TWI435045B - Heat dissipation structure for heat dissipation device - Google Patents

Description

Heat dissipation structure of heat sink

A heat dissipating structure of a heat dissipating device, in particular, a heat dissipating structure of a heat dissipating device capable of improving the vapor-liquid circulation efficiency of a working fluid inside the heat dissipating device.

In the current electronic equipment, in order to achieve high heat dissipation efficiency, heat transfer devices such as heat pipes, temperature equalizing plates, loop heat pipes, and heat exchangers have been selected for heat conduction.

In addition, since these heat transfer elements are excellent in electrical conductivity of several times to several tens of times of metals such as copper and aluminum, they are used as various components for heat countermeasures as components for cooling. From the shape, the heat pipe can be divided into a heat pipe in the shape of a circular pipe, a heat pipe having a flat shape and a D shape. In order to cool a CPU or other cooled parts of an electronic device that generates hot electronic parts or the like by performing calculations or work, a temperature equalizing plate or a flat type heat pipe is also adopted from the viewpoint of easy attachment to a cooled part and a wide contact area. Or a thin heat exchanger for heat dissipation. With the miniaturization and space saving of the cooling mechanism, in the case of using a cooling mechanism of the heat pipe, it is more necessary to strictly reduce the thickness of the heat pipe.

When the internal working fluid of the heat transfer elements is to be subjected to vapor-liquid circulation, a capillary structure having a capillary force (groove, metal mesh structure, sintered structure, etc.) is required inside, so that the working fluid can be smoothly operated. The heat transfer element performs the work of vapor-liquid circulation.

If the heat transfer elements are to be used in a relatively narrow area, they must be made thinner, and the internal capillary structure will be made in addition to the thickness of the heat transfer element itself, so that the heat transfer element cannot be made. The main problem of thinning.

Furthermore, the capillary structure after being made thinner will also have a capillary force after being thinned. The drop affects the internal working fluid vapor-liquid circulation efficiency of the heat transfer element and further reduces the heat transfer efficiency. Therefore, the prior art has the following disadvantages: 1. The heat transfer efficiency is poor; 2. The heat transfer element is limited in thickness.

Therefore, in order to solve the above disadvantages of the prior art, the main object of the present invention is to provide a heat dissipation structure of a heat dissipation device capable of improving heat conduction and heat dissipation efficiency.

A secondary object of the present invention is to provide a heat dissipation structure for a heat dissipating device that enhances the internal working fluid vapor-liquid circulation of a thinned heat sink.

In order to achieve the above object, the present invention provides a heat dissipating structure for a heat dissipating device, comprising: a heat dissipating device body having a chamber, the chamber being provided with at least one whisker structure layer and a working fluid, the whisker ( The Whisker) structural layer extends over the interior walls of the chamber.

The heat dissipating device may be any one of a heat pipe and a loop heat pipe, a flat plate heat pipe, a temperature equalizing plate and a heat exchanger.

The whisker structure layer can greatly improve the efficiency of the vapor-liquid circulation of the working fluid in the heat dissipating device body, and because the structure is dense, the heat-dissipating device can maintain the capillary force when the heat-dissipating device is thinned, so that the heat-dissipating device body The working fluid is able to smoothly carry out the vapor-liquid circulation.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

Please refer to Figures 1, 2 and 2A, which are perspective and A-A cross-sectional views and a partial enlarged view of the first embodiment of the heat dissipation structure of the heat sink of the present invention. The heat dissipation structure of the device comprises: a heat sink body 1 having a chamber 11 provided with at least one whisker structure layer 111 and a working fluid 112, the whisker structure layer 111 a complete or partial extension is disposed on the inner wall of the chamber 11. The whisker structure layer 111 is composed of a plurality of whisker monomers, and one end of the whisker monomer is a fixed end. The inner wall of the chamber 11 has the other end extending toward the inside of the chamber 11 to form a free end which is sharp (see Annex 1).

The heat dissipating device body 1 is a temperature equalizing plate, a flat plate heat pipe, a loop heat pipe and a heat exchanger. The present invention is a flat heat pipe as an illustration, but is not limited thereto, and the chamber is not limited thereto. 11 The inner wall is a smooth wall.

FIG. 3 is a cross-sectional view showing a second embodiment of the heat dissipation structure of the heat dissipation device of the present invention. As shown in the figure, the heat dissipation device body 1 of the present embodiment is illustrated by a heat pipe, but is not limited thereto. The whisker structure layer 111 extends axially on the inner wall of the chamber 11 of the heat pipe.

FIG. 4 is a cross-sectional view showing a third embodiment of the heat dissipation structure of the heat dissipation device of the present invention. As shown in the figure, the heat dissipation device body 1 of the present embodiment is illustrated by a heat pipe, but is not limited thereto. The chamber 11 further has at least a first section 113 and a second section 114 and a third section 115. The first, second and third sections 113, 114, 115 are connected to each other. The structural layer 111 is selectively disposed in any one of the first segment 113, the second segment 114, and the third segment 115. In this embodiment, the whisker structure layer 111 is disposed only in the second segment 114. But it is not limited.

Please refer to FIG. 5, which is a fourth implementation of the heat dissipation structure of the heat dissipation device of the present invention. The cross-sectional view of the embodiment is the same as that of the third embodiment described above, and therefore will not be described again here, but the difference between the present embodiment and the foregoing third embodiment is the chamber. 11 is further provided with a coating 2 (having a characteristic of super-hydrophilicity and super-hydrophobicity), and the coating 2 is selectively disposed in any one of the first section 113 and the second section 114 and the third section 115. Embodiment The coating 2 is disposed in the third section 115.

FIG. 6 is a cross-sectional view showing a fifth embodiment of the heat dissipation structure of the heat dissipation device of the present invention. As shown in the figure, the embodiment is identical to the structure of the third embodiment, and thus will not be further described herein. The difference between this embodiment and the foregoing third embodiment is that the chamber 11 further has a coating 2, and the coating 2 is simultaneously disposed on the first section 113 and the third section 115.

FIG. 7 is a cross-sectional view showing a sixth embodiment of the heat dissipation structure of the heat dissipation device of the present invention. As shown in the figure, the embodiment is identical to the second embodiment, and therefore will not be described again. The difference between this embodiment and the foregoing second embodiment is that there is a capillary structure 3 between the inner wall of the chamber 11 and the whisker structure layer 111, and the capillary structure 3 is a sintered powder and a mesh. The grid body and the fibrous body and the porous structure and the groove are added or combined, and the embodiment is not limited by the groove, and the groove is recessed in the The inner wall of the chamber 11 and the whisker structure layer 111 are simultaneously attached to the inner wall of the groove and the chamber 11.

FIG. 8 is a cross-sectional view showing a seventh embodiment of the heat dissipation structure of the heat dissipation device of the present invention. As shown in the figure, the embodiment is identical to the second embodiment, and thus will not be described again. However, this embodiment is different from the foregoing second embodiment. There is a coating 2 between the inner wall of the chamber 11 and the whisker structure layer 111.

FIG. 9 is a cross-sectional view showing the eighth embodiment of the heat dissipation structure of the heat dissipation device of the present invention. As shown in the figure, the embodiment is identical to the structure of the third embodiment, and therefore will not be described again. The difference between the embodiment and the foregoing third embodiment is that the chamber 11 further has at least a first section 113 and a second section 114 and a third section 115, the first and second sections. The three segments 113, 114, 115 are connected to each other, and the whisker structure layer 111 on the second segment 114 is densely distributed.

FIG. 10 is a cross-sectional view showing a ninth embodiment of the heat dissipation structure of the heat dissipation device of the present invention. As shown in the figure, the embodiment is identical to the structure of the third embodiment, and thus will not be further described herein. The difference between the embodiment and the foregoing third embodiment is that the chamber 11 further has at least a first section 113 and a second section 114 and a third section 115, the first and second sections. The three segments 113, 114, and 115 are connected to each other, and the whisker structure layer 111 on the first and third segments 113 and 115 is densely distributed.

In the heat pipe and the temperature equalizing plate and the flat heat pipe and the loop heat pipe, a whisker structure layer 111 is disposed inside, and the whisker structure layer 111 can change the surface tension of the working fluid 112 in the interior thereof to accelerate the reflow speed. It has excellent vapor-liquid circulation efficiency, which can greatly improve the heat transfer efficiency.

The whisker structure layer 111 is referred to (Attachment 1). Attachment 1 is an image of a whisker structure layer 111 scanning electron microscope, and the whisker structure layer 111 can be attached to another capillary structure.

1‧‧‧heat sink body

11‧‧‧ chamber

111‧‧‧ whisker structure

112‧‧‧Working fluid

113‧‧‧First section

114‧‧‧Second section

115‧‧‧ third section

2‧‧‧ coating

3‧‧‧Capillary structure

1 is a perspective view of a first embodiment of a heat dissipation structure of a heat sink of the present invention; 2 is a cross-sectional view of the first embodiment of the heat dissipation structure of the heat dissipation device of the present invention; FIG. 2A is a partial enlarged view of the first embodiment of the heat dissipation structure of the heat dissipation device of the present invention; FIG. FIG. 4 is a cross-sectional view showing a third embodiment of the heat dissipation structure of the heat dissipation device of the present invention; FIG. 4 is a cross-sectional view showing a heat dissipation structure of the heat dissipation device of the present invention; FIG. 6 is a cross-sectional view showing a fifth embodiment of a heat dissipation structure of a heat dissipation device according to the present invention; and FIG. 7 is a cross-sectional view showing a sixth embodiment of a heat dissipation structure of the heat dissipation device of the present invention; FIG. 9 is a cross-sectional view showing a heat dissipation structure of a heat dissipation device according to a seventh embodiment of the present invention; FIG. 9 is a cross-sectional view showing a heat dissipation structure of the heat dissipation device of the present invention; FIG. 10 is a heat dissipation structure of the heat dissipation device of the present invention. A cross-sectional view of the ninth embodiment; the attachment 1 is a scanning electron microscope image of the whisker structure layer.

1‧‧‧heat sink body

11‧‧‧ chamber

111‧‧‧ whisker structure

112‧‧‧Working fluid

Claims (9)

A heat dissipating structure of a heat dissipating device comprises: a heat dissipating device body having a chamber, wherein the chamber is provided with at least one whisker structure layer and a working fluid, and the whisker layer is partially extended on the inner wall of the chamber The heat dissipating device is a heat pipe, the chamber further has at least a first section and a second section and a third section, the first, second and third sections are connected to each other, The whisker structure layer is disposed singly or simultaneously in any one of the first, second, and third segments, and the whisker structure layer is composed of a plurality of whisker monomers, one end of the whisker monomer The fixed end is disposed on the inner wall of the chamber, and the other end thereof extends toward the inner portion of the chamber to form a free end, and the free end is sharp. The heat dissipation structure of the heat dissipation device according to claim 1, wherein the inner wall of the chamber is a smooth wall surface. The heat dissipation structure of the heat dissipating device of claim 1, wherein the chamber further has a plating film, and the coating film is selected to be disposed in the first section, the second section, and the third section. One. The heat dissipation structure of the heat dissipation device according to claim 1, wherein the heat dissipation device is any one of a temperature equalization plate and a heat pipe and a loop heat pipe and a heat exchanger. The heat dissipation structure of the heat dissipation device according to claim 1, wherein the inner wall of the chamber and the whisker structure layer have a capillary structure. The heat dissipation structure of the heat dissipation device according to claim 1, wherein the capillary structure is a sintered powder, a mesh body, a fiber body, and a porous structure. Any of the body and the groove. The heat dissipation structure of the heat dissipation device of claim 1, wherein the heat dissipation device is a heat pipe, and the whisker structure layer is axially extended on the inner wall of the heat pipe. The heat dissipation structure of the heat dissipation device according to claim 1, wherein the whisker structure layer on the second section is densely distributed. The heat dissipation structure of the heat dissipation device of claim 1, wherein the first and third sections of the heat dissipation structure are densely distributed.