TWM503708U - Assembling housing for packaging modem apparatus - Google Patents
Assembling housing for packaging modem apparatus Download PDFInfo
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- TWM503708U TWM503708U TW104204555U TW104204555U TWM503708U TW M503708 U TWM503708 U TW M503708U TW 104204555 U TW104204555 U TW 104204555U TW 104204555 U TW104204555 U TW 104204555U TW M503708 U TWM503708 U TW M503708U
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- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 230000017525 heat dissipation Effects 0.000 claims description 47
- 230000000694 effects Effects 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
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Abstract
Description
本創作係指一種用於一數據機裝置之組裝式殼體,尤指一種用於一數據機裝置且兼具有美觀對稱設計與良好散熱功效之組裝式殼體。The present invention refers to an assembled housing for a data machine device, and more particularly to an assembled housing for a data machine device that has both an aesthetically symmetrical design and good heat dissipation.
傳統上,用來包覆數據機裝置之殼體係透過複數個片狀或板狀之面板來形成包覆結構,惟為了提供較佳之散熱功效,該包覆結構僅於面板上設置有適當之散熱孔洞或挖槽,卻未能兼顧複數個面板所對應之多個接縫處或連接處的美觀設計,對於目前使用者求新求變之產品要求,僅具備有實用性質之產品無法有效增加其購買欲望,致相關產品之市場競爭力或市占率皆可能對應下滑,而相關產品也將乏人問津。Conventionally, the housing for covering the data device device is formed into a covering structure through a plurality of sheet-like or plate-shaped panels, but in order to provide better heat dissipation, the covering structure is only provided with appropriate heat dissipation on the panel. Holes or trenches, but fail to take into account the aesthetic design of multiple seams or joints corresponding to multiple panels. For current users to request new products, only products with practical properties cannot effectively increase their Purchasing desires, the market competitiveness or market share of related products may fall correspondingly, and related products will also be lacking.
因此,提供一種兼具有美觀對稱設計與良好散熱功效之組裝式殼體且可適性地包覆數據機裝置,已成為本領域之重要課題。Therefore, it has become an important subject in the art to provide an assembled housing which has both an aesthetically symmetrical design and a good heat dissipation effect and can be coated with a data device.
因此,本創作之主要目的即在於提供一種用於一數據機裝置且兼具有美觀對稱設計與良好散熱功效之組裝式殼體。Therefore, the main purpose of the present invention is to provide an assembled housing for a data machine device that has both an aesthetically symmetrical design and good heat dissipation.
本創作揭露一種組裝式殼體,用以包覆一數據機裝置並提供散熱功能,該組裝式殼體包含有一第一殼體,包含有一第一面板與一第二面板,該第一面板設置有一第一散熱區,該第二面板設置有一第二散熱區;以及一 第二殼體,包含有一第三面板與一第四面板,該第三面板設置有一第三散熱區,該第四面板設置有一第四散熱區;其中,該第一面板與該第三面板係平行設置,該第二面板與該第四面板係連接形成一L型曲面板來垂直連接該第一面板與該第三面板,且該第一殼體與該第二殼體之連接處係形成一連接曲線並隱藏於該第二散熱區或該第四散熱區內,使得該數據機裝置由連接後之該第一殼體與該第二殼體完整包覆。The present invention discloses an assembled housing for enclosing a data device and providing a heat dissipation function. The assembled housing includes a first housing including a first panel and a second panel. a first heat dissipation area, the second panel is provided with a second heat dissipation area; and a The second housing includes a third panel and a fourth panel, the third panel is provided with a third heat dissipation area, and the fourth panel is provided with a fourth heat dissipation area; wherein the first panel and the third panel are Parallelly disposed, the second panel is coupled to the fourth panel to form an L-shaped curved panel to vertically connect the first panel and the third panel, and the connection between the first housing and the second housing is formed A connecting curve is hidden in the second heat dissipating region or the fourth heat dissipating region, so that the data device device is completely covered by the connected first casing and the second casing.
10‧‧‧組裝式殼體10‧‧‧Assembled housing
100‧‧‧第一殼體100‧‧‧ first housing
1000‧‧‧第一面板1000‧‧‧ first panel
1002‧‧‧第二面板1002‧‧‧ second panel
102‧‧‧第二殼體102‧‧‧ second housing
1020‧‧‧第三面板1020‧‧‧ third panel
1022‧‧‧第四面板1022‧‧‧Fourth panel
110‧‧‧數據機裝置110‧‧‧Data machine installation
AZ‧‧‧天線設置區AZ‧‧‧Antenna setting area
EB‧‧‧延伸底座EB‧‧‧ Extension base
LP‧‧‧L型曲面板LP‧‧‧L type curved panel
CL‧‧‧連接曲線CL‧‧‧ connection curve
GM‧‧‧導光柱GM‧‧‧Light Guide
RA‧‧‧大R導角RA‧‧‧大R lead angle
HL‧‧‧散熱孔洞HL‧‧‧Solution holes
VL‧‧‧線狀凹槽VL‧‧‧ linear groove
UI‧‧‧使用者操作介面UI‧‧‧User interface
Z1‧‧‧第一散熱區Z1‧‧‧First heat sink
Z2‧‧‧第二散熱區Z2‧‧‧second heat sink
Z3‧‧‧第三散熱區Z3‧‧‧ Third heat sink
Z4‧‧‧第四散熱區Z4‧‧‧4th heat sink
第1圖為本創作實施例一組裝式殼體之示意圖。1 is a schematic view of an assembled housing of the first embodiment of the present invention.
第2圖與第3圖為本創作實施例一組裝式殼體之多角度視圖。2 and 3 are multi-angle views of the assembled housing of the first embodiment of the present invention.
第4圖為本創作實施例一組裝式殼體之正視分解圖。Figure 4 is a front exploded view of the assembled housing of the first embodiment of the present invention.
第5圖與第6圖為本創作實施例一組裝式殼體之上視圖。5 and 6 are top views of the assembled housing of the first embodiment of the present invention.
第7圖為本創作實施例一組裝式殼體之一下視圖。Figure 7 is a bottom plan view of the assembled housing of the first embodiment of the present invention.
第8圖為本創作實施例一L型曲面板之背視圖。Figure 8 is a rear view of the L-shaped curved panel of the first embodiment of the present invention.
第9圖為本創作實施例一組裝式殼體之內視圖。Figure 9 is an inside view of the assembled housing of the first embodiment of the present invention.
第10圖為本創作實施例一組裝式殼體之爆炸圖。Figure 10 is an exploded view of the assembled housing of the first embodiment of the present invention.
在說明書及後續的申請專利範圍當中使用了某些詞彙來指稱特定的元件。所屬領域中具有通常知識者應可理解,製造商可能會用不同的名詞來稱呼同樣的元件。本說明書及後續的申請專利範圍並不以名稱的差異來作為區別元件的方式,而是以元件在功能上的差異來作為區別的基準。在通篇說明書及後續的請求項當中所提及的「包含」係為一開放式的用語,故應解釋成「包含但不限定於」。Certain terms are used throughout the description and following claims to refer to particular elements. It should be understood by those of ordinary skill in the art that manufacturers may refer to the same elements by different nouns. The scope of this specification and the subsequent patent application do not use the difference of the names as the means for distinguishing the elements, but the differences in the functions of the elements as the basis for the distinction. The term "including" as used throughout the specification and subsequent claims is an open term and should be interpreted as "including but not limited to".
請參考第1圖,第1圖為本創作實施例一組裝式殼體10之示意圖。 如第1圖所示,組裝式殼體10包含有一第一殼體100與一第二殼體102,且組裝式殼體10內設置有一數據機裝置(圖中未示)。詳細來說,第一殼體100包含有一第一面板1000與一第二面板1002,其中第一面板1000設置有一第一散熱區Z1,而第二面板1002設置有一第二散熱區Z2。類似地,第二殼體102包含有一第三面板1020與一第四面板1022,其中第三面板1020設置有一第三散熱區(圖中未示),而第四面板1022設置有一第四散熱區Z4。較佳地,第一面板1000與第三面板1020係平行設置,而第二面板1002與第四面板1022相連接而形成一L型曲面板LP,以垂直連接第一面板1000與第三面板1020。Please refer to FIG. 1 , which is a schematic view of an assembled housing 10 according to the first embodiment of the present invention. As shown in FIG. 1, the assembled housing 10 includes a first housing 100 and a second housing 102, and a data unit (not shown) is disposed in the assembled housing 10. In detail, the first housing 100 includes a first panel 1000 and a second panel 1002. The first panel 1000 is provided with a first heat dissipation zone Z1, and the second panel 1002 is provided with a second heat dissipation zone Z2. Similarly, the second housing 102 includes a third panel 1020 and a fourth panel 1022, wherein the third panel 1020 is provided with a third heat dissipation area (not shown), and the fourth panel 1022 is provided with a fourth heat dissipation area. Z4. Preferably, the first panel 1000 is disposed in parallel with the third panel 1020, and the second panel 1002 is coupled to the fourth panel 1022 to form an L-shaped curved panel LP to vertically connect the first panel 1000 and the third panel 1020. .
據此,相對於一水平地面來說,本實施例中的第一面板1000與第三面板1020將垂直設置於水平地面上來左右包覆數據機裝置,至於第二面板1002與第四面板1022將共同形成一環狀面板或一帶狀面板(即L型曲面板LP)來連接第一面板1000與第三面板1020。此外,第一面板1000與第三面板1020還連接有一延伸底座EB,其中延伸底座EB係為一體成型來連接第一面板1000與第三面板1020,且延伸底座EB之長度超出L型曲面板LP之寬度,使得組裝式殼體10可穩固地站立於水平地面上,並形成一結構對稱之殼體結構。Accordingly, the first panel 1000 and the third panel 1020 in this embodiment will be vertically disposed on the horizontal ground to cover the data device with respect to a horizontal floor, and the second panel 1002 and the fourth panel 1022 will be A ring panel or a strip panel (ie, an L-shaped curved panel LP) is collectively formed to connect the first panel 1000 and the third panel 1020. In addition, the first panel 1000 and the third panel 1020 are further connected with an extension base EB, wherein the extension base EB is integrally formed to connect the first panel 1000 and the third panel 1020, and the length of the extension base EB exceeds the L-shaped curved panel LP. The width allows the assembled housing 10 to stand firmly on a level surface and form a structurally symmetrical housing structure.
此外,本實施例還提供適當之散熱設計,即第一散熱區Z1與第三散熱區Z3分別包含有複數個散熱孔洞HL,而第二散熱區Z2與第四散熱區Z4係分別包含有複數個散熱線狀凹槽VL。此外,組裝式殼體10係透過第一殼體100與第二殼體102之連接來完整包覆數據機裝置的操作模組或元件,且於本實施例中,第一殼體100與第二殼體102之連接處對應為一連接曲線CL,且連接曲線CL可隱藏於第四散熱區Z4內(或亦可修改為第二散熱區 Z2內),換言之,連接曲線CL可適性地隱藏於複數個散熱線狀凹槽中一者,使得使用者不易察覺第一殼體100與第二殼體102之連接處,並賦予組裝式殼體10美觀對稱設計之組裝結構。In addition, the embodiment further provides a proper heat dissipation design, that is, the first heat dissipation zone Z1 and the third heat dissipation zone Z3 respectively include a plurality of heat dissipation holes HL, and the second heat dissipation zone Z2 and the fourth heat dissipation zone Z4 respectively include a plurality of heat dissipation zones Z4 A heat-dissipating linear groove VL. In addition, the assembled housing 10 is completely covered by the connection of the first housing 100 and the second housing 102 to completely cover the operation module or component of the data device, and in the embodiment, the first housing 100 and the first The connection between the two housings 102 corresponds to a connection curve CL, and the connection curve CL can be hidden in the fourth heat dissipation zone Z4 (or can also be modified into the second heat dissipation zone) In Z2), in other words, the connection curve CL is adaptively concealed in one of the plurality of heat-dissipating linear grooves, so that the user does not easily perceive the connection between the first housing 100 and the second housing 102, and gives the assembled housing The assembly structure of the body 10 is beautiful and symmetrical.
另外,組裝式殼體10之正視面的L型曲面板LP還包含有一大R導角RA,且印刷有一品牌標誌iCBN來展現其廠牌名稱,並藉由L型曲面板之大R導角與第一面板1000與延伸底座EB,更能適性地提示使用者如何設置組裝式殼體10,即本實施例中組裝式殼體10已包含有提示元件,而不會被使用者給顛倒設置。In addition, the L-shaped curved panel LP of the front side of the assembled housing 10 further includes a large R lead angle RA, and a brand logo iCBN is printed to display the name of the brand, and the large R lead angle of the L-shaped curved panel is displayed. With the first panel 1000 and the extension base EB, it is more suitable to prompt the user how to set the assembled housing 10, that is, the assembled housing 10 in the embodiment already includes the prompting component without being reversed by the user. .
再者,正視面的L型曲面板LP還包含有一操作面板,來設置數據機裝置之一使用者操作介面UI,即L型曲面板LP可預設有複數個凹槽孔洞,以供讓數據機裝置之使用者操作介面UI上複數個控制按鈕可外露顯示於組裝式殼體10之外,方便使用者來啟動數據機裝置之操作,以及對應得知數據機裝置目前的操作狀態。當然,為了方便數據機裝置之其他排線的連接或設置,背視面的L型曲面板LP也包含有複數個凹槽孔洞,而詳細內容將於其他圖式表明。Furthermore, the front view L-shaped curved panel LP further includes an operation panel for setting a user operation interface UI of the data device, that is, the L-shaped curved panel LP can be pre-positioned with a plurality of groove holes for data A plurality of control buttons on the UI of the user interface of the device can be exposed and displayed outside the assembled housing 10, facilitating the user to start the operation of the data device, and correspondingly knowing the current operating state of the data device. Of course, in order to facilitate the connection or arrangement of other cables of the data device device, the L-shaped curved panel LP of the back view surface also includes a plurality of groove holes, and the details will be indicated in other drawings.
請參考第2圖與第3圖,第2圖與第3圖為本創作實施例一組裝式殼體10之多角度視圖。如第2圖所示,組裝式殼體10的側視圖可知第一面板1000或第三面板1020的尺寸為151mm×162mm,而組裝式殼體10的正視圖可知L型曲面板LP的尺寸為46mm×162mm,而第一面板1000與第三面板1020所連接之延伸底座EB的尺寸為長度60mm。如第3圖所示,組裝式殼體10的側視圖可知L型曲面板LP連接第一面板1000或第三面板1020之處還設置有前後導角,即大R導角RA的尺寸為R25,而小導角的尺寸為R1.5,同時第3圖亦顯示背視面的L型曲面板LP之複數個凹槽孔洞。另外,為了 便於組裝式殼體10進行散熱,但又不致使灰塵或其他異物進入組裝式殼體10內,本實施例中所設置之散熱孔洞HL的尺寸為3mm×3mm,然非用以限制本創作之範疇。Please refer to FIG. 2 and FIG. 3, and FIG. 2 and FIG. 3 are multi-angle views of the assembled housing 10 according to the creative embodiment. As shown in FIG. 2, the side view of the assembled housing 10 shows that the size of the first panel 1000 or the third panel 1020 is 151 mm × 162 mm, and the front view of the assembled housing 10 shows that the size of the L-shaped curved panel LP is 46 mm × 162 mm, and the extension base EB to which the first panel 1000 and the third panel 1020 are connected has a length of 60 mm. As shown in FIG. 3, the side view of the assembled housing 10 shows that the L-shaped curved panel LP is also provided with front and rear guide angles when the first panel 1000 or the third panel 1020 is connected, that is, the size of the large R lead angle RA is R25. The small guide angle has a size of R1.5, and the third figure also shows a plurality of groove holes of the L-shaped curved panel LP of the back view. In addition, in order The heat dissipating hole HL provided in this embodiment is 3 mm×3 mm, which is not used to limit the creation of the heat dissipating hole HL in the embodiment. category.
請再參考第4圖,第4圖為本創作實施例一組裝式殼體10之正視分解圖。如第4圖所示,正視面的L型曲面板LP透過適當元件配對連接扣之機構設計,而不會破壞L型曲面板LP的完整性。Please refer to FIG. 4 again. FIG. 4 is a front exploded view of the assembled housing 10 according to the first embodiment of the present invention. As shown in Fig. 4, the L-shaped curved panel LP of the front view is designed by the mechanism of the appropriate component pairing buckle without breaking the integrity of the L-shaped curved panel LP.
請再參考第5圖,第5圖為本創作實施例一組裝式殼體10之上視圖。如第5圖所示,上視面的L型曲面板LP已清楚繪出第一殼體100與第二殼體102間的連接曲線CL係如何隱藏於第四散熱區Z4內(或亦可修改為第二散熱區Z2內),來增加美觀設計之功效。Please refer to FIG. 5 again. FIG. 5 is a top view of the assembled housing 10 according to the first embodiment of the present invention. As shown in FIG. 5, the L-shaped curved panel LP of the upper viewing surface clearly shows how the connection curve CL between the first housing 100 and the second housing 102 is hidden in the fourth heat dissipation zone Z4 (or Modified to the second heat dissipation zone Z2) to increase the effect of aesthetic design.
請再參考第6圖,第6圖為本創作實施例一組裝式殼體10之另一上視圖。如第6圖所示,本實施例中第一面板1000之第一散熱區Z1與第三面板1020之第三散熱區Z3還增設有複數個V型溝槽,例如第一散熱區Z1的V型溝槽V1、V2,來增加組裝式殼體10的美觀設計與質感效果,然非用以限制本創作之範疇。Please refer to FIG. 6 again. FIG. 6 is another top view of the assembled housing 10 according to the creative embodiment. As shown in FIG. 6, in the first heat dissipation zone Z1 of the first panel 1000 and the third heat dissipation zone Z3 of the third panel 1020, a plurality of V-shaped grooves are added, for example, the V of the first heat dissipation zone Z1. The grooves V1, V2 are used to increase the aesthetic design and texture effect of the assembled housing 10, but are not intended to limit the scope of the present invention.
請再參考第7圖,第7圖為本創作實施例一組裝式殼體10之一下視圖。如第7圖所示,延伸底座EB透過適當元件配對連接扣之機構設計,而不會破壞延伸底座EB利用一體成型之設計而連接至第一面板1000與第三面板1020的完整性。Referring to FIG. 7, FIG. 7 is a bottom view of the assembled housing 10 of the first embodiment of the present invention. As shown in FIG. 7, the extension base EB is designed through the mechanism of the appropriate component mating buckle without breaking the integrity of the extension base EB to the first panel 1000 and the third panel 1020 using the integrally formed design.
請再參考第8圖,第8圖為本創作實施例一L型曲面板LP之背視圖。如第8圖所示,本實施例中L型曲面板之一背板還增設有一導光柱GM 來防止溢光產生,即本實施例中導光柱GM係對應為L型曲面板LP之使用者操作面板UI之連接處,可適性地遮蔽數據機裝置中多個操作元件/模組或使用者操作面板UI對應產生之工作光源信號,並增加組裝式殼體10實用功效。Please refer to FIG. 8 again. FIG. 8 is a rear view of the L-shaped curved panel LP of the first embodiment of the present invention. As shown in FIG. 8, in the embodiment, one of the L-shaped curved panels is further provided with a light guide column GM. To prevent the generation of the light, that is, the light guide column GM in the embodiment corresponds to the connection of the user operation panel UI of the L-shaped curved panel LP, and can appropriately shield multiple operating elements/modules or users in the data device. The operation panel UI corresponds to the generated working light source signal, and increases the practical effect of the assembled housing 10.
請再參考第9圖,第9圖為本創作實施例一組裝式殼體10之內視圖。如第9圖所示,本實施例中組裝式殼體10係可於第一面板1000或第三面板1020增設有一天線設置區AZ,來添設至少一天線元件,即本實施例中為了加強射頻訊號之傳輸效果,係可適性地利用第一面板1000或第三面板1020之機構設計,來添設多個插槽處來設置至少一天線元件,然非用以限制本創作的範疇。Please refer to FIG. 9 again. FIG. 9 is an internal view of the assembled housing 10 according to the first embodiment of the present invention. As shown in FIG. 9, the assembled housing 10 of the present embodiment can be provided with an antenna setting area AZ in the first panel 1000 or the third panel 1020 to add at least one antenna element, that is, in this embodiment, in order to strengthen The transmission effect of the RF signal is adaptively utilizing the mechanism design of the first panel 1000 or the third panel 1020 to add a plurality of slots to set at least one antenna element, but is not intended to limit the scope of the creation.
請再參考第10圖,第10圖為本創作實施例一組裝式殼體10之爆炸圖。如第10圖所示,本實施例中組裝式殼體10係可利用第一殼體100與第二殼體102之連接來完整包覆數據機裝置110,且透過多處散熱區來有效提高組裝式殼體10之散熱效果,同時延伸底座EB之設計亦可讓組裝式殼體10穩固地站立於水平地面上。至於第一殼體100與第二殼體102之連接處,係巧妙地隱藏於散熱區之一線狀凹槽內,以對應提高組裝式殼體10之美觀設計。Please refer to FIG. 10 again. FIG. 10 is an exploded view of the assembled housing 10 according to the first embodiment of the present invention. As shown in FIG. 10, the assembled housing 10 in the present embodiment can completely cover the data device 110 by using the connection between the first housing 100 and the second housing 102, and effectively improve the heat dissipation area through multiple heat dissipation zones. The heat dissipation effect of the assembled housing 10, while the design of the extension base EB also allows the assembled housing 10 to stand firmly on the level ground. As for the connection between the first housing 100 and the second housing 102, it is subtly hidden in one of the linear grooves of the heat dissipation area to correspondingly improve the aesthetic design of the assembled housing 10.
綜上所述,本創作實施例係提供一種兼具有美觀設計與實用散熱效果之組裝式殼體,對應將多殼體之連接處隱藏於散熱凹槽內,同時搭配多處散熱區之設置位置,來提高組裝式殼體的實用性質,同時也能兼顧美觀視覺的對稱效果。In summary, the present embodiment provides an assembled housing that has both an aesthetic design and a practical heat dissipation effect, and the connection between the multiple housings is concealed in the heat dissipation groove, and the plurality of heat dissipation regions are disposed at the same time. The position is to improve the practical nature of the assembled housing, and at the same time to achieve the symmetrical effect of aesthetic vision.
10‧‧‧組裝式殼體10‧‧‧Assembled housing
100‧‧‧第一殼體100‧‧‧ first housing
1000‧‧‧第一面板1000‧‧‧ first panel
1002‧‧‧第二面板1002‧‧‧ second panel
102‧‧‧第二殼體102‧‧‧ second housing
1020‧‧‧第三面板1020‧‧‧ third panel
1022‧‧‧第四面板1022‧‧‧Fourth panel
EB‧‧‧延伸底座EB‧‧‧ Extension base
LP‧‧‧L型曲面板LP‧‧‧L type curved panel
CL‧‧‧連接曲線CL‧‧‧ connection curve
RA‧‧‧大R導角RA‧‧‧大R lead angle
HL‧‧‧散熱孔洞HL‧‧‧Solution holes
VL‧‧‧線狀凹槽VL‧‧‧ linear groove
UI‧‧‧使用者操作介面UI‧‧‧User interface
Z1‧‧‧第一散熱區Z1‧‧‧First heat sink
Z2‧‧‧第二散熱區Z2‧‧‧second heat sink
Z3‧‧‧第三散熱區Z3‧‧‧ Third heat sink
Z4‧‧‧第四散熱區Z4‧‧‧4th heat sink
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104204555U TWM503708U (en) | 2015-03-26 | 2015-03-26 | Assembling housing for packaging modem apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104204555U TWM503708U (en) | 2015-03-26 | 2015-03-26 | Assembling housing for packaging modem apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM503708U true TWM503708U (en) | 2015-06-21 |
Family
ID=53937781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104204555U TWM503708U (en) | 2015-03-26 | 2015-03-26 | Assembling housing for packaging modem apparatus |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM503708U (en) |
-
2015
- 2015-03-26 TW TW104204555U patent/TWM503708U/en not_active IP Right Cessation
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