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TWI561665B - - Google Patents

Info

Publication number
TWI561665B
TWI561665B TW103104703A TW103104703A TWI561665B TW I561665 B TWI561665 B TW I561665B TW 103104703 A TW103104703 A TW 103104703A TW 103104703 A TW103104703 A TW 103104703A TW I561665 B TWI561665 B TW I561665B
Authority
TW
Taiwan
Application number
TW103104703A
Other versions
TW201437408A (zh
Inventor
Toshiyuki Sakemi
Original Assignee
Sumitomo Heavy Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries filed Critical Sumitomo Heavy Industries
Publication of TW201437408A publication Critical patent/TW201437408A/zh
Application granted granted Critical
Publication of TWI561665B publication Critical patent/TWI561665B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/32Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
TW103104703A 2013-03-28 2014-02-13 成膜裝置 TW201437408A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013068577A JP5951542B2 (ja) 2013-03-28 2013-03-28 成膜装置

Publications (2)

Publication Number Publication Date
TW201437408A TW201437408A (zh) 2014-10-01
TWI561665B true TWI561665B (zh) 2016-12-11

Family

ID=51595361

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103104703A TW201437408A (zh) 2013-03-28 2014-02-13 成膜裝置

Country Status (4)

Country Link
JP (1) JP5951542B2 (zh)
KR (1) KR101858155B1 (zh)
CN (1) CN104073766B (zh)
TW (1) TW201437408A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6584982B2 (ja) * 2015-07-21 2019-10-02 住友重機械工業株式会社 成膜装置
JP7448909B2 (ja) * 2019-06-27 2024-03-13 住友重機械工業株式会社 成膜方法、及び成膜装置
JP2022156767A (ja) * 2021-03-31 2022-10-14 住友重機械工業株式会社 成膜装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0397853A (ja) * 1989-09-09 1991-04-23 Nkk Corp レーザーを利用したpvd装置
JPH1112725A (ja) * 1997-06-20 1999-01-19 Sumitomo Heavy Ind Ltd 金属酸化物の被覆方法
US20080064227A1 (en) * 2006-09-07 2008-03-13 Jin-Sung Kim Apparatus For Chemical Vapor Deposition and Method For Cleaning Injector Included in the Apparatus
TW200952109A (en) * 2008-02-20 2009-12-16 Tokyo Electron Ltd Gas supply device
TW201037098A (en) * 2008-12-01 2010-10-16 Tokyo Electron Ltd Film deposition apparatus

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02208207A (ja) * 1989-02-08 1990-08-17 Matsushita Electric Ind Co Ltd 超電導薄膜の製造方法および製造装置
US5508368A (en) * 1994-03-03 1996-04-16 Diamonex, Incorporated Ion beam process for deposition of highly abrasion-resistant coatings
JPH11130587A (ja) * 1997-10-27 1999-05-18 Gifu Prefecture Kenkyu Kaihatsu Zaidan 窒化物半導体の製造方法
JP3664033B2 (ja) * 2000-03-29 2005-06-22 セイコーエプソン株式会社 セラミックスの製造方法およびその製造装置
JP2002030426A (ja) * 2000-07-07 2002-01-31 Sumitomo Heavy Ind Ltd 成膜方法及び装置
JP4637556B2 (ja) * 2004-12-01 2011-02-23 株式会社アルバック 成膜装置とこの成膜装置を含む複合型配線膜形成装置および薄膜製造方法
JP4901696B2 (ja) * 2007-11-06 2012-03-21 キヤノンアネルバ株式会社 成膜装置
JP2010037620A (ja) * 2008-08-07 2010-02-18 Seiko Epson Corp 成膜方法、膜材料、および成膜装置
JP4823293B2 (ja) * 2008-10-31 2011-11-24 株式会社シンクロン 成膜方法及び成膜装置
JP2010121144A (ja) * 2008-11-17 2010-06-03 Seiko Epson Corp 成膜装置
JP5543251B2 (ja) 2010-03-23 2014-07-09 スタンレー電気株式会社 イオンプレーティング法を用いた成膜方法およびそれに用いられる装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0397853A (ja) * 1989-09-09 1991-04-23 Nkk Corp レーザーを利用したpvd装置
JPH1112725A (ja) * 1997-06-20 1999-01-19 Sumitomo Heavy Ind Ltd 金属酸化物の被覆方法
US20080064227A1 (en) * 2006-09-07 2008-03-13 Jin-Sung Kim Apparatus For Chemical Vapor Deposition and Method For Cleaning Injector Included in the Apparatus
TW200952109A (en) * 2008-02-20 2009-12-16 Tokyo Electron Ltd Gas supply device
TW201037098A (en) * 2008-12-01 2010-10-16 Tokyo Electron Ltd Film deposition apparatus

Also Published As

Publication number Publication date
JP2014189874A (ja) 2014-10-06
KR101858155B1 (ko) 2018-05-15
JP5951542B2 (ja) 2016-07-13
CN104073766A (zh) 2014-10-01
KR20140118721A (ko) 2014-10-08
CN104073766B (zh) 2018-05-29
TW201437408A (zh) 2014-10-01

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