CN2763974Y - Radiator - Google Patents

Abstract

The utility model relates to a heat radiator for the heat radiation of an electronic element and comprises a heat absorption part, a heat radiation part engaged with the heat absorption part and a heat reservoir engaged with the heat radiation part, wherein the heat reservoir is a container made of heat conduction material. Medium with large specific heat is reserved in the heat reservoir. The heat radiator causes the efficiency of the heat radiation of the heat radiator to be increased and the fluctuation of the working temperature of the electronic element to be stable through the arrangement of the heat reservoir. Therefore, the noise generated in the operation of a fan is caused to become smaller and have no fluctuation.

Description

heat sink

【Technical field】

The utility model relates to a heat dissipation device, in particular to a heat dissipation device used for electronic components.

【Background technique】

Electronic components such as the central processing unit generate a lot of heat during operation, and if the heat generated is not discharged in time, it will affect the operation stability of the electronic components and even cause serious consequences of burning them. Therefore, in order to ensure the normal operation of the electronic components, the industry generally installs a heat sink on the electronic components for auxiliary heat dissipation.

Usually, in order to dissipate heat quickly, a fan is also installed on the radiator, but the noise problem of fan operation also arises thereupon. Since the heat generated by electronic components is not constant during the working process, the use of a fan with a fixed speed is bound to produce some adverse consequences, for example, if the fan speed is too small, the noise is small but the heat dissipation is not sufficient, or the fan speed is too high and the heat dissipation is sufficient But it is too noisy and wastes resources. In order to overcome the above problems, currently, the industry widely uses BIOS (Basic Input Output System) to control the fan speed to achieve an optimal balance of heat dissipation and noise. When the computer is turned on or some programs are running, the heat generated by the central processing unit and other electronic components increases sharply, and the temperature rises, and the BIOS then instructs the fan to speed up. The components generate less heat and the temperature is lower, and the BIOS then instructs the fan to slow down. However, due to the unsteady change of the temperature of the electronic components such as the central processing unit, the rotation speed of the fan controlled by the BIOS changes accordingly, and the phenomenon of high and low noise occurs, which makes people feel harsh.

【Content of invention】

The technical problem to be solved by the utility model is to provide a heat dissipation device with low noise and no noise fluctuation that can effectively dissipate heat to electronic components.

The technical problem to be solved by the utility model is solved by the following technical solutions: the utility model heat dissipation device is used for heat dissipation of electronic components, which includes a heat absorption part and a heat dissipation part joined with the heat absorption part, and the heat dissipation device also It includes a heat accumulator connected with the radiating part, the heat accumulator is a container made of heat-conducting material, and a medium with high specific heat is stored in it.

Compared with the prior art, the heat dissipation device of the utility model is equipped with a heat storage device, so that the heat dissipation efficiency of the heat dissipation device is improved, and the fluctuation of the working temperature of the electronic components is relatively stable, so that the noise generated by the fan during operation is small and has no fluctuations. .

【Description of drawings】

Fig. 1 is a three-dimensional assembled view of the heat dissipation device of the present invention.

Fig. 2 is a three-dimensional exploded view of the heat dissipation device of the present invention.

Fig. 3 is a three-dimensional assembled view of another embodiment of the heat dissipation device of the present invention.

Fig. 4 is a three-dimensional exploded view of another embodiment of the heat dissipation device of the present invention.

【Detailed ways】

Please refer to Fig. 1 and Fig. 2, the heat dissipation device of the present utility model is used to be installed on the heating electronic components such as the central processing unit (not shown) of a computer system to carry out heat dissipation to it. The heat dissipation device includes a radiator 10 , three heat pipes 20 , a heat storage 30 and a fan 40 .

The heat sink 10 includes a base 11 for absorbing heat and a cooling fin group 14 arranged on the base 11 for heat dissipation. The lower surface of the base 11 is attached to the surface of the central processing unit. Three semi-cylindrical grooves 12 are opened on the upper surface. The lower surface of the heat sink set 14 is provided with three semi-cylindrical grooves 15 corresponding to the grooves 12 on the upper surface of the base 11 , and the upper surface of the heat sink set 14 is provided with three relatively dispersed semi-cylindrical grooves 16 .

The heat accumulator 30 is a square airtight container made of heat-conducting material, which stores a medium with a relatively high specific heat, such as water, etc., and the lower surface of the heat accumulator 30 is provided with three grooves 16 which are connected with the heat sink group 14 The corresponding semi-cylindrical groove 32.

Each heat pipe 20 is substantially U-shaped, and has a first horizontal section 22 , a second horizontal section 24 and a middle section connecting the first and second horizontal sections 22 , 24 .

The lower surface of the fin assembly 14 is joined to the upper surface of the base 11 , and the grooves 12 and 15 correspond to form three cylindrical lower accommodating grooves. The lower surface of the heat accumulator 30 is joined to the upper surface of the fin assembly 14 , and the grooves 32 , 16 correspond to form three cylindrical upper accommodating grooves. The first horizontal section 22 and the second horizontal section 24 of each heat pipe 20 can be respectively fixed in the lower and upper accommodating grooves by means of heat-conducting adhesive bonding or solder paste welding.

The fan 40 is disposed on one side of the heat sink assembly 14 through a fixing member 41 , and its rotational speed is controlled by the BIOS of the computer system according to the temperature of the central processing unit.

When the central processing unit is working, the heat generated by it is absorbed by the base 11 of the heat sink 10, and a part of the heat is directly transferred to the heat sink group 14 by the base 11, and at the same time, another part of the heat is quickly transferred to the heat sink group 14 through the heat pipe 20. The upper part and the heat storage 30 are released by the cooling fin group 14 and the fan 40 and absorbed by the medium in the heat storage 30 to be stored in the heat storage 30 .

Please refer to Fig. 3 and Fig. 4, it is another embodiment of the heat dissipation device of the present invention, the heat accumulator 30' is a U-shaped container, and it has an upper part 33, a lower part 34 and connecting the upper and lower parts 33, 34 In the middle part, the radiator 10 is placed between the upper and lower parts 33, 34, the lower surface of the upper part 33 is joined with the upper surface of the heat sink group 14, and three grooves are provided on the lower surface with the heat sink group 14 16 corresponds to the semi-cylindrical groove 36 , the upper surface of the lower part 34 is joined with the lower surface of the base 11 of the radiator 10 .

In the utility model, the heat storage device 30, 30' is not limited to the above-mentioned shape, it can be other shapes that can be joined with the cooling fin group 14 of the radiator 10, such as a □ shape, etc.; the heat storage device 30, 30' is not limited to The above-mentioned positions can be set at other positions that can be connected with the fin assembly 14 of the heat sink 10 .

Compared with the prior art, the heat dissipation device of the utility model is provided with a heat storage device, and the medium in the heat storage device absorbs part of the heat generated by the central processing unit, and because the specific heat of the medium is relatively large, the temperature when absorbing a certain amount of heat The change is not obvious, so that there is a larger temperature difference between the central processing unit and the heat storage device. In addition, the heat pipe has a faster heat transfer speed, so the heat generated by the central processing unit is quickly transferred to the heat storage device and absorbed. And spread to the heat sink group to dissipate, avoid the heat accumulation of the central processing unit, so that the operating temperature of the central processing unit is lower and the temperature change is more stable, and the fan speed is controlled by the BIOS of the computer system according to the temperature of the central processing unit , so that the rotational speed of the fan is smaller and more stable, and the noise generated by the fan is lower and has no fluctuation.

Claims (8)

1. heat abstractor, it comprises a radiator and a fan, it is characterized in that: this radiator comprises an endothermic section and a radiating part that engages with this endothermic section, this heat abstractor also comprises a thermal storage device that engages with this radiating part, this thermal storage device is a container of being made by Heat Conduction Material, stores the big medium of specific heat in it.

2. heat abstractor as claimed in claim 1 is characterized in that: described medium is a water.

3. heat abstractor as claimed in claim 2 is characterized in that: described heat abstractor also comprises some heat pipes that engage with this thermal storage device and endothermic section respectively.

4. heat abstractor as claimed in claim 3, it is characterized in that: described each heat pipe is a ㄈ shape, it comprises one first horizontal segment and one second horizontal segment, and this first horizontal part engages with this radiating part and endothermic section, and this second horizontal segment engages with this thermal storage device and radiating part.

5. heat abstractor as claimed in claim 2 is characterized in that: described container is square.

6. heat abstractor as claimed in claim 5 is characterized in that: described thermal storage device is engaged in this radiating part top.

7. heat abstractor as claimed in claim 2 is characterized in that: described container is a ㄈ shape.

8. heat abstractor as claimed in claim 7 is characterized in that: described thermal storage device comprises a top and a bottom, and this radiator places between this upper and lower part.

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