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TWI560619B - Manufacturing method and manufacturing apparatus of fingerprint identification chip package structure - Google Patents

Manufacturing method and manufacturing apparatus of fingerprint identification chip package structure

Info

Publication number
TWI560619B
TWI560619B TW105106079A TW105106079A TWI560619B TW I560619 B TWI560619 B TW I560619B TW 105106079 A TW105106079 A TW 105106079A TW 105106079 A TW105106079 A TW 105106079A TW I560619 B TWI560619 B TW I560619B
Authority
TW
Taiwan
Prior art keywords
manufacturing
package structure
fingerprint identification
chip package
identification chip
Prior art date
Application number
TW105106079A
Other languages
English (en)
Other versions
TW201732676A (zh
Inventor
Meng-Chih Chang
Original Assignee
Chipmos Technologies Inc
Chipmos Technologies Bermuda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW105106079A priority Critical patent/TWI560619B/zh
Priority to CN201610227215.6A priority patent/CN107146763A/zh
Application granted granted Critical
Publication of TWI560619B publication Critical patent/TWI560619B/zh
Publication of TW201732676A publication Critical patent/TW201732676A/zh

Links

Classifications

    • H10W74/014—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
    • H10P72/0441—
    • H10W72/884—

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Image Input (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW105106079A 2016-03-01 2016-03-01 Manufacturing method and manufacturing apparatus of fingerprint identification chip package structure TWI560619B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW105106079A TWI560619B (en) 2016-03-01 2016-03-01 Manufacturing method and manufacturing apparatus of fingerprint identification chip package structure
CN201610227215.6A CN107146763A (zh) 2016-03-01 2016-04-13 指纹辨识芯片封装结构的制作方法及制作设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105106079A TWI560619B (en) 2016-03-01 2016-03-01 Manufacturing method and manufacturing apparatus of fingerprint identification chip package structure

Publications (2)

Publication Number Publication Date
TWI560619B true TWI560619B (en) 2016-12-01
TW201732676A TW201732676A (zh) 2017-09-16

Family

ID=58227178

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105106079A TWI560619B (en) 2016-03-01 2016-03-01 Manufacturing method and manufacturing apparatus of fingerprint identification chip package structure

Country Status (2)

Country Link
CN (1) CN107146763A (zh)
TW (1) TWI560619B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI644601B (zh) * 2017-03-03 2018-12-11 致伸科技股份有限公司 指紋辨識模組的治具及指紋辨識模組的製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109508619A (zh) * 2017-09-15 2019-03-22 南昌欧菲生物识别技术有限公司 光学指纹识别组件的制造方法及电子装置
CN110077657B (zh) * 2018-01-26 2021-03-09 致伸科技股份有限公司 指纹辨识模块包装方法
CN108427909A (zh) * 2018-01-29 2018-08-21 广东越众光电科技有限公司 一种图案化指纹模组的制作方法
CN115910865B (zh) * 2022-11-29 2023-11-24 江苏盐芯微电子有限公司 一种封装指纹识别芯片封装装置及其封装方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9425134B2 (en) * 2010-05-11 2016-08-23 Xintec Inc. Chip package
KR101238212B1 (ko) * 2010-12-23 2013-02-28 하나 마이크론(주) 반도체 패키지 및 이의 제조 방법
KR20150019415A (ko) * 2013-08-14 2015-02-25 주식회사 아이피시티 모바일 장치용 지문 센서 모듈 및 이의 제조방법
TWI485821B (zh) * 2014-02-24 2015-05-21 新東亞微電子股份有限公司 指紋辨識晶片封裝模組及其製造方法
WO2015174775A1 (ko) * 2014-05-16 2015-11-19 크루셜텍(주) 지문센서 모듈 및 이의 제조방법
TWI567834B (zh) * 2014-06-13 2017-01-21 新東亞微電子股份有限公司 指紋辨識晶片封裝模組的製造方法
CN104123564A (zh) * 2014-07-23 2014-10-29 上海思立微电子科技有限公司 带有镀膜保护层的指纹识别器件及指纹识别组件
CN104182736B (zh) * 2014-08-26 2017-08-25 南昌欧菲生物识别技术有限公司 指纹识别传感器封装结构及封装方法
CN104505347B (zh) * 2014-12-04 2017-05-24 江苏长电科技股份有限公司 一种在塑封过程中贴装石墨烯散热薄膜的方法
CN104866814B (zh) * 2015-04-17 2019-09-13 业成科技（成都）有限公司 指纹识别装置及其制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI644601B (zh) * 2017-03-03 2018-12-11 致伸科技股份有限公司 指紋辨識模組的治具及指紋辨識模組的製造方法

Also Published As

Publication number Publication date
CN107146763A (zh) 2017-09-08
TW201732676A (zh) 2017-09-16

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