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TWI561825B - Probe device - Google Patents

Probe device

Info

Publication number
TWI561825B
TWI561825B TW104110820A TW104110820A TWI561825B TW I561825 B TWI561825 B TW I561825B TW 104110820 A TW104110820 A TW 104110820A TW 104110820 A TW104110820 A TW 104110820A TW I561825 B TWI561825 B TW I561825B
Authority
TW
Taiwan
Prior art keywords
probe device
probe
Prior art date
Application number
TW104110820A
Other languages
English (en)
Other versions
TW201623973A (zh
Inventor
Chae Gap Lee
Original Assignee
Chae Gap Lee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chae Gap Lee filed Critical Chae Gap Lee
Publication of TW201623973A publication Critical patent/TW201623973A/zh
Application granted granted Critical
Publication of TWI561825B publication Critical patent/TWI561825B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
TW104110820A 2014-12-18 2015-04-01 Probe device TWI561825B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140183389A KR101716803B1 (ko) 2014-12-18 2014-12-18 프로브 장치

Publications (2)

Publication Number Publication Date
TW201623973A TW201623973A (zh) 2016-07-01
TWI561825B true TWI561825B (en) 2016-12-11

Family

ID=56366226

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104110820A TWI561825B (en) 2014-12-18 2015-04-01 Probe device

Country Status (2)

Country Link
KR (1) KR101716803B1 (zh)
TW (1) TWI561825B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101869044B1 (ko) * 2016-11-10 2018-07-19 윌테크놀러지(주) 스크럽 현상이 저감된 수직형 프로브 카드용 니들유닛 및 이를 이용한 프로브 카드
JP2018179721A (ja) * 2017-04-12 2018-11-15 株式会社日本マイクロニクス 電気的接続装置
KR101769355B1 (ko) * 2017-05-31 2017-08-18 주식회사 새한마이크로텍 수직형 프로브핀 및 이를 구비한 프로브핀 조립체
US11454650B2 (en) * 2018-07-18 2022-09-27 Nidec-Read Corporation Probe, inspection jig, inspection device, and method for manufacturing probe
IT202000013978A1 (it) 2020-06-11 2021-12-11 Microtest S R L Un supporto porta sonde e relative sonde con montaggio facilitato

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001074779A (ja) * 1999-08-31 2001-03-23 Micronics Japan Co Ltd プローブ、プローブユニット及びプローブカード
TW201027080A (en) * 2008-11-25 2010-07-16 Nhk Spring Co Ltd Contact probe, probe unit and assembly method of probe unit
US7786740B2 (en) * 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
TWM411569U (en) * 2011-03-22 2011-09-11 Micro Precise Technology Co Ltd Testing probe and probe retaining base
CN102478594A (zh) * 2010-11-22 2012-05-30 励威电子股份有限公司 高频垂直式弹片探针卡结构

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2799973B2 (ja) * 1995-07-06 1998-09-21 日本電子材料株式会社 垂直作動式プローブカード
JP2000021528A (ja) * 1998-07-03 2000-01-21 Furukawa Electric Co Ltd:The Ｉｃソケット用コンタクトピン
JP2002202337A (ja) * 2001-01-04 2002-07-19 Takashi Nansai ファインピッチ基板検査用治具
JP4268447B2 (ja) 2003-05-14 2009-05-27 Ｈｏｙａ株式会社 基板保持具、基板処理装置、基板検査装置及びこれらの使用方法
KR100806379B1 (ko) * 2006-12-22 2008-02-27 세크론 주식회사 프로브 및 이를 포함하는 프로브 카드

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001074779A (ja) * 1999-08-31 2001-03-23 Micronics Japan Co Ltd プローブ、プローブユニット及びプローブカード
US7786740B2 (en) * 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
TW201027080A (en) * 2008-11-25 2010-07-16 Nhk Spring Co Ltd Contact probe, probe unit and assembly method of probe unit
CN102478594A (zh) * 2010-11-22 2012-05-30 励威电子股份有限公司 高频垂直式弹片探针卡结构
TWM411569U (en) * 2011-03-22 2011-09-11 Micro Precise Technology Co Ltd Testing probe and probe retaining base

Also Published As

Publication number Publication date
TW201623973A (zh) 2016-07-01
KR101716803B1 (ko) 2017-03-15
KR20160074271A (ko) 2016-06-28

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees