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TWI562205B - Method and apparatus which reduce the erosion rate of surfaces exposed to halogen-containing plasmas - Google Patents

Method and apparatus which reduce the erosion rate of surfaces exposed to halogen-containing plasmas

Info

Publication number
TWI562205B
TWI562205B TW103132298A TW103132298A TWI562205B TW I562205 B TWI562205 B TW I562205B TW 103132298 A TW103132298 A TW 103132298A TW 103132298 A TW103132298 A TW 103132298A TW I562205 B TWI562205 B TW I562205B
Authority
TW
Taiwan
Prior art keywords
halogen
reduce
erosion rate
surfaces exposed
containing plasmas
Prior art date
Application number
TW103132298A
Other languages
English (en)
Other versions
TW201503238A (zh
Inventor
Jennifer Y Sun
Ren-Guan Duan
Jie Yuan
Li Xu
Kenneth S Collins
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/796,211 external-priority patent/US7696117B2/en
Priority claimed from US11/796,210 external-priority patent/US20080264564A1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW201503238A publication Critical patent/TW201503238A/zh
Application granted granted Critical
Publication of TWI562205B publication Critical patent/TWI562205B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/50—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds
    • C04B35/505—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds based on yttrium oxide
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4404—Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32467—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H01J37/32495—Means for protecting the vessel against plasma

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Structural Engineering (AREA)
  • Composite Materials (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Coating By Spraying Or Casting (AREA)
TW103132298A 2007-04-27 2007-07-04 Method and apparatus which reduce the erosion rate of surfaces exposed to halogen-containing plasmas TWI562205B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/796,211 US7696117B2 (en) 2007-04-27 2007-04-27 Method and apparatus which reduce the erosion rate of surfaces exposed to halogen-containing plasmas
US11/796,210 US20080264564A1 (en) 2007-04-27 2007-04-27 Method of reducing the erosion rate of semiconductor processing apparatus exposed to halogen-containing plasmas

Publications (2)

Publication Number Publication Date
TW201503238A TW201503238A (zh) 2015-01-16
TWI562205B true TWI562205B (en) 2016-12-11

Family

ID=39691093

Family Applications (11)

Application Number Title Priority Date Filing Date
TW105136802A TWI628154B (zh) 2007-04-27 2007-07-04 減小曝露於含鹵素電漿下之表面腐蝕速率的方法與設備
TW107103413A TWI654159B (zh) 2007-04-27 2007-07-04 減小曝露於含鹵素電漿下之表面腐蝕速率的方法與設備
TW104122059A TWI571452B (zh) 2007-04-27 2007-07-04 減小曝露於含鹵素電漿下之表面腐蝕速率的方法與設備
TW107103401A TWI654158B (zh) 2007-04-27 2007-07-04 減小曝露於含鹵素電漿下之表面腐蝕速率的方法與設備
TW109115828A TWI744898B (zh) 2007-04-27 2007-07-04 減小曝露於含鹵素電漿下之表面腐蝕速率的方法與設備
TW108104769A TWI695822B (zh) 2007-04-27 2007-07-04 減小曝露於含鹵素電漿下之表面腐蝕速率的方法與設備
TW096124359A TWI351057B (en) 2007-04-27 2007-07-04 Method and apparatus which reduce the erosion rate of surfaces exposed to halogen-containing plasmas
TW103132298A TWI562205B (en) 2007-04-27 2007-07-04 Method and apparatus which reduce the erosion rate of surfaces exposed to halogen-containing plasmas
TW103132299A TWI567793B (zh) 2007-04-27 2007-07-04 減小曝露於含鹵素電漿下之表面腐蝕速率的設備
TW100117999A TWI483291B (zh) 2007-04-27 2007-07-04 減小曝露於含鹵素電漿下之表面腐蝕速率的方法與設備
TW107103418A TWI654160B (zh) 2007-04-27 2007-07-04 減小曝露於含鹵素電漿下之表面腐蝕速率的方法與設備

Family Applications Before (7)

Application Number Title Priority Date Filing Date
TW105136802A TWI628154B (zh) 2007-04-27 2007-07-04 減小曝露於含鹵素電漿下之表面腐蝕速率的方法與設備
TW107103413A TWI654159B (zh) 2007-04-27 2007-07-04 減小曝露於含鹵素電漿下之表面腐蝕速率的方法與設備
TW104122059A TWI571452B (zh) 2007-04-27 2007-07-04 減小曝露於含鹵素電漿下之表面腐蝕速率的方法與設備
TW107103401A TWI654158B (zh) 2007-04-27 2007-07-04 減小曝露於含鹵素電漿下之表面腐蝕速率的方法與設備
TW109115828A TWI744898B (zh) 2007-04-27 2007-07-04 減小曝露於含鹵素電漿下之表面腐蝕速率的方法與設備
TW108104769A TWI695822B (zh) 2007-04-27 2007-07-04 減小曝露於含鹵素電漿下之表面腐蝕速率的方法與設備
TW096124359A TWI351057B (en) 2007-04-27 2007-07-04 Method and apparatus which reduce the erosion rate of surfaces exposed to halogen-containing plasmas

Family Applications After (3)

Application Number Title Priority Date Filing Date
TW103132299A TWI567793B (zh) 2007-04-27 2007-07-04 減小曝露於含鹵素電漿下之表面腐蝕速率的設備
TW100117999A TWI483291B (zh) 2007-04-27 2007-07-04 減小曝露於含鹵素電漿下之表面腐蝕速率的方法與設備
TW107103418A TWI654160B (zh) 2007-04-27 2007-07-04 減小曝露於含鹵素電漿下之表面腐蝕速率的方法與設備

Country Status (6)

Country Link
EP (1) EP1988187A3 (zh)
JP (7) JP4975676B2 (zh)
KR (6) KR100917292B1 (zh)
CN (1) CN103102157A (zh)
SG (3) SG10201803162TA (zh)
TW (11) TWI628154B (zh)

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