不同實施方案之功能、組件及/或特徵之各種組合及/或子組合。 Although certain features of the described embodiments have been illustrated as described herein, many modifications, substitutions, changes, and equivalents will now occur to those skilled in the art. Therefore, it should be understood that the scope of the accompanying patent application is intended to cover all such modifications and changes as fall within the scope of the embodiments. It should be understood that they are presented by way of example only, without limitation, and that various changes in form and detail can be made. Except for mutually exclusive combinations, any part of the devices and / or methods described herein may be combined into any combination. The embodiments described herein may include various combinations and / or sub-combinations of the functions, components and / or features of the different embodiments.

Claims (25)

一種電子設備,其包括:一顯示器部分;耦合至該顯示器部分之一基座框架,該基座框架包含由與一底壁相對之一頂壁及耦合至該頂壁及該底壁之一側壁界定之一通道,該側壁具有界定該基座框架之一外周長(perimeter)之至少一部分之一外表面,該通道具有該基座框架之一第一側上之一第一側部分、與該基座框架之該第一側相對之該基座框架之一第二側上之一第二側部分、一遠端(distal)部分及一近端(proximal)部分,該第一側部分沿不平行於一第二縱軸(longitudinal axis)之一第一縱軸對準,該遠端部分沿該第二縱軸對準;及一中平面(midplane),其具有安置在該通道之該第一側部分中之一第一邊緣及安置在該通道之該第二側部分中之一第二邊緣。An electronic device includes: a display portion; a base frame coupled to the display portion, the base frame including a top wall opposite to a bottom wall and a side wall coupled to the top wall and the bottom wall A channel is defined, the side wall has an outer surface defining at least a part of an outer perimeter of the base frame, the channel has a first side portion on a first side of the base frame, and the The first side of the base frame is opposite to a second side portion, a distal portion and a proximal portion on a second side of the base frame. Aligned with a first longitudinal axis parallel to a second longitudinal axis, the distal portion being aligned along the second longitudinal axis; and a midplane having the first plane disposed in the channel A first edge in one side portion and a second edge disposed in the second side portion of the channel. 如請求項1之設備,其中該中平面具有介於該第一邊緣與該第二邊緣之間之一長度,該長度大於自該通道之該第一側部分之該頂壁之一邊緣至該通道之該第二側部分之該頂壁之一邊緣之一長度。The device of claim 1, wherein the midplane has a length between the first edge and the second edge, the length being greater than an edge from the edge of the top wall of the first side portion of the channel to the A length of an edge of the top wall of the second side portion of the channel. 如請求項1之設備,其中該頂壁、該底壁及該側壁係經單件式形成。The device of claim 1, wherein the top wall, the bottom wall and the side wall are formed in a single piece. 如請求項1之設備,其中該第一縱軸平行於一第三縱軸,該基座框架之該第二側沿該第三縱軸對準。The device of claim 1, wherein the first longitudinal axis is parallel to a third longitudinal axis, and the second side of the base frame is aligned along the third longitudinal axis. 如請求項1之設備,其中該頂壁沿一第一平面對準,該中平面沿平行於該第一平面之一第二平面對準。The device of claim 1, wherein the top wall is aligned along a first plane, and the middle plane is aligned along a second plane parallel to the first plane. 如請求項1之設備,其中該頂壁具有界定一掌托區域之至少一部分及界定一軌跡板開口之至少一部分。The device of claim 1, wherein the top wall has at least a portion defining a palm rest area and at least a portion defining a trackpad opening. 如請求項1之設備,其中該頂壁沿一第一平面對準,該頂壁具有界定該通道之該遠端部分之一部分且該底壁具有界定該通道之該遠端部分之一部分,該頂壁之該部分具有沿一第二平面對準之一邊緣,該底壁之該部分之一邊緣沿該第二平面對準,該第二平面正交於該第一平面。The device of claim 1, wherein the top wall is aligned along a first plane, the top wall has a portion defining the distal portion of the channel and the bottom wall has a portion defining the distal portion of the channel, The portion of the top wall has an edge aligned along a second plane, an edge of the portion of the bottom wall is aligned along the second plane, and the second plane is orthogonal to the first plane. 如請求項1之設備,其中該側壁具有一彎曲形狀。The device of claim 1, wherein the side wall has a curved shape. 如請求項1之設備,其中該遠端部分為該通道之一第一遠端部分,該設備進一步包括:一構架組件,其具有安置在該通道之該遠端部分中之一第一端部之一部分及具有安置在該通道之一第二遠端部分中之一第二端部之一部分。The device of claim 1, wherein the remote portion is a first remote portion of the channel, the device further includes: a frame assembly having a first end portion disposed in the remote portion of the channel A portion and a portion having a second end portion disposed in a second distal portion of the channel. 如請求項1之設備,其中該第一側部分具有一截面輪廓,該截面輪廓實質上與該遠端部分之一截面輪廓相同。The device of claim 1, wherein the first side portion has a cross-sectional profile, and the cross-sectional profile is substantially the same as a cross-sectional profile of the distal portion. 如請求項1之設備,其中該中平面具有與該第二縱軸平行而對準且安置於該通道之該近端部分內之一第三邊緣,該中平面具有相對於該第三邊緣且與該第二縱軸平行而對準之一第四邊緣,該第三邊緣安置於該通道之該遠端部分之外部。The device of claim 1, wherein the mid-plane has a third edge aligned parallel to the second longitudinal axis and disposed within the proximal portion of the channel, the mid-plane has a distance from the third edge and A fourth edge is aligned parallel to the second longitudinal axis, and the third edge is disposed outside the distal portion of the channel. 如請求項1之設備,其中該通道之該遠端部分為該通道之一第一遠端部分,該通道具有一第二遠端部分,其沿該第二縱軸對準,該通道之該第二遠端部分具有一端(end),其以自該通道之該第一遠端部分之一端的一距離而分離。The device of claim 1, wherein the remote portion of the channel is a first remote portion of the channel, the channel has a second remote portion aligned along the second longitudinal axis, and the channel The second distal portion has an end separated by a distance from one end of the first distal portion of the channel. 如請求項1之設備,其中該通道之該第一側部分及該通道之該遠端部分之各者具有一對稱截面輪廓,該通道之該近端部分具有一非對稱截面輪廓。The device of claim 1, wherein each of the first side portion of the channel and the distal portion of the channel has a symmetrical cross-sectional profile, and the proximal portion of the channel has an asymmetrical cross-sectional profile. 一種電子設備,其包括:一構架(backbone)組件;耦合至該構架組件之一顯示器部分;一基座框架,其包含由與一底壁相對之一頂壁及耦合至該頂壁及該底壁之一側壁界定之一通道,該側壁具有界定該基座框架之一外周長之至少一部分之一外表面,該通道具有一遠端部分、一近端部分及一側部分,該通道之該遠端部分沿一縱軸對準,該縱軸實質上正交於該通道之該側部分所沿對準之一縱軸,該構架組件具有安置在該遠端部分之一凹陷區域中之至少一部分。An electronic device includes: a framework component; a display portion coupled to the framework component; a base frame including a top wall opposite to a bottom wall and coupled to the top wall and the bottom A side wall of the wall defines a passage, the side wall has an outer surface defining at least a portion of an outer perimeter of the base frame, the passage has a distal portion, a proximal portion, and a side portion. The distal portion is aligned along a longitudinal axis that is substantially orthogonal to a longitudinal axis along which the side portion of the channel is aligned. The frame assembly has at least one recessed area disposed in a recessed area of the distal portion. portion. 如請求項14之設備,其進一步包括:一中平面,其具有安置在該近端部分之一凹陷區域中及在該側部分之一凹陷區域中之一邊緣;及耦合至該中平面及該構架組件之一板。The device of claim 14, further comprising: a midplane having an edge disposed in a recessed area of the proximal portion and an edge in a recessed area of the side portion; and coupled to the midplane and the One of the components of the framework. 如請求項14之設備,其進一步包括:一中平面,其具有安置在該近端部分之一凹陷區域中之一邊緣;及一熱結合膜,其耦合在該中平面與該近端部分之該凹陷區域之一內表面之間。The device of claim 14, further comprising: a midplane having an edge disposed in a recessed area of the proximal portion; and a thermal bonding membrane coupled between the midplane and the proximal portion Between one of the inner surfaces of the recessed area. 如請求項14之設備,其中該頂壁、該底壁及該側壁共同界定具有一彎曲表面之一形狀。The device of claim 14, wherein the top wall, the bottom wall, and the side wall collectively define a shape having a curved surface. 如請求項14之設備,其中該頂壁、該底壁及該側壁共同界定一c型截面輪廓。The device of claim 14, wherein the top wall, the bottom wall, and the side wall collectively define a c-shaped profile. 一種電子設備,其包括:一構架組件;一顯示器部分,其耦合至該構架組件;一基座框架,其耦合至該顯示器部分,該基座框架包含在該基座框架之一前側上之一近端通道部分、在與該基座框架之該前側相對之該基座框架之一背側上之一遠端通道部分、及安置於該基座框架之該背側與該前側之間的該基座框架之一側上之一側通道部分;一中平面,其具有安置於該近端通道部分中之一第一邊緣且具有安置於該側通道部分中之一第二邊緣,該構架組件具有安置於該遠端通道部分中之一部分;及一板,其耦合至該中平面及該構架組件。An electronic device includes: a frame component; a display portion coupled to the frame component; and a base frame coupled to the display portion, the base frame including one on a front side of the base frame A proximal channel portion, a distal channel portion on a back side of the base frame opposite the front side of the base frame, and the disposed between the back side and the front side of the base frame A side channel portion on one side of the base frame; a midplane having a first edge disposed in the proximal channel portion and a second edge disposed in the side channel portion, the frame assembly There is a portion disposed in the distal channel portion; and a plate coupled to the midplane and the frame assembly. 如請求項19之設備,其中該構架組件包括與該中平面之一凹陷對準之一突部(protrusion)。The device of claim 19, wherein the framework assembly includes a protrusion aligned with a depression in the mid-plane. 如請求項19之設備,該遠端通道部分沿一縱軸對準,該縱軸實質上正交於該側通道部分且平行於該近端通道部分。As in the apparatus of claim 19, the distal channel portion is aligned along a longitudinal axis that is substantially orthogonal to the side channel portion and parallel to the proximal channel portion. 如請求項19之設備,其中該遠端通道部分與該側通道部分鄰接(contiguous)。The device of claim 19, wherein the remote channel portion is contiguous with the side channel portion. 如請求項19之設備,其進一步包括:一熱結合膜,其安置在該中平面上且耦合至該近端通道部分之一內表面。The device of claim 19, further comprising: a thermal bonding membrane disposed on the midplane and coupled to an inner surface of the proximal channel portion. 如請求項19之設備,其中該遠端通道部分界定與一底壁相對之一頂壁及耦合至該頂壁與該底壁之一側壁,該側壁具有界定該基座框架之一外周長之至少一部分之一外表面。The device of claim 19, wherein the distal channel portion defines a top wall opposite to a bottom wall and a side wall coupled to the top wall and the bottom wall, the side wall having an outer perimeter defining an outer perimeter of the base frame At least a portion of one of the outer surfaces. 如請求項19之設備,其中該遠端通道部分界定與一底壁相對之一頂壁及耦合至該頂壁與該底壁之一側壁,該底壁及該側壁共同界定具有一彎曲表面之一形狀。The device of claim 19, wherein the distal channel portion defines a top wall opposite a bottom wall and a side wall coupled to the top wall and the bottom wall, and the bottom wall and the side wall collectively define a curved surface One shape.
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US14/041,496 US9069523B2 (en) 2013-09-30 2013-09-30 Computer display including a bezel
US14/041,466 US8811003B1 (en) 2013-09-30 2013-09-30 Keyboard support member for a computing device
US14/041,629 2013-09-30
US14/041,496 2013-09-30
US14/041,453 US8821678B1 (en) 2013-09-30 2013-09-30 Electronic device enclosure assembly
US14/041,466 2013-09-30
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI773207B (en) * 2020-11-06 2022-08-01 友達光電股份有限公司 Touch display device

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8861191B1 (en) 2013-09-30 2014-10-14 Google Inc. Apparatus related to a structure of a base portion of a computing device
US9430006B1 (en) 2013-09-30 2016-08-30 Google Inc. Computing device with heat spreader
TWI567531B (en) * 2015-12-10 2017-01-21 英業達股份有限公司 Electronic device
CN115686136A (en) * 2017-03-29 2023-02-03 苹果公司 Device with integrated interface system
US10698443B2 (en) * 2017-05-01 2020-06-30 Microsoft Technology Licensing, Llc Computing devices with an adhered cover and methods of manufacturing thereof
US10691176B2 (en) * 2018-07-12 2020-06-23 Google Llc Textured pattern surface for a computing device
TWI736279B (en) * 2019-05-23 2021-08-11 仁寶電腦工業股份有限公司 Electronic device
CN113892071A (en) * 2019-07-15 2022-01-04 惠普发展公司, 有限责任合伙企业 Wood panel assembly for palm support and touch control board
US20250225280A1 (en) * 2024-01-04 2025-07-10 Quanta Computer Inc. Rotating Intrusion-Detection Module For A Computing Storage Device
TWI872966B (en) * 2024-02-27 2025-02-11 恒昌行精密工業有限公司 Anti-fool rotating buckle

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW445018U (en) * 2000-07-13 2001-07-01 Mitac Technology Corp Drawer-type assembly structure design
US20090279238A1 (en) * 2007-05-16 2009-11-12 Sony Corporation Keyboard connection configuration and electronic device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7012189B2 (en) 2001-03-28 2006-03-14 Apple Computer, Inc. Computer enclosure
US6826040B2 (en) 2002-12-23 2004-11-30 First International Computer Inc. Laptop computer structure
CN2785021Y (en) * 2005-01-21 2006-05-31 鸿富锦精密工业(深圳)有限公司 laptop case
KR101096705B1 (en) * 2005-02-04 2011-12-22 엘지디스플레이 주식회사 A note-book computer
US7505257B2 (en) * 2005-03-31 2009-03-17 Inventec Corporation Body structure for notebook type computer
TWI360036B (en) 2008-09-12 2012-03-11 Compal Electronics Inc Data processing device
CN101896047B (en) 2009-05-19 2013-06-05 鸿富锦精密工业(深圳)有限公司 Electronic equipment and clamping stopping device thereof
KR101671802B1 (en) 2010-09-30 2016-11-03 애플 인크. Portable computing device
KR200471325Y1 (en) * 2011-07-13 2014-02-19 모토로라 모빌리티 엘엘씨 Mobile electronic device with enhanced tolerance accumulator

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW445018U (en) * 2000-07-13 2001-07-01 Mitac Technology Corp Drawer-type assembly structure design
US20090279238A1 (en) * 2007-05-16 2009-11-12 Sony Corporation Keyboard connection configuration and electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI773207B (en) * 2020-11-06 2022-08-01 友達光電股份有限公司 Touch display device

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