TWI554715B - Led filament and filament-type led bulb - Google Patents

Description

LED filament and filament type LED bulb

The invention relates to the technical field of LED illumination, in particular to an LED filament and a filament type LED bulb.

A Light Emitting Diode (LED) is a solid-state semiconductor device that converts electrical energy into visible light, which directly converts electrical energy into light. Because LED light source has the characteristics of energy saving, long life and environmental protection, it has determined that LED is an ideal light source to replace traditional light source and has a wide range of applications.

The existing filament type LED bulb generally comprises an LED filament, a core column, a transparent lamp cover such as a spherical lamp cover, and a lamp cap such as a screw cap; wherein the translucent lamp cover and the stem are fixedly connected with the lamp cap, and the core post is housed in the transparent lamp cover and An electrode is disposed thereon to electrically connect the LED filament to the LED filament by the electrode. As shown in FIG. 1, the LED filament comprises a carrier 11 and a conductive pin 15, and the conductive electrode 13 and the conductive pin 15 on the carrier 11 are fixed together by a bonding material 14; the carrier 11 is provided with series, parallel or A plurality of LED chips 12 are connected in series and in parallel. In the previous filament type LED bulb manufacturing process, the LED filament was mostly assembled manually when assembled to the stem, because the position of the electrode E0 on the stem may be inconsistent (for example, the solid circle and the dotted circle in Fig. 1) In order to make the conductive pin 15 of the LED filament and the electrode E0 on the stem, it is necessary to use an external force to bond the two together and weld, so that the conductive pin 15 of the LED filament is pulled when the welding is aligned. The external force is pushed, which easily causes the conductive pin 15 of the LED filament to fall off or break, resulting in component failure.

Therefore, in view of the deficiencies in the prior art, the present invention proposes an LED filament and a filament type LED bulb.

Specifically, an LED filament provided by an embodiment of the invention includes: a carrier, an LED chip disposed on the carrier, and a conductive pin fixedly connected to the carrier, and the conductive pin is electrically connected to the LED chip. Among them, the conductive pin includes: a pin head, a pin tail, and a pin neck connecting the pin head and the tail of the pin, and the physical width of the pin neck is smaller than the maximum physical width of the pin head.

In one embodiment of the invention, at least one side of the pin neck is retracted relative to the pin head such that the physical width of the pin neck is less than the maximum physical width of the pin head. Further, at least one side of the pin head is provided with a recess, and/or a middle portion of the pin head is provided with a through hole.

In one embodiment of the invention, the physical width of the tail of the pin is greater than the physical width of the neck of the pin.

In an embodiment of the invention, at least one side of the pin neck and at least one side of the pin tail are retracted relative to the pin head such that the physical width of the pin neck is smaller than the pin. The maximum physical width of the head. Further, at least one side of the pin head is provided with a recess, and/or a middle portion of the pin head is provided with a through hole.

In one embodiment of the invention, the pin neck is provided with a through hole such that the physical width of the pin neck is smaller than the maximum physical width of the pin head. Further, at least one side of the pin head is provided with a recess, and/or a middle portion of the pin head is provided with a through hole.

In one embodiment of the invention, the lead leg of the conductive pin is fixedly connected by a bonding material and a conductive electrode on the carrier.

In an embodiment of the invention, the conductive pin and the carrier are of a unitary structure.

In addition, a filament type LED bulb provided by an embodiment of the invention includes: a lamp cap, a light transmissive lamp cover, a core post and an LED filament, and the translucent lamp cover and the stem are fixedly connected with the lamp cap. The LED filament comprises: a carrier, an LED chip disposed on the carrier, and a conductive pin fixedly connected to the carrier, wherein the conductive pin is electrically connected to the LED chip and the LED filament is connected to the stem by the conductive pin. Furthermore, the conductive pins include: a pin head, a pin tail, and a pin neck connecting the pin head and the tail of the pin; the pin neck is retracted in the width direction with respect to the pin head or A through hole is formed in the neck of the pin to form a pin neck having a reduced physical width.

In one embodiment of the present invention, at least one side of the pin head is provided with a recess, and/or a middle portion of the pin head is provided with a through hole.

In one embodiment of the invention, the physical width of the tail of the pin is greater than or equal to the physical width of the neck of the pin.

In one embodiment of the invention, the lead pins of the conductive pins in the filament type LED bulb are fixedly connected by a bonding material and a conductive electrode on the carrier.

In an embodiment of the invention, the conductive pin in the filament type LED bulb is integrated with the carrier.

In addition, an LED filament provided by an embodiment of the invention includes: a strip carrier, at least one LED chip, and a conductive pin. The at least one LED chip is disposed on the strip carrier; the conductive pin is disposed at one end of the strip carrier and electrically connected to the at least one LED chip. The conductive pin includes an adhesive region connected to the strip carrier, a stress relief region, and a solder region.

In one embodiment of the invention, the stress relief region is a region of the conductive pin having a reduced physical width relative to the bond region.

In one embodiment of the invention, the stress relief region is a region of the conductive pin that has a smaller thickness relative to the bond region.

In an embodiment of the invention, the bonding region and the bonding region are both a plurality of conductive structures, and the stress releasing region is a single-layer conductive structure.

As can be seen from the above, the embodiment of the present invention adopts a method of making the neck of the pin with respect to the width of the pin head or opening a through hole at the neck of the pin to form a pin neck having a reduced physical width, or The neck of the pin is made to have a small thickness relative to the head of the pin, so that the neck of the pin becomes a weak point of the conductive pin; when the stress is generated, the pin neck acts first, thereby protecting The pin head and the carrier are either the carrier itself. Furthermore, by forming a recess in the side of the lead head and/or opening a through hole in the middle portion, the joint area of the pin head and the carrier is increased, so that the bonding strength between the pin head and the carrier can be increased.

The above described objects, features and advantages of the present invention will become more apparent from the aspects of the appended claims. [First Embodiment]

Referring to FIG. 2A, an LED filament provided by a first embodiment of the present invention includes a carrier 21, a plurality of LED chips 22 disposed on the carrier 21, and a conductive pin 25 fixedly coupled to the carrier 21. The carrier 21 is used to carry the LED chip 22, which is, for example, a transparent material such as a transparent ceramic, a sapphire or a glass substrate; and the plurality of LED chips 22 are connected in series, in parallel or in series and parallel, for example, and are usually fixed on the carrier 21. On one side, each LED chip 22 can be electrically connected by a metal wire and connected to a conductive electrode 23 adhered or printed on the carrier 21, where the conductive electrode 23 is, for example, a silver pad (Ag pad); a conductive pin 25 is electrically coupled to the plurality of LED chips 22 to provide an external power source to the plurality of LED chips 22, including a pin header 251, a pin tail 255, and a lead neck connecting the pin header 251 and the pin tail 255 253, the pin header 251, the lead neck 253, and the pin tail 255 are typically of a unitary structure; the lead head 251 is fixed to the conductive electrode on the carrier 21 by a material (refer to reference numeral 14 in FIG. 1). 23, so that the conductive pin 25 is fixedly connected to the carrier 21, where the bonding material is, for example, solder paste; in addition, in order to ensure the subsequent reliability of the conductive pin 25 and the carrier 21, preferably the conductive pin 25 and the conductive electrode The subsequent length of 23 is the conductive pin 25 The total length of between 1/4 to 3/4.

In the above, the two sides of the pin head 251 are provided with a circular arc-shaped recess 2510 and a circular through hole 2512 is formed in the middle portion, so that the joint area of the pin head 251 and the carrier 21 is increased, thereby increasing the The strength of the bond of the carrier 21. Both sides of the pin neck 253 are retracted relative to the pin head 251, that is, the pin neck 253 is retracted in the width direction with respect to the pin head 251 to reduce the physical width of the pin neck 253. As a weak point of the conductive pin 25, when the stress is generated, the pin neck 253 is actuated first (for example, bent and deformed first), thereby protecting the pin head 251 and the carrier 21. Both side edges of the pin tail portion 255 are not retracted with respect to the pin head portion 251, and recesses and through holes are not provided at both side edges and intermediate portions. In this embodiment, as shown in FIG. 2A, the maximum physical width of the pin head 251 is W1, the physical width of the pin neck 253 is W3, and the maximum physical width of the pin tail 255 is W5, and the relationship is satisfied: W5 =W1>W3. [Second embodiment]

Referring to FIG. 2B, a conductive pin 35 for an LED filament provided by a second embodiment of the present invention includes: a pin header 351, a pin tail 355, and a pin neck connecting the pin header 351 and the pin tail 355. Portion 353, pin head 351, lead neck 353, and pin tail 355 are typically unitary in construction.

A circular arc-shaped recess 3510 is formed on both sides of the lead portion 351, so that the joint area of the lead portion 351 and the carrier 21 is increased, thereby increasing the bonding strength with the carrier 21. Both sides of the pin neck 353 are retracted with respect to the pin head 351, that is, the pin neck 353 is retracted in the width direction with respect to the pin head 351 to reduce the physical width of the pin neck 353. It becomes a weak point of the conductive pin 35. Both side edges of the pin tail 355 are not retracted with respect to the pin head 351, and no recess is provided on both side edges thereof. In this embodiment, as shown in FIG. 2B, the maximum physical width of the lead head 351 is W1, the physical width of the lead neck 353 is W3, and the maximum physical width of the lead tail 355 is W5, and the relationship is satisfied: W5 =W1>W3. [Third embodiment]

Referring to FIG. 2C, a conductive pin 45 for an LED filament provided by a third embodiment of the present invention includes: a pin header 451, a pin tail 455, and a pin neck connecting the pin head 451 and the pin tail 455. Portion 453, pin head 451, pin neck 453, and pin tail 455 are typically unitary in construction.

A circular arc-shaped recess 4510 is formed on both sides of the pin head portion 451, and a circular through hole 4512 is formed in the middle portion, so that the joint area of the pin head portion 451 and the carrier 21 is increased, thereby increasing the contact area with the carrier 21. Then the intensity. Both sides of the pin neck 453 and both sides of the pin tail 455 are retracted relative to the pin head 451, that is, the pin neck 453 and the pin tail 455 are in width relative to the pin head 451. The overall contraction in the direction is to reduce the physical width of the lead neck 453 and become a weak point of the conductive pin 45. In this embodiment, as shown in FIG. 2C, the maximum physical width of the pin head 451 is W1, the physical width of the lead neck 453 is W3, and the physical width of the lead tail 455 is W5, and the relationship is satisfied: W1> W3=W5. Fourth Embodiment

Referring to FIG. 2D, a conductive pin 55 for an LED filament according to a fourth embodiment of the present invention includes: a pin header 551, a pin tail 555, and a pin neck connecting the pin header 551 and the pin tail 555. Portion 553, pin head 551, pin neck 553 and pin tail 555 are typically of unitary construction.

A square recess 5510 is formed on both sides of the pin head 551, so that the joint area of the pin head 551 and the carrier 21 is increased, thereby increasing the bonding strength with the carrier 21. Both sides of the pin neck 553 and both sides of the pin tail 555 are retracted relative to the pin head 551, that is, the pin neck 553 and the pin tail 555 are in width relative to the pin head 551. The overall inward direction is reduced to reduce the physical width of the pin neck 553 and become a weak point of the conductive pin 55. In this embodiment, as shown in FIG. 2D, the maximum physical width of the pin head 551 is W1, the physical width of the pin neck 553 is W3, and the physical width of the pin tail 555 is W5, and the relationship is satisfied: W1> W3=W5. [Fifth Embodiment]

Referring to FIG. 2E, a conductive pin 65 for an LED filament according to a fifth embodiment of the present invention includes: a pin header 651, a pin tail 655, and a lead neck connecting the pin header 651 and the pin tail 655. Portion 653, pin head 651, pin neck 653 and pin tail 655 are typically unitary in construction.

A circular arc-shaped recess 6510 is formed on both sides of the pin head 651, and a square through hole 6512 is formed in the middle portion, so that the joint area of the pin head 651 and the carrier 21 is increased, thereby increasing the adhesion to the carrier 21. strength. The two sides of the pin neck 653 are retracted relative to the pin head 651, that is, the pin neck 653 is retracted in the width direction with respect to the pin head 651 to reduce the physical width of the pin neck 653. It becomes a weak point of the conductive pin 65. Both sides of the pin tail portion 655 are not retracted with respect to the pin head portion 651, and recesses and through holes are not provided at both side edges and intermediate portions. In this embodiment, as shown in FIG. 2E, the maximum physical width of the pin head 651 is W1, the physical width of the pin neck 653 is W3, and the physical width of the pin tail 655 is W5, and the relationship is satisfied: W5= W1>W3. [Sixth embodiment]

Referring to FIG. 2F, a conductive pin 75 for an LED filament according to a sixth embodiment of the present invention includes: a pin header 751, a pin tail 755, and a pin neck connecting the pin header 751 and the pin tail 755. Portion 753, pin head 751, pin neck 753, and pin tail 755 are typically unitary in construction.

A circular arc-shaped recess 7510 is formed on both sides of the pin head 751, and a circular through hole 7512 is formed in the middle portion, so that the joint area of the pin head 751 and the carrier 21 is increased, thereby increasing the contact area with the carrier 21. Then the intensity. A square through hole 7532 is formed in the middle of the pin neck 753 to reduce the physical width of the pin neck 753 and become a weak point of the conductive pin 75. Both sides of the pin tail portion 755 are not retracted with respect to the pin head portion 751, and recesses and through holes are not provided at both side edges and intermediate portions. In this embodiment, as shown in FIG. 2F, the maximum physical width of the pin head 751 is W1, and the physical width of the pin neck 753 is W3 (ie, W3/2+ W3/2), and the tail of the pin 755 The entity width is W5 and the relationship is satisfied: W5=W1>W3. [Seventh embodiment]

Referring to FIG. 2G, a conductive pin 85 for an LED filament according to a seventh embodiment of the present invention includes: a pin header 851, a pin tail 855, and a pin neck connecting the pin head 851 and the pin tail 855. Portion 853, pin head 851, pin neck 853, and pin tail 855 are typically unitary in construction.

A circular arc-shaped recess 8510 is formed on both sides of the pin head 851, and a circular through hole 8512 is formed in the middle portion, so that the joint area of the lead head 851 and the carrier 21 is increased, thereby increasing the contact area with the carrier 21. Then the intensity. A circular through hole 8532 is formed in the middle of the pin neck 853 to reduce the physical width of the pin neck 853 and become a weak point of the conductive pin 85. Both sides of the pin tail portion 855 are not retracted with respect to the pin head portion 851, and recesses and through holes are not provided at both side edges and intermediate portions. In this embodiment, as shown in FIG. 2G, the maximum physical width of the pin head 851 is W1, and the physical width of the pin neck 853 is W3 (ie, W3/2+ W3/2), and the tail of the pin 855 The entity width is W5 and the relationship is satisfied: W5=W1>W3.

Here, it is worthwhile to integrate that the recesses formed on the sides of the pin heads of the respective conductive pins in the foregoing first to seventh embodiments are not limited to circular arcs and squares, and may be any other shape such as a triangle. And, the recess is not limited to be opened on both sides of the pin head, and may be opened on one side of the pin head; further, the through hole in the middle of the pin head is not limited to Round, square, which can be any other shape, such as a triangle or the like. In addition, the through hole formed in the middle portion of the neck portion of the pin is not limited to a square shape or a circular shape, and may be any other shape such as a triangle. [Eighth Embodiment]

Referring to FIG. 3, an LED filament provided by an eighth embodiment of the present invention includes a carrier 91, a plurality of LED chips 92 disposed on the carrier 91, and a conductive lead extending from the carrier 91 and extending outward from the carrier 91. Feet 95. The carrier 91 is used to carry the LED chip 92, which is, for example, a conductive material such as a metal substrate, and preferably has a through hole (not shown in FIG. 3) on the metal substrate to partially transmit the carrier 91; The LED chips 92 are connected, for example, in series, parallel or series-parallel manner and are usually fixed on one side of the carrier 91. Each of the LED chips 92 can be electrically connected by a metal wire formed on the carrier 91; the conductive pins 95 and The plurality of LED chips 92 are electrically connected to provide an external power source to the plurality of LED chips 92, including a pin header 951, a pin tail 955, and a pin neck 953 connecting the pin header 951 and the pin tail 955. The lead head 951, the lead neck 953, and the lead tail 955 are typically of unitary construction.

In the above, both sides of the pin neck 953 and both sides of the pin tail 955 are retracted relative to the pin head 951, that is, the pin neck 953 and the pin tail 955 are opposite to the pin head. The 951 is internally retracted in the width direction to reduce the physical width of the lead neck portion 953 to become a weak point of the conductive pin 95. In this embodiment, as shown in FIG. 3, the physical width of the pin head 951 is W1, the physical width of the pin neck 953 is W3, and the physical width of the pin tail 955 is W5, and the relationship is satisfied: W1>W3 =W5.

It is worth mentioning here that in the foregoing eighth embodiment, the manner in which the through-holes of the lead neck are opened can be used to replace the width of the lead neck in the width direction to reduce the physical width of the lead neck. In addition, the shape design of the pin tail can also adopt the structure shown in FIGS. 2A, 2B, 2E, 2F, and 2G. Ninth Embodiment

Referring to FIG. 4 , a filament type LED bulb 100 according to a ninth embodiment of the present invention includes a lamp cap 1001 , a light transmissive lamp cover 1003 , a stem 1005 , and at least one LED filament 1007 . The lamp cap 1001 is, for example, a threaded lamp cap; the light transmissive lamp cover 1003 and the stem 1005 are fixedly connected to the lamp cap 1001; the stem 1005 is usually further provided with a wire as a positive and negative poles of the power source, and the positive and negative poles of the power source are connected to the external power source through the lamp cap 1001. The conductive pin 10071 on the LED filament 1007 is electrically coupled to the positive and negative terminals of the power supply on the stem 1005 to provide an external power source to the LED chip on the LED filament 1007. Moreover, the number of LED filaments 1007 is one or more, and the specific number depends on the requirements in practical applications. In this embodiment, the LED filament 1007 can adopt the LED filament of the first embodiment shown in FIG. 2A or the LED filament of the eighth embodiment shown in FIG. 3, and the structure of the conductive pin 10071 in the LED filament can also adopt a diagram. 2A to 2G, the structure of the various conductive pins; the specific structure of each component of the LED filament 1007 can be referred to FIG. 2A to 2G and FIG. 3, and details are not described herein again.

In addition, it is worth mentioning that, according to the physical widths indicated in FIGS. 2A-2G and FIG. 3, the physical widths in the above first to eighth embodiments of the present invention can be understood as: various components of the conductive pins (pins) The width of the non-empty portion in the width direction of the head, the neck of the pin, and the tail of the pin, respectively.

Finally, it is also worth mentioning that the various embodiments described above divide the conductive pins into pin headers, pin necks, and pin tails. Wherein, the pin head is adapted to be fixedly connected to the carrier, for example, by adhesive bonding, and the pin head can also be referred to as a bonding area, where the carrier is usually a strip structure for application. LED filament; the neck of the pin has a reduced physical width relative to the pin head and becomes a stress relief area; the tail of the pin is adapted to be soldered to the electrode on the stem of the filament type LED bulb, so the pin can also be used The tail is called the weld zone. Furthermore, the foregoing embodiments have a reduced physical width of the stress relief region (corresponding to the pin neck) relative to the bonding region (corresponding to the pin head), but the invention is not limited thereto, and may be The stress relief zone has a relatively small thickness relative to the bond zone, such as the embodiment shown in FIG.

Specifically, as shown in FIG. 5, the conductive pin 115 includes a pin head 1151, a pin neck 1153, and a pin tail 1155, which respectively correspond to a bonding region, a stress relief region, and a bonding region. Furthermore, in order to achieve a small thickness of the pin neck 1153 with respect to the pin head 1151, for example, the lead head 1151 and the pin tail 1155 are each provided in a plurality of layers (for example, two or more layers). The pin neck 1153 is provided as a single layer of conductive structure.

In summary, the above embodiment of the present invention reduces the physical width of the lead neck by reducing the width of the lead neck relative to the pin head or by opening a through hole in the neck of the lead, or The neck of the pin becomes a weak point of the conductive pin by making the neck of the lead have a small thickness relative to the head of the pin; when the stress is generated, the pin neck is actuated first (for example, the bend is advanced) Deformation) to protect the pin head from the carrier or the carrier itself. Furthermore, by forming a recess in the side of the lead head and/or opening a through hole in the middle portion, the joint area of the pin head and the carrier is increased, so that the bonding strength between the pin head and the carrier can be increased.

So far, the principle and implementation of the LED filament and the filament type LED bulb of the present invention have been described in the specific examples. The description of the above embodiments is only used to help understand the method and core idea of the present invention; The present invention is not limited by the scope of the present invention, and the scope of the present invention is not limited by the scope of the present invention. The scope of the attached patent application shall prevail.

11, 21, 91‧ ‧ carrier
12, 22, 92‧‧‧ LED chips
14‧‧‧Next material
13, 23‧‧‧ conductive electrodes
E0‧‧‧electrode
15, 25, 35, 45, 55, 65, 75, 85, 95, 11071, 115‧‧‧ conductive pins
251, 351, 451, 551, 651, 751, 851, 951, 1151‧‧ ‧ pin head
2510, 3510, 4510, 5510, 6510, 7510, 8510‧‧‧
2512, 4512, 6512, 7512, 8512‧‧ ‧ through hole in the pin head
7532, 8532‧‧ ‧ pin neck through hole
253, 353, 453, 553, 653, 753, 853, 953, 1153 ‧ ‧ lead neck
255, 355, 455, 555, 655, 755, 855, 955, 1155‧‧‧ pin tail
W1, W3, W5‧‧‧ entity width
100‧‧‧filament type LED bulb
1001‧‧‧ lamp holder
1003‧‧‧Lighting lampshade
1005‧‧‧ core column
1007‧‧‧filament

1 is a schematic structural view of a prior art LED filament. 2A is a schematic structural view of an LED filament according to a first embodiment of the present invention. 2B is a schematic structural view of a conductive pin according to a second embodiment of the present invention. 2C is a schematic structural view of a conductive pin according to a third embodiment of the present invention. 2D is a schematic structural view of a conductive pin according to a fourth embodiment of the present invention. 2E is a schematic structural view of a conductive pin according to a fifth embodiment of the present invention. 2F is a schematic structural view of a conductive pin according to a sixth embodiment of the present invention. 2G is a schematic structural view of a conductive pin according to a seventh embodiment of the present invention. 3 is a schematic structural view of an LED filament according to an eighth embodiment of the present invention. 4 is a schematic structural view of a filament type LED bulb according to a ninth embodiment of the present invention. FIG. 5 is a schematic structural view of a conductive pin according to another embodiment of the present invention.

21‧‧‧ Carrier

22‧‧‧LED chip

23‧‧‧Conductive electrode

25‧‧‧Electrical pins

251‧‧‧ pin head

2510‧‧‧ dent

2512‧‧‧through hole

253‧‧‧ pin neck

255‧‧‧ pin tail

W1, W3, W5‧‧‧ entity width

Claims (10)

An LED filament comprising: a carrier, an LED chip disposed on the carrier, and a conductive pin fixedly coupled to the carrier, wherein the conductive pin is electrically connected to the LED chip; wherein the conductive lead The foot includes: a pin head, a pin tail, and a lead neck connecting the pin head and the tail of the pin; the pin neck is provided with a through hole to make the pin neck The physical width is less than the maximum physical width of the pin head. The LED filament of claim 1, wherein at least one side of the lead head is provided with a recess, and/or a middle portion of the lead head is provided with a through hole. The LED filament of claim 1, wherein the physical width of the tail of the pin is greater than the physical width of the neck of the pin. The LED filament of claim 1, wherein the pin head of the conductive pin is fixedly connected by a bonding material and a conductive electrode on the carrier, or the conductive pin is The carrier is a unitary structure. A filament type LED bulb comprising: a lamp cap, a transparent lamp cover, a stem and an LED filament, wherein the translucent lamp cover and the stem are fixedly connected to the lamp cap, the LED filament comprises: a carrier disposed on the carrier And an LED chip, and a conductive pin fixedly connected to the carrier, the conductive pin is electrically connected to the LED chip, and the LED filament is connected to the stem through the conductive pin; The conductive pin includes: a pin head, a pin tail, and a lead neck connecting the pin head and the tail of the pin; the lead neck has a through hole formed therein to form Reduce the body width of the pin neck. The filament type LED bulb of claim 5, wherein at least one side of the pin head is provided with a recess, and/or a middle portion of the lead head is provided with a through hole. The filament type LED bulb of claim 5, wherein the physical width of the tail of the lead is greater than the physical width of the neck of the lead. The filament type LED bulb of claim 5, wherein the pin head of the conductive pin is fixedly connected by a bonding material and a conductive electrode on the carrier, or the conductive pin is The carrier is a unitary structure. An LED filament comprising: a strip-shaped carrier; at least one LED chip disposed on the strip carrier; and a conductive pin disposed at one end of the strip carrier and electrically connected to the at least one LED chip The conductive pin includes a bonding region connected to the strip carrier, a stress releasing region, and a soldering region; wherein the stress releasing region is provided with a through hole such that the stress releasing region is An area of the conductive pin having a reduced physical width relative to the bond area, or the stress relief area is a region of the conductive pin having a smaller thickness relative to the bond area. The LED filament of claim 9, wherein the stress relief region is a single layer of the conductive pin having a smaller thickness relative to the bonding region. The conductive structure and the bonding region and the bonding region are both multilayer conductive structures.