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CN104812945B - 表面处理电解铜箔、积层板、印刷配线板、及电子机器 - Google Patents

表面处理电解铜箔、积层板、印刷配线板、及电子机器 Download PDF

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Publication number
CN104812945B
CN104812945B CN201380061468.5A CN201380061468A CN104812945B CN 104812945 B CN104812945 B CN 104812945B CN 201380061468 A CN201380061468 A CN 201380061468A CN 104812945 B CN104812945 B CN 104812945B
Authority
CN
China
Prior art keywords
copper foil
treated
roughened
roughness
electrolytic copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201380061468.5A
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English (en)
Chinese (zh)
Other versions
CN104812945A (zh
Inventor
古曳伦也
犬饲贤二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of CN104812945A publication Critical patent/CN104812945A/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201380061468.5A 2012-11-26 2013-11-26 表面处理电解铜箔、积层板、印刷配线板、及电子机器 Active CN104812945B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012257896 2012-11-26
JP2012-257896 2012-11-26
PCT/JP2013/081806 WO2014081041A1 (fr) 2012-11-26 2013-11-26 Feuille de cuivre électrolytique traitée en surface, stratifié et carte de circuit imprimé

Publications (2)

Publication Number Publication Date
CN104812945A CN104812945A (zh) 2015-07-29
CN104812945B true CN104812945B (zh) 2018-08-28

Family

ID=50776215

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380061468.5A Active CN104812945B (zh) 2012-11-26 2013-11-26 表面处理电解铜箔、积层板、印刷配线板、及电子机器

Country Status (7)

Country Link
JP (1) JP5710845B2 (fr)
KR (2) KR102078897B1 (fr)
CN (1) CN104812945B (fr)
MY (1) MY176308A (fr)
PH (1) PH12015501174B1 (fr)
TW (1) TWI509111B (fr)
WO (1) WO2014081041A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6193534B2 (ja) * 2015-07-03 2017-09-06 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
KR102490491B1 (ko) * 2015-07-29 2023-01-19 나믹스 코포레이션 조면화 처리 구리박, 동장 적층판 및 프린트 배선판
TWI732892B (zh) * 2016-07-26 2021-07-11 日商松下知識產權經營股份有限公司 透視型電極用積層板、透視型電極素材、組件及透視型電極用積層板之製造方法
KR102274906B1 (ko) * 2016-09-12 2021-07-09 후루카와 덴키 고교 가부시키가이샤 구리박 및 이것을 갖는 동장 적층판
KR101734840B1 (ko) * 2016-11-11 2017-05-15 일진머티리얼즈 주식회사 내굴곡성이 우수한 이차전지용 전해동박 및 그의 제조방법
JP7356209B2 (ja) * 2017-03-31 2023-10-04 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP7492808B2 (ja) 2017-03-31 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6632739B2 (ja) * 2017-04-25 2020-01-22 古河電気工業株式会社 表面処理銅箔
KR20200118144A (ko) 2018-03-30 2020-10-14 미쓰이금속광업주식회사 동장 적층판
EP3778219A4 (fr) * 2018-04-10 2021-12-29 DIC Corporation Structure composite et son procédé de fabrication
KR102479331B1 (ko) * 2018-04-25 2022-12-19 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박, 동 클래드 적층판 및, 프린트 배선판
JP7032239B2 (ja) * 2018-05-28 2022-03-08 古河電気工業株式会社 リードフレーム材およびその製造方法ならびに半導体パッケージ
JP6895936B2 (ja) * 2018-09-28 2021-06-30 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及び回路基板
JP2020100144A (ja) * 2018-12-21 2020-07-02 積水化学工業株式会社 積層体
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
KR102638749B1 (ko) * 2019-06-07 2024-02-21 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박, 동클래드 적층판 및, 프린트 배선판
TWI776168B (zh) * 2019-06-19 2022-09-01 金居開發股份有限公司 進階反轉電解銅箔及應用其的銅箔基板
US11332839B2 (en) 2019-06-19 2022-05-17 Co-Tech Development Corp. Advanced electrodeposited copper foil and copper clad laminate using the same
TWI697574B (zh) * 2019-11-27 2020-07-01 長春石油化學股份有限公司 電解銅箔、電極及包含其之鋰離子電池
CN115380633B (zh) 2020-03-30 2025-02-07 三菱综合材料株式会社 接合体及绝缘电路基板
KR102496228B1 (ko) * 2020-06-11 2023-02-06 미쓰이금속광업주식회사 양면 동장 적층판
WO2022153580A1 (fr) * 2021-01-15 2022-07-21 Ｊｘ金属株式会社 Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé
WO2023281759A1 (fr) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Feuille de cuivre traitée en surface, stratifié cuivré et carte de circuit imprimé

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* Cited by examiner, † Cited by third party
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CN102046853A (zh) * 2008-05-28 2011-05-04 三井金属矿业株式会社 铜箔的粗化处理方法和由该粗化处理方法得到的印刷布线板用铜箔
CN102215635A (zh) * 2010-04-06 2011-10-12 福田金属箔粉工业株式会社 覆铜层压板用处理铜箔、覆铜层压板以及使用该覆铜层压板的印刷布线板
CN102215632A (zh) * 2010-04-06 2011-10-12 福田金属箔粉工业株式会社 覆铜层压板用处理铜箔、覆铜层压板以及使用该覆铜层压板的印刷布线板

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JP4567360B2 (ja) * 2004-04-02 2010-10-20 三井金属鉱業株式会社 銅箔の製造方法及びその製造方法で得られる銅箔
JP5129642B2 (ja) * 2007-04-19 2013-01-30 三井金属鉱業株式会社 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板
JP5215631B2 (ja) * 2007-10-24 2013-06-19 三井金属鉱業株式会社 表面処理銅箔
CN102224281B (zh) * 2008-11-25 2014-03-26 吉坤日矿日石金属株式会社 印刷电路用铜箔
JP5282675B2 (ja) * 2009-06-23 2013-09-04 日立電線株式会社 プリント配線板用銅箔およびその製造方法
WO2012046804A1 (fr) * 2010-10-06 2012-04-12 古河電気工業株式会社 Feuille de cuivre et son procédé de fabrication, feuille de cuivre avec support et son procédé de fabrication, carte de circuit imprimé et carte de circuit imprimé multicouche
KR20140009323A (ko) * 2011-01-26 2014-01-22 스미토모 베이클리트 컴퍼니 리미티드 프린트 배선판 및 프린트 배선판의 제조 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102046853A (zh) * 2008-05-28 2011-05-04 三井金属矿业株式会社 铜箔的粗化处理方法和由该粗化处理方法得到的印刷布线板用铜箔
CN102215635A (zh) * 2010-04-06 2011-10-12 福田金属箔粉工业株式会社 覆铜层压板用处理铜箔、覆铜层压板以及使用该覆铜层压板的印刷布线板
CN102215632A (zh) * 2010-04-06 2011-10-12 福田金属箔粉工业株式会社 覆铜层压板用处理铜箔、覆铜层压板以及使用该覆铜层压板的印刷布线板

Also Published As

Publication number Publication date
KR20140124402A (ko) 2014-10-24
KR20170002705A (ko) 2017-01-06
PH12015501174A1 (en) 2015-08-10
MY176308A (en) 2020-07-28
WO2014081041A1 (fr) 2014-05-30
JPWO2014081041A1 (ja) 2017-01-05
JP5710845B2 (ja) 2015-04-30
CN104812945A (zh) 2015-07-29
KR102078897B1 (ko) 2020-02-19
PH12015501174B1 (en) 2019-01-11
TWI509111B (zh) 2015-11-21
TW201428139A (zh) 2014-07-16

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Address after: No.4, 10-fan, erdingmu, huzhimen, Tokyo, Japan

Patentee after: JX Nippon Mining & Metals Corp.

Address before: Tokyo, Japan

Patentee before: JX Nippon Mining & Metals Corp.

CP02 Change in the address of a patent holder