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CN203979910U - COB-LED light source and lamps - Google Patents

COB-LED light source and lamps Download PDF

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Publication number
CN203979910U
CN203979910U CN201320430738.2U CN201320430738U CN203979910U CN 203979910 U CN203979910 U CN 203979910U CN 201320430738 U CN201320430738 U CN 201320430738U CN 203979910 U CN203979910 U CN 203979910U
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light
cob
led
light source
transmitting
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CN201320430738.2U
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肖文玉
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Hong Shengxiang Photoelectric Lighting Science And Technology Ltd Of Zhongshan City
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Zhongshan Wanpu Electronic Technology Co ltd
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    • H10W74/00
    • H10W90/753

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Abstract

The utility model relates to a LED technical field provides a COB-LED light source and lamps and lanterns. The COB-LED light source comprises a light-transmitting substrate, a plurality of LED chips and a light-transmitting packaging body; the printing opacity base plate edge is equipped with anodal pad and negative pole pad, and printing opacity base plate middle part is equipped with the printed circuit line, and a plurality of LED chips are located printing opacity base plate upper surface and loop through the printed circuit line and switch on the series connection between anodal pad and negative pole pad, and the printing opacity packaging body is located printing opacity base plate upper surface and is covered a plurality of LED chips, and printing opacity base plate lower surface is equipped with the reflector layer, and the reflection of light face and a plurality of LED chips of reflector layer are relative. The COB-LED light source has the advantages of uniform light, large light-emitting angle, wide irradiation range and high light-emitting efficiency; a plurality of LEDs in the COB-LED light source are connected in series, so that a power circuit of the plurality of LEDs only needs one rectifier bridge circuit and one constant current IC, and the circuit cost is saved.

Description

COB-LED光源及灯具COB-LED light source and lamps

技术领域technical field

本实用新型涉及LED技术领域,尤其涉及一种COB-LED光源及灯具。The utility model relates to the technical field of LEDs, in particular to a COB-LED light source and a lamp.

背景技术Background technique

COB-LED光源是指将数个LED芯片贴在基板上所形成的集成面光源。COB-LED光源技术剔除了支架概念,无电镀、无回流焊、无贴片工序,因此制造工序减少近三分之一,成本也随之节约了近三分之一。COB-LED light source refers to an integrated surface light source formed by pasting several LED chips on a substrate. COB-LED light source technology eliminates the concept of brackets, no electroplating, no reflow soldering, and no SMT process, so the manufacturing process is reduced by nearly one-third, and the cost is also saved by nearly one-third.

COB(Chip On Board,中文:板上芯片)工艺流程首先是在基板上表面用导热环氧树脂(一般用掺银颗粒的环氧树脂)覆盖芯片安放点,然后将芯片直接安放在基板上表面,热处理至芯片牢固地固定在基板上表面为止,随后再用焊线的方法在芯片和基板之间直接建立电气连接。The COB (Chip On Board, Chinese: chip on board) process first covers the chip placement point on the upper surface of the substrate with thermally conductive epoxy resin (generally epoxy resin doped with silver particles), and then directly places the chip on the upper surface of the substrate. , heat treatment until the chip is firmly fixed on the upper surface of the substrate, and then use the wire bonding method to directly establish an electrical connection between the chip and the substrate.

现有COB-LED光源主要是将LED芯片贴在表面为镜面的基板上,依靠镜面反射LED芯片所发出的光线来提高出光效率,这类COB-LED光源通常的光效只有70-80lm/W,这是因为LED向下发射出的光线未被有效利用所致。而且,上述COB-LED光源的出光角度也较小,其光线指向性过强,不适于有特殊要求的领域运用。The existing COB-LED light source is mainly to paste the LED chip on the substrate with a mirror surface, and rely on the mirror surface to reflect the light emitted by the LED chip to improve the light output efficiency. The light efficiency of this type of COB-LED light source is usually only 70-80lm/W , this is because the light emitted downward by the LED is not effectively utilized. Moreover, the above-mentioned COB-LED light source has a small light emitting angle, and its light directivity is too strong, so it is not suitable for use in fields with special requirements.

实用新型内容Utility model content

本实用新型的目的在于克服现有技术之缺陷,提供了一种出光效率高、出光角度大、均光效果好的COB-LED光源。The purpose of the utility model is to overcome the defects of the prior art and provide a COB-LED light source with high light output efficiency, large light output angle and good light uniformity effect.

为此,本实用新型采用以下技术方案:For this reason, the utility model adopts the following technical solutions:

一种COB-LED光源,包括透光基板、多个LED芯片及透光封装体;A COB-LED light source, comprising a light-transmitting substrate, a plurality of LED chips and a light-transmitting package;

所述透光基板边缘设有正极焊盘和负极焊盘,所述透光基板中部设有印刷电路线,所述多个LED芯片设于所述透光基板上表面并依次通过所述印刷电路线导通串联于所述正极焊盘和负极焊盘之间,所述透光封装体设于所述透光基板上表面且覆盖所述多个LED芯片,所述透光基板下表面设有反光层,所述反光层的反光面与所述多个LED芯片相对。Positive pads and negative pads are provided on the edge of the transparent substrate, printed circuit lines are provided in the middle of the transparent substrate, and the plurality of LED chips are arranged on the upper surface of the transparent substrate and pass through the printed circuit in turn. The wire conduction is connected in series between the positive pad and the negative pad, the light-transmitting package is arranged on the upper surface of the light-transmitting substrate and covers the plurality of LED chips, and the lower surface of the light-transmitting substrate is provided with A reflective layer, the reflective surface of the reflective layer is opposite to the plurality of LED chips.

进一步的,所述透光封装体包括透光围坝以及凝结于所述透光围坝所围成的区域内的荧光胶,所述多个LED芯片位于所述透光围坝所围成的区域内,所述荧光胶覆盖所述LED芯片。Further, the light-transmitting package includes a light-transmitting dam and fluorescent glue condensed in the area surrounded by the light-transmitting dam, and the plurality of LED chips are located in the area surrounded by the light-transmitting dam. In the region, the fluorescent glue covers the LED chip.

进一步的,所述反光层为银镀层。Further, the reflective layer is silver plating.

进一步的,所述反光层为镍镀层。Further, the reflective layer is nickel plating.

进一步的,所述反光层为贴附于所述透光基板下表面的反光片。Further, the reflective layer is a reflective sheet attached to the lower surface of the transparent substrate.

本实用新型还提供了一种灯具,包括灯壳,还包括上述的COB-LED光源,所述COB-LED光源设于所述灯壳内。The utility model also provides a lamp, which includes a lamp housing and the above-mentioned COB-LED light source, and the COB-LED light source is arranged in the lamp housing.

本实用新型所提供的COB-LED光源具有以下技术效果:The COB-LED light source provided by the utility model has the following technical effects:

该COB-LED光源通过在透光基板下表面设置反光层,可将多个LED芯片向下发射的光线反射出透光基板上表面,充分利用了LED芯片所发出的所有光线,提升了LED光源的出光效率;由光学原理可知,该COB-LED光源还能达到出光角度大的效果,适于有特殊要求的领域运用。因此,该COB-LED光源所发出的光线均匀、出光角度大、照射范围广、出光效率高。The COB-LED light source is provided with a reflective layer on the lower surface of the light-transmitting substrate, which can reflect the light emitted downwards from multiple LED chips to the upper surface of the light-transmitting substrate, making full use of all the light emitted by the LED chips, and improving the LED light source. High light output efficiency; From the optical principle, the COB-LED light source can also achieve the effect of large light output angle, which is suitable for applications in fields with special requirements. Therefore, the light emitted by the COB-LED light source is uniform, the light emission angle is large, the irradiation range is wide, and the light emission efficiency is high.

此外,该COB-LED光源中的多个LED芯片采用串联连接,因此该多个LED芯片的电源电路只需要一个整流桥电路以及一颗恒流IC即可,节省了电路成本。In addition, multiple LED chips in the COB-LED light source are connected in series, so the power supply circuit of the multiple LED chips only needs a rectifier bridge circuit and a constant current IC, which saves circuit costs.

本实用新型还提供了一种灯具,包括灯壳及上述COB-LED光源,所述COB-LED光源设于所述灯壳内。The utility model also provides a lamp, which includes a lamp housing and the above-mentioned COB-LED light source, and the COB-LED light source is arranged in the lamp housing.

采用了上述COB-LED光源的灯具所发出的光线具有均匀、出光角度大、照射范围广、出光效率高的优点。The light emitted by the lamp using the above-mentioned COB-LED light source has the advantages of uniformity, large light emission angle, wide irradiation range and high light emission efficiency.

附图说明Description of drawings

图1为本实用新型实施例中COB-LED光源的主视图;Fig. 1 is the front view of the COB-LED light source in the embodiment of the utility model;

图2为图1中A-A的剖视图;Fig. 2 is the sectional view of A-A among Fig. 1;

图3为本实用新型实施例中COB-LED光源的后视图;Fig. 3 is the rear view of the COB-LED light source in the embodiment of the utility model;

图4为本实用新型实施例中透光基板上表面未设透光封装体的示意图;Fig. 4 is a schematic diagram of an upper surface of a light-transmitting substrate without a light-transmitting package in an embodiment of the present invention;

图5为本实用新型实施例中COB-LED光源使用时的光路图;Fig. 5 is the optical path diagram when the COB-LED light source is used in the embodiment of the utility model;

图6为本实用新型实施例中COB-LED光源的电源电路示意图。Fig. 6 is a schematic diagram of the power supply circuit of the COB-LED light source in the embodiment of the present invention.

具体实施方式Detailed ways

为了使本实用新型的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本实用新型进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本实用新型,并不用于限定本实用新型。In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model.

参见图1~4。See Figures 1-4.

一种COB-LED光源,包括透光基板1、多个LED芯片2及透光封装体3;透光基板1边缘设有正极焊盘11和负极焊盘12,透光基板1中部设有印刷电路线13,多个LED芯片2设于透光基板1上表面并依次通过印刷电路线13导通串联于正极焊盘11和负极焊盘12之间,透光封装体3设于透光基板1上表面且覆盖多个LED芯片2,透光基板1下表面设有反光层4,反光层4的反光面与多个LED芯片2相对。A COB-LED light source, comprising a light-transmitting substrate 1, a plurality of LED chips 2 and a light-transmitting package body 3; the edge of the light-transmitting substrate 1 is provided with a positive electrode pad 11 and a negative electrode pad 12, and the middle of the light-transmitting substrate 1 is provided with a printed The circuit wire 13, a plurality of LED chips 2 are arranged on the upper surface of the light-transmitting substrate 1 and are sequentially connected in series between the positive electrode pad 11 and the negative electrode pad 12 through the printed circuit wire 13, and the light-transmitting package body 3 is arranged on the light-transmitting substrate The upper surface of 1 covers a plurality of LED chips 2 , and the lower surface of the light-transmitting substrate 1 is provided with a reflective layer 4 , and the reflective surface of the reflective layer 4 is opposite to the plurality of LED chips 2 .

以下结合图5对该COB-LED光源的发光效果作进一步说明。点亮多个LED芯片2时,多个LED芯片2所发出的光线向四面八方发射,其中向下射出的光线直接进入透光基板1,当光线射于反光层4时,光线被反光层4反射,经过多次往返反射,光线最终将射出透光基板1上表面,有效利用了由多个LED芯片2向下射出的光线,同时,由于最终被反射出透光基板1上表面的光线与垂直方向成角度,起到散光的效果,整体出光角度大。可见,该COB-LED光源通过在透光基板1下表面设置反光层4,可将多个LED芯片2向下发射的光线反射出透光基板1上表面,充分利用了LED所发出的所有光线,提升了LED的出光效率;由光学原理可知,该COB-LED光源还能达到出光角度大的效果。The luminous effect of the COB-LED light source will be further described below with reference to FIG. 5 . When a plurality of LED chips 2 are lit, the light emitted by the plurality of LED chips 2 is emitted in all directions, and the light emitted downwards directly enters the light-transmitting substrate 1, and when the light is incident on the reflective layer 4, the light is reflected by the reflective layer 4 , after multiple round-trip reflections, the light will finally exit the upper surface of the transparent substrate 1, which effectively utilizes the downward emission of light from a plurality of LED chips 2, and at the same time, because the light that is finally reflected from the upper surface of the transparent substrate The direction is angled, which has the effect of astigmatism, and the overall light output angle is large. It can be seen that by setting the reflective layer 4 on the lower surface of the light-transmitting substrate 1, the COB-LED light source can reflect the light emitted downwards from multiple LED chips 2 to the upper surface of the light-transmitting substrate 1, making full use of all the light emitted by the LEDs. , which improves the light output efficiency of the LED; it can be seen from the optical principle that the COB-LED light source can also achieve the effect of a large light output angle.

此外,结合图6。该COB-LED光源中的多个LED芯片2采用串联连接,因此该多个LED芯片2的电源电路只需要一个整流桥电路5以及一颗恒流IC6即可,节省了电路成本。In addition, in conjunction with Figure 6. Multiple LED chips 2 in the COB-LED light source are connected in series, so the power supply circuit of the multiple LED chips 2 only needs one rectifier bridge circuit 5 and one constant current IC6, which saves circuit cost.

作为本实用新型的进一步改进,透光封装体3包括透光围坝31以及凝结于透光围坝31所围成的区域内的荧光胶32,多个LED芯片2位于透光围坝31所围成的区域内,荧光胶32覆盖多个LED芯片2。透光围坝31和荧光胶32允许光线通过,有效利用光线的同时,还起到均光的效果。透光围坝31的材料可为硅胶或树脂。荧光胶32为萤光粉加硅胶或树脂混合组成。As a further improvement of the present utility model, the light-transmitting package body 3 includes a light-transmitting dam 31 and fluorescent glue 32 condensed in the area surrounded by the light-transmitting dam 31, and a plurality of LED chips 2 are located in the area surrounded by the light-transmitting dam 31. In the enclosed area, fluorescent glue 32 covers a plurality of LED chips 2 . The light-transmitting dam 31 and the fluorescent glue 32 allow light to pass through, effectively utilizing the light and at the same time playing an effect of light uniformity. The material of the transparent dam 31 can be silica gel or resin. The fluorescent glue 32 is composed of fluorescent powder plus silica gel or resin.

作为本实用新型关于反光层4的其中一种实施方式,反光层4可为银镀层。As one of the embodiments of the present invention concerning the reflective layer 4, the reflective layer 4 may be a silver plated layer.

作为本实用新型关于反光层4的另一种实施方式,反光层4也可为镍镀层。As another embodiment of the present invention regarding the reflective layer 4, the reflective layer 4 may also be a nickel plating layer.

作为本实用新型关于反光层4的又一种实施方式,反光层4亦可为贴附于透光基板1下表面的反光片。As yet another embodiment of the present invention regarding the reflective layer 4 , the reflective layer 4 may also be a reflective sheet attached to the lower surface of the transparent substrate 1 .

上述三种关于反光层4的实施方式均具有各自的技术效果,生产时可根据实际需要选用任意一种实施方式。当然,反光层4的设置并不限于以上三种方式,任何可以达到反光效果的实施方式均属于本实用新型的保护范围之内。The above three implementations of the reflective layer 4 all have their own technical effects, and any implementation can be selected according to actual needs during production. Of course, the arrangement of the reflective layer 4 is not limited to the above three methods, and any embodiment that can achieve the reflective effect falls within the protection scope of the present invention.

另外,透光基板1可为具有高透光率的蓝宝石基板、玻璃基板或者采用其他具有高透光率的材料制成的基板。In addition, the transparent substrate 1 can be a sapphire substrate with high light transmittance, a glass substrate or a substrate made of other materials with high light transmittance.

本实用新型实施例还提供了一种灯具(图未示),包括灯壳及上述COB-LED光源,COB-LED光源设于灯壳内。采用了上述COB-LED光源的灯具所发出的光线均匀、出光角度大、照射范围广、出光效率高。The embodiment of the utility model also provides a lamp (not shown in the figure), which includes a lamp housing and the above-mentioned COB-LED light source, and the COB-LED light source is arranged in the lamp housing. The light emitted by the lamp adopting the above-mentioned COB-LED light source is uniform, has a large light emitting angle, a wide irradiation range, and high light emitting efficiency.

以上所述仅为本实用新型较佳的实施例而已,其结构并不限于上述列举的形状,凡在本实用新型的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本实用新型的保护范围之内。The above description is only a preferred embodiment of the utility model, and its structure is not limited to the shapes listed above. Any modifications, equivalent replacements and improvements made within the spirit and principles of the utility model should include Within the protection scope of the present utility model.

Claims (6)

1.一种COB-LED光源,其特征在于:包括透光基板(1)、多个LED芯片(2)及透光封装体(3);1. A COB-LED light source, characterized in that it includes a light-transmitting substrate (1), a plurality of LED chips (2) and a light-transmitting package (3); 所述透光基板(1)边缘设有正极焊盘(11)和负极焊盘(12),所述透光基板(1)中部设有印刷电路线(13),所述多个LED芯片(2)设于所述透光基板(1)上表面并依次通过所述印刷电路线(13)导通串联于所述正极焊盘(11)和负极焊盘(12)之间,所述透光封装体(3)设于所述透光基板(1)上表面且覆盖所述多个LED芯片(2),所述透光基板(1)下表面设有反光层(4),所述反光层(4)的反光面与所述多个LED芯片(2)相对。An anode pad (11) and a cathode pad (12) are provided on the edge of the light-transmitting substrate (1), a printed circuit line (13) is provided in the middle of the light-transmitting substrate (1), and the plurality of LED chips ( 2) It is arranged on the upper surface of the transparent substrate (1) and connected in series between the positive electrode pad (11) and the negative electrode pad (12) through the printed circuit line (13) sequentially. The optical package (3) is arranged on the upper surface of the light-transmitting substrate (1) and covers the plurality of LED chips (2), the lower surface of the light-transmitting substrate (1) is provided with a reflective layer (4), and the The reflective surface of the reflective layer (4) is opposite to the plurality of LED chips (2). 2.如权利要求1所述的COB-LED光源,其特征在于:所述透光封装体(3)包括透光围坝(31)以及凝结于所述透光围坝(31)所围成的区域内的荧光胶(32),所述多个LED芯片(2)位于所述透光围坝(31)所围成的区域内,所述荧光胶(32)覆盖所述LED芯片(2)。2. The COB-LED light source according to claim 1, characterized in that: the light-transmitting encapsulation (3) includes a light-transmitting dam (31) and is formed by condensation on the light-transmitting dam (31) The fluorescent glue (32) in the area, the plurality of LED chips (2) are located in the area surrounded by the light-transmitting dam (31), and the fluorescent glue (32) covers the LED chips (2 ). 3.如权利要求1所述的COB-LED光源,其特征在于:所述反光层(4)为银镀层。3. The COB-LED light source according to claim 1, characterized in that: the reflective layer (4) is silver plating. 4.如权利要求1所述的COB-LED光源,其特征在于:所述反光层(4)为镍镀层。4. The COB-LED light source according to claim 1, characterized in that: the reflective layer (4) is nickel plating. 5.如权利要求1所述的COB-LED光源,其特征在于:所述反光层(4)为贴附于所述透光基板(1)下表面的反光片。5. The COB-LED light source according to claim 1, characterized in that: the reflective layer (4) is a reflective sheet attached to the lower surface of the transparent substrate (1). 6.一种灯具,包括灯壳,其特征在于:还包括权利要求1-5任一项所述的COB-LED光源,所述COB-LED光源设于所述灯壳内。6. A lamp, comprising a lamp housing, characterized in that it further comprises the COB-LED light source according to any one of claims 1-5, and the COB-LED light source is arranged in the lamp housing.
CN201320430738.2U 2013-07-17 2013-07-17 COB-LED light source and lamps Expired - Fee Related CN203979910U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106907584A (en) * 2017-03-29 2017-06-30 山东晶泰星光电科技有限公司 A kind of illuminating module and LED with rectifier bridge stack
CN107152614A (en) * 2017-07-06 2017-09-12 山东中微光电子有限公司 A kind of LED area light source
CN112614927A (en) * 2020-12-24 2021-04-06 江西鸿利光电有限公司 Novel COB (chip on board) dam packaging process

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106907584A (en) * 2017-03-29 2017-06-30 山东晶泰星光电科技有限公司 A kind of illuminating module and LED with rectifier bridge stack
CN107152614A (en) * 2017-07-06 2017-09-12 山东中微光电子有限公司 A kind of LED area light source
CN112614927A (en) * 2020-12-24 2021-04-06 江西鸿利光电有限公司 Novel COB (chip on board) dam packaging process

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