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TWI563626B - Manufacturing method of electronic packaging device - Google Patents

Manufacturing method of electronic packaging device

Info

Publication number
TWI563626B
TWI563626B TW103115162A TW103115162A TWI563626B TW I563626 B TWI563626 B TW I563626B TW 103115162 A TW103115162 A TW 103115162A TW 103115162 A TW103115162 A TW 103115162A TW I563626 B TWI563626 B TW I563626B
Authority
TW
Taiwan
Prior art keywords
manufacturing
packaging device
electronic packaging
electronic
packaging
Prior art date
Application number
TW103115162A
Other languages
Chinese (zh)
Other versions
TW201541601A (en
Inventor
Chi Min Lin
Steven Siu-Tit Leung
Original Assignee
Universal Scient Ind Shanghai
Universal Global Scient Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universal Scient Ind Shanghai, Universal Global Scient Ind Co filed Critical Universal Scient Ind Shanghai
Priority to TW103115162A priority Critical patent/TWI563626B/en
Publication of TW201541601A publication Critical patent/TW201541601A/en
Application granted granted Critical
Publication of TWI563626B publication Critical patent/TWI563626B/en

Links

Classifications

    • H10W42/276—
    • H10W74/10—
    • H10W90/724—
TW103115162A 2014-04-28 2014-04-28 Manufacturing method of electronic packaging device TWI563626B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103115162A TWI563626B (en) 2014-04-28 2014-04-28 Manufacturing method of electronic packaging device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103115162A TWI563626B (en) 2014-04-28 2014-04-28 Manufacturing method of electronic packaging device

Publications (2)

Publication Number Publication Date
TW201541601A TW201541601A (en) 2015-11-01
TWI563626B true TWI563626B (en) 2016-12-21

Family

ID=55220565

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103115162A TWI563626B (en) 2014-04-28 2014-04-28 Manufacturing method of electronic packaging device

Country Status (1)

Country Link
TW (1) TWI563626B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115954279A (en) * 2022-12-16 2023-04-11 环维电子(上海)有限公司 Encapsulation board and method of making same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201212178A (en) * 2010-09-07 2012-03-16 Powertech Technology Inc Semiconductor package structure and method for manufacturing the same
TW201412211A (en) * 2012-09-07 2014-03-16 環旭電子股份有限公司 Circuit board system and method of manufacturing same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201212178A (en) * 2010-09-07 2012-03-16 Powertech Technology Inc Semiconductor package structure and method for manufacturing the same
TW201412211A (en) * 2012-09-07 2014-03-16 環旭電子股份有限公司 Circuit board system and method of manufacturing same

Also Published As

Publication number Publication date
TW201541601A (en) 2015-11-01

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