JP2002064297A - Substrate aligning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate aligning device where a work load accompanying visual operation is reduced by preventing variation in positioning precision among operators, which occurs when visually aligning with a naked eye or through a microscope. SOLUTION: A probe 3 comprises a reference measuring piece 31 and a plurality of resistance measuring pieces a32-d35, and judges alignment state of a substrate 1 based on an electric resistance value by measuring the electric resistance value of a reference original-point mark 2 provided at the substrate 1. Based on presence of continuity between the reference measuring piece 31 and the resistance measuring pieces a32-d35, moving direction and moving amount of a stage 13 on which the substrate 1 is mounted are controlled by a stage driving/controlling part 11 for correcting position of the substrate 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for aligning a board, and more particularly, to positioning and setting a board at a predetermined position when mounting a component on a printed wiring board or inspecting a mounting board. The present invention relates to an apparatus for aligning a substrate.

[0002]

2. Description of the Related Art Conventionally, in a mounter apparatus for mounting an article on a printed wiring board or an apparatus for inspecting a mounting board, an article is mounted at a correct predetermined position or probing is performed at a predetermined position. For this purpose, the alignment between the reference origin of the mounting device and the inspection device and the origin of the substrate is adjusted.

A conventional substrate positioning device will be described with reference to the drawings.

FIG. 4A is a schematic configuration diagram showing a conventional substrate positioning apparatus 100, and FIG.
FIG. 3 is an enlarged view showing a middle substrate origin mark 106.

Referring to FIGS. 4 (a) and 4 (b), a conventional substrate alignment apparatus 100 includes a substrate origin mark 1
06, a stage 102 on which the substrate is mounted and movable in three axial directions, a stage driving unit 103 that drives the stage 102, and a probe 104 that is arranged to face the substrate 101 and has a probe 105. And a microscope 107 for enlarging and viewing the substrate origin mark 106 and the tip of the probe 104.

The substrate positioning apparatus 100 configured as described above performs a positioning operation of the substrate 101 as follows.

A substrate 101 is mounted at a predetermined position on a stage 102, and a substrate origin mark 10 indicating the origin of the substrate 101 is provided.
Probe 10 indicating the center of 6 and the origin serving as a reference on the device side
4 so that the tip of the tracing stylus 105 coincides with the naked eye or visually under the microscope 107.
While the stage 102 is moved by the operation 3, the positioning of the substrate 101 with respect to the probe 104 is adjusted.

[0008] Such a substrate positioning apparatus 100
However, since the positioning of the substrate 101 is performed by the naked eye or visually under the microscope 107, there is a disadvantage that the positioning accuracy is changed and unstable due to the individual difference of an operator who performs the positioning of the substrate 101.

[0009] Further, since the operator performs visual work with the naked eye or under the microscope 107, there is a disadvantage that a work load is generated.

[0010]

As described above,
Since the conventional substrate alignment device performs the alignment of the substrate with the naked eye or visually under a microscope, there is a problem that the positioning accuracy changes and is not stable due to individual differences of an operator who performs the alignment of the substrate. is there.

[0011] Further, since the worker performs visual work with the naked eye or under a microscope, there is a problem that a work load is generated.

An object of the present invention is to measure the electric resistance value of a substrate origin mark provided on a substrate by using a reference probe and a plurality of resistance probes constituting a probe, so that the position of the substrate is adjusted. Can be determined by the electric resistance value, and based on the electric resistance value between the reference measuring element and the plurality of resistance measuring elements, the stage on which the substrate is mounted can be moved to perform the alignment of the substrate. It is an object of the present invention to provide a substrate positioning apparatus that prevents variations in positioning accuracy due to individual differences between workers, which occurs when performing positioning with the naked eye or under a microscope, and reduces the work load involved in visual work.

[0013]

According to the present invention, there is provided an apparatus for aligning a substrate, comprising: a substrate provided with a conductive substrate origin mark; a stage on which the substrate is mounted and movable in three axial directions; and a stage for driving the stage. A drive unit, a stage drive control unit that controls the operation of the stage drive unit, a probe including a reference probe and a plurality of resistance probes that contact the substrate when measuring the electrical resistance of the substrate origin mark, and a reference probe and a plurality of the probes. A contact switching unit that switches between the resistance measurement element and the resistance measurement unit that measures the electrical resistance of the substrate origin mark by a probe through the contact switching unit, and a resistance measurement value that is measured by the resistance measurement unit And a resistance value storage unit for storing

[0014] The probe is characterized in that a plurality of resistance measuring elements are arranged at equal intervals on the same circumference around the reference measuring element.

[0015] The probe has three or more resistance measuring elements.

The substrate origin mark is a circle or a square.

The circumferential diameter on which a plurality of resistance measuring elements are arranged is:
It is characterized by being smaller than the substrate origin mark.

The vicinity of the outside of the substrate origin mark is characterized by having electrical insulation.

The stage drive control section is characterized in that it has means for controlling the movement operation of the stage drive section in which all the electrical resistances between the reference probe and the plurality of resistance probes become conductive.

The stage drive control unit, when any one of the electrical resistances between the reference tracing stylus and the plurality of resistance tracing styluses is in a non-conducting state, controls the substrate with respect to the probe by a combination of the reference stylus and the non-conducting resistance tracing stylus. And a means for controlling the stage drive unit to move the stage to correct the position shift.

The displacement correction value is set in advance to a difference between the radius of the substrate origin mark and the radius of the circumference on which the plurality of resistance probes are arranged.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a substrate positioning apparatus according to the present invention will be described with reference to the drawings.

FIG. 1 is a schematic block diagram showing a substrate positioning apparatus according to the present invention.

Referring to FIG. 1, a substrate positioning apparatus 20 includes a substrate 1 provided with a conductive circular substrate origin mark 2, a stage 13 on which the substrate 1 is mounted and which is movable in three axial directions, Stage drive unit 12 that drives stage 13
A stage drive control section 11 for controlling the operation of the stage drive section 12; a reference tracing stylus 31 and a resistance tracing stylus a32, a resistance tracing stylus b33, and a resistance tracing stylus which come into contact with the substrate 1 when measuring the electric resistance of the substrate origin mark 2. c34, resistance measuring element d35
A contact switching unit 9 for switching between a reference probe 31 and a resistance probe a32, a resistance probe b33, a resistance probe c34, and a resistance probe d35;
It comprises a resistance measuring section 10 for measuring the electric resistance of the substrate origin mark 2 by the probe 3 via the contact switching section 9, and a resistance value storing section 14 for storing the resistance measured value measured by the resistance measuring section 10. ing.

The probe 3 has four resistance measuring elements a3 at equal intervals on the same circumference around the reference measuring element 31.
2. A resistance measuring element b33, a resistance measuring element c34, and a resistance measuring element d35 are arranged. A circumference of the four resistance measuring elements a32, a resistance measuring element b33, a resistance measuring element c34, and a resistance measuring element d35 is arranged. , Smaller than the circle diameter of the substrate origin mark 2,
The vicinity of the substrate 1 outside the substrate origin mark 2 is configured to be electrically insulating.

Next, the operation of the substrate positioning apparatus 20 configured as described above will be described with reference to the drawings.

FIG. 2 is a flowchart showing the operation of the substrate positioning apparatus 20, and FIGS. 3 (a) to 3 (i)
It is a figure which shows the relative positional relationship of the board | substrate origin mark 2 with respect to the reference measuring element 31, the resistance measuring element a32, the resistance measuring element b33, the resistance measuring element c34, and the resistance measuring element d35 of the probe 3. In FIG. 3, for convenience, the reference probe 31, the resistance probe a 32, the resistance probe b 33, and the resistance probe c
Reference numeral 34 denotes a resistance measuring element d35.

Here, the reference tracing stylus 31 and four reference tracing styluses 31 are taken into consideration in consideration of the dispersion of the substrate 1 and the probe 3, the positioning error of the stage 13, the setting error of the substrate 1 on the stage 13, and the like. Any two of the resistance tracing stylus a32, the resistance tracing stylus b33, the resistance tracing stylus c34, and the resistance tracing stylus d35 must be set to the circle diameter of the substrate origin mark 2 and 4 so as to be always located within the substrate origin mark 2. The relative magnitude relation with the circumference diameter on which the resistance measuring elements a32 to d35 are arranged is determined.

Therefore, when the substrate 1 is set on the stage 13 and the stage 13 is moved to a theoretical initial setting position where the center of the probe 3 and the center of the substrate origin mark 2 coincide, at least two reference tracing stylus 31 and The resistance probe of
It is present in the substrate origin mark 2 and is in a conductive state.

Referring to FIGS. 1 to 3, the substrate 1 is set at a predetermined position on the stage 13 (S1), and the stage 1 is set at an initial setting position where the center of the probe 3 and the center of the substrate origin mark 2 theoretically coincide with each other. The stage 13 is moved in the X and Y directions based on the position information stored in the drive controller 11 (S2), and then moved in the Z direction to bring the substrate 1 into contact with the probe 3 (S3).

Next, the electrical resistance between the reference probe 31 and the resistance probe a32 to the resistance probe d35 is measured by the resistance measurement section 10 via the contact switching section 9 (S4). The value is stored and held in the resistance value storage unit 14 (S5).

In the stage drive control section 11, the reference tracing stylus 31 and the resistance tracing stylus a3 are obtained from the respective resistance values in the resistance value storing section 14.
It is determined whether or not there is electrical continuity between the second and the resistance tracing stylus d35 (S6). If there is all electrical continuity, the alignment of the substrate 1 is completed (S7). It is determined whether or not there is only one resistance measuring element at one position (S8). If not only one position, but also two non-conducting points, the probe 3 is determined based on a combination of the two non-conducting resistance measuring elements. Then, the displacement direction and displacement correction value of the substrate 1 with respect to are determined, and the moving direction and the moving amount of the stage 13 are determined (S9).

After that, the stage 13 is moved in the Z direction so that the substrate 1 and the probe 3 are brought into a non-contact state, and the stage 13 is moved in the X direction and the Y direction according to the values determined by the stage drive control unit 11. After moving the stage 13 in the X and Y directions (S10), the process returns to S3.
The operation after S3 described above is repeated.

In step S8, if there is only one non-conductive resistance probe, the direction of displacement of the substrate 1 with respect to the probe 3 and the displacement correction value are determined from the non-conductive resistance probe. Then, the moving direction and the moving amount of the stage 13 are determined (S11).

Next, the stage 1 is moved in the Z direction to bring the substrate 1 and the probe 3 out of contact with each other, and the stage 13 is moved in the X direction or the Y direction according to the value determined by the stage drive control section 11. After the stage 13 is moved in the X or Y direction by the drive unit 12 (S12), the process returns to S3, and the operation after S3 is repeated.

Here, the direction of the displacement of the substrate 1 with respect to the probe 3 in S9 and S11 and the displacement correction value are determined by the stage drive control unit 11, and the stage 13
FIG. 3 shows a specific example of determining the moving direction and the moving amount of
This will be described in detail with reference to FIG.

When the stage 13 is moved to a theoretical initial setting position where the center of the probe 3 and the center of the substrate origin mark 2 coincide with each other, when the stage 13 is in the state shown in FIG. Since all of the resistance measurement element a32 to the resistance measurement element d35 exist, the reference measurement element 31 and the resistance measurement element a32 are provided.
3 (b) to 3 (e) show any one of the four resistance measurement elements a32 to d35. FIG. 3 (f) to FIG.
(I) shows four resistance measuring elements a32 to d35.
2 shows a state where any two of them are present outside the substrate origin mark 2.

First, a case where any one of the four resistance measuring elements a32 to d35 exists outside the substrate origin mark 2 will be described with reference to FIGS. 3 (b) to 3 (e). Will be explained.

The stage drive control section 11 includes the reference tracing stylus 3
When there is no electrical connection between 1 and the resistance tracing stylus d35, the stage 13 is moved by a preset correction value in the −Y direction,
When the reference tracing stylus 31 and the resistance tracing stylus a32 are non-conductive, it is moved by a preset correction value in the Y direction, and when the reference tracing stylus 31 and the resistance tracing stylus b33 are non-conductive,
The stage 13 is moved by a preset correction value in the −X direction, and when the reference tracing stylus 31 and the resistance tracing stylus c34 are non-conductive, the stage 13 is moved by the preset correction value in the X direction. Perform control.

Next, referring to FIGS. 3F to 3I, a case where any two of the four resistance measuring elements a32 to d35 exist outside the substrate origin mark 2 will be described. I will explain.

The stage drive control section 11 includes the reference tracing stylus 3
When the resistance measurement element b33 and the reference measurement element 31 and the resistance measurement element d35 are non-conductive, the stage 13 is moved by a preset correction value in the -X direction and the -Y direction, and When the conduction between the tracing stylus 31 and the resistance tracing stylus a32 and between the reference tracing stylus 31 and the resistance tracing stylus b33 are non-conductive, the stage 13 is moved by a preset correction value in the -X direction and the Y direction, Between the reference tracing stylus 31 and the resistance tracing stylus a32 and between the reference tracing stylus 31 and the resistance tracing stylus c3
4, the stage 13 is moved by a preset correction value in the X direction and the Y direction, and the stage 13 is moved between the reference tracing stylus 31 and the resistance tracing stylus c34 and the reference tracing stylus 31.
When there is no electrical connection between the resistance measuring element d35 and the resistance measuring element d35, control is performed to move the stage 13 by a preset correction value in the X direction and the −Y direction.

As an example, the correction values are the X and Y values of the radius of the substrate origin mark 2 and the four resistance measuring elements a32.
To the difference between the radius of the circumference where the resistance tracing stylus d35 is disposed (the correction value set in advance is the same as the correction value in the X direction and the correction value in the Y direction).

The stage drive control unit 11 operates the stage drive unit 12 to move the stage 13 by a correction value in a predetermined direction to perform the positioning of the substrate 1. And again measure the respective electric resistance values between the reference tracing stylus 31 and the resistance tracing stylus a32 to the resistance tracing stylus d35 in the resistance measuring unit 10, and the reference tracing stylus 31 and the resistance tracing stylus a32 to the resistance tracing stylus are measured again. When all of the continuities are present between the reference tracing stylus d35 and the resistance tracing stylus a32 to the resistance tracing stylus d35, the alignment of the substrate 1 is completed. The above-described operation of performing the position correction and performing the resistance measurement is repeated, and finally, the reference tracing stylus 31 and all the resistance tracing styluses a32 to d
The above-described operation is repeated until the connection between the terminal 35 and the terminal becomes conductive.

[0044]

As described above, the substrate positioning apparatus of the present invention uses the reference probe and the plurality of resistance probes mounted on the probe to mark the origin of the substrate provided on the substrate.
By measuring the electrical resistance of the probe, the alignment state of the substrate with respect to the probe can be determined based on the electrical resistance. Based on the electrical resistance between the reference probe and the plurality of resistance probes, the step on which the substrate is mounted is determined. -The position of the board can be adjusted by moving the board to correct the position of the board, and the positioning accuracy due to the individual difference of the operator that occurs when the board is aligned with the naked eye or visually under a microscope. There is an effect that variation can be prevented, and a work load associated with visual work can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic block diagram showing a substrate positioning apparatus of the present invention.

FIG. 2 is a flowchart showing the operation of the substrate positioning apparatus of the present invention.

FIGS. 3A to 3I are diagrams showing a relative positional relationship of a substrate origin mark with respect to a probe.

FIG. 4A is a schematic configuration diagram showing a conventional substrate alignment device, and FIG. 4B is an enlarged view showing a substrate origin mark in FIG. 4A.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 101 Substrate 2, 106 Substrate origin mark 3, 104 Probe 9 Contact switching part 10 Resistance measurement part 11 Stage drive control part 12, 103 Stage drive part 13, 102 Stage 14 Resistance storage part 20, 100 Substrate alignment Apparatus 31 Reference measuring element 32 Resistance measuring element a 33 Resistance measuring element b 34 Resistance measuring element c 35 Resistance measuring element d 107 Microscope

Claims (9)

[Claims] 1. A substrate provided with a conductive substrate origin mark, a stage on which the substrate is mounted and movable in three axial directions, a stage driver for driving the stage, and operation of the stage driver. A stage drive control unit,
A probe including a reference probe and a plurality of resistance probes that contact the substrate when measuring the electrical resistance of the substrate origin mark, and a contact switch for switching between the reference probe and the plurality of resistance probes. A resistance measuring unit configured to measure an electric resistance of the substrate origin mark by the probe via the contact switching unit; and a resistance storage unit configured to store a resistance measured value measured by the resistance measuring unit. A substrate alignment device, comprising: 2. The substrate alignment apparatus according to claim 1, wherein the probe has a plurality of resistance measuring elements arranged at equal intervals on the same circumference around the reference measuring element. 3. The substrate positioning apparatus according to claim 1, wherein the probe has three or more resistance measuring elements. 4. The apparatus according to claim 1, wherein the substrate origin mark is a circle or a square. 5. The substrate positioning apparatus according to claim 2, wherein a circumference diameter on which the plurality of resistance measuring elements are arranged is smaller than the substrate origin mark. . 6. The substrate according to claim 1, wherein an area near the outside of the substrate origin mark has electrical insulation.
The substrate alignment apparatus according to any one of claims 1 to 6. 7. The stage drive control unit includes means for controlling a movement operation of the stage drive unit in which all electric resistances between the reference tracing stylus and the plurality of resistance tracing stalls are in a conductive state. The substrate positioning apparatus according to claim 1, wherein: 8. The resistance measurement device according to claim 1, wherein the stage drive control unit is configured to, when any one of the electrical resistances between the reference tracing stylus and the plurality of resistance tracing styluses is in a non-conduction state, be in a non-conduction state with the reference tracing stylus. Means for determining a direction of displacement of the substrate with respect to the probe and a displacement correction value with respect to the probe, and means for controlling the stage driving unit to move the stage to correct the displacement. The substrate alignment apparatus according to claim 1 or 7, further comprising: 9. The apparatus according to claim 8, wherein the displacement correction value is set in advance to a difference between a radius of the substrate origin mark and a radius of a circumference on which the plurality of resistance measuring elements are arranged. An apparatus for aligning a substrate as described in the above.