TWI598889B - Conductive particles with insulating particles, conductive material, and connection structure - Google Patents
Conductive particles with insulating particles, conductive material, and connection structure Download PDFInfo
- Publication number
- TWI598889B TWI598889B TW102143594A TW102143594A TWI598889B TW I598889 B TWI598889 B TW I598889B TW 102143594 A TW102143594 A TW 102143594A TW 102143594 A TW102143594 A TW 102143594A TW I598889 B TWI598889 B TW I598889B
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- Taiwan
- Prior art keywords
- particles
- conductive
- insulating
- insulating particles
- conductive particles
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- 150000004678 hydrides Chemical class 0.000 description 1
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- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
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- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
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- 229920001568 phenolic resin Polymers 0.000 description 1
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- 239000011574 phosphorus Substances 0.000 description 1
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- 229920006122 polyamide resin Polymers 0.000 description 1
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- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
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- 229920002530 polyetherether ketone Polymers 0.000 description 1
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- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
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- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- GRPURDFRFHUDSP-UHFFFAOYSA-N tris(prop-2-enyl) benzene-1,2,4-tricarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C(C(=O)OCC=C)=C1 GRPURDFRFHUDSP-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012259824 | 2012-11-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201423766A TW201423766A (zh) | 2014-06-16 |
| TWI598889B true TWI598889B (zh) | 2017-09-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102143594A TWI598889B (zh) | 2012-11-28 | 2013-11-28 | Conductive particles with insulating particles, conductive material, and connection structure |
Country Status (5)
| Country | Link |
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| JP (1) | JP5530571B1 (ja) |
| KR (1) | KR102095291B1 (ja) |
| CN (1) | CN104584141B (ja) |
| TW (1) | TWI598889B (ja) |
| WO (1) | WO2014084173A1 (ja) |
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| JP6067149B2 (ja) | 2014-12-04 | 2017-01-25 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
| KR102529562B1 (ko) * | 2015-05-20 | 2023-05-09 | 세키스이가가쿠 고교가부시키가이샤 | 도전성 점착재 및 도전성 기재 부착 도전성 점착재 |
| KR20180029945A (ko) * | 2015-07-14 | 2018-03-21 | 세키스이가가쿠 고교가부시키가이샤 | 도전 재료 및 접속 구조체 |
| WO2017051842A1 (ja) * | 2015-09-24 | 2017-03-30 | 積水化学工業株式会社 | 導電性粒子、導電材料、および接続構造体 |
| CN111971757B (zh) * | 2018-04-04 | 2023-03-14 | 积水化学工业株式会社 | 导电性粒子、其制造方法、导电材料及连接结构体 |
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| JP3103956B2 (ja) * | 1993-06-03 | 2000-10-30 | ソニーケミカル株式会社 | 異方性導電膜 |
| CN100437838C (zh) * | 2003-07-07 | 2008-11-26 | 积水化学工业株式会社 | 包覆导电性粒子、各向异性导电材料以及导电连接结构体 |
| US20100025089A1 (en) * | 2004-01-07 | 2010-02-04 | Jun Taketatsu | Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof |
| JP4380327B2 (ja) * | 2004-01-07 | 2009-12-09 | 日立化成工業株式会社 | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 |
| JP4993880B2 (ja) * | 2005-07-06 | 2012-08-08 | 旭化成イーマテリアルズ株式会社 | 異方導電性接着シート及び微細接続構造体 |
| KR101538820B1 (ko) * | 2008-03-21 | 2015-07-22 | 세키스이가가쿠 고교가부시키가이샤 | 경화성 조성물, 이방성 도전 재료 및 접속 구조체 |
| JP4386146B2 (ja) * | 2009-05-08 | 2009-12-16 | 日立化成工業株式会社 | フィルム状回路接続材料、回路部材の接続構造及びその製造方法 |
| JP4386145B2 (ja) * | 2009-05-08 | 2009-12-16 | 日立化成工業株式会社 | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 |
| JP4993230B2 (ja) * | 2009-09-08 | 2012-08-08 | 積水化学工業株式会社 | 絶縁粒子付き導電性粒子、絶縁粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体 |
| JP2011105861A (ja) * | 2009-11-18 | 2011-06-02 | Hitachi Chem Co Ltd | 回路接続材料及び接続構造体 |
| WO2012137335A1 (ja) * | 2011-04-07 | 2012-10-11 | 日立化成工業株式会社 | 回路接続材料及びその使用並びに接続構造体及びその製造方法 |
| JP5698080B2 (ja) * | 2011-06-28 | 2015-04-08 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
-
2013
- 2013-11-25 JP JP2013555500A patent/JP5530571B1/ja active Active
- 2013-11-25 WO PCT/JP2013/081661 patent/WO2014084173A1/ja not_active Ceased
- 2013-11-25 KR KR1020157001454A patent/KR102095291B1/ko active Active
- 2013-11-25 CN CN201380044989.XA patent/CN104584141B/zh active Active
- 2013-11-28 TW TW102143594A patent/TWI598889B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150090018A (ko) | 2015-08-05 |
| CN104584141B (zh) | 2017-04-12 |
| TW201423766A (zh) | 2014-06-16 |
| JP5530571B1 (ja) | 2014-06-25 |
| KR102095291B1 (ko) | 2020-03-31 |
| WO2014084173A1 (ja) | 2014-06-05 |
| CN104584141A (zh) | 2015-04-29 |
| JPWO2014084173A1 (ja) | 2017-01-05 |
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