TWI500371B - Mark for inspection and printed circuit board having the same - Google Patents

Description

Check mark and printed circuit board with it

The present invention relates to an inspection mark and a printed circuit board having such an inspection mark.

Recently, in the printed circuit board (PCB) industry, the importance of substrates for flip chip (FC) has gradually increased.

One common process for fabricating substrates for flip chip is a bumping process.

The bump process is a process for forming bumps that can be electrically connected to a semiconductor wafer on a printed circuit board. As the semiconductor wafer is highly integrated, it is necessary to form bumps having fine pitch.

In order to form fine pitch bumps, an important point is to ensure process capacity with respect to fineness, such as processes regarding bump size, pad pitch or solder eccentricity, and the like. ability. However, there is a limitation in reducing the bump size and the pitch fineness of the pads. There is therefore a need for a process that reduces the size of the pads used to support the bumps.

However, the above process may be caused by substrate distortion, scale abnormality, etc., so that the solder resist opening (SRO) formed in the solder resist deviates beyond the pad boundary in order to form a bump, resulting in an open circuit (electrical open). Problems such as defects or bump defects. In order to avoid the above defects, it is necessary to manage the pad boundary to the interface surface (interface The distance between the surfaces, ie the eccentric position of the solder resist opening.

Meanwhile, in the case of Korean Patent Publication No. 2006-0026191, a method of detecting whether or not the solder resist opening is eccentric according to the prior art is disclosed.

However, the foregoing method for detecting whether the solder resist opening is eccentric according to the prior art may be caused by the difference in the height of the pad surface and the solder resist surface in the z-axis direction, resulting in the worker's shape and focus according to the solder resist opening (SRO). When measuring, there is a measurement error between different workers, and it may be difficult to systematically monitor the eccentric direction.

SUMMARY OF THE INVENTION The present invention is directed to providing an inspection mark and a printed circuit board having such an inspection mark capable of detecting an eccentric amount and an eccentric direction of a solder resist opening with accurate values.

In addition, the present invention is used to provide an inspection mark and a printed circuit board having such an inspection mark, which can minimize inspection costs and reduce process capacity.

According to a preferred embodiment of the present invention, an inspection mark is provided, including a plurality of voltage application terminals, a first pattern, a plurality of second patterns, a plurality of voltage measuring terminals, a solder resist layer, and a surface treatment layer. The voltage application terminal includes a pair of first voltage application terminals and a pair of second voltage application terminals, the first voltage application terminals are separated from each other and opposed to each other in a first direction, and the second voltage application terminals are separated from each other and in a vertical first direction One of the second directions is opposite to each other. The first pattern includes a 1-1st pattern and a 1-2th pattern a pattern connecting the pair of first voltage application terminals and the pair of second voltage application terminals. The second pattern is an extended form having ends connected to one of the sides of the 1-1st pattern and the 1-2th pattern or the other surface. The voltage measuring terminal is connected to the other end of the second pattern. The solder resist layer has a first opening and a second opening, the first opening exposing the voltage application terminal and the voltage measuring terminal, and the second opening exposing the first pattern. The surface treatment layer is formed on the voltage application terminal, the voltage measurement terminal, and the first pattern exposed by the first opening and the second opening, wherein the 1-1st pattern and the 1-2th pattern of the first pattern are mutually Crossing, the second opening exposes an intersection of one of the first patterns.

The end of the second pattern connected to the 1-1st pattern and the 1-2th pattern may be adjacent to the voltage application terminal.

The surface treatment layer may be made of nickel (Ni) and gold (Au).

The 1-1st pattern and the 1-2th pattern may have the same length.

The lateral length and the longitudinal length of the second opening may not be equal to each other.

The added value of the lateral length and the longitudinal length of the second opening may be equal to the length of the 1-1st pattern or the length of the 1-2th pattern.

One of the first voltage application terminal pairs may be numbered 1, and the other voltage application terminals may be numbered as 1 and counterclockwise labeled 2, 3, and 4, the length of the 1-1st pattern, and the first 1-2 The length of the pattern may each be a+b, the length of the portion of the second opening parallel to the 1-1st pattern may be a, and the length of the portion of the second opening perpendicular to the 1-1st pattern may be b, and The resistance value between the voltage application terminals 1 and 2 is R ₁₂ , the resistance value between the voltage application terminals 2 and 3 is R ₂₃ , the resistance value between the voltage application terminals 3 and 4 is R ₃₄ , the voltage application terminal 4 and When the resistance value between 1 is R ₄₁ , the resistance value between the voltage application terminals 1 and 3 is R _{13 ,} and the resistance value between the voltage application terminals 2 and 4 is R ₂₄ , an eccentric amount x and an eccentric amount y They can be expressed by the following equations: The eccentric amount x represents the extent that the intersection of the 1-1st pattern and the 1-2th pattern deviates from the center of the second opening in a direction parallel to the 1-1st pattern, and the eccentric amount y represents a pattern perpendicular to the 1-1st plane. In the direction, the intersection of the 1-1st pattern and the 1-2th pattern is offset from the center of the second opening.

According to another preferred embodiment of the present invention, a printed circuit board is provided comprising a substrate unit area and a blank area surrounding the substrate unit area. The printed circuit board includes an inspection mark including a plurality of voltage application terminals, a first pattern, a plurality of second patterns, a plurality of voltage measuring terminals, a solder resist layer, and a surface treatment layer. The voltage application terminal includes a pair of first voltage application terminals and a pair of second voltage application terminals, the first voltage application terminals are separated from each other and opposed to each other in a first direction, and the second voltage application terminals are separated from each other and in a vertical first direction One of the second directions is opposite to each other. The first pattern includes a 1-1st pattern and a 1-2th pattern, and connects the pair of first voltage application terminals and the pair of second voltage application terminals. The second pattern is an extended form having ends connected to one of the sides of the 1-1st pattern and the 1-2th pattern or the other surface. The voltage measuring terminal is connected to the other end of the second pattern. The solder resist layer has a first opening and a second opening, the first opening exposing the voltage application terminal and the voltage measuring terminal, and the second opening storm The first pattern is exposed. The surface treatment layer is formed on the voltage application terminal, the voltage measurement terminal, and the first pattern exposed by the first opening and the second opening, wherein the 1-1st pattern and the 1-2th pattern of the first pattern are mutually Crossing, the second opening exposes an intersection of one of the first patterns.

The end of the second pattern connected to the 1-1st pattern and the 1-2th pattern may be adjacent to the voltage application terminal.

The surface treatment layer may be made of nickel (Ni) and gold (Au).

The 1-1st pattern and the 1-2th pattern may have the same length.

The lateral length and the longitudinal length of the second opening may not be equal to each other.

The added value of the lateral length and the longitudinal length of the second opening may be equal to the length of the 1-1st pattern or the length of the 1-2th pattern.

One of the first voltage application terminal pairs may be numbered 1, and the other voltage application terminals may be numbered as 1 and counterclockwise labeled 2, 3, and 4, the length of the 1-1st pattern, and the first 1-2 The length of the pattern may each be a+b, the length of the portion of the second opening parallel to the 1-1st pattern may be a, and the length of the portion of the second opening perpendicular to the 1-1st pattern may be b, and The resistance value between the voltage application terminals 1 and 2 is R ₁₂ , the resistance value between the voltage application terminals 2 and 3 is R ₂₃ , the resistance value between the voltage application terminals 3 and 4 is R ₃₄ , the voltage application terminal 4 and When the resistance value between 1 is R ₄₁ , the resistance value between the voltage application terminals 1 and 3 is R ₁₃ and the resistance value between the voltage application terminals 2 and 4 is R ₂₄ , an eccentric amount x and an eccentric amount y They can be expressed by the following equations: The eccentric amount x represents the extent that the intersection of the 1-1st pattern and the 1-2th pattern deviates from the center of the second opening in a direction parallel to the 1-1st pattern, and the eccentric amount y represents a pattern perpendicular to the 1-1st plane. In the direction, the intersection of the 1-1st pattern and the 1-2th pattern is offset from the center of the second opening.

The blank area may include a long blank area located in a plurality of strips including a plurality of substrate units, or the blank area may include a flat blank area, the flat blank area is located in a flat plate, and the plurality of strips Arranged in the plate.

The advantages and features of the present invention are disclosed by the following embodiments and the accompanying drawings.

Words used in the description of the present invention and in the scope of the claims should not be construed as being limited to their ordinary meaning or definition in the dictionary, but should be described in an optimal manner based on the concept that the inventor can appropriately define the term. The law is interpreted as having meaning and concepts related to the technical field of the present invention.

The above objects or other objects, advantages and features of the present invention will become apparent to those skilled in the <RTIgt; In the description and drawings, like reference numerals are used to refer to the In the description of the present invention, if it is relevant to the present invention Detailed description of the technique will result in the focus of the reading being out of focus, and the detailed description will be omitted from the manual. In the description of the invention, the terms first, second, etc. are used to distinguish different elements, and are not intended to limit each element.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail in conjunction with the drawings.

1 is a plan view showing a mark for inspection according to a preferred embodiment of the present invention, and FIG. 2 is a view showing a solder resist (solder) in an inspection mark according to a preferred embodiment of the present invention. Top view of the pattern on the bottom of the resist).

Referring to FIG. 1 and FIG. 2, an inspection mark 100 according to a preferred embodiment of the present invention includes a voltage applying terminal 1, 2, 3, 4, a first pattern 101, and a second pattern. 111a, 111b, 111c, and 111d, voltage measuring terminals 1', 2', 3', 4', solder resist layer 150, and surface treatment layer 160.

As shown in FIGS. 1 and 2, the voltage application terminals 1, 2, 3, 4 may include a pair of first voltage application terminals 1 and 3 which are separated from each other and opposed to each other in a first direction, and a pair are separated from each other. And in a second direction, the second voltage application terminals 2 and 4 are opposite to each other, and the second direction is perpendicular to the first direction.

In this example, the first direction may represent the vertical direction of the first and second figures, and the second direction may represent the horizontal direction of the first and second figures, but the preferred embodiment of the present invention is not limited herein. The first direction may be a horizontal direction, and the two directions may be a vertical direction.

In this example, the voltage application terminals 1, 2, 3, and 4 can be made of copper (Cu). However, it is not particularly limited to this.

The first pattern 101 may include a 1-1st pattern 101a and a 1-2st pattern 101b, and the 1-1st pattern 101a and the 1-2th pattern 101b are respectively connected to the first voltage application terminal pair 1, 3 and the second voltage application. Terminals 2, 4.

In this example, similar to the voltage application terminals 1, 2, 3, and 4, the first pattern 101 may be made of copper (Cu), but is not limited thereto.

In this example, the 1-1st pattern 101a and the 1-2st pattern 101b may have the same length, but are not limited thereto.

The second patterns 111a, 111b, 111c, and 111d are patterns extending to be connected to one surface or the other surface of both sides of the 1-1st pattern 101a and the 1-2th pattern 101b.

For example, referring to FIG. 2, the second patterns 111a and 111c may be formed adjacent to the portions of the first voltage application terminals 1 and 3 located on both sides of the 1-1st pattern 101a, that is, the second patterns 111b and 111d may be formed. The portions of the second voltage application terminals 2 and 4 located on both sides of the 1-2th pattern 101b connecting the second voltage application terminals 2, 4 are adjacent.

In this example, as shown in FIG. 2, each of the second patterns 111a, 111b, 111c, and 111d may be formed to extend in the same direction, but is not particularly limited thereto. However, the second patterns 111a, 111b, 111c, and 111d may be formed in such a manner as not to cause a short circuit between each other.

Further, the second patterns 111a, 111b, 111c, and 111d may also be made of copper (Cu), but are not limited thereto.

Furthermore, the second patterns 111a, 111b, 111c, and 111d may have the same length, but are not particularly limited thereto.

Voltage measuring terminals 1', 2', 3' and 4' are each connected to a second pattern The terminals of 111a, 111b, 111c, and 111d may also be made of copper (Cu), but are not limited thereto.

As shown in FIGS. 1 and 2, one end of the second patterns 111a, 111b, 111c, 111d is connected to the first pattern 101, and the other end is connectable to the aforementioned voltage measuring terminals 1', 2', 3 ', 4' are connected.

In addition, the inspection mark 100 may include a solder resist layer 150 including a first electrode exposing the aforementioned voltage application terminals 1, 2, 3, 4 and the aforementioned voltage measuring terminals 1', 2', 3', 4' The opening 150a and the second opening 150b exposing a portion of the first pattern 101 where the 1-1st pattern 101a and the 1-2st pattern 101b cross each other.

Here, the lateral length and the vertical length of the second opening 150b may not be equal to each other.

In addition, the added value (sum) of the lateral length and the longitudinal length of the second opening 150b may be equal to the length of the 1-1st pattern 101a or the length of the 1-2th pattern 101b.

For example, as shown in FIG. 2, when the length of the 1-1st pattern 101a or the 1-2st pattern 101b is a+b, the lateral length of the second opening 150b can be set equal to a, and the longitudinal length can be Set to equal b. In this case, the lateral length of the second opening 150b can also be set equal to b, and the longitudinal length can also be set equal to a.

That is, the inspection mark 100 according to the preferred embodiment of the present invention is such that the lengths of the 1-1st pattern 101a and the 1-2th pattern 101b are equal to each other, and are exposed to the outer 1-1st pattern 101a, first The second opening 150b of the intersection portion of the pattern 101b is formed in such a manner that the added value of the lateral direction and the longitudinal length is equal to the length of the 1-1st pattern 101a or the length of the 1-2st pattern 101b.

Even if any portion is exposed, the lengths of the 1-1st pattern 101a and the 1-2th pattern 101b exposed are kept constant. The calculation operation for the eccentric value can be simplified by maintaining the length of the pattern exposed to the outside as a constant value.

The calculation of the eccentricity value will be discussed in the following sections.

In addition, the inspection mark 100 may further include a surface treatment layer 160 formed on the voltage application terminals 1, 2, 3, 4 exposed by the first opening 150a and the second opening 150b, and the voltage measurement terminal 1' , 2', 3', 4', the 1-1st pattern 101a, and the 1-2th pattern 101b.

In this example, the surface treatment layer 160 may be made of nickel (Ni) and gold (Au) in order, but is not particularly limited thereto.

Here, the surface treatment layer 160 is formed on the voltage application terminals 1, 2, 3, 4 and the voltage measurement terminals 1', 2', 3', 4' in order to prevent the terminal from being oxidized by exposure to air. .

Meanwhile, the surface treatment layer 160 is formed on the 1-1st pattern 101a and the 1-2th pattern 101b which are exposed to the outside, in order to prevent the exposed pattern from being oxidized, and to expose the exposed pattern to the unexposed one. The resistance values between the patterns are different.

That is, the 1-1st pattern 101a and the 1-2st pattern 101b which are not exposed are made of copper (Cu), and the 1-1st pattern 101a and the 1-2st pattern 101b which are exposed are made of copper. (Cu)/nickel (Ni) and gold (Au) are formed so that the resistance values of the exposed portion and the unexposed portion are different.

As described above, the resistance value is measured by making the resistance values of the exposed portion and the unexposed portion different, and the 1-1st pattern 101a and the 1-2th pattern 101b can be calculated by using the measured resistance value. Intersection relative to the first The amount of eccentricity at the center of the two openings 150b and the eccentric direction.

This will be described, for example, in conjunction with Figure 3.

Referring to FIG. 3, when the center points of the 1-1st pattern 101a and the 1-2st pattern 101b crossing each other are represented by Q, with the center point Q as the origin, the longitudinal length of the 1-1st pattern 101a may be equal to N. The lateral length of the 1-2th pattern 101b may also be equal to N.

In this example, the longitudinal length of the 1-1st pattern 101a and the lateral length of the 1-2st pattern 101b are also equal to each other, such that the longitudinal and lateral lengths of the first pattern are centered at the center point Q and equal to N. .

In such a case, that is, in the case where the solder resist layer 150 and the surface treatment layer 160 are formed (refer to FIG. 2), the same result can be obtained by measuring the resistance value between the individual terminals.

That is, with the center point as the origin, all the longitudinal and lateral lengths of the first pattern are the same, and all the components are the same, so the same resistance value is measured.

Here, a solder resist layer 150 having a second opening 150b exposing a portion of the first pattern 101 is formed, the exposed portion including the center point Q, and the surface treatment layer 160 is formed on the first exposed to the outside On the pattern 101, then, the resistance value between the respective terminals is measured.

In this example, when the center of the second opening 150b coincides with the center point Q, the measurement results of the resistance values between the individual terminals may be equal, and when the center of the second opening 150b does not coincide with the center point Q, the individual terminals are interposed. The measurement of the resistance value may not be equal.

Here, when the center of the second opening 150b coincides with the center point Q, The reason why the resistance value measurement results are equal is that the longitudinal and lateral lengths of the portion in which the surface treatment layer 160 is formed are also equal. When the center of the second opening 150b and the center point Q are not coincident, the reason why the resistance value measurement results are not equal is the portion of the surface treatment layer 160 of the first pattern 101 whose longitudinal and lateral lengths are not equal to each other.

The method of calculating the eccentric amount and the eccentric direction using the measured resistance value will be described below with reference to Fig. 3. 3 is a view showing a case where the center of the second opening of the solder resist is eccentric with respect to the central portion Q of the first pattern 101. That is, the case where there is an eccentric amount x in the x direction and an eccentric amount y in the y direction is shown.

First, using the measured resistance value, the formula of the eccentric amount and the eccentric direction of the solder resist second opening 150b is calculated as shown in the following Equation 1.

Here, R ₁₂ denotes a resistance value between the voltage application terminals 1 and 2, R ₂₃ denotes a resistance value between the voltage application terminals 2 and 3, and R ₃₄ denotes a resistance value between the voltage application terminals 3 and 4. R ₄₁ denotes a resistance value between the voltage application terminals 4 and 1, R ₁₃ denotes a resistance value between the voltage application terminals 1 and 3, and R ₂₄ denotes a resistance value between the voltage application terminals 2 and 4.

Further, a represents the lateral length of the second opening 150b based on Fig. 3, and b represents the longitudinal length of the second opening 150b. In this example, the lengths of the 1-1st pattern 101a and the 1-2st pattern 101b are each a+b.

Also, x represents an eccentricity of the central portion of the second opening 150b in the x direction, and y represents an eccentricity of the central portion of the second opening 150b in the y direction.

That is, as shown in FIG. 3, the inspection mark 100 according to the preferred embodiment of the present invention may include a solder resist layer 150 and a surface treatment layer 160 having a second opening 150b formed in the second opening 150b. On the first pattern 101 including the 1-1st pattern 101a and the 1-2st pattern 101b, the surface treatment layer 160 is formed on the first pattern 101 exposed by the second opening 150b, wherein the second opening 150b The lateral length is a, the longitudinal length is b, and the length of the first pattern 101 is a+b.

The resistance value between the individual terminals of the check mark 100 is measured, and the measured resistance value and the predetermined values of a and b are substituted into Equation 1 described above to obtain x and y.

The obtained x and y represent the amount of eccentricity in the x direction and the amount of eccentricity in the y direction based on the center of the second opening 150b.

As described above, according to the inspection mark 100 of the preferred embodiment of the present invention, the resistance value is electrically measured, and the measured value is substituted into the correlation equation to calculate an accurate eccentric amount and an eccentric direction.

In addition, the inspection mark 100 according to the preferred embodiment of the present invention is formed by a separate process, but can be formed while forming a pattern on the substrate together with the solder resist layer, thereby eliminating the need for additional process steps and costs.

Figure 4 is a diagram showing an inspection in accordance with a preferred embodiment of the present invention. Top view of the printed circuit board.

Meanwhile, the details of the check mark 100 have been described above, and the related description will be omitted below.

As shown in FIG. 4, the inspection mark 100 according to the preferred embodiment of the present invention may be formed in a dummy region 220 of a printed circuit board 300, the printed circuit board 300 including a plurality of unit substrates 10 The substrate unit area 213 and the blank area 220 surrounding the substrate unit area 213 are not particularly limited thereto.

Here, the blank area 220 may be a strip dummy region 211 surrounding the substrate unit area 213, located in a strip 210 including a plurality of substrate units 10.

In addition, the blank area 220 may be a panel dummy region 201 surrounding the strip region 215. The strip region 215 is arranged with a plurality of strips 210 disposed on the flat panel 200 including the plurality of strips 210. Among them.

The above description is only a preferred embodiment, and therefore, the area in which the inspection mark 100 is formed is not particularly limited thereto.

In a preferred embodiment of the present invention, the eccentricity value is calculated by performing surface treatment on the pattern exposed by the solder resist opening, and then measuring the resistance value of each terminal, and the eccentricity of the solder resist opening can be accurately detected. Volume and eccentric direction.

Moreover, the preferred embodiment of the present invention can detect the eccentricity and eccentricity of the solder resist opening with accurate values as described above, thereby accurately measuring the irregular eccentricity of each position, such as scale abnormality. ) and distortion and so on.

The preferred embodiment of the present invention can detect the eccentricity only by measuring the resistance values of the terminals, without using additional equipment such as a microscope or the like, thereby reducing the process cost.

In view of the above, the present invention has been described above in terms of preferred embodiments, which are intended to specifically explain the embodiments of the present invention, and are not intended to limit the inspection marks and printed circuit boards having the same according to the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention.

Accordingly, the present invention includes any and all modifications and variations of the present invention, and the scope of the present invention is defined by the scope of the appended claims.

1, 2, 3, 4‧‧‧ voltage application terminals

1', 2', 3', 4'‧‧‧ voltage measuring terminals

10‧‧‧Substrate unit

100‧‧‧Check marks

101‧‧‧ first pattern

101a‧‧‧1-1st pattern

101b‧‧‧1-2th pattern

111a, 111b, 111c, 111d‧‧‧ second pattern

150‧‧‧ solder resist layer

150a‧‧‧first opening

150b‧‧‧second opening

160‧‧‧Surface treatment layer

200‧‧‧ tablet

201‧‧‧Table blank area

210‧‧‧ strips

211‧‧‧ long blank area

213‧‧‧Substrate unit area

215‧‧‧Long strip area

220‧‧‧Blank area

300‧‧‧Printed circuit board

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a plan view showing an inspection mark in accordance with a preferred embodiment of the present invention.

Fig. 2 is a plan view showing a pattern provided on the bottom of the solder resist in the inspection mark according to the preferred embodiment of the present invention.

Figure 3 is a plan view showing an eccentricity of the second opening of the solder resist in the inspection mark according to the preferred embodiment of the present invention.

Figure 4 is a top plan view of a printed circuit board having inspection indicia in accordance with a preferred embodiment of the present invention.

1, 2, 3, 4‧‧‧ voltage application terminals

1', 2', 3', 4'‧‧‧ voltage measuring terminals

100‧‧‧Check marks

150‧‧‧ solder resist layer

150a‧‧‧first opening

150b‧‧‧second opening

160‧‧‧Surface treatment layer

Claims (15)

An inspection mark comprising: a plurality of voltage application terminals including a pair of first voltage application terminals and a pair of second voltage application terminals, the pair of first voltage application terminals being separated from each other and facing each other in a first direction, the pair The second voltage application terminals are separated from each other and opposed to each other in a second direction, the second direction being perpendicular to the first direction; a first pattern comprising a 1-1st pattern and a 1-2th pattern, the first a pattern connecting the pair of first voltage application terminals and the pair of second voltage application terminals; the plurality of second patterns are in an extended form, the second patterns having a connection to the 1-1st pattern and the first a surface of one side of the pattern or an end of the other surface; a plurality of voltage measuring terminals connected to the other end of the second patterns; a solder resist layer having a first opening and a second opening, The first opening exposes the voltage applying terminals and the voltage measuring terminals, the second opening exposing the first pattern; and a surface treatment layer formed by the first opening and the second opening Exposed to the outside The voltage applying terminal, the voltage measuring terminals, and the first pattern, wherein the 1-1st pattern and the 1-2th pattern of the first pattern cross each other, and the second opening exposes the One of the first patterns intersects the portion. Such as the inspection mark described in item 1 of the patent application, each of which The ends of the second patterns connected to the 1-1st pattern and the 1-2th pattern are adjacent to the corresponding voltage application terminal. The inspection mark according to claim 1, wherein the surface treatment layer is made of nickel (Ni) and gold (Au). The inspection mark of claim 1, wherein the 1-1st pattern has the same length as the 1-2th pattern. The inspection mark of claim 1, wherein the lateral length of the second opening and the longitudinal length of the second opening are not equal to each other. The inspection mark according to claim 1, wherein the added value of the lateral length and the longitudinal length of the second opening is equal to the length of the 1-1st pattern or the length of the 1-2th pattern. The inspection mark according to Item 1 of the patent application, wherein one of the pair of first voltage application terminals is numbered 1, and each of the other voltage application terminals is numbered counterclockwise based on the number 1 2, 3 and 4, the length of the 1-1st pattern and the length of the 1-2th pattern are each a+b, and the length of the portion of the second opening parallel to the 1-1st pattern is a, The length of the portion of the second opening perpendicular to the 1-1st pattern is b, and the resistance value between the voltage application terminals 1 and 2 is R ₁₂ , and the resistance value between the voltage application terminals 2 and 3 is R ₂₃ The resistance value between the voltage application terminals 3 and 4 is R ₃₄ , the resistance value between the voltage application terminals 4 and 1 is R ₄₁ , the resistance value between the voltage application terminals 1 and 3 is R _{13 ,} and the voltage application terminal 2 When the resistance value between 4 and 4 is R ₂₄ , an eccentricity x and an eccentricity y are respectively expressed by the following equation: The eccentricity x is a degree indicating that the intersection of the 1-1st pattern and the 1-2th pattern is offset from the center of the second opening in a direction parallel to one of the 1-1st patterns, the eccentric amount The y represents the extent to which the intersection of the 1-1st pattern and the 1-2th pattern is offset from the center of the second opening in a direction perpendicular to one of the 1-1st patterns. A printed circuit board comprising a substrate unit area and a blank area surrounding the substrate unit area, the printed circuit board comprising: an inspection mark, comprising a plurality of voltage application terminals, including a pair of first voltage application terminals and a pair of second voltage application terminals, the pair of first voltage application terminals being separated from each other and facing each other in a first direction, the pair of second voltage application terminals being separated from each other and opposed to each other in a second direction, the second direction Vertically perpendicular to the first direction; a first pattern comprising a 1-1st pattern and a 1-2th pattern, the first pattern connecting the pair of first voltage application terminals and the pair of second voltage application terminals; a second pattern having an extended shape, the second patterns having ends connected to one or both sides of the 1-1st pattern and the 1-2th pattern; a plurality of voltage measuring terminals, Connecting to the other end of the second patterns; a solder resist layer having a first opening and a second opening, the first opening exposing the voltage applying terminals and the voltage measuring terminals, the first two Department of mouth exposed The first pattern; and a surface treatment layer formed on the voltage application terminals, the voltage measurement terminals, and the first pattern exposed by the first opening and the second opening, wherein the first pattern The 1-1st pattern and the 1-2th pattern of a pattern intersect each other, and the second opening exposes an intersection of the first pattern. The printed circuit board of claim 8, wherein the ends of the second patterns connected to the 1-1st pattern and the 1-2th pattern are adjacent to the corresponding voltage application terminal. The printed circuit board of claim 8, wherein the surface treatment layer is made of nickel (Ni) and gold (Au). The printed circuit board of claim 8, wherein the 1-1st pattern has the same length as the 1-2th pattern. The printed circuit board of claim 8, wherein the lateral length of the second opening and the longitudinal length of the second opening are not equal to each other. The printed circuit board according to claim 8, wherein the added value of the lateral length and the longitudinal length of the second opening is equal to the length of the 1-1st pattern or the length of the 1-2th pattern. The printed circuit board of claim 8, wherein one of the pair of first voltage application terminals is numbered 1, and each of the other voltage application terminals is numbered counterclockwise based on the number one. 2, 3 and 4, the length of the 1-1st pattern and the length of the 1-2th pattern are each a+b, and the length of the portion of the second opening parallel to the 1-1st pattern is a, The length of the portion of the second opening perpendicular to the 1-1st pattern is b, and the resistance value between the voltage application terminals 1 and 2 is R ₁₂ , and the resistance value between the voltage application terminals 2 and 3 is R. ₂₃ , the resistance value between the voltage application terminals 3 and 4 is R ₃₄ , the resistance value between the voltage application terminals 4 and 1 is R ₄₁ , the resistance value between the voltage application terminals 1 and 3 is R ₁₃ and the voltage application terminal When the resistance value between 2 and 4 is R ₂₄ , an eccentricity x and an eccentricity y are respectively expressed by the following equation: The eccentricity x is a degree indicating that the intersection of the 1-1st pattern and the 1-2th pattern is offset from the center of the second opening in a direction parallel to one of the 1-1st patterns, the eccentric amount The y represents the extent to which the intersection of the 1-1st pattern and the 1-2th pattern is offset from the center of the second opening in a direction perpendicular to one of the 1-1st patterns. The printed circuit board of claim 8, wherein the blank area comprises a long blank area, the long blank area is located in a plurality of strips, the strips comprise a plurality of substrate units, or The blank area includes a flat blank area, and the flat blank area is located in a flat plate, and the long strips are arranged in the flat plate.