TWM452370U - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
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- TWM452370U TWM452370U TW101222181U TW101222181U TWM452370U TW M452370 U TWM452370 U TW M452370U TW 101222181 U TW101222181 U TW 101222181U TW 101222181 U TW101222181 U TW 101222181U TW M452370 U TWM452370 U TW M452370U
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- dissipating device
- heat dissipating
- heat
- working fluid
- heat sink
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- 230000017525 heat dissipation Effects 0.000 title claims description 10
- 239000012530 fluid Substances 0.000 claims description 40
- 239000011247 coating layer Substances 0.000 claims description 17
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- 230000002209 hydrophobic effect Effects 0.000 claims description 4
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- 239000003245 coal Substances 0.000 claims description 2
- 238000003754 machining Methods 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 17
- 238000001704 evaporation Methods 0.000 description 8
- 230000008020 evaporation Effects 0.000 description 8
- 238000009833 condensation Methods 0.000 description 6
- 230000005494 condensation Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
本創作是有關於一種散熱裝置，尤指一種可減少成本並大幅降低整體熱阻之散熱裝置。
This creation is about a heat sink, especially a heat sink that reduces cost and significantly reduces overall thermal resistance.
隨著科技產業快速的進步，電子裝置的功能也愈來愈強大，例如中央處理器(Central Processing Unit, CPU)、晶片組或顯示單元的電子元件運算速度也隨著增長，造成電子元件單位時間所產生的熱量就會相對提高；因此，若電子元件所散發出的熱量無法及時散熱，就會影響電子裝置整體的運作，或導致電子元件的損燬。
一般業界採用的電子元件散熱裝置大部分透過如風扇、散熱器或是熱管等散熱元件進行散熱，並藉由散熱器接觸熱源，再透過熱管將熱傳導至遠端散熱，或由風扇強制引導氣流對該散熱器強制散熱，針對空間較狹窄或面積較大之熱源則選擇以均溫板作為導熱元件作為傳導熱源之使用。
傳統均溫板係透過以兩片板材對應蓋合所製成，該板材的相對應側係設置有溝槽及毛細結構(如Mesh、燒結體)之中任一或其任一之相加總，將該等板材對應蓋合形成一密閉腔室，該密閉腔室呈真空狀態並其內部填充有一工作流體，而為了增加毛細極限，利用銅柱coating燒結、燒結柱、發泡柱等毛細結構用以支撐作為回流道，當前述均溫板內之工作流體由蒸發區受熱產生蒸發，工作流體由液態轉換為汽態，汽態之工作流體至均溫板之冷凝區後由汽態冷凝轉換為液態，再透過銅柱回流至蒸發區繼續循環作用，汽態之工作流體在該冷凝區冷凝成液態小水珠狀後，因重力或毛細作用之關係使得工作流體可回流至蒸發區。
但由於傳統均溫板因其工作流體之回流速度太慢，易生空燒或均溫不佳，以致無法使工作流體有效的進行汽液變化之熱交換，其均溫效果不彰顯，因此在設計上，若以增加毛細結構對工作流體的毛細吸力之考量，將可加速冷卻之工作流體的回流（吸）力，大幅的提高毛細吸力進而有效提昇均溫板的熱傳導能力，但習知上毛細吸力及流體阻力卻為兩個相互衝突的設計因素：若僅考量提昇毛細吸力，需提供孔隙較小的毛細結構，但此小孔隙卻提供較大流體阻力而阻礙了工作流體的回流作用；若僅考量降低流體阻力，則需提供孔隙較大的毛細結構以利於工作流體回流，但此大孔隙卻不利於增加毛細吸力。
故市面上另有一種均溫板採用複合式微結構，其係包含一第一毛細結構層及一第二毛細結構層，該第一、二結構層具有不同的孔隙尺寸；無論是前述採用單層的傳統均溫板亦或是採用複合式的均溫板，其製程皆複雜不易薄化且難以控制品質，造成成本及不良率的提高。
以上所述，習知具有下列之缺點：
1.成本較高；
2.均溫性較差；
3.不易薄化；
4.熱阻較高。
是以，要如何解決上述習用之問題與缺失，即為本案之創作人與從事此行業之相關廠商所亟欲研究改善之方向所在者。
With the rapid advancement of the technology industry, the functions of electronic devices are becoming more and more powerful. For example, the operation speed of electronic components such as a central processing unit (CPU), a chipset or a display unit is also increasing, resulting in an electronic component unit time. The generated heat is relatively increased; therefore, if the heat emitted by the electronic component cannot be dissipated in time, it may affect the overall operation of the electronic device or cause damage to the electronic component.
Most of the heat dissipation devices used in the industry use a heat dissipating component such as a fan, a heat sink or a heat pipe to dissipate heat, and the heat sink contacts the heat source, and then transmits heat to the remote end through the heat pipe, or the air is forcibly guided by the fan. The heat sink is forcibly dissipated, and the heat source is used as a heat conduction element as a heat conduction source for a heat source having a narrow space or a large area.
The conventional uniform temperature plate is made by correspondingly covering two sheets, and the corresponding side of the plate is provided with a sum of any one or any one of a groove and a capillary structure (such as a mesh, a sintered body). The plates are correspondingly closed to form a closed chamber, the closed chamber is in a vacuum state and filled with a working fluid therein, and in order to increase the capillary limit, a capillary structure such as a copper column coating sintering, a sintered column, a foaming column or the like is used. For supporting as a return flow, when the working fluid in the aforementioned temperature equalizing plate is heated by the evaporation zone to generate evaporation, the working fluid is converted from a liquid state to a vapor state, and the working fluid in the vapor state is converted into a condensation zone of the uniform temperature plate and then converted by vapor condensation. In the liquid state, it is recirculated through the copper column to the evaporation zone to continue the circulation. After the vaporized working fluid is condensed into the liquid small water droplet shape in the condensation zone, the working fluid can be returned to the evaporation zone due to the relationship of gravity or capillary action.
However, due to the slow reflow rate of the working fluid in the conventional temperature equalizing plate, it is easy to generate air or the average temperature is not good, so that the working fluid can not effectively exchange the vapor-liquid change heat, and the uniform temperature effect is not obvious, so In design, if the capillary suction of the working fluid is increased to increase the capillary suction force of the working fluid, the reflux (suction) force of the cooling working fluid can be accelerated, and the capillary suction force can be greatly improved to effectively improve the heat transfer capacity of the temperature equalizing plate, but it is conventionally known. Capillary suction and fluid resistance are two conflicting design factors: if only the capillary suction is considered, it is necessary to provide a capillary structure with a small pore size, but this small pore provides a large fluid resistance and hinders the return flow of the working fluid; If only considering reducing the fluid resistance, it is necessary to provide a capillary structure with a large pore size to facilitate the return of the working fluid, but this large pore is not conducive to increasing the capillary suction.
Therefore, another uniform temperature plate on the market adopts a composite microstructure, which comprises a first capillary structure layer and a second capillary structure layer, the first and second structural layers have different pore sizes; whether the foregoing uses a single layer The traditional temperature equalizing plate or the composite temperature equalizing plate is complicated in process, difficult to thin and difficult to control quality, resulting in an increase in cost and defect rate.
As mentioned above, the conventional disadvantages have the following disadvantages:
1. Higher cost;
2. The temperature uniformity is poor;
3. Not easy to thin;
4. The thermal resistance is higher.
Therefore, how to solve the above problems and problems in the past, that is, the creators of the case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.
爰此，為有效解決上述之問題，本創作之主要目的在於提供一種可大幅減少成本之散熱裝置。
本創作之次要目的，在於提供一種可降低整體熱阻之散熱裝置。
本創作之次要目的，在於提供一種可令冷凝區均溫性較佳之散熱裝置。
為達上述目的，本創作係提供一種散熱裝置，係包括一第一板體及一第二板體，該第一板體具有一第一側面及一第二側面，該第二側面上形成（或設置）有一粗糙結構，該第二板體具有一第三側面及一第四側面，該第二板體之第四側面係蓋合相對該第一板體之第二側面，並共同界定一腔室並填充有一工作流體，所述散熱裝置更具有一鍍膜層披覆於所述第二側面之粗糙結構上或第四側面上其中任一側面上或同時披覆於第二側面之粗糙結構上及第四側面上。
透過本創作此結構的設計，利用前述第二側面上形成的局部或全部之粗糙結構，並於該粗糙結構上所披覆的鍍膜層係由二氧化矽所組成，且其具有親水性或疏水性特性，當該第二板體之第三側面受熱時，液態之工作流體會受熱而蒸發為汽態工作流體，接著，汽態工作流體於第一板體之第二側面產生冷凝而轉換成為液態之工作流體，藉由所述粗糙結構的形成，會迅速將液態工作流體拉回至相對該第二側面之熱源對應位置處，再經由集結成的液態工作流體流回所述第四側面，加速冷凝之工作液體的回流，進而促使整體散熱裝置熱阻降低並提升散熱裝置之均溫性；除此之外，還可改善習知均溫板製程複雜且難以控制品質，進以大幅減少不良率及生產成本之效果者。
Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat sink that can greatly reduce the cost.
The second objective of this creation is to provide a heat sink that reduces overall thermal resistance.
The secondary purpose of this creation is to provide a heat sink that provides optimum temperature uniformity in the condensing zone.
In order to achieve the above object, the present invention provides a heat dissipating device comprising a first plate body and a second plate body, the first plate body having a first side surface and a second side surface formed on the second side surface ( Or a rough structure, the second plate body has a third side surface and a fourth side surface, and the fourth side surface of the second board body is covered with respect to the second side surface of the first board body, and defines a common The chamber is filled with a working fluid, and the heat dissipating device further has a coating layer coated on the rough structure of the second side or a rough structure on either side of the fourth side or simultaneously covering the second side Upper and fourth sides.
Through the design of the structure of the present invention, the partial or total rough structure formed on the second side surface is utilized, and the coating layer coated on the rough structure is composed of cerium oxide, and is hydrophilic or hydrophobic. Sexual property, when the third side of the second plate is heated, the liquid working fluid is heated to evaporate into a vapor working fluid, and then the vapor working fluid is condensed on the second side of the first plate to be converted into The liquid working fluid, by the formation of the rough structure, rapidly pulls the liquid working fluid back to a position corresponding to the heat source of the second side, and then flows back to the fourth side through the assembled liquid working fluid. Accelerate the recirculation of the condensed working fluid, which in turn promotes the thermal resistance of the overall heat sink and improves the temperature uniformity of the heat sink; in addition, it can improve the conventional temperature equalizing plate process and difficult to control the quality, thereby greatly reducing the defect The effect of the rate and production cost.
本創作之上述目的及其結構與功能上的特性，將依據所附圖式之較佳實施例予以說明。
請參閱第1A、1B、1C、1D、1E、1F圖，係為本創作之散熱裝置第一實施例之立體分解圖及立體組合圖及剖視圖及放大示意圖，一種散熱裝置，係包括一第一板體10及一第二板體11，該第一板體10具有一第一側面101及一第二側面102（冷凝區），該第二側面102上得局部（第1C及1D圖）及全部（第1E及1F圖）其中任一形成（或設置）有一粗糙結構1021，於本創作中上述所稱之局部的粗糙結構1021係在一熱源2(CPU、電晶體或其他產生熱之物體(件)等)對應之正上方處，並該第二側面102之粗糙結構1021上得披覆有一鍍膜層1022，且該鍍膜層1022係由二氧化矽所組成；
所述第二側面102之粗糙結構1021於本創作中之優先選擇係為佈微槽道之毛細結構，其係利用機械加工（可為壓印及刻印及雕刻等）或蝕刻任一方式形成，並該粗糙結構1021亦係呈凹凸狀，所述鍍膜層1022係為一親水性薄膜及一疏水性薄膜其中任一，本實施例係以親水性薄膜作為說明，但並不引以為限。
前述之第二板體11具有一第三側面111及一第四側面112（蒸發區），該第二板體11之第四側面112係蓋合相對該第一板體10之第二側面102，並共同界定一腔室113，所述第三側面111與所述熱源2相互接觸；
前述之腔室113內填充有一工作流體12，該工作流體12係可為純水及甲醇及丙酮及冷煤及氨其中任一。
透過本創作散熱裝置的設計，利用所述第二側面102上形成的局部或全部之粗糙結構1021，並於該粗糙結構1021上披覆的具有親水性或疏水性特性鍍膜層1022，當該第三側面111接觸熱源2，令該第二板體11之第三側面111受熱時，此時液態工作流體12會因受熱轉換為汽態工作流體12，接著，汽態工作流體12於第一板體10之第二側面102產生冷凝而轉換成為液態之工作流體12，藉由所述粗糙結構1021的形成，會迅速將液態工作流體12拉回集結至相對該第二側面102之熱源2對應位置處（也就是冷凝區最熱之部分），再由集結成的液態工作流體2流回所述第二板體11之第四側面112，透過該粗糙結構1021，得加速冷凝之工作液體2的回流速度，進而促使整體散熱裝置1熱阻降低並提升了均溫性；除此之外，還可改善習知均溫板製程複雜且難以控制品質，進以大幅減少不良率及生產成本之效果。
續請參閱第2A、2B圖，係為本創作散熱裝置之第二實施例之剖視圖及放大示意圖，所述散熱裝置部份元件及元件間之相對應之關係與前述之散熱裝置相同，故在此不再贅述，惟本散熱裝置與前述最主要之差異為，所述粗糙結構1021係呈波浪狀，並該粗糙結構1021上披覆有所述鍍膜層1022，同樣也可加速冷凝之工作液體的回流速度並提升均溫性，並大幅降低整體熱阻且減少生產成本之效果。
再請參閱第3A、3B圖，係為本創作散熱裝置之第三實施例之剖視圖及放大示意圖，所述散熱裝置部份元件及元件間之相對應之關係與前述之散熱裝置相同，故在此不再贅述，惟本散熱裝置與前述最主要之差異為，所述粗糙結構1021係呈鋸齒狀，並該粗糙結構1021上披覆有所述鍍膜層1022，同樣也可加速冷凝之工作液體的回流速度並提升均溫性，並大幅降低整體熱阻且減少生產成本之效果。
請參閱第4A、4B圖，係為本創作散熱裝置之第四實施例之剖視圖及放大示意圖，所述散熱裝置部份元件及元件間之相對應之關係與前述之散熱裝置相同，故在此不再贅述，惟本散熱裝置與前述最主要之差異為，所述鍍膜層1022係披覆於第四側面112上（蒸發區）。
請參閱第5A、5B圖，係為本創作散熱裝置之第五實施例之剖視圖及放大示意圖，所述散熱裝置部份元件及元件間之相對應之關係與前述之散熱裝置相同，故在此不再贅述，惟本散熱裝置與前述最主要之差異為，所述鍍膜層1022係同時披覆於所述第二側面102之粗糙結構1021上及第四側面112上，同樣也可加速冷凝之工作液體的回流速度並提升均溫性，並大幅降低整體熱阻且減少生產成本之效果。
請參閱第6圖，係為本創作散熱裝置之第六實施例之立體分解圖，所述散熱裝置部份元件及元件間之相對應之關係與前述之散熱裝置相同，故在此不再贅述，惟本散熱裝置與前述最主要之差異為，所述該第二板體11更具有一毛細結構1121，該毛細結構1121係形成在該第四側面112上，該毛細結構1121係可為複數溝槽及燒結粉末體及網格體其中任一，本實施例係以燒結粉末結構體作為說明，但並不引以為限。
請參閱第7圖並一併參閱第1E圖，係為本創作散熱裝置之第七實施例之立體分解圖，所述散熱裝置部份元件及元件間之相對應之關係與前述之散熱裝置相同，故在此不再贅述，惟本散熱裝置與前述最主要之差異為，所述腔室113更具有至少一支撐柱1131，該支撐柱1131兩端分別連接所述第二側面102（冷凝區）及第四側面112（蒸發區），並該支撐柱1131外部具有一毛細結構體1131a，並該毛細結構體1131a係可為複數溝槽及燒結粉末體及網格體其中任一，於本實施例係以燒結粉末結構體作為說明，但並不引以為限。
本創作之粗糙結構1021（圖中未示出）之高度係由板體中央向板體邊緣呈漸縮狀態。
透過前述之實施例，當所述第二板體11之第三側面111受熱時，汽態工作流體12於第一板體10之第二側面102產生冷凝而轉換成為液態之工作流體12，藉由所述鍍膜層1022的親水特性，再加上透過所述支撐柱1131上毛細結構體1131a的毛細吸力牽引，將液態工作流體12由冷凝區拉回蒸發區，如此達到加速冷凝之工作液體的回流速度並提升均溫性，並降低整體散熱裝置1之熱阻。
以上所述，本創作相較於習知具有下列優點：
1.減少成本；
2.提升散熱裝置均溫性；
3.降低散熱裝置整體熱阻。
以上已將本創作做一詳細說明，惟以上所述者，僅為本創作之ㄧ較佳實施例而已，當不能限定本創作實施之範圍。即凡依本創作申請範圍所作之均等變化與修飾等，皆應仍屬本創作之專利涵蓋範圍。
The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.
1A, 1B, 1C, 1D, 1E, 1F, is a perspective exploded view and a perspective view, a cross-sectional view and an enlarged schematic view of a first embodiment of the heat sink of the present invention, and a heat dissipating device includes a first The first body 10 has a first side 101 and a second side 102 (condensing area), and the second side 102 is partially (1C and 1D) and All (1E and 1F drawings) are formed (or arranged) with a rough structure 1021, which is referred to in the present invention as a heat source 2 (CPU, transistor or other object that generates heat). a coating layer 1022 is coated on the rough structure 1021 of the second side surface 102, and the coating layer 1022 is composed of cerium oxide;
The preferred structure of the second side 102 of the rough structure 1021 is a capillary structure of a microchannel, which is formed by mechanical processing (which can be embossed and engraved and engraved) or etched. The rough structure 1021 is also in the form of a concavo-convex shape. The coating layer 1022 is a hydrophilic film and a hydrophobic film. The present embodiment is described by a hydrophilic film, but is not limited thereto.
The second board body 11 has a third side surface 111 and a fourth side surface 112 (evaporation area). The fourth side surface 112 of the second board body 11 is closed to the second side surface 102 of the first board body 10. And jointly defining a chamber 113, the third side 111 and the heat source 2 are in contact with each other;
The aforementioned chamber 113 is filled with a working fluid 12, which may be pure water and any of methanol and acetone, and cold coal and ammonia.
Through the design of the heat sink of the present invention, a partial or total rough structure 1021 formed on the second side surface 102 is used, and a hydrophilic or hydrophobic characteristic coating layer 1022 is coated on the rough structure 1021. When the three sides 111 contact the heat source 2 to heat the third side 111 of the second plate 11, the liquid working fluid 12 is converted into the vapor working fluid 12 by heat, and then the vapor working fluid 12 is on the first plate. The second side 102 of the body 10 is condensed and converted into a liquid working fluid 12. By the formation of the rough structure 1021, the liquid working fluid 12 is quickly pulled back to the corresponding position of the heat source 2 opposite to the second side 102. Wherein, that is, the hottest part of the condensation zone, the liquid working fluid 2 is collected and returned to the fourth side 112 of the second plate body 11 to pass through the rough structure 1021 to accelerate the condensation of the working liquid 2 The reflow speed, which in turn causes the overall heat dissipation device 1 to reduce the thermal resistance and improve the temperature uniformity; in addition, it can improve the conventional uniform temperature plate process and is difficult to control the quality, thereby greatly reducing the defect rate and production. The effect.
Continuing to refer to Figures 2A and 2B, which are cross-sectional views and enlarged schematic views of a second embodiment of the heat dissipating device of the present invention. The corresponding relationship between the components and components of the heat dissipating device is the same as that of the heat dissipating device described above. Therefore, the main difference between the heat dissipating device and the foregoing is that the rough structure 1021 is wavy, and the rough structure 1021 is coated with the coating layer 1022, which can also accelerate the condensing working liquid. The reflow speed increases the temperature uniformity and greatly reduces the overall thermal resistance and reduces the production cost.
3A and 3B are a cross-sectional view and an enlarged schematic view of a third embodiment of the heat dissipating device. The corresponding relationship between the components and the components of the heat dissipating device is the same as that of the heat dissipating device described above. Therefore, the main difference between the heat dissipating device and the foregoing is that the rough structure 1021 is saw-toothed, and the rough structure 1021 is coated with the coating layer 1022, which can also accelerate the condensing working liquid. The reflow speed increases the temperature uniformity and greatly reduces the overall thermal resistance and reduces the production cost.
Please refer to FIGS. 4A and 4B , which are cross-sectional views and enlarged schematic views of a fourth embodiment of the heat sink according to the present invention. The corresponding relationship between the components and components of the heat sink device is the same as that of the heat sink described above. It will not be described again, but the main difference between the heat sink and the foregoing is that the coating layer 1022 is coated on the fourth side 112 (evaporation zone).
Please refer to FIG. 5A and FIG. 5B , which are cross-sectional views and enlarged schematic views of a fifth embodiment of the heat dissipating device. The corresponding relationship between the components and the components of the heat dissipating device is the same as that of the heat dissipating device described above. It is not described again, but the main difference between the heat sink and the foregoing is that the coating layer 1022 is simultaneously coated on the rough structure 1021 and the fourth side 112 of the second side 102, and the condensation can also be accelerated. The reflux rate of the working fluid increases the temperature uniformity and greatly reduces the overall thermal resistance and reduces the production cost.
Please refer to FIG. 6 , which is a perspective exploded view of a sixth embodiment of the heat dissipation device. The corresponding relationship between the components and the components of the heat dissipation device is the same as that of the heat dissipation device described above, and thus will not be described herein. The first main difference between the heat sink and the heat sink is that the second body 11 has a capillary structure 1121. The capillary structure 1121 is formed on the fourth side 112. The capillary structure 1121 can be plural. In the present embodiment, the sintered powder structure is described as a description of the groove, the sintered powder body and the mesh body, but is not limited thereto.
Please refer to FIG. 7 and FIG. 1E together, which is a perspective exploded view of a seventh embodiment of the heat dissipating device. The corresponding relationship between some components and components of the heat dissipating device is the same as the heat dissipating device described above. Therefore, the main difference between the present heat dissipating device and the foregoing is that the chamber 113 further has at least one supporting column 1131, and the two ends of the supporting column 1131 are respectively connected to the second side 102 (condensing area). And the fourth side 112 (evaporation zone), and the outer side of the support column 1131 has a capillary structure 1131a, and the capillary structure 1131a can be any of a plurality of grooves, a sintered powder body and a mesh body. The examples are based on the description of the sintered powder structure, but are not limited thereto.
The height of the rough structure 1021 (not shown) of the present invention is gradually tapered from the center of the plate body toward the edge of the plate body.
Through the foregoing embodiment, when the third side surface 111 of the second plate body 11 is heated, the vaporous working fluid 12 is condensed on the second side surface 102 of the first plate body 10 to be converted into a liquid working fluid 12, The liquid working fluid 12 is pulled back from the condensing zone to the evaporation zone by the hydrophilic property of the coating layer 1022, and by the capillary suction of the capillary structure 1131a on the support column 1131, thus achieving the accelerated condensing working fluid. The reflow speed increases the temperature uniformity and reduces the thermal resistance of the overall heat sink 1.
As mentioned above, this creation has the following advantages over the prior art:
1. Reduce costs;
2. Improve the temperature uniformity of the heat sink;
3. Reduce the overall thermal resistance of the heat sink.
The present invention has been described in detail above, but the above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited. That is, all changes and modifications made in accordance with the scope of this creation application shall remain covered by the patents of this creation.
1‧‧‧散熱裝置
10‧‧‧第一板體
101‧‧‧第一側面
102‧‧‧第二側面
1021‧‧‧粗糙結構
1022‧‧‧鍍膜層
11‧‧‧第二板體
111‧‧‧第三側面
112‧‧‧第四側面
1121‧‧‧毛細結構
113‧‧‧腔室
1131‧‧‧支撐柱
1131a‧‧‧毛細結構體
12‧‧‧工作流體
2‧‧‧熱源
1‧‧‧heating device
10‧‧‧ first board
101‧‧‧ first side
102‧‧‧ second side
1021‧‧‧Rough structure
1022‧‧‧ coating layer
11‧‧‧Second plate
111‧‧‧ third side
112‧‧‧fourth side
1121‧‧‧Capillary structure
113‧‧‧ chamber
1131‧‧‧Support column
1131a‧‧‧Capillary structure
12‧‧‧Working fluid
2‧‧‧heat source
第1A圖係為本創作散熱裝置第一實施例之立體分解圖；
第1B圖係為本創作散熱裝置第一實施例之立體組合圖；
第1C圖係為本創作散熱裝置第一實施例之剖視圖；
第1D圖係為本創作散熱裝置第一實施例之放大示意圖；
第1E圖係為本創作散熱裝置第一實施例之另一剖視圖；
第1F圖係為本創作散熱裝置第一實施例之另一放大示意圖；
第2A圖係為本創作散熱裝置第二實施例之剖視圖；
第2B圖係為本創作散熱裝置第二實施例之放大示意圖；
第3A圖係為本創作散熱裝置第三實施例之剖視圖；
第3B圖係為本創作散熱裝置第三實施例之放大示意圖；
第4A圖係為本創作散熱裝置第四實施例之剖視圖；
第4B圖係為本創作散熱裝置第四實施例之放大示意圖；
第5A圖係為本創作散熱裝置第五實施例之剖視圖；
第5B圖係為本創作散熱裝置第五實施例之放大示意圖；
第6圖係為本創作散熱裝置第六實施例之立體分解圖；
第7圖係為本創作散熱裝置第七實施例之立體分解圖。
1A is a perspective exploded view of the first embodiment of the heat sink device of the present invention;
1B is a perspective assembled view of the first embodiment of the heat sink device;
1C is a cross-sectional view of the first embodiment of the heat sink of the present invention;
1D is an enlarged schematic view of a first embodiment of the heat sink of the present invention;
1E is another cross-sectional view of the first embodiment of the heat sink of the present invention;
FIG. 1F is another enlarged schematic view of the first embodiment of the creation heat dissipation device;
2A is a cross-sectional view showing a second embodiment of the heat sink of the present invention;
2B is an enlarged schematic view showing a second embodiment of the heat sink of the present invention;
Figure 3A is a cross-sectional view showing a third embodiment of the heat sink of the present invention;
FIG. 3B is an enlarged schematic view showing a third embodiment of the heat dissipation device of the present invention;
Figure 4A is a cross-sectional view showing a fourth embodiment of the heat sink of the present invention;
4B is an enlarged schematic view of a fourth embodiment of the heat sink of the present invention;
Figure 5A is a cross-sectional view showing a fifth embodiment of the heat sink of the present invention;
FIG. 5B is an enlarged schematic view showing a fifth embodiment of the heat dissipation device of the present invention;
Figure 6 is a perspective exploded view of the sixth embodiment of the heat sink device of the present invention;
Figure 7 is a perspective exploded view of the seventh embodiment of the heat sink device.
1‧‧‧散熱裝置 1‧‧‧heating device
1021‧‧‧粗糙結構 1021‧‧‧Rough structure
1022‧‧‧鍍膜層 1022‧‧‧ coating layer
113‧‧‧腔室 113‧‧‧ chamber
12‧‧‧工作流體 12‧‧‧Working fluid
2‧‧‧熱源 2‧‧‧heat source
Claims (16)
一第一板體，具有一第一側面及一第二側面，該第二側面上形成有一粗糙結構；及
一第二板體，具有一第三側面及一第四側面，該第二板體之第四側面係蓋合相對該第一板體之第二側面，並共同界定一腔室，該腔室內填充有一工作流體。A heat sink includes:
a first plate body having a first side surface and a second side surface, wherein the second side surface is formed with a rough structure; and a second board body having a third side surface and a fourth side surface, the second board body The fourth side is capped with respect to the second side of the first plate and collectively defines a chamber filled with a working fluid.
The heat dissipating device of claim 3, wherein the coating layer is composed of cerium oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101222181U TWM452370U (en) | 2012-11-16 | 2012-11-16 | Heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101222181U TWM452370U (en) | 2012-11-16 | 2012-11-16 | Heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM452370U true TWM452370U (en) | 2013-05-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101222181U TWM452370U (en) | 2012-11-16 | 2012-11-16 | Heat dissipation device |
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| Country | Link |
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| TW (1) | TWM452370U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104168739A (en) * | 2013-05-17 | 2014-11-26 | 奇鋐科技股份有限公司 | Supporting structure of heat dissipation unit |
| CN107949238A (en) * | 2017-11-10 | 2018-04-20 | 中国船舶重工集团公司第七六研究所 | A kind of soaking plate heat dissipating device with support column arrangement and preparation method thereof |
| CN108105734A (en) * | 2017-12-18 | 2018-06-01 | 苏州亿拓光电科技有限公司 | LED component soaking plate and LED component |
| TWI639806B (en) * | 2016-02-05 | 2018-11-01 | 業強科技股份有限公司 | Thermal conduction device and method of manufacturing same |
| TWI753320B (en) * | 2019-01-04 | 2022-01-21 | 大陸商深圳興奇宏科技有限公司 | Heat dissipation unit and heat dissipation device using same |
| US11371784B2 (en) | 2019-01-18 | 2022-06-28 | Asia Vital Components (China) Co., Ltd. | Heat dissipation unit and heat dissipation device using same |
-
2012
- 2012-11-16 TW TW101222181U patent/TWM452370U/en not_active IP Right Cessation
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104168739A (en) * | 2013-05-17 | 2014-11-26 | 奇鋐科技股份有限公司 | Supporting structure of heat dissipation unit |
| TWI639806B (en) * | 2016-02-05 | 2018-11-01 | 業強科技股份有限公司 | Thermal conduction device and method of manufacturing same |
| CN107949238A (en) * | 2017-11-10 | 2018-04-20 | 中国船舶重工集团公司第七六研究所 | A kind of soaking plate heat dissipating device with support column arrangement and preparation method thereof |
| CN108105734A (en) * | 2017-12-18 | 2018-06-01 | 苏州亿拓光电科技有限公司 | LED component soaking plate and LED component |
| TWI753320B (en) * | 2019-01-04 | 2022-01-21 | 大陸商深圳興奇宏科技有限公司 | Heat dissipation unit and heat dissipation device using same |
| US11371784B2 (en) | 2019-01-18 | 2022-06-28 | Asia Vital Components (China) Co., Ltd. | Heat dissipation unit and heat dissipation device using same |
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