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TWI563613B - Method of manufacturing electronic package module and electronic package module manufactured by the same - Google Patents

Method of manufacturing electronic package module and electronic package module manufactured by the same

Info

Publication number
TWI563613B
TWI563613B TW103126024A TW103126024A TWI563613B TW I563613 B TWI563613 B TW I563613B TW 103126024 A TW103126024 A TW 103126024A TW 103126024 A TW103126024 A TW 103126024A TW I563613 B TWI563613 B TW I563613B
Authority
TW
Taiwan
Prior art keywords
electronic package
package module
same
manufactured
manufacturing
Prior art date
Application number
TW103126024A
Other languages
Chinese (zh)
Other versions
TW201605001A (en
Inventor
Jen Chun Chen
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW103126024A priority Critical patent/TWI563613B/en
Publication of TW201605001A publication Critical patent/TW201605001A/en
Application granted granted Critical
Publication of TWI563613B publication Critical patent/TWI563613B/en

Links

TW103126024A 2014-07-30 2014-07-30 Method of manufacturing electronic package module and electronic package module manufactured by the same TWI563613B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103126024A TWI563613B (en) 2014-07-30 2014-07-30 Method of manufacturing electronic package module and electronic package module manufactured by the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103126024A TWI563613B (en) 2014-07-30 2014-07-30 Method of manufacturing electronic package module and electronic package module manufactured by the same

Publications (2)

Publication Number Publication Date
TW201605001A TW201605001A (en) 2016-02-01
TWI563613B true TWI563613B (en) 2016-12-21

Family

ID=55809711

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103126024A TWI563613B (en) 2014-07-30 2014-07-30 Method of manufacturing electronic package module and electronic package module manufactured by the same

Country Status (1)

Country Link
TW (1) TWI563613B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI778323B (en) * 2019-01-29 2022-09-21 日商日亞化學工業股份有限公司 Method of manufacturing light emitting device
TWI817669B (en) * 2019-01-29 2023-10-01 日商日亞化學工業股份有限公司 Light emitting device

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6672113B2 (en) * 2016-09-09 2020-03-25 Ｔｏｗａ株式会社 Electronic circuit device and method of manufacturing electronic circuit device
TWI719718B (en) 2019-11-18 2021-02-21 啟碁科技股份有限公司 Package structure and manufacturing method thereof
TWI732517B (en) * 2020-04-09 2021-07-01 矽品精密工業股份有限公司 Electronic package and manufacturing method thereof
CN113611688A (en) * 2021-08-03 2021-11-05 东莞记忆存储科技有限公司 Chip structure and processing method thereof
JP7805739B2 (en) * 2021-09-30 2026-01-26 芝浦メカトロニクス株式会社 Film forming method, resin layer forming device, film forming device, and electromagnetic wave shielded circuit board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200940662A (en) * 2008-03-27 2009-10-01 Walsin Technology Corp Light curable electric conduction ink and light curable electric conduction film
TW201414374A (en) * 2012-09-24 2014-04-01 環旭電子股份有限公司 Electronic module and method of manufacturing same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200940662A (en) * 2008-03-27 2009-10-01 Walsin Technology Corp Light curable electric conduction ink and light curable electric conduction film
TW201414374A (en) * 2012-09-24 2014-04-01 環旭電子股份有限公司 Electronic module and method of manufacturing same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI778323B (en) * 2019-01-29 2022-09-21 日商日亞化學工業股份有限公司 Method of manufacturing light emitting device
TWI817669B (en) * 2019-01-29 2023-10-01 日商日亞化學工業股份有限公司 Light emitting device

Also Published As

Publication number Publication date
TW201605001A (en) 2016-02-01

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