M429083 五、新型說明： 【新型所屬之技術領域】 [0001] 一種散熱裝置之散熱結構，尤指一種可提升散熱裝置内 部工作流體汽液循環效率的散熱裝置之散熱結構。 【先前技術】 [0002] 現行電子設備内部為講求高散熱效率已大量選擇熱管、 均溫板、環路熱管、熱交換器等熱傳元件進行熱傳導工 作。 並，該等熱傳元件其熱傳導率是銅、鋁等金屬的數倍至 數十倍左右而相當的優異，因此是作為冷卻用元件而被 運用於各種熱對策相關機器。從形狀來看，熱管可分成 圓管形狀的熱管、扁平形狀及D型形狀的熱管。為了冷卻 CPU或其他因執行運算或工作而產生熱之電子零件等的電 子機器的被冷卻零件，基於容易安裝於被冷卻零件且能 獲得寬廣接觸面積的觀點，也採用均溫板或扁平型熱管 或薄型熱交換器來進行散熱。隨著冷卻機構的小型化、 省空間化，在使用熱管的冷卻機構的情況，更有嚴格要 求該熱管的極薄型化之必要。 所述該等熱傳元件内部工作流體欲進行汽液循環時，其 内部需設置具有毛細力之毛細結構（溝槽、金屬網格體 結構、燒結結構等），使得令工作流體得以順利於該熱 傳元件進行汽液循環之工作。 若該等熱傳元件需使用於較為窄小之處，則勢必需製成 薄型化，而該内部之毛細結構則將會是除了熱傳元件本 身厚度問題外，令該熱傳元件無法製成薄型化最主要之 表單編號A0101 第3頁/共18頁 M429083 問題。 再者，製成薄型化後之毛細結構則會因薄型化後其毛細 力亦下降，影響該熱傳元件之内部工作流體汽液循環效 率進而令熱傳導效率大幅降低，故習知技術具有下列缺 點： 1. 熱傳效率不佳； 2. 熱傳元件薄型化有限。 【新型内容】 [0003] 爰此，為解決上述習知技術之缺點，本創作之主要目的 ，係提供一種可提升導熱及散熱效率的散熱裝置之散熱 結構。 本創作次要目的係提供一種提升薄型化之散熱裝置其内 部工作流體汽液猶環的散熱裝置之散熱結構。 為達上述之目的，本創作係提供一散熱裝置之散熱結構 ，係包含：一散熱裝置本體具有一腔室，所述腔室設有 至少一鬚晶結構層及一工作流體，該鬚晶（Whisker)結 構層延伸設於該腔室内壁。 所述散熱裝置本體係可為熱管及環路熱管及平板式熱管 及均溫板及熱交換器其中任一。 所述鬚晶結構層係可大幅提升該散熱裝置本體内部工作 流體之汽液循環之效率，並因其結構縝密，令該散熱裝 置薄型化時仍可維持其毛細力，令散熱裝置本體内部工 作流體得以順利進行汽液循環。 【實施方式】 [0004] 本創作之上述目的及其結構與功能上的特性，將依據所 表單编號A0101 第4頁/共18頁 附圖式之較佳實施例予以說明。 請參閱第1、2、2A圖係為本創作之散熱裝置之散熱結 構第一實施例之立體及A-A剖視及局部放大圖，如圖所示 ’所述散熱裝置之散熱結構，係包含：一具有一腔室 之散熱裝置本體1，所述腔室11設有至少一鬚晶結構層 111及一工作流體112，該鬚晶（Whisker)結構層U1 係完整或局部的延伸置設於該腔室u内壁，該鬚晶結構 層111係由複數鬚晶（Whisker)單體所構成，該鬚晶單 體之一端係為固結端被設置於該腔室丨丨内壁上，其另一 端朝腔室11内部延伸形成自由端，該自由端係為銳狀者 (參閱附件一）。 所述散熱裝置本體1係為均溫板及平板式熱管及環路熱管 及熱交換器其中任一，本創作係以平板式熱管作為說明 ，但並不引以為限，並所述腔室n内壁係為平滑壁面。 請參閱第3圖，係為本創作之散熱裝置之散熱結構第二實 施例之剖視圖，如圖所示，本實施例散熱裝置本體丨係以 熱管作為說明，但並不引以為限，該鬚晶結構層ln轴向 延伸設於該熱管之腔室11内壁。 請參閱第4圖，係為本創作之散熱裝置之散熱結構第三實 施例之别視圖，如圖所示，本實施例散熱裝置本體丨係以 熱管作為說明’但並不引以為限，所述腔室11更具有至 少一第一區段113及一第二區段114及一第三區段115， 所述第一、二、三區段113、114、115相互連接，所述 鬚晶結構層111係選擇設置於所述第一區段113、第二區 段114及第三區段115其中任一，本實施例係將鬚晶結構 層111僅設置於該第二區段114，但並不引以為限。 表單編號A0101 第5頁/共18頁 M429083 請參閱第5圖，係為本創作之散熱裝置之散熱結構第四實 施例之剖視圖，如圖所示，本實施例係與前述第三實施 例部分結構相同，故在此將不再贅述，惟本實施例與前 述第三實施例之不同處係為所述腔室11更設有一鍍膜2( 具有超親水性及超疏水性之特性），該鍍膜2係選擇設置 於所述第一區段113及第二區段114及第三區段115其中 任一，本實施例該鍍膜2係設置於該第三區段115。 請參閱第6圖，係為本創作之散熱裝置之散熱結構第五實 施例之剖視圖，如圖所示，本實施例係與前述第三實施 例部分結構相同，故在此將不再贅述，惟本.實施例與前 述第三實施例之不同處係為所述腔室11更具有一鍍膜2， 該鍍膜2同時設置於所述第一區段113及第三區段115。 請參閱第7圖，係為本創作之散熱裝置之散熱結構第六實 施例之剖視圖，如圖所示，本實施例係與前述第二實施 例部分結構相同，故在此將不再贅述，惟本實施例與前 述第二實施例之不同處係為所述腔室11内壁與該鬚晶結 構層111間更具有一毛細結構3，所述所述毛細結構3係為 燒結粉末及網格體及纖維體及多孔性結構體及溝槽其中 任一，或其兩兩相加組合，本實施例係以溝槽作為說明 但並不引以為限，所述溝槽凹設於該腔室11内壁，並該 鬚晶結構層111同時彼附於該溝槽及腔室11内壁。 請參閱第8圖，係為本創作之散熱裝置之散熱結構第七實 施例之剖視圖，如圖所示，本實施例係與前述第二實施 例部分結構相同，故在此將不再贅述，惟本實施例與前 述第二實施例之不同處係為所述腔室11内壁與該鬚晶結 構層111間更具有一鍍膜2。 表單編號A0101 第6頁/共18頁 清參閱第9圖’係為本創作之散熱裝置之散熱結構第八實 施例之剖視圖，如圖所示，本實施例係與前述第三實施 例部分結構相同，故在此將不再贅述，惟本實施例與前 述第三實施例之不同處係為所述腔室11更具有至少一第 一區段113及一第二區段π4及一第三區段115，所述第 一、二、三區段113、114、115相互連接，所述第二區 段114上之鬚晶結構層係分佈較密。 請參閱第10圖，係為本創作之散熱裝置之散熱結構第九 貫施例之剖視圖，如圖所示，本實施例係與前述第三實 施例部分結構相同，故在此將不再贅述，惟本實施例與 前述第三實施例之不同處係為所述腔室u更具有至少一 第一區段113及一第二區段114及一第三區段ι15，所述 第一、二、三區段113、114、115相互連接，所述第一 、三區段113、115上之鬚晶結構層ill係分佈較密。 於該熱管及均溫板及平板式熱管及環路熱管中將其内 部設置鬚晶結構層111，該鬚晶結構層11丨係可改變該工 作流體112於其内部之表面張力，加快回流速度而具有極 佳之汽液循環效率，藉以大幅提升熱傳效能者。 所述鬚晶結構層111係參閱（附件一）附件一為鬚晶結構 層111掃瞄式電子顯微鏡之影像圖，所述鬚晶結構層lu 係可坡附於另一毛細結構上。 【圖式簡單說明】 [0005ί 第1圖係為本創作之散熱裝置之散熱結構第一實施例之立 體圖； 第2圖係為本創作之散熱裝置之散熱結構第一實施例之Α-Α剖視圖； 表單編號Α0101 第7頁/共18頁 第2A圖係為本創作之散熱裝置之散熱結構第一實施例之 A-A剖視之局部放大圖； 第3圖係為本創作之散熱裝置之散熱結構第二實施例之剖 視圖； 第4圖係為本創作之散熱裝置之散熱結構第三實施例之剖 視圖， 第5圖係為本創作之散熱裝置之散熱結構第四實施例之剖 視圖， 第6圖係為本創作之散熱裝置之散熱結構第五實施例之剖 視圖； 第7圖係為本創作之散熱裝置之散熱結構第六實施例之剖 視圖， 第8圖係為本創作之散熱裝置之散熱結構第七實施例之剖 視圖， 第9圖係為本創作之散熱裝置冬散熱結構第八實施例之剖 視圖， 第10圖係為本創作之散熱裝置之散熱結構第九實施例之 剖視圖； 附件一係為鬚晶結構層掃瞄式電子顯微鏡影像圖。 【主要元件符號說明】 [0006] 散熱裝置本體1 腔室11 鬚晶結構層111 工作流體112 第一區段113 第二區段114 表單编號A0101 第8頁/共18頁 M429083 第三區段115 鍍膜2 毛細結構3 表單編號A0101 第9頁/共18頁M429083 V. New description: [New technical field] [0001] A heat dissipation structure of a heat dissipating device, especially a heat dissipating structure of a heat dissipating device capable of improving the vapor-liquid circulation efficiency of a working fluid inside a heat dissipating device. [Prior Art] [0002] In the current electronic equipment, a heat transfer element such as a heat pipe, a temperature equalizing plate, a loop heat pipe, and a heat exchanger has been selected for heat conduction in order to achieve high heat dissipation efficiency. In addition, these heat transfer elements are excellent in electrical conductivity of several times to several tens of times of metals such as copper and aluminum, and are used as various components for heat countermeasures as components for cooling. In terms of shape, the heat pipe can be divided into a heat pipe in the shape of a circular pipe, a heat pipe having a flat shape and a D shape. In order to cool a CPU or other cooled parts of an electronic device that generates hot electronic parts or the like by performing calculations or work, a temperature equalizing plate or a flat type heat pipe is also adopted from the viewpoint of easy attachment to a cooled part and a wide contact area. Or a thin heat exchanger for heat dissipation. With the miniaturization and space saving of the cooling mechanism, in the case of a cooling mechanism using a heat pipe, it is necessary to strictly reduce the thickness of the heat pipe. When the internal working fluid of the heat transfer elements is to be subjected to vapor-liquid circulation, a capillary structure having a capillary force (groove, metal mesh structure, sintered structure, etc.) is required inside, so that the working fluid can be smoothly operated. The heat transfer element performs the work of vapor-liquid circulation. If the heat transfer elements are to be used in a relatively narrow area, they must be made thinner, and the internal capillary structure will be made in addition to the thickness of the heat transfer element itself, so that the heat transfer element cannot be made. The most important form number for thinning is A0101 Page 3 of 18 M429083 Question. Furthermore, the capillary structure after the thinning is reduced, the capillary force of the thinned structure is also reduced, which affects the internal working fluid vapor-liquid circulation efficiency of the heat-transfer element, thereby greatly reducing the heat transfer efficiency. Therefore, the prior art has the following disadvantages. : 1. The heat transfer efficiency is not good; 2. The heat transfer component is limited in thickness. [New Content] [0003] In order to solve the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a heat dissipation structure of a heat dissipation device that can improve heat conduction and heat dissipation efficiency. The secondary objective of the present invention is to provide a heat dissipating structure for a heat dissipating device that enhances the vaporization of the internal working fluid of the thinned heat dissipating device. For the purpose of the above, the present invention provides a heat dissipating structure of a heat dissipating device, comprising: a heat dissipating device body having a chamber, the chamber being provided with at least one whisker structure layer and a working fluid, the whisker ( The Whisker) structural layer extends over the interior walls of the chamber. The heat dissipating device may be any one of a heat pipe and a loop heat pipe, a flat plate heat pipe, and a temperature equalizing plate and a heat exchanger. The whisker structure layer can greatly improve the efficiency of the vapor-liquid circulation of the working fluid in the heat dissipating device body, and the structure of the heat-dissipating device can maintain the capillary force when the heat-dissipating device is thinned, so that the heat-dissipating device body works internally. The fluid is smoothly circulated. [Embodiment] The above object of the present invention and its structural and functional characteristics will be described in accordance with a preferred embodiment of the drawing No. A0101, page 4 of the accompanying drawings. Please refer to Figures 1, 2, and 2A for the three-dimensional and AA cross-sectional views and a partial enlarged view of the first embodiment of the heat dissipation structure of the heat sink of the present invention. As shown in the figure, the heat dissipation structure of the heat dissipation device includes: a heat sink body 1 having a chamber, the chamber 11 is provided with at least one whisker structure layer 111 and a working fluid 112, and the whisker structure layer U1 is completely or partially extended. The inner wall of the chamber u, the whisker structure layer 111 is composed of a plurality of whisker monomers, one end of which is a fixed end disposed on the inner wall of the chamber, and the other end Extending into the interior of the chamber 11 forms a free end which is sharp (see Annex I). The heat dissipating device body 1 is a temperature equalizing plate, a flat plate heat pipe, a loop heat pipe and a heat exchanger. The present invention uses a flat heat pipe as an illustration, but is not limited thereto, and the chamber is not limited thereto. The n inner wall is a smooth wall. Referring to FIG. 3, it is a cross-sectional view of a second embodiment of the heat dissipation structure of the heat sink of the present invention. As shown in the figure, the heat sink body of the embodiment is illustrated by a heat pipe, but is not limited thereto. The whisker structure layer ln extends axially on the inner wall of the chamber 11 of the heat pipe. Please refer to FIG. 4 , which is a different view of the third embodiment of the heat dissipation structure of the heat sink of the present invention. As shown in the figure, the heat sink body of the embodiment is provided with a heat pipe as a description, but is not limited thereto. The chamber 11 further has at least a first section 113 and a second section 114 and a third section 115. The first, second and third sections 113, 114, 115 are connected to each other. The crystal structure layer 111 is selectively disposed in any one of the first segment 113, the second segment 114, and the third segment 115. In this embodiment, the whisker structure layer 111 is disposed only in the second segment 114. , but not limited to. Form No. A0101 Page 5 of 18 M429083 Please refer to FIG. 5, which is a cross-sectional view of a fourth embodiment of the heat dissipation structure of the heat sink of the present invention. As shown in the figure, the embodiment is in part with the foregoing third embodiment. The structure is the same, so it will not be described here. However, the difference between the embodiment and the third embodiment is that the chamber 11 is further provided with a coating 2 (having a property of super hydrophilicity and superhydrophobicity). The coating 2 is selectively disposed on the first section 113, the second section 114, and the third section 115. The coating 2 is disposed in the third section 115 in this embodiment. FIG. 6 is a cross-sectional view showing a fifth embodiment of the heat dissipation structure of the heat dissipation device of the present invention. As shown in the figure, the embodiment is identical to the structure of the third embodiment, and therefore will not be further described herein. However, the difference between the embodiment and the foregoing third embodiment is that the chamber 11 further has a coating 2, and the coating 2 is simultaneously disposed on the first section 113 and the third section 115. FIG. 7 is a cross-sectional view showing a sixth embodiment of the heat dissipating structure of the heat dissipating device of the present invention. As shown in the figure, the embodiment is identical to the second embodiment, and therefore will not be described again. The difference between this embodiment and the foregoing second embodiment is that there is a capillary structure 3 between the inner wall of the chamber 11 and the whisker structure layer 111, and the capillary structure 3 is a sintered powder and a grid. The body and the fibrous body and the porous structure and the groove are combined or combined with each other, and the embodiment is described by a groove as a description, but not limited thereto, the groove is recessed in the cavity The inner wall of the chamber 11 and the whisker structure layer 111 are simultaneously attached to the inner wall of the groove and the chamber 11. FIG. 8 is a cross-sectional view showing a seventh embodiment of the heat dissipating structure of the heat dissipating device of the present invention. As shown in the figure, the embodiment is identical to the second embodiment, and therefore will not be described again. The difference between this embodiment and the foregoing second embodiment is that there is a coating 2 between the inner wall of the chamber 11 and the whisker structure layer 111. Form No. A0101, page 6 / page 18, see Fig. 9 is a cross-sectional view of the eighth embodiment of the heat dissipation structure of the heat sink of the present invention. As shown in the figure, the present embodiment is partially related to the foregoing third embodiment. The same is omitted here, but the difference between this embodiment and the foregoing third embodiment is that the chamber 11 further has at least a first section 113 and a second section π4 and a third. In the section 115, the first, second and third sections 113, 114, 115 are connected to each other, and the whisker structure layer on the second section 114 is densely distributed. Please refer to FIG. 10 , which is a cross-sectional view of a ninth embodiment of the heat dissipation structure of the heat sink of the present invention. As shown in the figure, the embodiment is identical to the structure of the third embodiment, and therefore will not be described herein. The difference between the embodiment and the foregoing third embodiment is that the chamber u further has at least a first section 113 and a second section 114 and a third section ι15, the first, The two sections 113, 114, and 115 are connected to each other, and the whisker structure layer ill on the first and third sections 113 and 115 is densely distributed. In the heat pipe and the temperature equalizing plate and the flat heat pipe and the loop heat pipe, a whisker structure layer 111 is disposed inside, and the whisker structure layer 11 can change the surface tension of the working fluid 112 in the interior thereof to accelerate the reflow speed. And with excellent vapor-liquid circulation efficiency, it can greatly improve the heat transfer efficiency. The whisker structure layer 111 is referred to (Attachment 1). Attachment 1 is an image of a whisker structure layer 111 scanning electron microscope, and the whisker structure layer is attached to another capillary structure. BRIEF DESCRIPTION OF THE DRAWINGS [0005] FIG. 1 is a perspective view of a first embodiment of a heat dissipation structure of a heat dissipation device of the present invention; FIG. 2 is a cross-sectional view of a first embodiment of a heat dissipation structure of the heat dissipation device of the present invention. Form No. Α0101 Page 7 of 18 Figure 2A is a partial enlarged view of the AA cross section of the first embodiment of the heat dissipation structure of the heat sink of the present invention; Fig. 3 is a heat dissipation structure of the heat sink of the present invention FIG. 4 is a cross-sectional view showing a third embodiment of the heat dissipation structure of the heat dissipation device of the present invention, and FIG. 5 is a cross-sectional view showing a fourth embodiment of the heat dissipation structure of the heat dissipation device of the present invention, FIG. The cross-sectional view of the fifth embodiment of the heat dissipation structure of the heat sink of the present invention; FIG. 7 is a cross-sectional view of the sixth embodiment of the heat dissipation structure of the heat sink of the present invention, and FIG. 8 is a heat dissipation structure of the heat sink of the present invention. The sectional view of the seventh embodiment, the ninth embodiment is a cross-sectional view of the eighth embodiment of the winter heat dissipation structure of the heat dissipation device of the present invention, and the tenth figure is the ninth embodiment of the heat dissipation structure of the heat dissipation device of the present invention. Sectional view; Annex I is a scanning electron microscope image of the whisker structure layer. [Main component symbol description] [0006] Heat sink body 1 chamber 11 whisker layer 111 Working fluid 112 First section 113 Second section 114 Form No. A0101 Page 8 of 18 M429083 Third section 115 Coating 2 Capillary Structure 3 Form No. A0101 Page 9 of 18