CN2735548Y - High power LED cooling structure - Google Patents

Abstract

The utility model relates to a high power LED heat radiation structure, belonging to the electromechanical category; it comprises a shell base with a containing space; the heat dissipation box is arranged in the accommodating space of the shell base, and heat dissipation liquid is sealed in the heat dissipation box; a circuit substrate disposed on the heat dissipation box; and at least one high power LED disposed on the circuit substrate; wherein, the heat dissipation box comprises a bearing groove body and a groove cover which covers the bearing groove body, and the heat dissipation liquid is heat dissipation silicone oil; a heat-conducting adhesive layer is arranged between the heat dissipation box and the circuit substrate, a stirring system is arranged in the heat dissipation box, and the heat dissipation box is connected to an oil pressure circulating system; through the introduction of the heat dissipation system, the influence on the electrical property of the high-power LED due to heat accumulation can be avoided; has the advantages that: the structure is simple, the assembly is easy, and the influence of heat accumulation on the electrical property of the high-power LED can be avoided.

Description

High power LED cooling structure

technical field

The utility model relates to electromechanical products, in particular to a heat dissipation structure for high-power LEDs, especially a heat dissipation structure suitable for high-power light-emitting diodes. accumulate and affect its electrical properties.

Background technique

As we all know, a light emitting diode (Light Emitting Diode, LED) is a PN diode that uses current to emit light. A forward bias is added to the PN diode, the P-type part is the anode, and the N-type part is the anode. The cathode, then, the P-type semiconductor will flow into electrons, and the part of N-type semiconductor will flow into holes. In addition, the electrons and holes near the PN junction will disappear due to strong combination. At this time, the specific semiconductor, which flows into The electrons and holes have the energy to emit light, and this situation is used to produce a light source, the so-called light-emitting diode;

However, no matter what type of light-emitting diode it is, its service life and reliability are mainly controlled by temperature. Taking a high-power GaN light-emitting diode as an example, when the diode receives electric energy, it will turn 10 % of the electrical energy is converted into light energy and dissipated, and the remaining 90% is dissipated as heat energy; so for GaN-type light-emitting diodes, almost all the electrical energy received by the LED chip is converted into heat energy, and therefore The heat dissipation of high-power LEDs has become an important issue, especially for lamps assembled from high-power LEDs; as shown in Figure 1, it is a commonly used combination of high-power LED lamps, its main structure It includes a housing base 11, a circuit substrate 12 locked on the housing base 11, and a plurality of high-power LEDs 13, which are arranged on the circuit substrate 12. Through the conduction of the power wire 14, the lamp combination However, in actual use, the high-power LED 13 will generate a large amount of heat energy, but in this type of device structure, the heat energy can only pass through the power supply wire 14 or the circuit board 12 and the housing base 11 The conduction at the contact point comes to dissipate, and its effect is not good, causes this high-power LED 13 to make its electrical property be affected because of heat accumulation and temperature rise, needs to be improved.

Utility model content

According to the purpose of the present utility model, aiming at the shortcomings of the above-mentioned commonly used high-power LED heat dissipation structure, a high-power LED heat dissipation structure is provided, the structure includes a shell base, which has an accommodation space; a heat dissipation box, set In the accommodating space of the base of the housing, heat dissipation liquid is sealed in the heat dissipation box; a circuit substrate is arranged on the heat dissipation box; and at least one high-power LED is arranged on the circuit substrate; wherein , the cooling box includes a carrying tank for carrying the heat dissipation liquid; a tank cover for covering the carrying tank for sealing the heat dissipation liquid in the carrying tank, and the heat dissipation liquid is a Heat dissipation silicon oil; there is a thermally conductive adhesive layer between the heat dissipation box and the circuit substrate, which is used to bond the heat dissipation box and the circuit substrate and conduct heat therebetween; the heat dissipation box contains a stirring system for stirring the inside of the heat dissipation box The heat dissipation liquid is used to accelerate the heat dissipation effect of the heat dissipation liquid; the heat dissipation tank is connected to an oil pressure circulation system to drive the heat dissipation liquid in the heat dissipation tank, thereby accelerating the heat dissipation effect of the heat dissipation liquid; through the heat dissipation system It can effectively dissipate the heat generated by the high-power LED, and avoid affecting the electrical properties of the high-power LED due to heat accumulation.

The utility model has the advantages of simple structure and easy assembly, and can avoid affecting the electrical properties of high-power LEDs due to heat accumulation.

Description of drawings:

Figure 1 is a schematic diagram of the assembly and combination of commonly used high-power LED lamps;

Fig. 2 is the structural representation of the utility model;

Fig. 3 is another embodiment schematic diagram of the present utility model;

Fig. 4 is another embodiment schematic diagram of the utility model;

Fig. 5 is a schematic diagram of yet another embodiment of the utility model.

Detailed ways:

As shown in accompanying drawing 2, the high-power LED lamp group comprises a shell base 21, and it has an accommodating space; 24 is sealed with heat dissipation liquid 25; a circuit substrate 22 is arranged on the heat dissipation box 24; and at least one high-power LED 23 is arranged on the circuit substrate 22; wherein, the heat dissipation box 24 includes a bearing tank 241 , used to carry the heat dissipation liquid 25; a tank cover 242, which is covered on the bearing tank body 241, is used to seal the heat dissipation liquid 25 in the bearing tank body, and an oil seal gasket can be added between the two 243, stored in a tight seal. In practical applications, there is a thermally conductive adhesive layer 26 between the heat dissipation box 24 and the circuit substrate 22, which is used to bond the heat dissipation box 24 and the circuit substrate 22, and conduct heat therebetween; The liquid 25 can be selected from a liquid with better heat dissipation capability and low thermal expansion rate, and generally commercially available heat dissipation silicone oil can be used;

With the introduction of the heat dissipation box 24 structure, the heat generated by the high-power LED 23 is introduced into the heat dissipation box 24 by the circuit board 22 through the thermal conductive adhesive 26, and then can be effectively dissipated through the convection and conduction of the heat dissipation liquid 25 in the heat dissipation box 24 The heat generated by the high-power LED avoids affecting the electrical properties of the high-power LED or causing damage due to heat accumulation;

As shown in Figure 3, its structure includes a housing base 21, which has an accommodating space, a light-transmitting upper cover 34, corresponding to the housing base 21, to close the accommodating space, and a circuit The substrate 22 is arranged in the accommodating space, at least one high-power LED 23 is arranged on the circuit substrate 22, and a cooling liquid 35 is filled in the accommodating space to dissipate the power generated by the high-power LED 23 to avoid affecting its electrical properties due to heat accumulation; similarly, the heat dissipation liquid can be a heat dissipation silicon oil, of course, in practical applications, in order to seal the heat dissipation liquid 35 in the accommodating space, the light-transmitting upper cover 34 An oil seal gasket 361 can be added between the shell base 21, and then the two can be sealed together by screws or other clamping methods; The inside of the accommodating space passes through the base shell 21 outwardly. Since the heat dissipation liquid 35 can directly contact the high-power LED, the heat will be dissipated more effectively. On the other hand, the heat dissipation liquid 35 itself is an insulating material. It will not affect the electrical properties of high-power LEDs; moreover, the light emitted by high-power LEDs can soften the light radiation through the scattering of heat dissipation liquid;

As shown in Figure 4, a stirring system 41 can be set in the carrying space in the cooling box 24 to stir the heat dissipation liquid 25 in the carrying space, thereby accelerating the dissipation of the heat generated by the high-power LED 23 and avoiding Heat accumulation affects its electrical properties;

As shown in Figure 5, the bearing space in the cooling box 24 is connected to an oil pressure circulation system 51, which is used to drive the heat dissipation liquid 25 in the bearing space, thereby accelerating the dissipation of the heat generated by the high-power main LED, Avoid affecting its electrical properties due to heat accumulation.

In addition, for the assembly structure disclosed in this utility model, whether it is the shell base or the heat dissipation box, the selection of materials must be carefully considered at the same time. The utility model considers the material of the shell base or the heat dissipation box In addition, in addition to paying attention to the mechanical properties, insulation and conductivity of the material itself, the expansion coefficient related to temperature is also the basic consideration for the selection of materials in this utility model, otherwise improper material selection may make the shell of the light-emitting diode assembly structure , Under constant temperature changes, qualitative changes, deterioration or even cracking will occur.

Claims (5)

1. A high-power LED heat dissipation structure, characterized in that: comprising A shell base, which has an accommodating space; A heat dissipation box is arranged in the accommodation space of the housing base, and heat dissipation liquid is sealed in the heat dissipation box; a circuit substrate, arranged on the cooling box; and at least one high-power LED disposed on the circuit substrate; 2. A heat dissipation structure for high-power LEDs according to claim 1, characterized in that: the heat dissipation box includes a bearing tank for carrying the heat dissipation liquid; and a tank cover for covering the bearing groove The body is used to seal the heat dissipation liquid in the carrying tank, and the heat dissipation liquid is heat dissipation silicon oil. 3. A high-power LED heat dissipation structure according to claim 1, characterized in that: there is a thermally conductive adhesive layer between the heat dissipation box and the circuit substrate for bonding the heat dissipation box and the circuit substrate, and Conduct heat between them. 4. A high-power LED heat dissipation structure according to claim 1, characterized in that: said heat dissipation box contains a stirring system for stirring the heat dissipation liquid in the heat dissipation box. 5. A heat dissipation structure for high-power LEDs according to claim 1, wherein the heat dissipation box is connected to an oil pressure circulation system for driving the heat dissipation liquid in the heat dissipation box.

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