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TWI561825B - Probe device - Google Patents

Probe device

Info

Publication number
TWI561825B
TWI561825B TW104110820A TW104110820A TWI561825B TW I561825 B TWI561825 B TW I561825B TW 104110820 A TW104110820 A TW 104110820A TW 104110820 A TW104110820 A TW 104110820A TW I561825 B TWI561825 B TW I561825B
Authority
TW
Taiwan
Prior art keywords
probe device
probe
Prior art date
Application number
TW104110820A
Other languages
Chinese (zh)
Other versions
TW201623973A (en
Inventor
Chae Gap Lee
Original Assignee
Chae Gap Lee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chae Gap Lee filed Critical Chae Gap Lee
Publication of TW201623973A publication Critical patent/TW201623973A/en
Application granted granted Critical
Publication of TWI561825B publication Critical patent/TWI561825B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
TW104110820A 2014-12-18 2015-04-01 Probe device TWI561825B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140183389A KR101716803B1 (en) 2014-12-18 2014-12-18 Probe device

Publications (2)

Publication Number Publication Date
TW201623973A TW201623973A (en) 2016-07-01
TWI561825B true TWI561825B (en) 2016-12-11

Family

ID=56366226

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104110820A TWI561825B (en) 2014-12-18 2015-04-01 Probe device

Country Status (2)

Country Link
KR (1) KR101716803B1 (en)
TW (1) TWI561825B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101869044B1 (en) * 2016-11-10 2018-07-19 윌테크놀러지(주) Needle unit for vertical probe card with reduced scrub phenomenon and vertical probe using thereof
JP2018179721A (en) * 2017-04-12 2018-11-15 株式会社日本マイクロニクス Electrical connection device
KR101769355B1 (en) * 2017-05-31 2017-08-18 주식회사 새한마이크로텍 Vertical probe pin and probe pin assembly with the same
US11454650B2 (en) * 2018-07-18 2022-09-27 Nidec-Read Corporation Probe, inspection jig, inspection device, and method for manufacturing probe
IT202000013978A1 (en) 2020-06-11 2021-12-11 Microtest S R L A PROBE HOLDER SUPPORT AND RELATED PROBES WITH EASY ASSEMBLY

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001074779A (en) * 1999-08-31 2001-03-23 Micronics Japan Co Ltd Probe, probe unit and probe card
TW201027080A (en) * 2008-11-25 2010-07-16 Nhk Spring Co Ltd Contact probe, probe unit and assembly method of probe unit
US7786740B2 (en) * 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
TWM411569U (en) * 2011-03-22 2011-09-11 Micro Precise Technology Co Ltd Testing probe and probe retaining base
CN102478594A (en) * 2010-11-22 2012-05-30 励威电子股份有限公司 High-frequency vertical spring probe card structure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2799973B2 (en) * 1995-07-06 1998-09-21 日本電子材料株式会社 Vertically actuated probe card
JP2000021528A (en) * 1998-07-03 2000-01-21 Furukawa Electric Co Ltd:The Contact pin for IC socket
JP2002202337A (en) * 2001-01-04 2002-07-19 Takashi Nansai Jig for fine pitch substrate inspection
JP4268447B2 (en) 2003-05-14 2009-05-27 Ｈｏｙａ株式会社 Substrate holder, substrate processing apparatus, substrate inspection apparatus, and methods of use thereof
KR100806379B1 (en) * 2006-12-22 2008-02-27 세크론 주식회사 Probes and probe cards containing them

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001074779A (en) * 1999-08-31 2001-03-23 Micronics Japan Co Ltd Probe, probe unit and probe card
US7786740B2 (en) * 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
TW201027080A (en) * 2008-11-25 2010-07-16 Nhk Spring Co Ltd Contact probe, probe unit and assembly method of probe unit
CN102478594A (en) * 2010-11-22 2012-05-30 励威电子股份有限公司 High-frequency vertical spring probe card structure
TWM411569U (en) * 2011-03-22 2011-09-11 Micro Precise Technology Co Ltd Testing probe and probe retaining base

Also Published As

Publication number Publication date
TW201623973A (en) 2016-07-01
KR101716803B1 (en) 2017-03-15
KR20160074271A (en) 2016-06-28

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees