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GB2527790B - Testing device - Google Patents

Testing device

Info

Publication number
GB2527790B
GB2527790B GB1411779.0A GB201411779A GB2527790B GB 2527790 B GB2527790 B GB 2527790B GB 201411779 A GB201411779 A GB 201411779A GB 2527790 B GB2527790 B GB 2527790B
Authority
GB
United Kingdom
Prior art keywords
testing device
testing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1411779.0A
Other versions
GB2527790A (en
GB201411779D0 (en
Inventor
Winter Graham
Cudbertson Steven
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linwave Technology Ltd
Original Assignee
Linwave Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linwave Technology Ltd filed Critical Linwave Technology Ltd
Priority to GB1411779.0A priority Critical patent/GB2527790B/en
Publication of GB201411779D0 publication Critical patent/GB201411779D0/en
Publication of GB2527790A publication Critical patent/GB2527790A/en
Application granted granted Critical
Publication of GB2527790B publication Critical patent/GB2527790B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/15—Pins, blades or sockets having separate spring member for producing or increasing contact pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/193—Means for increasing contact pressure at the end of engagement of coupling part, e.g. zero insertion force or no friction
    • H10P74/207—
    • H10P74/273—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
GB1411779.0A 2014-07-02 2014-07-02 Testing device Active GB2527790B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1411779.0A GB2527790B (en) 2014-07-02 2014-07-02 Testing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1411779.0A GB2527790B (en) 2014-07-02 2014-07-02 Testing device

Publications (3)

Publication Number Publication Date
GB201411779D0 GB201411779D0 (en) 2014-08-13
GB2527790A GB2527790A (en) 2016-01-06
GB2527790B true GB2527790B (en) 2017-04-05

Family

ID=51410503

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1411779.0A Active GB2527790B (en) 2014-07-02 2014-07-02 Testing device

Country Status (1)

Country Link
GB (1) GB2527790B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4766371A (en) * 1982-07-24 1988-08-23 Risho Kogyo Co., Ltd. Test board for semiconductor packages
US4769591A (en) * 1985-12-20 1988-09-06 U.S. Philips Corporation Testing apparatus for leadless package containing a high-frequency integrated circuit chip
JPH09298257A (en) * 1996-04-30 1997-11-18 Shin Etsu Polymer Co Ltd Semiconductor package connecting socket
JPH11190753A (en) * 1997-12-26 1999-07-13 Sumitomo Wiring Syst Ltd Tool for inspecting electronic parts
US20030151420A1 (en) * 2002-02-08 2003-08-14 Ultratera Corporation Test fixture for semiconductor package and test method of using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4766371A (en) * 1982-07-24 1988-08-23 Risho Kogyo Co., Ltd. Test board for semiconductor packages
US4769591A (en) * 1985-12-20 1988-09-06 U.S. Philips Corporation Testing apparatus for leadless package containing a high-frequency integrated circuit chip
JPH09298257A (en) * 1996-04-30 1997-11-18 Shin Etsu Polymer Co Ltd Semiconductor package connecting socket
JPH11190753A (en) * 1997-12-26 1999-07-13 Sumitomo Wiring Syst Ltd Tool for inspecting electronic parts
US20030151420A1 (en) * 2002-02-08 2003-08-14 Ultratera Corporation Test fixture for semiconductor package and test method of using the same

Also Published As

Publication number Publication date
GB2527790A (en) 2016-01-06
GB201411779D0 (en) 2014-08-13

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