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TWI560795B - Wafer probing device - Google Patents

Wafer probing device

Info

Publication number
TWI560795B
TWI560795B TW104128019A TW104128019A TWI560795B TW I560795 B TWI560795 B TW I560795B TW 104128019 A TW104128019 A TW 104128019A TW 104128019 A TW104128019 A TW 104128019A TW I560795 B TWI560795 B TW I560795B
Authority
TW
Taiwan
Prior art keywords
probing device
wafer probing
wafer
probing
Prior art date
Application number
TW104128019A
Other languages
English (en)
Other versions
TW201643981A (zh
Inventor
Chia-Hung Hung
Yu-Hsun Hsu
Original Assignee
Mpi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mpi Corp filed Critical Mpi Corp
Application granted granted Critical
Publication of TWI560795B publication Critical patent/TWI560795B/zh
Publication of TW201643981A publication Critical patent/TW201643981A/zh

Links

TW104128019A 2015-06-01 2015-08-26 Wafer probing device TWI560795B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201562169181P 2015-06-01 2015-06-01

Publications (2)

Publication Number Publication Date
TWI560795B true TWI560795B (en) 2016-12-01
TW201643981A TW201643981A (zh) 2016-12-16

Family

ID=58055992

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104128019A TWI560795B (en) 2015-06-01 2015-08-26 Wafer probing device

Country Status (1)

Country Link
TW (1) TWI560795B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10976363B2 (en) 2017-12-15 2021-04-13 Mpi Corporation Wafer inspection method and wafer probing system
US11353501B2 (en) 2017-12-15 2022-06-07 Mpi Corporation Wafer inspection method and wafer probing system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW293126B (zh) * 1994-02-22 1996-12-11 Gen Electric
CN101285865A (zh) * 2007-03-23 2008-10-15 东京毅力科创株式会社 探针针尖位置检测方法及装置、对准方法以及探针装置
TW201202720A (en) * 2010-03-12 2012-01-16 Tokyo Electron Ltd Probe apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW293126B (zh) * 1994-02-22 1996-12-11 Gen Electric
CN101285865A (zh) * 2007-03-23 2008-10-15 东京毅力科创株式会社 探针针尖位置检测方法及装置、对准方法以及探针装置
TW201202720A (en) * 2010-03-12 2012-01-16 Tokyo Electron Ltd Probe apparatus

Also Published As

Publication number Publication date
TW201643981A (zh) 2016-12-16

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