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GB201819585D0 - Wafer test system - Google Patents

Wafer test system

Info

Publication number
GB201819585D0
GB201819585D0 GBGB1819585.9A GB201819585A GB201819585D0 GB 201819585 D0 GB201819585 D0 GB 201819585D0 GB 201819585 A GB201819585 A GB 201819585A GB 201819585 D0 GB201819585 D0 GB 201819585D0
Authority
GB
United Kingdom
Prior art keywords
test system
wafer test
wafer
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB1819585.9A
Other versions
GB2567968A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sino IC Technology Co Ltd
Original Assignee
Sino IC Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sino IC Technology Co Ltd filed Critical Sino IC Technology Co Ltd
Publication of GB201819585D0 publication Critical patent/GB201819585D0/en
Publication of GB2567968A publication Critical patent/GB2567968A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
GB1819585.9A 2016-12-30 2017-12-04 Wafer test system Withdrawn GB2567968A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201611264465.3A CN106597261A (en) 2016-12-30 2016-12-30 Wafer test system
PCT/CN2017/114373 WO2018121184A1 (en) 2016-12-30 2017-12-04 Wafer test system

Publications (2)

Publication Number Publication Date
GB201819585D0 true GB201819585D0 (en) 2019-01-16
GB2567968A GB2567968A (en) 2019-05-01

Family

ID=58581651

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1819585.9A Withdrawn GB2567968A (en) 2016-12-30 2017-12-04 Wafer test system

Country Status (3)

Country Link
CN (1) CN106597261A (en)
GB (1) GB2567968A (en)
WO (1) WO2018121184A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106597261A (en) * 2016-12-30 2017-04-26 上海华岭集成电路技术股份有限公司 Wafer test system
CN108400100A (en) * 2018-02-27 2018-08-14 上海华岭集成电路技术股份有限公司 A kind of wafer test parameters setting method
CN110879931B (en) * 2018-09-05 2022-04-05 长鑫存储技术有限公司 Visual memory chip repair analysis program inspection method and device
CN110967609B (en) * 2018-09-29 2022-02-08 合肥晶合集成电路股份有限公司 Monitoring system and monitoring method
CN110146798B (en) * 2019-03-29 2021-04-09 福建省福联集成电路有限公司 Automatic analysis method and system for failure core particles
CN110579702A (en) * 2019-09-20 2019-12-17 紫光宏茂微电子(上海)有限公司 Display method and device for chip test, storage medium and terminal
CN110763979A (en) * 2019-10-31 2020-02-07 东莞长城开发科技有限公司 An automated system for LED wafer spot testing based on MES system
CN111983412B (en) * 2020-07-21 2021-12-31 深圳米飞泰克科技有限公司 Monitoring system, monitoring method, monitoring terminal and storage medium
CN112612755B (en) * 2020-12-03 2023-05-26 海光信息技术股份有限公司 Chip test information display method and device, electronic equipment and storage medium
CN112989141B (en) * 2021-03-15 2024-05-28 上海华力微电子有限公司 Method and system for inquiring and interrupting LOT of wafer batch
CN115331724A (en) * 2021-05-10 2022-11-11 中国科学院微电子研究所 Memory wafer test system and method
CN114429113B (en) * 2022-01-12 2024-07-23 上海华虹宏力半导体制造有限公司 Method for automatically distinguishing and classifying MPW product test data

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH084102B2 (en) * 1987-07-30 1996-01-17 東京エレクトロン株式会社 Semiconductor inspection equipment
US5892686A (en) * 1995-12-05 1999-04-06 Tokyo Electron Limited Wafer prober system
JP2004031690A (en) * 2002-06-26 2004-01-29 Agilent Technologies Japan Ltd Data analyzer
US7738693B2 (en) * 2002-12-24 2010-06-15 Lam Research Corporation User interface for wafer data analysis and visualization
US7319935B2 (en) * 2003-02-12 2008-01-15 Micron Technology, Inc. System and method for analyzing electrical failure data
US7991574B2 (en) * 2008-01-29 2011-08-02 International Business Machines Corporation Techniques for filtering systematic differences from wafer evaluation parameters
CN201637795U (en) * 2010-03-22 2010-11-17 华润赛美科微电子(深圳)有限公司 Testing system of probe station and testing display device of probe station
CN102135768A (en) * 2010-12-21 2011-07-27 上海华岭集成电路技术股份有限公司 Real-time probe test monitor system
CN102520332B (en) * 2011-12-15 2014-12-31 无锡中星微电子有限公司 Wafer testing device and method for the same
CN202939275U (en) * 2012-10-15 2013-05-15 深圳安博电子有限公司 Wafer IC test equipment
CN103199041B (en) * 2013-03-14 2015-07-22 上海华力微电子有限公司 Management system of wafer acceptable test procedure and application method thereof
TW201546468A (en) * 2014-06-11 2015-12-16 Signality System Engineering Co Ltd Wafer map identification system for wafer test data
CN105470158A (en) * 2014-10-31 2016-04-06 华润赛美科微电子(深圳)有限公司 Wafer test probe station and testing method thereof
CN104597392B (en) * 2015-01-09 2018-02-09 上海华岭集成电路技术股份有限公司 The method that test data depth is traced to the source
CN105067984B (en) * 2015-07-16 2017-12-29 无锡中微腾芯电子有限公司 Recover TSK plurality of probes platforms MAP method using test data
CN106597261A (en) * 2016-12-30 2017-04-26 上海华岭集成电路技术股份有限公司 Wafer test system

Also Published As

Publication number Publication date
WO2018121184A1 (en) 2018-07-05
GB2567968A (en) 2019-05-01
CN106597261A (en) 2017-04-26

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