TWI523279B - Light emitting diode device with full azimuth and its packaging method - Google Patents

Description

Omnidirectional light emitting diode device and packaging method thereof

The invention relates to a light-emitting diode and a packaging method thereof, in particular to a light-emitting diode device capable of omnidirectional illumination and a packaging method thereof.

With the improvement of lighting quality requirements, Light Emitting Diode (LED) has become the mainstream of current market use and R&D with its advantages of low power consumption and long service life, and has gradually replaced traditional light bulbs. Illumination body.

In many cases, LEDs are often designed to divergence white light to meet different lighting needs. Generally, white light-emitting diodes are required to be made of a yellow light-emitting Yttrium Aluminum Garnet (YAG) fluorescent powder with a diverging blue light emitting diode, which can be combined to emit white light. The white light emitting diode fabricated by the technology can be further divided into a multi-wafer type white light emitting diode and a single chip white light emitting diode.

Referring to FIG. 1 , a conventional multi-wafer type white light emitting diode 1 includes a red light emitting diode 11 , a green light emitting diode 12 , and a blue light emitting diode 13 disposed adjacent to each other. . The red light emitting diode 11 , the green light emitting diode 12 , and the blue light emitting diode 13 The emitted light is mixed to produce white light. However, the conventional multi-wafer type white light-emitting diode 1 can adjust the light color of the white light to be emitted according to different needs, but it is necessary to use a plurality of light-emitting diodes of different colors at the same time, so that the manufacturing cost is high. In addition, the LEDs of different colors may have different driving voltages, so it is necessary to design three different circuits to separately control the driving voltage, which is quite troublesome in the manufacturing process. In addition, the light-emitting diodes of different colors have different decay rates, temperature characteristics and lifetimes of the wafer, which will result in the red light-emitting diode 11, the green light-emitting diode 12, and the blue light-emitting diode. The white light color of the polar body 13 will change with the use time, and it will not produce a stable lighting effect.

Referring to FIG. 2 and FIG. 3, a conventional single-wafer type LED 2 includes a light-emitting diode 21 and a phosphor unit 22 excited by the light-emitting diode 21. The conventional single-wafer type light-emitting diode 2 can be mainly divided into three types:

1. The blue light emitting diode 21 is matched with a yellow phosphor unit 22. The yellow light-emitting phosphor unit 22 is excited by the blue light-emitting diode 21, and the yellow light emitted by the phosphor powder unit 22 is mixed with the unabsorbed blue light to generate white light 23. In this type, the phosphor powder unit 22 used is mainly a YAG phosphor powder of a yttrium aluminum garnet structure.

2. The blue light emitting diode 21 is combined with the red and green phosphor unit 22. The blue light emitting diode 21 is respectively used to excite the fluorescent powder unit 22 which can emit red light and green light, which The red light and the green light generated by the phosphor unit 22 are mixed with the unabsorbed blue light to generate white light 23. In this type, the phosphor unit 22 used is mainly a sulfur-containing phosphor.

3. The ultraviolet light emitting diode (UV-LED) 21 is combined with the phosphor powder unit 22 of three colors of red, green and blue. The ultraviolet light generated by the ultraviolet light emitting diode 21 is used to excite three or more kinds of phosphor powder units 22 which can respectively generate red, green and blue light, and the phosphor powder unit 22 generates three or more colors. The light can be mixed into white light 23. It should be noted that in this type, the light-emitting diode 21 used may be a blue light-emitting diode 21 in addition to the ultraviolet light-emitting diode 21.

Referring to FIG. 1 and FIG. 3, however, whether the multi-wafer type white light-emitting diode 1 or the single-wafer type light-emitting diode 2 has a white light emitting angle of about 90 to 160 degrees, Therefore, the multi-wafer type white light-emitting diode 1 or the single-wafer type light-emitting diode 2 faces a problem that the illumination angle is not as comprehensive as that of the conventional lamp. Although the multi-wafer type white light-emitting diode 1 or the single-wafer type light-emitting diode 2 can also be equipped with a reflection mechanism or a lens to improve the illumination angle of the lamp like a conventional lamp, the reflection mechanism or the lens is used to increase the angle. The light-emitting angle causes a decrease in luminous efficiency of the multi-wafer type white light-emitting diode 1 or the single-wafer type light-emitting diode 2. Of course, the user can also use a multi-wafer type white light-emitting diode 1 or a single-wafer type light-emitting diode that is more than twice the number. 2, in order to achieve the effect of 360 degree illumination angle. However, this practice will greatly increase the installation cost and increase the price of the LED lighting fixture.

Therefore, an object of the present invention is to provide a light-emitting diode which can achieve both cost and luminous efficiency and can emit light in all directions.

Another object of the present invention is to provide a packaging method for packaging a light-emitting diode capable of omnidirectional illumination.

Therefore, the omnidirectional light-emitting diode device of the present invention comprises a light-plate mechanism and a package covering the light-plate mechanism. The lamp board mechanism includes a transparent substrate, a light emitting diode chip unit disposed on the transparent substrate, and an electrical conduction disposed on the transparent substrate and electrically connected to the light emitting diode chip unit and an external power source. a unit and a transparent protective plate fixed to the transparent substrate.

In addition, the method for packaging the omnidirectional light-emitting diode device of the present invention comprises: a setting step of disposing the light-emitting diode chip unit and the electrical conductive unit on the transparent substrate, and making the light-emitting diode The bulk wafer unit and the electrically conductive unit can be electrically connected to the outside.

A compounding step of formulating a suitable package in accordance with the desired color and color temperature of the present invention.

a bonding step of bonding the transparent protective plate to the transparent substrate through an adhesive unit, so that the transparent substrate, the light emitting diode wafer unit, the electrically conductive unit, the adhesive unit and the transparent protective plate constitute the Light board mechanism.

In a packaging step, the package is coated and shaped outside the lamp board by means of filling and curing.

The effect of the invention is that the light emitted by the LED unit can be emitted in 360 degrees by the arrangement of the transparent substrate, and the LED can be made by the package. Adjusting the light source that meets the requirements and is stable in quality, and protecting the setting of the LED unit.

4‧‧‧Lighting diode device

40‧‧‧Light board mechanism

41‧‧‧Transparent substrate

41’‧‧‧ boards

42‧‧‧LED Diode Wafer Unit

421‧‧‧Light Emitting Diode Wafer

43‧‧‧Electrical Conduction Unit

431‧‧‧Electrical Conducting Department

44‧‧‧Wire unit

441‧‧‧ wire

45‧‧‧Adhesive unit

451‧‧‧Adhesive

46‧‧‧Transparent protection board

47‧‧‧Package

471‧‧‧Fluorescent agent

48‧‧‧Damp film

51‧‧‧Setting steps

52‧‧‧Provisioning steps

52’‧‧‧Addition steps

53‧‧‧ Combination steps

54‧‧‧Packaging steps

Other features and effects of the present invention will be apparent from the following description of the drawings. FIG. 1 is a schematic view showing a use of a conventional multi-wafer type white light emitting diode; FIG. 2 is a BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3 is a schematic view for explaining the use of the portion shown by the broken line in FIG. 2; FIG. 4 is a perspective view showing the omnidirectional illumination of the present invention. FIG. 5 is an exploded perspective view for assisting in explaining FIG. 4. For convenience of explanation, parts omitted in FIG. 5 are not shown; FIG. 6 is a top view. Another use of the first preferred embodiment is illustrated; FIG. 7 is a spectrogram illustrating the excitation and emission spectra of the YAG:Ce phosphor used in the first preferred embodiment; FIG. 8 is an electron Microscope image illustrating the use of the first preferred embodiment FIG. 9 is a flow chart illustrating a first preferred embodiment of a method for packaging the omnidirectional illumination LED device of the present invention; FIG. 10 is a spectrogram illustrating The first preferred embodiment of the omnidirectional illumination LED device is in a spectrum state in use; FIG. 11 is a side view showing a second preferred embodiment of the omnidirectional illumination LED device of the present invention. FIG. 12 is a top plan view showing a third preferred embodiment of the omnidirectional illumination LED device of the present invention. For convenience of explanation, some of the components omitted in FIG. 12 are not shown; FIG. 13 is a side view. FIG. 14 is a side view showing another use mode of the third preferred embodiment; FIG. 15 is a flow chart illustrating the package of the omnidirectional illumination LED device of the present invention. A second preferred embodiment of the method; and FIG. 16 is a side elevational view of a fourth preferred embodiment of the omnidirectional illumination LED device of the present invention.

Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals.

Referring to FIG. 4, a first preferred embodiment of the omnidirectional illumination LED device 4 of the present invention is shown. The first preferred embodiment includes a light panel mechanism 40 and a package body 47 that is wrapped around the light panel mechanism 40. The light board mechanism 40 includes a transparent substrate 41 and a transparent substrate. A light-emitting diode unit 42 on the 41, an electrical conduction unit 43 disposed on the transparent substrate 41, and a wire unit 44 electrically connected between the conductive unit 43 and the LED unit 42 An adhesive unit 45 disposed on the transparent substrate 41 and a transparent protective plate 46 fixed to the transparent substrate 41 by the adhesive unit 45.

Referring to FIG. 5, the material of the transparent substrate 41 may be glass, ceramic, plastic or high molecular polymer, and the LED unit 42 has a plurality of light-emitting diodes fixed on the transparent substrate 41 and emitting blue light. The polar body wafer 421. The electrically conductive unit 43 has two electrically conductive portions 431 respectively connected to the external power source. The lead unit 44 has a plurality of electrically conductive portions 431 electrically connected to the LEDs 421 . Wire 441. It should be noted that, in the preferred embodiment, the electrically conductive portions 431 are respectively connected to the positive and negative terminals of the external power source, and are driven by a current of 20 mA. In addition, the area of each of the light-emitting diode wafers 421 may be n times (n = 1, 2, 3, ...) of 10 x 30 mil ² to increase the light-emitting effect by increasing the transmission area.

The adhesive unit 45 has two adhesive portions 451 which are spaced apart from each other on the transparent substrate 41. Of course, the adhesive unit 45 may have only one adhesive portion 451 as long as it is disposed at a position such that the transparent protective plate 46 can be firmly bonded to the transparent substrate 41. As the transparent substrate 41, the transparent protective plate 46 may be made of a transparent plate such as glass, ceramic, plastic or polymer. In addition, the number of the LEDs 421, the electrically conductive portions 431, and the wires 441 are not limited to those shown in the drawings. In the preferred embodiment, the LED chip unit 42 is a light-emitting diode wafer 421 having 15 chips connected in series, and in practice, the light-emitting diode chips 421 may be electrically connected to each other in parallel as shown in FIG. In addition, the LED unit 42 may have only one LED chip 421, and may be connected to the external power source as appropriate by the arrangement of the wire unit 44 and the electrical conduction unit 43. The effect that the invention wants to achieve.

Referring to FIG. 4, the package body 47 is formed by a powdery phosphor 471, a curing agent, a silica gel, a siline coupling, and a diffusing agent, which are uniformly mixed and cured. The composition of the powdery phosphor 471 is obtained from various yellow, green and red phosphors excited by common rare earth elements, and various phosphors are prepared into different phosphors according to different ratios. Thereafter, the modulation of the phosphor 471 used in the present invention is carried out with different phosphors.

Further, in the preferred embodiment, three kinds of phosphor powders, YAG phosphor powder, LuAG phosphor powder and SSN phosphor powder, are used for the preparation. Among them, the yellow YAG phosphor powder has a molecular formula of Y ₃ Al ₅ O ₁₂ :Ce, which is prepared by high-temperature solid phase method and can provide yellow emission light near 540 nm to 580 nm; green LuAG phosphor powder The molecular formula is Lu ₃ Al ₅ O ₁₂ :Ce, which is also made by high temperature solid phase method and can provide green emission light around 500 nm to 540 nm; while the molecular formula of nitride red SSN phosphor powder is Sr ₂ Si ₅ N ₈ :Eu is also made by high temperature solid phase method and provides red emission near 620 nm to 660 nm.

In the preferred embodiment, the H3000 is prepared by yellow YAG phosphor powder, LuAG phosphor powder and SSN phosphor powder. H4500, H6000 and Y-003 four kinds of phosphors. The specifications of the various phosphors and the phosphor powder used are as follows:

1. H3000 phosphor, color temperature is 3000±300K: YAG: LuAG: SSN=0.2: 0.40: 0.10~0.15

Second, H4500 phosphor, color temperature is 4500 ± 300K: YAG: LuAG: SSN = 0.2: 0.40: 0.05 ~ 0.10

Third, H6000 phosphor, color temperature is 6000 ± 300K: YAG: LuAG: SSN = 0.2: 0.40: 0.01 ~ 0.05

Fourth, Y-003 phosphor: YAG=100%

Of course, the yellow YAG phosphor powder may also be a yellow oxide yellow phosphor powder, the molecular formula is β-SiAlON, and the green LuAG phosphor powder may also be a nitride green phosphor powder, and the molecular formula is BaAlON, and the above The red SSN phosphor can also be a nitride red phosphor SASN with a molecular formula of SrAlSiN ₈ :Eu. The user can add a fourth or more kinds of phosphor powder as needed.

It should be noted that the phosphor 471 used in the preferred embodiment may be selected from the combination of the above four kinds of phosphors, or one of the above four kinds of phosphors may be selected. The formulated powdered phosphor 471 must meet the following requirements:

1. The excitation spectrum of the phosphor 471 should match the emission spectrum of the blue light (wavelength 440 nm to 470 nm) emitted by the LED chips 421.

2. After being excited by blue light, the fluorescent agent 471 can produce high efficiency. The visible light emission has an emission spectrum that satisfies the requirements of white light, high light energy conversion rate, high lumen efficiency, and excellent temperature quenching characteristics.

Third, the material is stable in physical and chemical properties, and has a moisture-resistant function and does not react with semiconductor chips or packaging materials.

Fourth, to be able to withstand long-term bombardment of ultraviolet photons, performance stability.

5. The particles of the phosphor 471 should be fine, and the particle size should be below 8 μm.

6. The equipment for synthesizing the phosphor 471 is simple, and the raw materials used are inexpensive.

Referring to Fig. 7, the spectrum of the test of the self-made formula Y-003 phosphor (yellow YAG: Ce phosphor) of the present invention is shown. The wavelengths obtained from the excitation spectrum are 342 nm and 460 nm, of which 460 nm coincides with the blue emission spectrum (440 nm to 470 nm) emitted by the LED 421. As can be seen from Fig. 7, the wavelength of the emission spectrum obtained by the Y-003 phosphor is about 550 nm, and if the ratio of use is adjusted, the wavelength range can be further adjusted.

Fig. 8 is a particle electron micrograph of YAG:Ce of the self-made formula Y-003 phosphor of the present invention. The Granularity Parameters: D10 = 9.74 μm, showing that the phosphor particles used in the present invention are close to the particle size required for the phosphor 471.

In addition, since the phosphor 471 is an inorganic compound and the silica gel is an organic compound, the two often fail to be uniform in mixing. In the case of mixing, a gap is created during the curing process. The air sealed in the gaps causes a chemical reaction between hydrogen atoms and oxygen atoms in the high temperature, thereby forming dark spots or causing spots. Therefore, by the addition of the diffusing agent and the silane coupling, the inorganic phosphor 471 and the organic silica gel can be uniformly mixed to prevent the gap from being affected by the unevenness of the mixing and affecting the lighting quality after the package. In the preferred embodiment, the diffusing agent used is a type 115 or 120 diffusing agent produced by Qiao Yue, the component contained therein is silica, and the decane used may be any commercially available product. .

In general, in the preferred embodiment, the phosphor 471 accounts for 60% to 70% by weight of the package 47, and the amount of the diffusing agent and decane is 2% by weight of the package 47, respectively. 0.1% or less, the remainder is a blend of silica gel and curing agent in a weight ratio of 1:4.

Referring to FIG. 5 and FIG. 9 , the packaging method of the omnidirectional light emitting diode device of the present invention comprises a setting step 51 , a compounding step 52 , a combining step 53 , and a packaging step 54 .

First, the setting step 51 is for disposing the LEDs 421 and the electrically conductive portions 431 on the transparent substrate 41, and the LEDs 421 and the electrically conductive electrodes. The portion 431 can be electrically connected to an external power source.

In detail, prior to the transparent substrate 41, a highly transparent adhesive such as silicone or the like is used as a glue for fixing the wafer, and the number of the LEDs 421 required for the product is solidified. The crystal array is arranged, and the electrically conductive portion 431 electrically connected to the external power source is disposed on the transparent substrate 41. Then, using the square of the conventional light-emitting diode wire bond The wires 441 are soldered between the LEDs 421 and the electrically conductive portions 431 to electrically connect the LEDs 421 to an external power source.

It should be particularly noted that in order to maintain the useful life and durability of the present invention in a good state, in the setting step 51, special attention should be paid to the wire bonding strength of the light-emitting diode wafer 421 when the bonding wire is being processed. Whether or not it is sufficient, and the bonding strength between the electrically conductive portion 431 and the transparent substrate 41 also requires special attention.

Referring to Figures 4 and 9, the blending step 52 is a suitable package 47 in accordance with the desired color and color temperature of the present invention. Further, the phosphor 471, the curing agent, the silica gel, the decane, and the diffusing agent are mixed and stirred for 10 to 30 minutes, and the powdery phosphor 471 is uniformly dispersed in the package 47. Medium, and remove the bubble spare. Since the distribution of the phosphor 471 affects the angle of emission of light that it can absorb or be excited, whether or not the phosphor 471 is uniformly dispersed in the package 47 becomes a very important part of the compounding step 52.

The bonding step 53 combines the transparent protective plate 46 with the transparent substrate 41 through the adhesive portions 451, that is, the installation of the light plate mechanism 40 is completed.

This encapsulation step 54 is then performed. The encapsulation step 54 is to cover and shape the package body 47 outside the lamp panel mechanism 40 by means of filling and curing. Further, the encapsulating step 54 is to cover the lamp panel mechanism 40 through a cylindrical outer mold (not shown), and fill the prepared package body 47 into the mold by using a filling method. Covering the light board mechanism 40. Next, the package body 47 is shaped by curing, and after the mold is detached, the installation of the omnidirectional light-emitting diode device 4 of the present invention is completed. It should be noted that, in the packaging step 54, whether the thickness of the column body formed by the package 47 is uniform, whether the light-emitting diode device 4 can uniformly emit light, and therefore must be carefully in the packaging step 54. The result of curing of the package 47 was confirmed.

Referring to FIG. 4, in use, the wavelength of the blue light emitted by the LED chips 421 is mixed with the white light color temperature of the preset quality after the phosphor 471 is touched. In the lamp panel mechanism 40 of the first preferred embodiment, the transparent substrate 41 and the transparent protective plate 46 are transparent or have good light transmittance, and therefore are not transparent to the transparent substrate 41 or the transparent substrate 41. The arrangement of the protective plates 46 blocks the light-emitting angle of the light-emitting diode wafers 421. In other words, even if the package body 47 is covered with the lamp body 40 in the form of a column, the white surface of the columnar structure can uniformly emit white light.

In order to ensure that the present invention can achieve the omnidirectional illuminating effect under the premise of maintaining the illuminating quality, it is made of the specifications shown in FIG. 5 and matched with different proportions of H3000, H4500, H6000 and Y-003 phosphors. The phosphor 471 is detected one by one for its photoelectric characteristics. In particular, in this test, the experiment is divided into initial photoelectric characteristics (lighting time t = 0) and life test (lighting time t = 60 minutes), and all experiments are driven at 20 mA. It is carried out at room temperature. The experimental results are shown in Tables 1 and 2 and Figure 10 below.

From the experimental results, the brightness will be lower when the theoretical color temperature is lower, but the brightness difference between the present invention at high color temperature and low color temperature is not More, it should be the contribution of the fluorescent agent 471. In addition, there are nearly 80% performance in the detection of color rendering.

Further, under 20 mA, white light and yellow light will reach a stable value within 5 minutes, while white light has a low light attenuation of only 3%, and yellow light has a higher 7%. The color coordinate (CIE) change and the color temperature change are not large, and the stable value can be reached in about 5 minutes.

With the structural design described above, the first preferred embodiment of the present invention has the following advantages in practical use:

(1) Omnidirectional light output: the light emitting direction of the light emitting diode wafer unit 42 of the present invention is not transmitted through the arrangement of the transparent substrate 41 It is shielded, and the package 47 wrapped around the periphery of the lamp mechanism 40 is also transparent, so that an effect of 360 degrees of light can be achieved on average.

(2) Photoelectric characteristics are stable: The fluorescent agent 471 specially configured by the present invention not only stabilizes the white light quality emitted by the present invention, but also exhibits similar brightness regardless of high color temperature or low color temperature. In addition, in terms of color rendering and light decay, it can have a stable and good performance.

(3) Long service life: In addition to the transparent substrate 41 protecting the light-emitting diode chips 421, the package body 47 covers the light-plate assembly 40, so that the external moisture or force is not easy to directly The LED chips 421 cause damage and can effectively extend the service life.

(4) Maintaining the illuminating quality: the encapsulating body 47 is uniformly mixed with the organic phthalocyanine by the addition of the diffusing agent and decane, so that the package 47 is less likely to have a gap due to uneven mixing. Therefore, it is possible to avoid the occurrence of light spots caused by poor packaging.

Referring to FIG. 11, in order to avoid damage to the moisture of the package 47 disclosed by the present invention, the light-emitting diode device 4 can also be provided with a special moisture-proof film 48, in accordance with the second preferred embodiment of the present invention. Heat backlog The Laminator accumulates and covers the entire illuminating LED device 4 in all directions. In this way, not only can the effect as in the first preferred embodiment be achieved, but also after the reliability test (Ref. SAE Technical Paper Series 850144, Thin Film AC Electroluminescence for Automobile Instruments, March 1 1985). It is indeed possible to increase the service life of the present invention.

It should be particularly noted that the moisture-proof film 48 used in the preferred embodiment is an Aclar Film, that is, Nitoflon-4820N Nitto Denko equivalent. In actual use, it is not limited to such a moisture-proof film 48.

Referring to Figures 12 and 13, a third preferred embodiment of the present invention is shown. The third preferred embodiment is substantially the same as the first preferred embodiment except that the third preferred embodiment directly uses a transparent circuit board 41' (PCB board) as a transparent substrate. 41 (see FIG. 11), and the LED chips 421 are directly fixed on the circuit board 41' by an ITO process. In this way, the preferred embodiment does not need to provide the wires 441 (see FIG. 11), and the circuit can be directly formed on the circuit board 41', which can reduce the invention because of insufficient strength of the wire. Bad rate.

In addition, referring to FIG. 14, in the third preferred embodiment, since the LED chips 421 are disposed on opposite sides of the transparent or opaque circuit board 41', the present invention can be made. The effect of achieving all-round illumination is more remarkable.

Referring to Figures 15 and 16, a fourth preferred embodiment of the present invention is shown. The fourth preferred embodiment is substantially the same as the first preferred embodiment, except that after the configuration step 52 is completed, an addition is performed first. Step 52'. The adding step 52 ′ directly covers the transparent package 41 disposed in the matching step 52 on the transparent substrate 41 , the light emitting diode wafer unit 42 , and the wire unit 44 that are not combined with the transparent protective plate 46 . Thereafter, the bonding step 53 is performed, and the transparent protective sheet 46 is adhered to the transparent substrate 41 by the adhesive unit 45. Thereby, the package body 47 and the phosphor powder contained therein are located between the transparent substrate 41 and the transparent protection plate 46, so that the effect of the phosphor 471 is better. In the preferred embodiment, when the encapsulation step 54 is performed, the package 47 can achieve the effect of the present invention regardless of whether the transparent protection plate 46 is coated or not.

In summary, the present invention, through the arrangement of the transparent substrate 41, and the specially-configured phosphor 471 in the package 47, can not only enable the LED unit 42 to emit light in all directions, but also has stable and Good luminescence quality and photoelectric properties. In addition, the addition of the diffusing agent can also contribute to the reduction of the spot caused by the poor mixing effect of the raw materials in the packaging process, so that the object of the present invention can be achieved.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

4‧‧‧Lighting diode device

40‧‧‧Light board mechanism

41‧‧‧Transparent substrate

42‧‧‧LED Diode Wafer Unit

421‧‧‧Light Emitting Diode Wafer

43‧‧‧Electrical Conduction Unit

431‧‧‧Electrical Conducting Department

44‧‧‧Wire unit

441‧‧‧ wire

45‧‧‧Adhesive unit

451‧‧‧Adhesive

46‧‧‧Transparent protection board

47‧‧‧Package

471‧‧‧Fluorescent agent

Claims (18)

An omnidirectional illuminating light-emitting diode device comprising a light-plate mechanism and a package covering the light-plate mechanism, wherein the light-plate mechanism comprises a transparent substrate and a transparent substrate is disposed on the transparent substrate a light emitting diode chip unit, an electrical conducting unit disposed on the transparent substrate and electrically connected to the light emitting diode chip unit and an external power source, and a transparent protective plate fixed to the transparent substrate, the package The material of the body comprises a powdery fluorescent agent selected from any one of the following four kinds of phosphors: H3000, H4500, H6000 and Y-003, or a combination thereof, and the H3000 phosphor, The H4500 phosphor, the H6000 phosphor, and the Y-003 phosphor are prepared by adjusting the yellow fluorescent powder, the green fluorescent powder, and the red fluorescent powder according to different weight ratios. In the phosphor, the ratio of the yellow phosphor powder, the green phosphor powder, and the red phosphor powder is 0.2:0.4:0.10 to 0.15, and the yellow phosphor powder and green in the H4500 phosphor. The ratio of phosphor powder to red phosphor powder is 0.2:0.4:0.05 to 0.10 In the H6000 phosphor, the ratio of the yellow phosphor powder, the green phosphor powder, and the red phosphor powder is 0.2:0.4:0.01 to 0.05, and in the Y-003 phosphor, all of them are It consists of yellow phosphor powder. The omnidirectional illumination LED device of claim 1, wherein the panel mechanism further comprises a wire unit electrically connecting the LED unit and the electrically conductive unit. The omnidirectional light emitting diode device of claim 2, wherein the light emitting diode chip unit has a plurality of fixed to the transparent base A light-emitting diode chip on a board, the lead unit having a plurality of wires respectively connected between the light-emitting diode chips and the electrical conduction unit. The omnidirectional illuminating LED device of claim 3, wherein the illuminating diode chips are connected in series with each other. The omnidirectional light emitting diode device of claim 3, wherein the light emitting diode chips are connected in parallel with each other. The omnidirectional illuminating LED device of claim 2, wherein the transparent substrate is a circuit board, and the illuminating diode chip unit has a plurality of illuminating diode chips fixed on the circuit board. . The omnidirectional light-emitting diode device of claim 3 or 6, wherein the package is disposed between the transparent substrate and the transparent protective plate and covers the light-emitting diode wafer unit. The omnidirectional illumination LED device of claim 1, wherein the lamp assembly further comprises a moisture barrier film coated on the outside of the package. The omnidirectional illuminating LED device of claim 3, wherein the illuminating diode chips emit blue light. The omnidirectional illumination LED device of claim 1, wherein the lamp assembly further comprises an adhesive unit, wherein the transparent substrate and the transparent protection plate are coupled to each other by the adhesive unit. The omnidirectional illumination LED device of claim 1, wherein the transparent substrate is made of glass, ceramic, plastic or polymer. The omnidirectional illumination LED device of claim 1, wherein the transparent protection plate is made of glass, ceramic, plastic or high score Made of a sub-polymer. The omnidirectional illumination LED device according to claim 1, wherein the yellow phosphor is a YAG phosphor having a molecular formula of Y ₃ Al ₅ O ₁₂ :Ce, and the green phosphor is A LuAG phosphor having a molecular formula of Lu ₃ Al ₅ O ₁₂ :Ce is used, and the red phosphor is an SSN phosphor having a molecular formula of Sr ₂ Si ₅ N ₈ :Eu. The omnidirectional illumination LED device according to claim 1, wherein the yellow phosphor is an oxynitride yellow phosphor having a molecular formula of β-SiAlON, and the green phosphor is an optional molecular formula. It is a nitride green phosphor of BaAlON, and the red phosphor is a nitride red phosphor SASN having a molecular formula of SrAlSiN ₈ :Eu. The omnidirectional illuminating LED device of claim 1, wherein the material of the package further comprises a silica gel and a curing agent, and the phosphor accounts for about 60% to 70% of the package, the silicon The glue and the curing agent are blended in a ratio of 1:4 by weight. The omnidirectional illuminating LED device of claim 15, wherein the material of the package further comprises a diffusing agent and a decane, and the diffusing agent and the decane are added in an amount of 2% and 0.1% of the package, respectively. %the following. A method for packaging an omnidirectional light-emitting diode device includes: a setting step of disposing a light-emitting diode chip unit and an electrical conductive unit on a transparent substrate, and making the light-emitting diode wafer unit And the electrically conductive unit can be electrically connected to an external power source; a mixing step of arranging a suitable package according to the light color and color temperature required by the present invention; a bonding step of bonding a transparent protective plate to the transparent substrate through an adhesive unit, so that the transparent substrate, the light emitting diode wafer unit, the electrical conducting unit, the adhesive unit and the transparent protective plate form a a lamp board mechanism; and a packaging step of encapsulating and shaping the package body outside the lamp plate mechanism by means of filling and curing. The method of encapsulating the omnidirectional illumination LED device according to claim 17, further comprising an adding step, the step of adding the package disposed in the compounding step to the a transparent substrate combined with a transparent protective plate, the light emitting diode chip unit and the wire unit.