TWI509111B - Surface treatment of electrolytic copper foil, laminated board, and printed wiring board, electronic equipment - Google Patents
Surface treatment of electrolytic copper foil, laminated board, and printed wiring board, electronic equipment Download PDFInfo
- Publication number
- TWI509111B TWI509111B TW102143163A TW102143163A TWI509111B TW I509111 B TWI509111 B TW I509111B TW 102143163 A TW102143163 A TW 102143163A TW 102143163 A TW102143163 A TW 102143163A TW I509111 B TWI509111 B TW I509111B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper foil
- roughness
- treated
- electrolytic copper
- printed wiring
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 113
- 239000011889 copper foil Substances 0.000 title claims description 91
- 238000004381 surface treatment Methods 0.000 title 1
- 239000011347 resin Substances 0.000 claims description 25
- 229920005989 resin Polymers 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 24
- 239000010949 copper Substances 0.000 description 27
- 239000010410 layer Substances 0.000 description 26
- 229910052802 copper Inorganic materials 0.000 description 22
- 239000011888 foil Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 15
- 238000007788 roughening Methods 0.000 description 15
- 239000003792 electrolyte Substances 0.000 description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 12
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 10
- 239000003292 glue Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 239000007788 liquid Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000000460 chlorine Substances 0.000 description 5
- -1 chlorine ions Chemical class 0.000 description 5
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000001186 cumulative effect Effects 0.000 description 3
- 239000008151 electrolyte solution Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 239000004135 Bone phosphate Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910017518 Cu Zn Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910017752 Cu-Zn Inorganic materials 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910017816 Cu—Co Inorganic materials 0.000 description 1
- 229910017868 Cu—Ni—Co Inorganic materials 0.000 description 1
- 229910017943 Cu—Zn Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 235000011167 hydrochloric acid Nutrition 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 235000002639 sodium chloride Nutrition 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012257896 | 2012-11-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201428139A TW201428139A (zh) | 2014-07-16 |
| TWI509111B true TWI509111B (zh) | 2015-11-21 |
Family
ID=50776215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102143163A TWI509111B (zh) | 2012-11-26 | 2013-11-26 | Surface treatment of electrolytic copper foil, laminated board, and printed wiring board, electronic equipment |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP5710845B2 (fr) |
| KR (2) | KR102078897B1 (fr) |
| CN (1) | CN104812945B (fr) |
| MY (1) | MY176308A (fr) |
| PH (1) | PH12015501174B1 (fr) |
| TW (1) | TWI509111B (fr) |
| WO (1) | WO2014081041A1 (fr) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY177676A (en) * | 2015-07-03 | 2020-09-23 | Mitsui Mining & Smelting Co Ltd | Roughened copper foil, copper-clad laminate and printed wiring board |
| CN107923047B (zh) * | 2015-07-29 | 2020-05-01 | 纳美仕有限公司 | 粗糙化处理铜箔、覆铜层叠板及印刷电路板 |
| TWI732892B (zh) * | 2016-07-26 | 2021-07-11 | 日商松下知識產權經營股份有限公司 | 透視型電極用積層板、透視型電極素材、組件及透視型電極用積層板之製造方法 |
| CN109642338B (zh) * | 2016-09-12 | 2021-02-09 | 古河电气工业株式会社 | 铜箔以及具有该铜箔的覆铜板 |
| KR101734840B1 (ko) * | 2016-11-11 | 2017-05-15 | 일진머티리얼즈 주식회사 | 내굴곡성이 우수한 이차전지용 전해동박 및 그의 제조방법 |
| JP7356209B2 (ja) * | 2017-03-31 | 2023-10-04 | Ｊｘ金属株式会社 | 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| JP7492808B2 (ja) | 2017-03-31 | 2024-05-30 | Ｊｘ金属株式会社 | 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| JP6632739B2 (ja) * | 2017-04-25 | 2020-01-22 | 古河電気工業株式会社 | 表面処理銅箔 |
| MY204665A (en) | 2018-03-30 | 2024-09-07 | Mitsui Mining & Smelting Co Ltd | Copper-clad laminate |
| EP3778219A4 (fr) * | 2018-04-10 | 2021-12-29 | DIC Corporation | Structure composite et son procédé de fabrication |
| KR102479331B1 (ko) * | 2018-04-25 | 2022-12-19 | 후루카와 덴키 고교 가부시키가이샤 | 표면 처리 동박, 동 클래드 적층판 및, 프린트 배선판 |
| JP7032239B2 (ja) * | 2018-05-28 | 2022-03-08 | 古河電気工業株式会社 | リードフレーム材およびその製造方法ならびに半導体パッケージ |
| JP6895936B2 (ja) * | 2018-09-28 | 2021-06-30 | 古河電気工業株式会社 | 表面処理銅箔、並びにこれを用いた銅張積層板及び回路基板 |
| JP2020100144A (ja) * | 2018-12-21 | 2020-07-02 | 積水化学工業株式会社 | 積層体 |
| US10581081B1 (en) * | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
| WO2020246467A1 (fr) * | 2019-06-07 | 2020-12-10 | 古河電気工業株式会社 | Feuille de cuivre traitée en surface, plaque cuivrée stratifiée et carte de circuit imprimé |
| US11332839B2 (en) | 2019-06-19 | 2022-05-17 | Co-Tech Development Corp. | Advanced electrodeposited copper foil and copper clad laminate using the same |
| TWM608774U (zh) * | 2019-06-19 | 2021-03-11 | 金居開發股份有限公司 | 進階反轉電解銅箔及應用其的銅箔基板 |
| TWI697574B (zh) | 2019-11-27 | 2020-07-01 | 長春石油化學股份有限公司 | 電解銅箔、電極及包含其之鋰離子電池 |
| EP4132235B1 (fr) * | 2020-03-30 | 2025-02-19 | Mitsubishi Materials Corporation | Corps lié et carte de circuit imprimé d'isolation |
| WO2021251288A1 (fr) * | 2020-06-11 | 2021-12-16 | 三井金属鉱業株式会社 | Stratifié cuivré à double face |
| WO2022153580A1 (fr) * | 2021-01-15 | 2022-07-21 | Ｊｘ金属株式会社 | Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé |
| WO2023281759A1 (fr) * | 2021-07-09 | 2023-01-12 | Ｊｘ金属株式会社 | Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008285751A (ja) * | 2007-04-19 | 2008-11-27 | Mitsui Mining & Smelting Co Ltd | 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板 |
| TW201229322A (en) * | 2010-10-06 | 2012-07-16 | Furukawa Electric Co Ltd | Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board |
| JP2012169598A (ja) * | 2011-01-26 | 2012-09-06 | Sumitomo Bakelite Co Ltd | プリント配線板およびプリント配線板の製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4567360B2 (ja) * | 2004-04-02 | 2010-10-20 | 三井金属鉱業株式会社 | 銅箔の製造方法及びその製造方法で得られる銅箔 |
| JP5215631B2 (ja) * | 2007-10-24 | 2013-06-19 | 三井金属鉱業株式会社 | 表面処理銅箔 |
| TWI434965B (zh) * | 2008-05-28 | 2014-04-21 | Mitsui Mining & Smelting Co | A roughening method for copper foil, and a copper foil for a printed wiring board which is obtained by the roughening method |
| JP5318886B2 (ja) * | 2008-11-25 | 2013-10-16 | Ｊｘ日鉱日石金属株式会社 | 印刷回路用銅箔 |
| JP5282675B2 (ja) * | 2009-06-23 | 2013-09-04 | 日立電線株式会社 | プリント配線板用銅箔およびその製造方法 |
| JP5885054B2 (ja) * | 2010-04-06 | 2016-03-15 | 福田金属箔粉工業株式会社 | 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。 |
| JP5634103B2 (ja) * | 2010-04-06 | 2014-12-03 | 福田金属箔粉工業株式会社 | 銅張積層板用処理銅箔及び該処理銅箔を絶縁性樹脂基材に接着してなる銅張積層板並びに該銅張積層板を用いたプリント配線板。 |
-
2013
- 2013-11-26 KR KR1020167036617A patent/KR102078897B1/ko active Active
- 2013-11-26 WO PCT/JP2013/081806 patent/WO2014081041A1/fr not_active Ceased
- 2013-11-26 KR KR1020147025481A patent/KR20140124402A/ko not_active Ceased
- 2013-11-26 CN CN201380061468.5A patent/CN104812945B/zh active Active
- 2013-11-26 JP JP2014531008A patent/JP5710845B2/ja active Active
- 2013-11-26 TW TW102143163A patent/TWI509111B/zh active
- 2013-11-26 MY MYPI2015701682A patent/MY176308A/en unknown
-
2015
- 2015-05-26 PH PH12015501174A patent/PH12015501174B1/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008285751A (ja) * | 2007-04-19 | 2008-11-27 | Mitsui Mining & Smelting Co Ltd | 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板 |
| TW201229322A (en) * | 2010-10-06 | 2012-07-16 | Furukawa Electric Co Ltd | Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board |
| JP2012169598A (ja) * | 2011-01-26 | 2012-09-06 | Sumitomo Bakelite Co Ltd | プリント配線板およびプリント配線板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170002705A (ko) | 2017-01-06 |
| TW201428139A (zh) | 2014-07-16 |
| CN104812945B (zh) | 2018-08-28 |
| JP5710845B2 (ja) | 2015-04-30 |
| JPWO2014081041A1 (ja) | 2017-01-05 |
| KR20140124402A (ko) | 2014-10-24 |
| PH12015501174A1 (en) | 2015-08-10 |
| CN104812945A (zh) | 2015-07-29 |
| KR102078897B1 (ko) | 2020-02-19 |
| PH12015501174B1 (en) | 2019-01-11 |
| WO2014081041A1 (fr) | 2014-05-30 |
| MY176308A (en) | 2020-07-28 |
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