CN104866814B - Fingerprint recognition device and manufacturing method thereof - Google Patents

Abstract

A fingerprint identification device. The fingerprint identification device includes a protective substrate, an ink layer, and a fingerprint identification element, the ink layer is formed on the protective substrate, and the fingerprint identification element is fixed by the characteristic that the ink layer changes from a liquid state to a solid state during the formation process. on the ink layer. The fingerprint identification device and the manufacturing method thereof provided by the present invention can reduce the thickness of the fingerprint identification device, thereby providing a lighter and thinner fingerprint identification device.

Description

Fingerprint recognition device and manufacturing method thereof

technical field

The invention relates to a fingerprint identification device and a manufacturing method of the fingerprint identification device.

Background technique

Fingerprint identification devices are widely used in different fields such as industry, national defense, fire protection, and consumer electronics. Taking the field of consumer electronics as an example, many electronic devices such as mobile phones and notebook computers are equipped with fingerprint recognition functions to realize functions such as fingerprint unlocking and fingerprint payment. However, currently, electronic devices tend to be thinner and lighter, and how to reduce the thickness of the fingerprint identification device has been put on the agenda.

Contents of the invention

In view of this, it is necessary to provide a fingerprint identification device. The fingerprint identification device includes a protective substrate, an ink layer, and a fingerprint identification element, the ink layer is formed on the protective substrate, and the fingerprint identification element is fixed by the characteristic that the ink layer is converted from a liquid state to a solid state during the formation process. on the ink layer.

It is also necessary to provide a method for manufacturing a fingerprint recognition device, the method comprising: providing a protective substrate, and coating an ink material layer on the protective substrate; curing the ink material layer, and providing fingerprint identification elements embedded in the ink material layer during curing; and completing curing of the ink material layer to form an ink layer.

Compared with the prior art, the fingerprint identification device and its manufacturing method provided by the present invention can reduce the thickness of the fingerprint identification device, thereby providing a lighter and thinner fingerprint identification device.

Description of drawings

Fig. 1 is a schematic diagram of a fingerprint identification device provided by a specific embodiment of the present invention.

FIG. 2 is a cross-sectional view of the fingerprint identification device provided by the first embodiment of the present invention along the cutting line II-II in FIG. 1 .

FIG. 3 is a cross-sectional view of the fingerprint identification device provided by the second embodiment of the present invention along the cutting line II-II in FIG. 1 .

FIG. 4 is a cross-sectional view of the fingerprint identification device provided by the third embodiment of the present invention along the cutting line II-II in FIG. 1 .

FIG. 5 is a cross-sectional view of the fingerprint identification device provided by the fourth embodiment of the present invention along the cutting line II-II in FIG. 1 .

FIG. 6 is a cross-sectional view of the fingerprint identification device provided by the fifth embodiment of the present invention along the cutting line II-II in FIG. 1 .

Fig. 7 is a flow chart of the manufacturing method of the fingerprint identification device according to the specific embodiment of the present invention.

8 to 13 are schematic diagrams of each step of the manufacturing method in FIG. 7 .

Description of main component symbols

The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

Detailed ways

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of a fingerprint identification device 200 provided by a specific embodiment of the present invention applied to an electronic device 20 with a touch function. The electronic device 10 includes a touch structure to realize the touch function, a protective cover 100 and a decoration layer (not labeled). The electronic device defines a touch area 110 and a non-touch area 120 . An opening 100 a for accommodating the fingerprint identification device 200 is disposed on the protective cover 100 of the electronic device corresponding to the non-touch area 120 . The decoration layer is used to cover the metal wires (not shown) in the non-touch area 120 and form a decorative frame in the non-touch area 120 . The material of the decoration layer is colored ink, such as black ink or white ink, but not limited thereto.

Please also refer to FIG. 2, which is a cross-sectional view of the fingerprint recognition device 200 provided by the first embodiment of the present invention along the line II-II in FIG. To ensure the consistency of the frame, an ink layer 220 and a protective substrate 210 are further provided on the fingerprint identification element 230 of the fingerprint identification device 200 . In this embodiment, the color of the ink layer 220 is consistent with the color of the decoration layer of the electronic device. The material of the protective substrate 210 can be consistent with that of the protective cover 100 of the electronic device. Alternatively, the fingerprint identification device 200 can also be used independently of the electronic device. The protective substrate 210 is used to protect the fingerprint identification element 230 of the fingerprint identification device 200 . The ink layer 220 can also be used to cover the fingerprint identification element 230 to achieve the aesthetics of the fingerprint identification device 200 , and is not limited to the purpose of matching the decorative frame in this embodiment.

In this embodiment, the ink layer 220 is formed on the protection substrate 210 . The fingerprint identification element 230 is formed on the ink layer 220 . The protective substrate 210 is used to protect the ink layer 220 and the fingerprint recognition element 230 from being damaged. The ink layer 220 is used to cover the fingerprint identification element 230 to achieve the aesthetics of the fingerprint identification device 200 . The fingerprint identification element 230 is used for sensing the fingerprint of a finger placed on the protective substrate 210 corresponding to the position of the fingerprint identification element 230 . In the present invention, the ink layer 220 has the property of changing from a liquid state to a solid state during the formation process. The fingerprint identification element 230 is embedded in the ink layer 220 , and the attachment of the fingerprint identification element 230 to the protective substrate 210 is realized by virtue of the property of the ink layer 220 changing from liquid to solid state.

In this embodiment, the protection substrate 210 is a planar protection substrate 210 . The ink layer 220 includes a first ink sub-layer 221 and a second ink sub-layer 222 which are laminated. The first ink sublayer 221 is located between the second ink sublayer 222 and the protective substrate 210 . The fingerprint identification element 230 is pasted on the first ink sub-layer 221 through the second ink sub-layer 222 . Specifically, the first ink sub-layer 221 is formed on the surface of the protective substrate 210 , and the fingerprint identification element 230 is only embedded in the second ink sub-layer 222 . For the ink layer 220 with double-layer or even multi-layer ink sub-layers, compared with the single-layer ink layer 220, in the case that the fingerprint identification element 230 and the protective substrate 210 can be bonded, due to at least one The first ink sub-layer 222 is disposed between the fingerprint identification element 230 and the protective substrate 210, which can effectively guarantee the effect of shielding.

The material of the protective substrate 210 can be selected from glass, polymethylmethacrylate (PolymethylMethacrylate, PMMA), sapphire, polyethersulfone resin (Polyethersulfone resin, PES) and polyethylene terephthalate (polyethylene terephthalate, PET), etc. The material of the first ink sub-layer 221 and the second ink sub-layer 222 can be thermosetting ink or photosetting ink, preferably ink with a dielectric coefficient greater than 7. The colors of the first ink sub-layer 221 and the second ink sub-layer 222 can be black, white or colored. The overall thickness of the ink layer 220 ranges from 2 to 10 um. Wherein, the thickness of the first ink sub-layer 221 is preferably 2 um, and the thickness of the second ink sub-layer 222 is preferably greater than the thickness of the first ink sub-layer 221 .

Since the fingerprint recognition element 230 is fixed on the first ink sub-layer 221 through the property that the second ink sub-layer 222 is converted from a liquid state to a solid state during the formation process, and then fixed on the protective substrate 210, it is not necessary to Additional glue needs to be added between the ink layer 220 and the fingerprint identification element 230 , so that the thickness of the fingerprint identification device 200 can be reduced.

Please refer to FIG. 3 , the fingerprint identification device 300 provided by the second embodiment of the present invention includes a protective substrate 310 , an ink layer 320 and a fingerprint identification element 330 . The ink layer 320 is formed on the protective substrate 310 . The fingerprint identification element 330 is formed on the ink layer 320 . The protective substrate 310 is used to protect the ink layer 320 and the fingerprint identification element 330 from being damaged. The ink layer 320 is used to cover the fingerprint identification element 330 to achieve the aesthetics of the fingerprint identification device 300 . The fingerprint identification element 330 is used for sensing the fingerprint of a finger placed on the protective substrate 310 corresponding to the position of the fingerprint identification element 330 .

In this embodiment, the protective substrate 310 has a curved surface. Specifically, the protection substrate 310 includes a protection surface 311 and a bending surface 312 bent from the protection surface 311 to the side of the fingerprint identification element 330 . The ink layer 320 includes a first ink sub-layer 321 and a second ink sub-layer 322 which are stacked. The first ink sublayer 321 is located between the second ink sublayer 322 and the protection substrate 310 . The fingerprint identification element 330 is pasted on the first ink sub-layer 321 through the second ink sub-layer 322 . Specifically, the first ink sub-layer 221 is formed on the surface of the protective substrate 210 , and the fingerprint identification element 230 is only embedded in the second ink sub-layer 222 .

The material of the protective substrate 310 can be selected from glass, polymethylmethacrylate (PolymethylMethacrylate, PMMA), sapphire, polyethersulfone resin (Polyethersulfone resin, PES) and polyethylene terephthalate (polyethylene terephthalate, PET), etc. The material of the first ink sub-layer 321 and the second ink sub-layer 322 can be thermosetting ink or photosetting ink, preferably ink with a dielectric coefficient greater than 7. The colors of the first ink sub-layer 321 and the second ink sub-layer 322 can be black, white or colored. The overall thickness of the ink layer 320 ranges from 2 to 10 um. Wherein, the thickness of the first ink sub-layer 321 is preferably 2 um, and the thickness of the second ink sub-layer 322 is preferably greater than the thickness of the first ink sub-layer 321 .

Since the fingerprint identification element 330 is fixed on the first ink sub-layer 321 through the property that the second ink sub-layer 322 is converted from a liquid state to a solid state during the formation process, and then fixed on the protective substrate 310, it is not necessary to Additional glue needs to be added between the ink layer 320 and the fingerprint identification element 330 , so that the thickness of the fingerprint identification device 300 can be reduced.

Referring to FIG. 4 , the fingerprint identification device 400 provided by the third embodiment of the present invention includes a protective substrate 410 , an ink layer 420 , a fingerprint identification element 430 and a glue 440 . The ink layer 420 is formed on the protection substrate 410 . The fingerprint identification element 430 is formed on the ink layer 420 . The colloid 440 is located on the ink layer 420 on both sides of the fingerprint identification element 430 and pasted on both sides of the fingerprint identification element 430 . Two sides of the fingerprint identification element 430 are covered by the glue 440 near the end of the ink layer 420 . The protective substrate 410 is used to protect the ink layer 420 and the fingerprint identification element 430 from being damaged. The ink layer 420 is used to cover the fingerprint identification element 430 to achieve the aesthetics of the fingerprint identification device 400 . The fingerprint identification element 430 is used for sensing the fingerprint of a finger placed on the protective substrate 410 corresponding to the position of the fingerprint identification element 430 . The colloid 440 is used to strengthen the fixing strength of the fingerprint identification element 430 on the ink layer 420 , and is also used to prevent water vapor from entering the fingerprint identification element 430 .

In this embodiment, the protective substrate 410 is a planar protective substrate 410 . The ink layer 420 includes a first ink sub-layer 421 and a second ink sub-layer 422 which are stacked. The first ink sublayer 421 is located between the second ink sublayer 422 and the protection substrate 410 . The fingerprint identification element 430 is pasted on the first ink sub-layer 421 through the second ink sub-layer 422 . Specifically, the first ink sub-layer 421 is formed on the surface of the protective substrate 410, the fingerprint identification element 430 is only embedded in the second ink sub-layer 422, and the colloid 440 is located on the second ink sub-layer 422 on both sides of the fingerprint identification element 430. On the ink sub-layer 422.

The material of the protective substrate 410 can be selected from glass, polymethylmethacrylate (PolymethylMethacrylate, PMMA), sapphire, polyethersulfone resin (Polyethersulfone resin, PES) and polyethylene terephthalate (polyethylene terephthalate, PET), etc. The material of the first ink sub-layer 421 and the second ink sub-layer 422 can be thermosetting ink or photosetting ink, preferably ink with a dielectric coefficient greater than 7. The colors of the first ink sub-layer 421 and the second ink sub-layer 422 can be black, white or colored. The overall thickness of the ink layer 420 ranges from 2 to 10 um. Wherein, the thickness of the first ink sub-layer 321 is preferably 2 um, and the thickness of the second ink sub-layer 322 is preferably greater than the thickness of the first ink sub-layer 321 . The colloid 440 is triple glue.

Since the fingerprint identification element 430 is fixed on the first ink sub-layer 421 through the property that the second ink sub-layer 422 is converted from a liquid state to a solid state during the formation process, and then fixed on the protective substrate 410, it is not necessary to Additional glue needs to be added between the ink layer 420 and the fingerprint identification element 430 , so that the thickness of the fingerprint identification device 400 can be reduced. At the same time, the colloid 440 can strengthen the strength of the fingerprint identification element 430 fixed on the ink layer 420 without increasing the thickness of the fingerprint identification device 400, and prevent water vapor from entering the fingerprint identification element 430, thereby improving the fingerprint identification element. 430 stability.

Please refer to FIG. 5 , a fingerprint identification device 500 provided by the fourth embodiment of the present invention includes a protective substrate 510 , an ink layer 520 and a fingerprint identification element 530 . A groove 550 is defined on an inner surface of the protective substrate 510 . The depth of the groove 550 is smaller than the thickness of the protection substrate 510 . The ink layer 520 is formed in the groove 550 . The fingerprint identification element 530 is formed on the ink layer 520 in the groove 550 . The protective substrate 510 is used to protect the ink layer 520 and the fingerprint identification element 530 from being damaged. The ink layer 520 is used to cover the fingerprint identification element 530 to achieve the aesthetics of the fingerprint identification device 500 . The fingerprint identification element 530 is used to sense the fingerprint of a finger placed on the protection substrate 510 corresponding to the position of the fingerprint identification element 530 .

The ink layer 520 includes a first ink sub-layer 521 and a second ink sub-layer 522 that are stacked. The first ink sublayer 521 is located between the second ink sublayer 522 and the protective substrate 510 . The fingerprint identification element 530 is pasted on the first ink sub-layer 521 through the second ink sub-layer 522 . Specifically, the fingerprint identification element 530 is only embedded in the second ink sub-layer 522 .

The material of the protective substrate 510 can be selected from glass, polymethylmethacrylate (PolymethylMethacrylate, PMMA), sapphire, polyethersulfone resin (Polyethersulfone resin, PES) and polyethylene terephthalate (polyethylene terephthalate, PET), etc. The material of the first ink sub-layer 521 and the second ink sub-layer 522 can be thermosetting ink or photosetting ink, preferably ink with a dielectric coefficient greater than 7. The colors of the first ink sub-layer 521 and the second ink sub-layer 522 can be black, white or colored. The overall thickness of the ink layer 520 ranges from 2 to 10 um. Wherein, the thickness of the first ink sub-layer 521 is preferably 2 um, and the thickness of the second ink sub-layer 522 is preferably greater than the thickness of the first ink sub-layer 521 .

Since the fingerprint identification element 530 is fixed on the first ink sub-layer 521 through the property that the second ink sub-layer 522 is converted from a liquid state to a solid state during the formation process, and then fixed on the protective substrate 510, it is not necessary to Additional glue needs to be added between the ink layer 520 and the fingerprint identification element 530 , so that the thickness of the fingerprint identification device 500 can be reduced.

Please refer to FIG. 6 , the fingerprint identification device 600 provided by the fifth embodiment of the present invention includes a protective substrate 610 , an ink layer 620 , a fingerprint identification element 630 and a glue 640 . A groove 650 is defined on an inner surface of the protection substrate 610 . The depth of the groove 650 is smaller than the thickness of the protection substrate 610 . The ink layer 620 is formed in the groove 650 . The fingerprint identification element 630 is formed on the ink layer 620 in the groove 650 . The glue 640 is located on the ink layer 620 on both sides of the fingerprint identification element 640 , pasted on both sides of the fingerprint identification element 630 , and fills the groove 650 . Both sides of the fingerprint identification element 630 are completely covered by the glue 640 . The protective substrate 610 is used to protect the ink layer 620 and the fingerprint identification element 630 from being damaged. The ink layer 620 is used to cover the fingerprint identification element 630 to achieve the aesthetics of the fingerprint identification device 600 . The fingerprint identification element 630 is used to sense the fingerprint of a finger placed on the protective substrate 610 corresponding to the position of the fingerprint identification element 530 . The colloid 640 is used to strengthen the fixing strength of the fingerprint identification element 630 on the ink layer 620 , and is also used to prevent water vapor from entering the fingerprint identification element 630 .

The ink layer 620 includes a first ink sub-layer 621 and a second ink sub-layer 622 which are stacked. The first ink sublayer 621 is located between the second ink sublayer 622 and the protective substrate 610 . The fingerprint identification element 630 is pasted on the first ink sub-layer 621 through the second ink sub-layer 622 . Specifically, the fingerprint identification element 630 is only embedded in the second ink sub-layer 622 . The colloid 640 is located on the second ink sub-layer 622 on both sides of the fingerprint identification element 630 .

The material of the protective substrate 610 can be selected from glass, polymethylmethacrylate (PolymethylMethacrylate, PMMA), sapphire, polyethersulfone resin (Polyethersulfone resin, PES) and polyethylene terephthalate (polyethylene terephthalate, PET), etc. The material of the first ink sub-layer 621 and the second ink sub-layer 622 can be thermosetting ink or photosetting ink, preferably ink with a dielectric coefficient greater than 7. The colors of the first ink sub-layer 621 and the second ink sub-layer 622 can be black, white or colored. The overall thickness of the ink layer 620 ranges from 2 to 10 um. Wherein, the thickness of the first ink sub-layer 621 is preferably 2 um, and the thickness of the second ink sub-layer 622 is preferably greater than the thickness of the first ink sub-layer 621 . The colloid 640 is triple glue.

Since the fingerprint identification element 630 is fixed on the first ink sub-layer 621 through the property that the second ink sub-layer 622 is converted from a liquid state to a solid state during the formation process, and then fixed on the protective substrate 610, it is not necessary to Additional glue needs to be added between the ink layer 620 and the fingerprint identification element 630 , so that the thickness of the fingerprint identification device 600 can be reduced. At the same time, the colloid 640 can strengthen the strength of the fingerprint identification element 630 fixed on the ink layer 620 without increasing the thickness of the fingerprint identification device 600, and prevent water vapor from entering the fingerprint identification element 630, thereby improving the fingerprint identification element. 630 stability.

Please refer to FIG. 7 , which is a flow chart of the manufacturing method of the fingerprint identification device. It can be understood that the manufacturing methods of the fingerprint identification devices in the above five embodiments are substantially the same. For the convenience of description, the manufacturing method of the fingerprint identification device 400 in the above third embodiment is taken as an example for illustration, and the rest of the embodiments will not be repeated. The method comprises the steps of:

In step S201 , please refer to FIG. 8 , providing a protective substrate 410 , and coating a first ink material layer 420 a on the protective substrate 410 . The material of the first ink material layer 420a can be selected from thermosetting ink or photosetting ink, preferably an ink with a dielectric coefficient greater than 7. The thickness of the first ink material layer 420a is preferably 2um. The color of the first ink material layer 420a can be black, white or colored. In this embodiment, the protective substrate 410 is a plane. It can be understood that the protective substrate 410 can also be in other shapes. For example, the plane described in the second embodiment is a curved surface. A grooved plate structure is not limited thereto.

Step S202 , please refer to FIG. 9 , curing the first ink material layer 420 a to form a first ink sub-layer 421 . Wherein, the method of curing the first ink material layer 420a includes heating the first ink material layer 420a, irradiating the first ink material layer 420a with ultraviolet light, and the like.

Step S203 , please refer to FIG. 10 , coating the second ink material layer 420 b on the first ink sub-layer 421 . The material of the second ink material layer 420b can be selected from thermosetting ink or photosetting ink, preferably an ink with a dielectric coefficient greater than 7. The thickness of the second ink material layer 420b is preferably 2um. The color of the second ink material layer 420b can be black, white or colored.

Step S204, please refer to FIG. 11, curing the second ink material layer 420b, and setting the fingerprint identification element 430 embedded in the second ink material layer 420b when the second ink material layer 420b is not fully cured. It can be understood that since the second ink material layer 420b has not been cured, the second ink material layer 420b is a viscous liquid, so after the fingerprint recognition element 430 is disposed on the second ink material layer 420b A part of the second ink material layer 420 b located between the fingerprint identification element 430 and the first ink sub-layer 421 is pressed to both sides of the fingerprint identification element 430 .

Step S205 , please refer to FIG. 12 , completes curing the second ink material layer 420 b to form the second ink sub-layer 422 . At this time, the fingerprint identification element 430 is embedded in the second ink sub-layer 422 . Wherein, the method of curing the second ink material layer 420b includes heating the second ink material layer 420b, irradiating the second ink material layer 420b with ultraviolet light, and the like.

Step S206, please refer to FIG. 13, forming colloid 440 on the second ink sub-layer 422, the colloid 440 is located on the second ink sub-layer 422 on both sides of the fingerprint identification element 430 and pasted on the fingerprint identification on both sides of the element 430.

So far, the fabrication of the fingerprint identification device 400 is completed. It can be understood that step S206 can be omitted. Moreover, for the single-layer ink layer 420, step S203 is omitted, and it is only necessary to set and embed the fingerprint identification element when the single-layer ink layer is not fully cured.

The above embodiments are only used to illustrate the technical solutions of the present invention without limitation. Although the present invention has been described in detail with reference to preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced. Without departing from the spirit and scope of the technical solution of the present invention.

Claims (11)

1. a kind of fingerprint identification device comprising protective substrate, ink layer and fingerprint recognition element, the ink layer are formed in On the protective substrate, the ink layer includes the first ink sublayer and the second ink sublayer, the first ink sublayer position Between the second ink sublayer and the protective substrate, the fingerprint recognition element is by the second ink sublayer in shape It is embedded in the second ink sublayer at solid characteristic is converted to by liquid in the process and is pasted onto the first ink sublayer, Expose at least one surface of the fingerprint recognition element and is directly bonded with the protective substrate.

2. fingerprint identification device as described in claim 1, which is characterized in that the fingerprint identification device further includes colloid, institute State the two sides that colloid is located in the second ink sublayer of the fingerprint recognition elements on either side and is pasted onto the fingerprint recognition element.

3. fingerprint identification device as claimed in claim 2, which is characterized in that the two sides of the fingerprint recognition element are close to described One end of ink layer is covered by the colloid.

4. fingerprint identification device as described in claim 1, which is characterized in that the protective substrate includes protection face and by institute State the bending side that protection is bent towards fingerprint recognition element side.

5. fingerprint identification device as described in claim 1, which is characterized in that opened up on the protective substrate it is fluted, it is described Ink layer is formed in the groove, on the ink layer of the fingerprint recognition element setting in the groove.

6. fingerprint identification device as claimed in claim 5, which is characterized in that the fingerprint identification device further includes colloid, institute Colloid is stated to be located in the second ink sublayer of the fingerprint recognition elements on either side and affix on the fingerprint recognition element, institute The side for stating fingerprint recognition element is all covered by the colloid.

7. fingerprint identification device as described in claim 1, which is characterized in that the thickness of the ink layer is between 2 to 10um.

8. fingerprint identification device as described in claim 1, which is characterized in that the dielectric coefficient of the ink layer is not less than 7.

9. a kind of manufacturing method of fingerprint identification device, comprising:

Protective substrate is provided, and is coated with ink material layer on the protective substrate；

Solidify the ink material layer, and setting is embedded in the finger of the ink material layer when the ink material layer is not fully cured Line recognition component；And

Complete to solidify the ink material layer to form ink layer, wherein the step of coating ink material layer includes:

The first ink material layer is coated on the protective substrate；

Solidify first ink material layer to form the first ink sublayer；And

The second ink material layer is coated in the first ink sublayer, the fingerprint recognition element is in second ink material Layer is arranged in a manner of exposing at least one surface of the fingerprint recognition element when not being fully cured is embedded in the second ink material The bed of material, after completing to solidify the ink material layer, second ink material layer is cured as the second ink sublayer.

10. the manufacturing method of fingerprint identification device as claimed in claim 9, which is characterized in that after forming ink layer, the party Method further include:

Colloid is formed on the ink layer, the colloid is located on the ink layer of the fingerprint recognition elements on either side and is pasted onto On the two sides of the fingerprint recognition element.

11. the manufacturing method of fingerprint identification device as claimed in claim 9, which is characterized in that solidify the side of the ink layer Method includes carrying out heating and by ink layer described in ultraviolet light to the ink material layer.