JP2022015110A - How to manufacture a printed circuit board and how to use a printed circuit board - Google Patents

Abstract

To provide methods of manufacturing and using a printed circuit board, capable of suppressing an increase in manufacturing cost.SOLUTION: A method of manufacturing a printed circuit board of the present invention includes: a solder resist step of exposing a first wiring pattern formed on an insulating substrate in the air and covering a second wiring pattern with a solder resist; a step of applying surface treatment to the first wiring pattern; and a solder resist removal step of removing at least part of a portion of the solder resist, the portion covering the second wiring pattern, thereby to expose the second wiring pattern in the air and accelerating the deterioration of the second wiring pattern as compared to the first wiring pattern.SELECTED DRAWING: Figure 1

Description

The present invention relates to a method for manufacturing a printed circuit board (Printed Circuit Board, a substrate on which mounting is completed) and a method for using the printed circuit board.

The wiring pattern formed on the printed circuit board deteriorates due to corrosion or electrolytic corrosion, which causes a failure of the electric device / electronic device to which the printed circuit board is applied. In order to prevent such a failure, a method for detecting deterioration of the wiring pattern has been proposed.

Patent Document 1 states, "In a control board provided with a printed circuit board, a constant current is applied to a wiring having a width narrower than other wiring of the printed circuit board and a wiring having the narrow width through a resistor. The power supply to be passed and the voltage of the narrow width wiring are detected at a certain cycle, and processing is performed to issue an abnormal signal when a predetermined condition is satisfied. A control comprising means for detecting an abnormality in the narrow-width wiring, wherein the narrow-width wiring is provided near a fan in the control panel, near an opening, or near a high-temperature portion. "Board" is described.

Japanese Patent No. 3952660

However, since the width of the conductor portion for deterioration detection is narrowed with respect to the width of the conductor portion that functions for the original purpose, the manufacturing difficulty increases, the yield decreases, and as a result, the manufacturing cost increases. Inevitable. Therefore, it is desired to suppress an increase in manufacturing cost.

One aspect of the present disclosure is a solder resist step of exposing the first wiring pattern formed on the insulating substrate to the air and covering the second wiring pattern with a solder resist, and a step of applying a surface treatment to the first wiring pattern. By removing at least a part of the solder resist that covers the second wiring pattern, the second wiring pattern is exposed in the air, and the second wiring pattern is compared with the first wiring pattern. 2 It is a method for manufacturing a printed circuit board including a solder resist removing step for accelerating deterioration of a wiring pattern.

One aspect of the present disclosure is at least one of the solder resists covering the first wiring pattern and the plurality of second wiring patterns formed on the insulating substrate and surface-treated, which covers the second wiring pattern. By removing a part of the second wiring pattern, the second wiring pattern is exposed in the air, and the second wiring pattern is used as a printed circuit board in which deterioration of the second wiring pattern is promoted as compared with the first wiring pattern. By removing at least a part of the solder resist in the printed circuit board after use that covers the second wiring pattern of another one that is covered with the solder resist. , Another one of the second wiring patterns is exposed in the air and can be reused as a printed circuit board in which deterioration of the other one of the second wiring patterns is promoted as compared with the first wiring pattern. Maintenance steps to be performed and how to use the printed circuit board including.

According to one aspect of the present disclosure, an increase in manufacturing cost can be suppressed.

It is a flowchart explaining the manufacturing method of the printed circuit board which concerns on 1st Embodiment. It is the schematic of the printed circuit board in the solder resist process shown in FIG. 1. It is a schematic diagram of the printed circuit board in the substrate surface treatment process shown in FIG. 1. It is a schematic diagram of the printed circuit board in the solder resist removing process shown in FIG. 1. It is a schematic diagram of another printed circuit board in the solder resist removing process shown in FIG. 1. It is a flowchart explaining the use method of the printed circuit board which concerns on 2nd Embodiment. It is a schematic diagram of the printed circuit board in the manufacturing process shown in FIG. It is a schematic diagram of the printed circuit board in the maintenance process shown in FIG.

Hereinafter, a method of manufacturing the printed circuit board and a method of using the printed circuit board according to the embodiment will be described with reference to the drawings.

[First Embodiment]
First, a method of manufacturing the printed circuit board 1 according to the first embodiment will be described with reference to FIGS. 1 to 5. FIG. 1 is a flowchart illustrating a method of manufacturing the printed circuit board 1. FIG. 2 is a schematic view of the printed circuit board 1 in the solder resist step S11. FIG. 3 is a schematic view of the printed circuit board in the substrate surface treatment step S12 shown in FIG. FIG. 4 is a schematic view of the printed circuit board 1 in the solder resist removing step S13. FIG. 5 is a schematic view of another printed circuit board 1 in the solder resist removing step S13.

As shown in FIG. 1, the method for manufacturing a printed circuit board 1 (see FIGS. 2 to 4) includes a solder resist step S11, a substrate surface treatment step S12, and a solder resist removal step S13. As shown in FIGS. 2 to 4, the printed circuit board 1 manufactured by the manufacturing method shown in FIG. 1 has a first wiring pattern 11 and a second wiring pattern 12 formed on an insulating substrate 10, and is a machine tool. Applies to machines, robot controllers, etc.

In the solder resist step S11 shown in FIG. 1, as shown in FIG. 2, a part and a part of the first wiring pattern 11 formed on the insulating substrate 10 are exposed to the air, and the other part of the first wiring pattern 11 and the first wiring pattern 11 are exposed to the air. 2 This is a step of covering the wiring pattern 12 with the solder resist 13. In the drawings after FIG. 2 (excluding FIG. 6), the area covered by the solder resist 13 is provided with diagonal hatching that descends to the left.

The first wiring pattern 11 is formed of, for example, copper. The first wiring pattern 11 is usually a pattern for achieving the original function of the printed circuit board 1. The first wiring pattern 11 is one or a plurality of conductors having a first thickness within the range from the maximum thickness to the minimum thickness to be passed and a first width to be within the range from the maximum width to the minimum width to be passed. It is composed of a part 11A. The distance between the conductor portions 11A is the first distance within the range from the maximum distance to the minimum distance to be passed. The first exposed region 15 not covered by the solder resist 13 is provided for each conductor portion 11A.

The second wiring pattern 12 is formed of, for example, copper. The second wiring pattern 12 is a pattern for detecting deterioration, and is a pattern that is not directly related to the original function of the printed circuit board 1. The second wiring pattern 12 has one or more conductors having a second thickness within a range from a predetermined maximum thickness to a predetermined minimum thickness and a second width within a range from a predetermined maximum width to a predetermined minimum width. It is composed of a part 12A. The distance between the conductor portions 12A is a second distance within a range from a predetermined maximum distance to a predetermined minimum distance.

The second thickness of the conductor portion 12A is preferably the same as the first thickness of the conductor portion 11A. The second width of the conductor portion 12A is preferably the same as the first width of the conductor portion 11A. The second distance between the conductor portions 12A is preferably the same as the first distance between the conductor portions 11A. If any one or more of the thickness, width, and spacing of the conductor portion 11A and the conductor portion 12A is the same, the manufacturing becomes easy and the manufacturing cost becomes low. The conductor portion 11A and the conductor portion 12A may differ in any one or more of the thickness, width, and spacing.

As shown in FIG. 3, the substrate surface treatment step S12 shown in FIG. 1 is a step of applying a surface treatment to the first wiring pattern 11 (in the first exposed region 15) exposed in the air. .. The surface-treated region 16 in the first wiring pattern 11 is provided with diagonal hatching that descends to the right. Since the second wiring pattern 12 is covered with the solder resist 13, no surface treatment is applied to the second wiring pattern 12.

As shown in FIG. 4, the solder resist removing step S13 shown in FIG. 1 is at least a portion of the solder resist 13 covering the first wiring pattern 11 and the second wiring pattern 12 that covers the second wiring pattern 12. This is a step of exposing (exposing) the second wiring pattern 12 to the air (outside) by removing a part of the wiring pattern 12 to accelerate the deterioration of the second wiring pattern 12 as compared with the first wiring pattern 11. The solder resist 13 is removed by laser irradiation, glass fiber polishing, or the like. The region from which the solder resist 13 has been removed becomes the second exposed region 14.

As shown in FIG. 5, the second exposed region 14 may be formed from an aggregate of a plurality of strip-shaped regions 14A.

The printed circuit board 1 is completed by going through the solder resist step S11, the substrate surface treatment step S12, and the solder resist removing step S13.

As described above, the method for manufacturing the printed circuit board 1 includes a solder resist step S11 in which the first wiring pattern 11 formed on the insulating substrate 10 is exposed in the air and the second wiring pattern 12 is covered with the solder resist 13. 1 The second wiring pattern 12 is taken into consideration by removing at least a part of the portion of the solder resist 13 covering the second wiring pattern 12 and the substrate surface treatment step S12 in which the surface treatment is applied to the wiring pattern 11. It includes a solder resist removing step S13 which is exposed and accelerates deterioration of the second wiring pattern 12 as compared with the first wiring pattern 11.

According to such a manufacturing method of the printed circuit board 1, by using the second wiring pattern 12 in the manufactured printed circuit board 1 as a deterioration detection pattern, the wiring structure can be simplified and the increase in manufacturing cost can be suppressed. be able to. It is not essential to change the width, thickness, etc. of the second wiring pattern 12 as compared with the first wiring pattern 11.

Since a laser is commonly used to engrave the manufacturing rod of the printed circuit board 1, the introduction barrier is low when the solder resist 13 is removed by irradiation with the laser. Further, the laser has a high energy absorption capacity for a resin such as a solder resist 13 or an insulating substrate 10, and is hardly absorbed by a metal such as copper. Therefore, when the second wiring pattern 12 is made of a metal such as copper, if the solder resist 13 is removed by irradiation with a laser, the second wiring pattern 12 can be effectively exposed.

As shown in FIG. 5, when the second exposed region 14 is formed from an aggregate of a plurality of strip-shaped regions 14A, the cutting fluid that corrodes the second wiring pattern 12 is likely to be held in the strip-shaped region 14A due to surface tension. , The disconnection life of the second wiring pattern 12 can be stabilized.

[Second Embodiment]
Next, a method of using the printed circuit board 2 according to the second embodiment will be described with reference to FIGS. 6 to 8. The description of the printed circuit board 1 according to the first embodiment is appropriately applied or incorporated to the description of the printed circuit board 2 according to the second embodiment. The "1" in the tens and hundreds digits of the code in the printed circuit board 1 according to the first embodiment is replaced with "2" in the printed circuit board 2 according to the second embodiment. FIG. 6 is a flowchart illustrating how to use the printed circuit board 2. FIG. 7 is a schematic view of the printed circuit board 2 in the manufacturing process S21. FIG. 8 is a schematic view of the printed circuit board 2 in the maintenance step S22.

As shown in FIG. 6, the method of using the printed circuit board 2 (see FIGS. 7 and 8) includes a manufacturing process S21 and a maintenance process S22. The printed circuit board 2 manufactured or maintained by the method of use shown in FIG. 6 has a first wiring pattern 21 and a plurality of second wiring patterns 22 formed on an insulating substrate 20 as shown in FIGS. 7 and 8. It is applied to machine tools, robot controllers, etc.

As shown in FIG. 7, the manufacturing process S21 shown in FIG. 6 is one of the first wiring pattern 21 formed on the insulating substrate 20 and surface-treated and the solder resist 23 covering the plurality of second wiring patterns 22. By removing at least a part of the portion covering the two second wiring patterns 22 (also referred to as the second wiring pattern 221), one second wiring pattern 22 (221) is exposed to the air and the first This is a step of enabling the printed circuit board 2 to be used as a printed circuit board 2 in which deterioration of one second wiring pattern 22 (221) is promoted as compared with the wiring pattern 21.

The first wiring pattern 21 is formed of, for example, copper. The first wiring pattern 21 has one or a plurality of first thicknesses that fall within the range from the maximum thickness to the minimum thickness that is accepted, and the first width that falls within the range from the maximum width to the minimum width that is accepted. It is composed of a conductor portion 21A. The distance between the conductor portions 21A is the first distance within the range from the maximum distance to the minimum distance to be passed. The area 26 of the first wiring pattern 21 in the first exposed area 25 is surface-treated.

Each of the plurality of second wiring patterns 22 is formed of, for example, copper. Each of the plurality of second wiring patterns 22 has a second thickness within a range from a predetermined maximum thickness to a predetermined minimum thickness, and a second width within a range from a predetermined maximum width to a predetermined minimum width. It is composed of one or a plurality of conductor portions 22A. The distance between the conductor portions 22A is a second distance within a range from a predetermined maximum distance to a predetermined minimum distance.

The second thickness of the conductor portion 22A is preferably the same as the first thickness of the conductor portion 21A. The second width of the conductor portion 22A is preferably the same as the first width of the conductor portion 21A. The second distance between the conductor portions 22A is preferably the same as the first distance between the conductor portions 21A.

The solder resist 23 is removed by laser irradiation, glass fiber polishing, or the like. The region from which the solder resist 23 has been removed becomes a second exposed region 24 (also referred to as a second exposed region 241). Similar to the first embodiment, the second exposed region may be formed from an aggregate of a plurality of strip-shaped regions.

By going through the above manufacturing process S21, the printed circuit board 2 is completed. The completed printed circuit board 2 is shipped and used. The used printed circuit board 2 is collected and undergoes the maintenance step S22.

As shown in FIG. 8, the maintenance step S22 shown in FIG. 6 is another second wiring pattern 22 (second) of the solder resist 23 in the printed circuit board 2 after use, which is covered with the solder resist 23. A second exposed region 24 (also referred to as a second exposed region 242) is formed by removing at least a part of a portion covering the wiring pattern 222 (also referred to as a wiring pattern 222), and another second wiring pattern 22 (222) is formed. It is a step of exposing to the air and making it reusable as a printed circuit board 2 in which deterioration of another second wiring pattern 22 (222) is promoted as compared with the first wiring pattern 21. That is, a plurality of sets of another second wiring pattern 22 may be provided.

By going through the above maintenance step S22, the maintenance of the printed circuit board 2 is completed. The printed circuit board 2 whose maintenance has been completed is shipped again and used again. The maintenance step S22 can be repeated as long as the second wiring pattern 22 covered with the solder resist 23 remains.

As described above, the method of using the printed circuit board 2 is the second wiring of one of the first wiring pattern 21 formed on the insulating substrate 20 and surface-treated and the solder resist 23 covering the plurality of second wiring patterns 22. By removing at least a part of the portion covering the pattern 22 (221), one second wiring pattern 22 (221) is exposed in the air, and one second wiring pattern 22 (221) is exposed as compared with the first wiring pattern 21. 2 Of the solder resist 23 in the printed circuit board 2 after use, the manufacturing process S21 that enables the wiring pattern 22 (221) to be used as the printed circuit board 2 that has accelerated deterioration, and the solder resist 23 that is covered with the solder resist 23. By removing at least a part of the portion covering one of the second wiring patterns 22 (222), the other second wiring pattern 22 (222) is exposed to the air, and the first wiring pattern 21 and It includes a maintenance step S22 that makes it reusable as the printed circuit board 2 that has accelerated the deterioration of another second wiring pattern 22 (222) in comparison.

According to such a method of using the printed circuit board 2, the wiring structure can be obtained by using the second wiring pattern 22 (221) exposed in the air as a deterioration detection pattern in the manufactured printed circuit board 2. It becomes simple and the increase in manufacturing cost can be suppressed. Further, in the maintained printed circuit board 2, by using the second wiring pattern 22 (222) newly exposed in the air as a deterioration detection pattern, the wiring structure can be simplified and the increase in manufacturing cost can be suppressed. be able to. The description of the same effect as that of the first embodiment will be omitted.

The present invention is not limited to each of the above embodiments, and various modifications and modifications can be made.

1, 20 Printed circuit board 10, 20 Insulated circuit board 11,21 1st wiring pattern 11A, 21A Conductor part 12, 22 2nd wiring pattern 12A, 22A Conductor part 13,23 Solder resist S11 Solder resist process S12 Substrate surface treatment process S13 Solder resist removal process S21 Manufacturing process S22 Maintenance process

Claims (2)

A solder resist process in which the first wiring pattern formed on the insulating substrate is exposed in the air and the second wiring pattern is covered with a solder resist.
The process of applying surface treatment to the first wiring pattern and
By removing at least a part of the solder resist that covers the second wiring pattern, the second wiring pattern is exposed in the air, and the second wiring pattern is compared with the first wiring pattern. A method for manufacturing a printed circuit board, including a solder resist removing step that accelerates deterioration of a wiring pattern. By removing at least a part of one of the solder resists covering the first wiring pattern and the plurality of second wiring patterns formed on the insulating substrate and surface-treated, which covers the second wiring pattern. A manufacturing process in which one of the second wiring patterns is exposed in the air so that the second wiring pattern can be used as a printed circuit board in which deterioration of the second wiring pattern is promoted as compared with the first wiring pattern.
By removing at least a part of the solder resist in the printed circuit board after use that covers the second wiring pattern of another one covered with the solder resist, another one of the first. 2 Includes a maintenance step of exposing the wiring pattern to the air so that it can be reused as a printed circuit board that has accelerated deterioration of another one of the second wiring patterns as compared with the first wiring pattern. How to use the printed circuit board.

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