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TWI560619B - Manufacturing method and manufacturing apparatus of fingerprint identification chip package structure - Google Patents

Manufacturing method and manufacturing apparatus of fingerprint identification chip package structure

Info

Publication number
TWI560619B
TWI560619B TW105106079A TW105106079A TWI560619B TW I560619 B TWI560619 B TW I560619B TW 105106079 A TW105106079 A TW 105106079A TW 105106079 A TW105106079 A TW 105106079A TW I560619 B TWI560619 B TW I560619B
Authority
TW
Taiwan
Prior art keywords
manufacturing
package structure
fingerprint identification
chip package
identification chip
Prior art date
Application number
TW105106079A
Other languages
Chinese (zh)
Other versions
TW201732676A (en
Inventor
Meng-Chih Chang
Original Assignee
Chipmos Technologies Inc
Chipmos Technologies Bermuda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW105106079A priority Critical patent/TWI560619B/en
Priority to CN201610227215.6A priority patent/CN107146763A/en
Application granted granted Critical
Publication of TWI560619B publication Critical patent/TWI560619B/en
Publication of TW201732676A publication Critical patent/TW201732676A/en

Links

Classifications

    • H10W74/014—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
    • H10P72/0441—
    • H10W72/884—

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Image Input (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW105106079A 2016-03-01 2016-03-01 Manufacturing method and manufacturing apparatus of fingerprint identification chip package structure TWI560619B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW105106079A TWI560619B (en) 2016-03-01 2016-03-01 Manufacturing method and manufacturing apparatus of fingerprint identification chip package structure
CN201610227215.6A CN107146763A (en) 2016-03-01 2016-04-13 Manufacturing method and manufacturing equipment of fingerprint identification chip packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105106079A TWI560619B (en) 2016-03-01 2016-03-01 Manufacturing method and manufacturing apparatus of fingerprint identification chip package structure

Publications (2)

Publication Number Publication Date
TWI560619B true TWI560619B (en) 2016-12-01
TW201732676A TW201732676A (en) 2017-09-16

Family

ID=58227178

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105106079A TWI560619B (en) 2016-03-01 2016-03-01 Manufacturing method and manufacturing apparatus of fingerprint identification chip package structure

Country Status (2)

Country Link
CN (1) CN107146763A (en)
TW (1) TWI560619B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI644601B (en) * 2017-03-03 2018-12-11 致伸科技股份有限公司 Jig of fingerprint recognition module and method for fabricating fingerprint recognition module

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109508619A (en) * 2017-09-15 2019-03-22 南昌欧菲生物识别技术有限公司 The manufacturing method and electronic device of optical finger print recognizer component
CN110077657B (en) * 2018-01-26 2021-03-09 致伸科技股份有限公司 Fingerprint identification module packaging method
CN108427909A (en) * 2018-01-29 2018-08-21 广东越众光电科技有限公司 Manufacturing method of patterned fingerprint module
CN115910865B (en) * 2022-11-29 2023-11-24 江苏盐芯微电子有限公司 Packaging device and packaging method for packaging fingerprint identification chip

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9425134B2 (en) * 2010-05-11 2016-08-23 Xintec Inc. Chip package
KR101238212B1 (en) * 2010-12-23 2013-02-28 하나 마이크론(주) Semiconductor package and method for manufacturing the same
KR20150019415A (en) * 2013-08-14 2015-02-25 주식회사 아이피시티 Fingerprint sensor module for mobile device and manufacturing methode thereof
TWI485821B (en) * 2014-02-24 2015-05-21 新東亞微電子股份有限公司 Fingerprint identification chip package module and manufacturing method thereof
WO2015174775A1 (en) * 2014-05-16 2015-11-19 크루셜텍(주) Fingerprint sensor module and manufacturing method therefor
TWI567834B (en) * 2014-06-13 2017-01-21 新東亞微電子股份有限公司 Fingerprint identification chip package module manufacturing method
CN104123564A (en) * 2014-07-23 2014-10-29 上海思立微电子科技有限公司 Fingerprint identification device and assembly with coated film protective layer
CN104182736B (en) * 2014-08-26 2017-08-25 南昌欧菲生物识别技术有限公司 Fingerprint Identification sensor encapsulating structure and method for packing
CN104505347B (en) * 2014-12-04 2017-05-24 江苏长电科技股份有限公司 Method for pasting graphene heat-radiating thin-film in plastic packaging process
CN104866814B (en) * 2015-04-17 2019-09-13 业成科技（成都）有限公司 Fingerprint recognition device and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI644601B (en) * 2017-03-03 2018-12-11 致伸科技股份有限公司 Jig of fingerprint recognition module and method for fabricating fingerprint recognition module

Also Published As

Publication number Publication date
CN107146763A (en) 2017-09-08
TW201732676A (en) 2017-09-16

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