TWI416013B - Fan - Google Patents
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- TWI416013B TWI416013B TW97128375A TW97128375A TWI416013B TW I416013 B TWI416013 B TW I416013B TW 97128375 A TW97128375 A TW 97128375A TW 97128375 A TW97128375 A TW 97128375A TW I416013 B TWI416013 B TW I416013B
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Abstract
Description
本發明涉及一種風扇,特別係具有液晶顯示屏之風扇。 The present invention relates to a fan, particularly a fan having a liquid crystal display.
隨著電腦產業之不斷發展,電子元件運行頻率和速度不斷提升,發熱量越來越大,若不及時排除,其運行中產生之熱量累積引起之溫度升高,將會影響發熱電子元件之正常工作。 With the continuous development of the computer industry, the operating frequency and speed of electronic components continue to increase, and the heat generation is getting larger and larger. If not eliminated in time, the temperature rise caused by the accumulation of heat generated during operation will affect the normal heating element. jobs.
業界通常借助風扇來對發熱電子元件散熱。通常該風扇之扇框頂部中心貼置一標籤以標示該風扇之品牌或者標識其他之內容。如此該風扇之扇框只能顯示標識在扇框標籤上之內容,顯示之內容單一、固定。 The industry usually uses a fan to dissipate heat-generating electronic components. Usually, a label is placed on the center of the top of the fan frame to indicate the brand of the fan or to identify other contents. In this way, the fan frame of the fan can only display the content identified on the fan frame label, and the displayed content is single and fixed.
本發明旨在提供一種具有液晶顯示屏能動態顯示風扇資訊及其它資訊之風扇。 The present invention aims to provide a fan having a liquid crystal display capable of dynamically displaying fan information and other information.
一種風扇,包括一定子構件,一套置於該定子構件外之轉子構件及包裹該定子構件和轉子構件之扇框,該扇框安裝有一液晶顯示屏,該液晶顯示屏與定子構件電性連接。 A fan includes a certain sub-member, a rotor member disposed outside the stator member, and a fan frame enclosing the stator member and the rotor member, the fan frame being mounted with a liquid crystal display, the liquid crystal display being electrically connected to the stator member .
與習知技術相比,本發明風扇能夠動態顯示各種資訊,如公司標識、環境溫度、CPU溫度及該風扇之轉速等,顯示內容 豐富,並且本發明可以根據實際需要調整顯示之內容。 Compared with the prior art, the fan of the present invention can dynamically display various information such as company logo, ambient temperature, CPU temperature and the speed of the fan, etc. It is rich, and the present invention can adjust the content of the display according to actual needs.
10‧‧‧轉子構件 10‧‧‧Rotor components
21‧‧‧電路板 21‧‧‧ boards
23‧‧‧風扇接線點 23‧‧‧Fan wiring points
25‧‧‧晶片 25‧‧‧ wafer
27‧‧‧測溫探頭 27‧‧‧temperature probe
32‧‧‧頂壁 32‧‧‧ top wall
324‧‧‧凹槽 324‧‧‧ Groove
328‧‧‧開口 328‧‧‧ openings
34‧‧‧底壁 34‧‧‧ bottom wall
344‧‧‧安裝孔 344‧‧‧Installation holes
38‧‧‧中心柱 38‧‧‧ center column
44‧‧‧屏幕 44‧‧‧ screen
20‧‧‧定子構件 20‧‧‧STAR components
22‧‧‧電樞 22‧‧‧ Armature
24‧‧‧第一焊接點 24‧‧‧First solder joint
26‧‧‧第二焊接點 26‧‧‧Second solder joint
30‧‧‧扇框 30‧‧‧Fan frame
322‧‧‧支撐肋 322‧‧‧Support ribs
326‧‧‧壓塊 326‧‧‧Clamps
320‧‧‧中心座 320‧‧‧ center seat
342‧‧‧安裝凸耳 342‧‧‧ Mounting lugs
36‧‧‧連接壁 36‧‧‧Connecting wall
40‧‧‧液晶顯示屏 40‧‧‧LCD display
42‧‧‧第三焊接點 42‧‧‧ third welding point
圖1係本發明風扇之立體組裝圖。 1 is a perspective assembled view of a fan of the present invention.
圖2係本發明風扇之立體分解圖。 Figure 2 is an exploded perspective view of the fan of the present invention.
圖3係本發明風扇之另一角度之立體分解圖。 Figure 3 is an exploded perspective view of another angle of the fan of the present invention.
請同時參閱圖1和圖2,本發明風扇包括一轉子構件10、一套置於該轉子構件10內之定子構件20、將該定子構件20和轉子構件10包裹其內之扇框30及安裝在該扇框30頂端中心之液晶顯示屏40。 1 and 2, the fan of the present invention includes a rotor member 10, a set of stator members 20 disposed within the rotor member 10, a fan frame 30 enclosing the stator member 20 and the rotor member 10, and mounting The liquid crystal display 40 at the center of the top of the fan frame 30.
請參閱圖2,所述定子構件20包括一圓環形之電路板21及固定於該電路板21底面之由複數層矽鋼片疊設形成之一電樞22。該電樞22上纏繞繞線(未標示)用以產生交替變化之磁場,該繞線與電路板21電性連接。該電路板21之遠離電樞22之頂面設有複數風扇接線點23及複數第一焊接點24。在本實施例中,該等風扇接線點23和第一焊接點24設置在所述電路板21頂面之相對兩側。在該電路板21頂面之另外相對兩側分別設置一智能晶片25。在其他實施例中,該等風扇接線點23和第一焊接點24可根據實際需要排佈在其他位置。在本實施例中,所述智能晶片25之數量為二。在其他實施例中,該智能晶片25根據實際需要可為其他數量。在本實施例中,在所述風扇接線點23之外側設置有二第二焊接點26。一測溫探頭27焊接於該第二焊接點26上用以將該測測溫探頭27所測量之環 境溫度傳輸到電路板21之晶片25上。該測溫探頭27凸伸出該電路板21。 Referring to FIG. 2, the stator member 20 includes a circular circuit board 21 and an armature 22 formed by stacking a plurality of layers of silicon steel sheets fixed to the bottom surface of the circuit board 21. The armature 22 is wound with a winding (not shown) for generating an alternating magnetic field, and the winding is electrically connected to the circuit board 21. The top surface of the circuit board 21 remote from the armature 22 is provided with a plurality of fan connection points 23 and a plurality of first solder joints 24. In this embodiment, the fan connection points 23 and the first solder joints 24 are disposed on opposite sides of the top surface of the circuit board 21. A smart wafer 25 is disposed on each of the other opposite sides of the top surface of the circuit board 21. In other embodiments, the fan junctions 23 and the first solder joints 24 can be arranged at other locations as needed. In this embodiment, the number of the smart wafers 25 is two. In other embodiments, the smart wafer 25 can be other quantities as needed. In the present embodiment, two second solder joints 26 are disposed on the outer side of the fan connection point 23. A temperature measuring probe 27 is soldered to the second soldering point 26 for measuring the loop of the temperature measuring probe 27. The ambient temperature is transferred to the wafer 25 of the circuit board 21. The temperature measuring probe 27 protrudes from the circuit board 21.
所述扇框30包括一圓環形頂壁32、平行於該頂壁32且直徑大於頂壁32之圓環形底壁34及連接頂壁32周緣及底壁34周緣之複數間隔設置之連接壁36。該頂壁32中心位置處設置一圓盤形中心座320。複數支撐肋322連接中心座320外周緣及頂壁32內周緣,每一支撐肋322與連接壁36之位置相對應。一中心柱38自該中心座320中心向下延伸以供所述定子構件20和轉子構件10穿置。其中一支撐肋322上設有理線結構。該理線結構包括在該支撐肋322上設置之用於收容風扇數據線(圖未示)之凹槽324及自支撐壁322兩側壁延伸出之用以壓置所述風扇數據線之二壓塊326。該中心座320在靠近該理線結構處開設一開口328以便所述風扇數據線對應焊接至所述風扇接線點23,並且該風扇數據線穿過開口328收容於支撐壁322之凹槽324內。所述圓環形底壁34之周緣均勻對稱地向外凸設有四安裝凸耳342。每一安裝凸耳342上開設有一側向半封閉之安裝孔344,以供螺釘(圖未示)自上向下穿過而與其他部件配合。 The fan frame 30 includes a circular top wall 32, a circular bottom wall 34 parallel to the top wall 32 and having a diameter larger than the top wall 32, and a plurality of spaced connections connecting the periphery of the top wall 32 and the periphery of the bottom wall 34. Wall 36. A disc-shaped center seat 320 is disposed at a central position of the top wall 32. The plurality of support ribs 322 are connected to the outer circumference of the center seat 320 and the inner circumference of the top wall 32, and each of the support ribs 322 corresponds to the position of the connection wall 36. A center post 38 extends downwardly from the center of the center block 320 for the stator member 20 and the rotor member 10 to pass through. One of the support ribs 322 is provided with a cable management structure. The cable management structure includes a recess 324 disposed on the support rib 322 for receiving a fan data line (not shown) and two sidewalls extending from the side walls of the self-supporting wall 322 for pressing the fan data line. Block 326. The central base 320 defines an opening 328 near the cable structure so that the fan data line is correspondingly soldered to the fan connection point 23, and the fan data line is received in the recess 324 of the support wall 322 through the opening 328. . The circumference of the annular bottom wall 34 is uniformly symmetrically convexly provided with four mounting lugs 342. Each of the mounting lugs 342 is provided with a laterally semi-closed mounting hole 344 for a screw (not shown) to pass through from the top to the bottom to cooperate with other components.
請同時參閱圖3,所述液晶顯示屏40下側對應所述電路板21設有複數第三焊接點42,用以與該電路板21之第一焊接點24電性連接。該第三焊接點42可根據實際需要設置相應之數量。請同時參閱圖1,在本實施例中,該液晶顯示屏40之屏幕44形狀為長方形,在長方形之屏幕44內顯示資料資訊之內容 。在其他實施例中,該液晶顯示屏40之屏幕44形狀可為其他形狀。該液晶顯示屏40所顯示之內容可根據需要顯示不同之內容,例如,顯示公司標識、環境溫度、本發明風扇之轉速及CPU溫度等資訊內容。 Referring to FIG. 3 , the circuit board 21 is provided with a plurality of third solder joints 42 on the lower side of the liquid crystal display 40 for electrically connecting to the first solder joint 24 of the circuit board 21 . The third solder joint 42 can be set according to actual needs. Referring to FIG. 1 at the same time, in the embodiment, the screen 44 of the liquid crystal display 40 has a rectangular shape, and the content of the information information is displayed on the rectangular screen 44. . In other embodiments, the shape of the screen 44 of the liquid crystal display 40 can be other shapes. The content displayed on the liquid crystal display 40 can display different contents as needed, for example, display information such as company logo, ambient temperature, rotational speed of the fan of the present invention, and CPU temperature.
請同時參閱圖1至圖3,本發明風扇之安裝過程中,首先將具有一定長度之數據線(圖未示)焊接至所述定子構件20之第一焊接點24。其次將該定子構件20套置於所述中心柱38上,並將所述風扇接線點23對準所述頂座32之開口328,同時將焊接至第一焊接點24之數據線凸露出該定子構件20之電路板21。然後,將風扇之數據線焊接至風扇接線點23,並將該風扇數據線整理在支撐肋322之理線結構中。再次,將所述轉子構件10套置於定子構件20外圍。最後,將焊接至第一焊接點24之數據線之另一端焊接至上述液晶顯示屏40之第三焊接點42上,然後將該液晶顯示屏40固定至上述扇框30之中心座320上,此時,本發明風扇組裝完成。 Referring to FIG. 1 to FIG. 3 simultaneously, in the installation process of the fan of the present invention, a data line (not shown) having a certain length is first welded to the first solder joint 24 of the stator member 20. Next, the stator member 20 is placed over the center post 38, and the fan connection point 23 is aligned with the opening 328 of the top seat 32 while the data line soldered to the first solder joint 24 is exposed. The circuit board 21 of the stator member 20. Then, the data line of the fan is soldered to the fan connection point 23, and the fan data line is organized in the wire structure of the support rib 322. Again, the rotor member 10 is placed over the periphery of the stator member 20. Finally, the other end of the data line soldered to the first solder joint 24 is soldered to the third solder joint 42 of the liquid crystal display panel 40, and then the liquid crystal display panel 40 is fixed to the center block 320 of the fan frame 30. At this time, the fan assembly of the present invention is completed.
本發明風扇在使用過程中,該風扇之轉速、CPU溫度,上述智能晶片25中已編輯之程式及上述測溫探頭27採集到之環境溫度等資料資訊藉由該智能晶片25之運算轉換,將數據信息轉換成模擬信號,然後藉由上述液晶顯示屏40有規律之顯示出來。 During the use of the fan of the present invention, the speed of the fan, the CPU temperature, the edited program in the smart chip 25, and the ambient temperature and the like collected by the temperature measuring probe 27 are converted by the operation of the smart chip 25. The data information is converted into an analog signal and then displayed by the liquid crystal display 40 as described above.
與習知技術相比,本發明風扇能夠動態顯示各種資訊,如公司標識、環境溫度、CPU溫度及該風扇之轉速等,顯示內容豐富,並且本發明可以根據實際需要調整顯示之資訊。 Compared with the prior art, the fan of the present invention can dynamically display various information, such as company logo, ambient temperature, CPU temperature, and the speed of the fan, etc., and the display content is rich, and the present invention can adjust the displayed information according to actual needs.
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
10‧‧‧轉子構件 10‧‧‧Rotor components
21‧‧‧電路板 21‧‧‧ boards
23‧‧‧風扇接線點 23‧‧‧Fan wiring points
25‧‧‧晶片 25‧‧‧ wafer
27‧‧‧測溫探頭 27‧‧‧temperature probe
32‧‧‧頂壁 32‧‧‧ top wall
324‧‧‧凹槽 324‧‧‧ Groove
328‧‧‧開口 328‧‧‧ openings
34‧‧‧底壁 34‧‧‧ bottom wall
344‧‧‧安裝孔 344‧‧‧Installation holes
38‧‧‧中心柱 38‧‧‧ center column
44‧‧‧屏幕 44‧‧‧ screen
20‧‧‧定子構件 20‧‧‧STAR components
22‧‧‧電樞 22‧‧‧ Armature
24‧‧‧第一焊接點 24‧‧‧First solder joint
26‧‧‧第二焊接點 26‧‧‧Second solder joint
30‧‧‧扇框 30‧‧‧Fan frame
322‧‧‧支撐肋 322‧‧‧Support ribs
326‧‧‧壓塊 326‧‧‧Clamps
320‧‧‧中心座 320‧‧‧ center seat
342‧‧‧安裝凸耳 342‧‧‧ Mounting lugs
36‧‧‧連接壁 36‧‧‧Connecting wall
40‧‧‧液晶顯示屏 40‧‧‧LCD display
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97128375A TWI416013B (en) | 2008-07-25 | 2008-07-25 | Fan |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97128375A TWI416013B (en) | 2008-07-25 | 2008-07-25 | Fan |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201005186A TW201005186A (en) | 2010-02-01 |
| TWI416013B true TWI416013B (en) | 2013-11-21 |
Family
ID=44826136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97128375A TWI416013B (en) | 2008-07-25 | 2008-07-25 | Fan |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI416013B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12120843B2 (en) | 2020-09-16 | 2024-10-15 | Delta Electronics, Inc. | Fan management system and method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2307946Y (en) * | 1997-08-06 | 1999-02-17 | 邵树发 | Do-it-yourself fan thermostat |
| US6830434B2 (en) * | 2001-11-05 | 2004-12-14 | Aisin Kako Kabushiki Kaisha | Cooling fan |
| CN2763974Y (en) * | 2005-01-08 | 2006-03-08 | 富准精密工业(深圳)有限公司 | Radiator |
-
2008
- 2008-07-25 TW TW97128375A patent/TWI416013B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2307946Y (en) * | 1997-08-06 | 1999-02-17 | 邵树发 | Do-it-yourself fan thermostat |
| US6830434B2 (en) * | 2001-11-05 | 2004-12-14 | Aisin Kako Kabushiki Kaisha | Cooling fan |
| CN2763974Y (en) * | 2005-01-08 | 2006-03-08 | 富准精密工业(深圳)有限公司 | Radiator |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12120843B2 (en) | 2020-09-16 | 2024-10-15 | Delta Electronics, Inc. | Fan management system and method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201005186A (en) | 2010-02-01 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |