TWI493730B - 處理基板之方法及裝置 - Google Patents
處理基板之方法及裝置 Download PDFInfo
- Publication number
- TWI493730B TWI493730B TW099122210A TW99122210A TWI493730B TW I493730 B TWI493730 B TW I493730B TW 099122210 A TW099122210 A TW 099122210A TW 99122210 A TW99122210 A TW 99122210A TW I493730 B TWI493730 B TW I493730B
- Authority
- TW
- Taiwan
- Prior art keywords
- container
- foam
- treatment solution
- module
- solution
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
- G03F7/3057—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the processing units other than the developing unit, e.g. washing units
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
-
- H10P70/20—
-
- H10P72/0424—
-
- H10P50/287—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W10/00—Technologies for wastewater treatment
- Y02W10/30—Wastewater or sewage treatment systems using renewable energies
- Y02W10/37—Wastewater or sewage treatment systems using renewable energies using solar energy
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Degasification And Air Bubble Elimination (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009032217A DE102009032217A1 (de) | 2009-07-06 | 2009-07-06 | Verfahren und Vorrichtung zur Behandlung von Substraten |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201115636A TW201115636A (en) | 2011-05-01 |
| TWI493730B true TWI493730B (zh) | 2015-07-21 |
Family
ID=43307765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099122210A TWI493730B (zh) | 2009-07-06 | 2010-07-06 | 處理基板之方法及裝置 |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US20120097188A1 (es) |
| EP (1) | EP2452356B1 (es) |
| JP (1) | JP2012532471A (es) |
| KR (1) | KR101717261B1 (es) |
| CN (1) | CN102576199B (es) |
| AU (1) | AU2010270288A1 (es) |
| CA (1) | CA2765288A1 (es) |
| DE (1) | DE102009032217A1 (es) |
| ES (1) | ES2426567T3 (es) |
| IL (1) | IL217326A0 (es) |
| MX (1) | MX2012000344A (es) |
| MY (1) | MY154759A (es) |
| SG (1) | SG177420A1 (es) |
| TW (1) | TWI493730B (es) |
| WO (1) | WO2011003880A2 (es) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2923703C (en) | 2013-09-18 | 2021-10-05 | Flint Group Germany Gmbh | Digitally exposable flexographic printing element and method for producing flexographic printing plates |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4519690A (en) * | 1982-08-06 | 1985-05-28 | Hitachi Chemical Company, Ltd. | Process for developing or peeling alkali-type photosensitive film and apparatus used therein |
| TW200832549A (en) * | 2006-10-23 | 2008-08-01 | Samsung Electronics Co Ltd | Removing photoresist from substrates by means of treatment liquid, and processing treatment liquid with ozone |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1952727A (en) * | 1929-10-26 | 1934-03-27 | United Verde Copper Company | Froth flotation |
| US3846330A (en) * | 1973-08-16 | 1974-11-05 | Du Pont | Apparatus |
| DE2361150B2 (de) * | 1973-12-07 | 1980-12-11 | Agfa-Gevaert Ag, 5090 Leverkusen | Fotografisches Gerät zur Naßbehandlung fotografischer Schichtträger |
| DE2820815C2 (de) * | 1978-05-12 | 1983-09-29 | Gebr. Schmid GmbH & Co, 7290 Freudenstadt | Durchlaufmaschine zum Entfernen von Fotoresisten und/oder Siebdruckfarben von Trägern |
| US4722355A (en) * | 1985-08-19 | 1988-02-02 | Rolf Moe | Machine and method for stripping photoresist from wafers |
| JPS6274089A (ja) * | 1985-09-28 | 1987-04-04 | Tanaka Kikinzoku Kogyo Kk | プリント基板製造装置 |
| US4861385A (en) * | 1986-10-02 | 1989-08-29 | Aisaburo Yagishita | Article washing method |
| DE3736578A1 (de) * | 1987-10-26 | 1989-05-03 | Schering Ag | Verfahren zum zerstoeren von schaum und vorrichtung dafuer |
| DE3813518A1 (de) * | 1988-04-22 | 1989-11-02 | Hoellmueller Maschbau H | Maschine zum reinigen und/oder spuelen von bohrungen in leiterplatten |
| JPH0737311Y2 (ja) * | 1990-03-30 | 1995-08-23 | 株式会社芝浦製作所 | 処理装置の気泡発生防止装置 |
| JP2732725B2 (ja) * | 1991-06-14 | 1998-03-30 | 富士写真フイルム株式会社 | 水なし平版印刷版の廃液処理装置 |
| DE9200734U1 (de) * | 1992-01-23 | 1992-05-07 | Gebr. Schmid GmbH & Co, 7290 Freudenstadt | Vorrichtung zur Aufbereitung einer partikelbeladenen in einem Prozess anfallenden Flüssigkeit |
| JPH07509539A (ja) * | 1992-08-01 | 1995-10-19 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 特に平坦な被処理物を電解的に処理する方法,及び特にこの方法を実施するための装置 |
| US5759743A (en) * | 1992-10-30 | 1998-06-02 | Nippon Paint Co., Ltd. | Developer-circulating method in flexographic printing plate-making process and apparatus for carrying out developer-circulating method |
| DE4406759A1 (de) * | 1994-03-02 | 1995-09-07 | Gat Handels U Servicegesellsch | Reinigungs- und Wiederaufbereitungsverfahren für Wasser, Entwickler und Fixiererflüssigkeit, im Bereich von Filmentwicklung und Repros |
| US5494644A (en) * | 1994-12-06 | 1996-02-27 | Ecolab Inc. | Multiple product dispensing system including dispenser for forming use solution from solid chemical compositions |
| DE19715893C2 (de) * | 1997-04-16 | 1999-04-29 | Boehringer Ingelheim Int | Vorrichtung zum Entnehmen einer Flüssigkeit aus einem geschlossenen Behälter |
| EP0883027B1 (en) * | 1997-06-05 | 2001-09-19 | AGFA-GEVAERT naamloze vennootschap | A method for making an offset printing plate according to the silver salt diffusion transfer process |
| US6247856B1 (en) * | 1998-01-22 | 2001-06-19 | Toyo Boseki Kabushiki Kaisha | Developing system of photosensitive resin plates and apparatus used therein |
| DE19944908A1 (de) * | 1999-09-10 | 2001-04-12 | Atotech Deutschland Gmbh | Verfahren zum Bilden eines Leitermusters auf dielektrischen Substraten |
| US6454835B1 (en) * | 2000-06-02 | 2002-09-24 | Scitex Digital Printing, Inc. | Two-phase flow separator |
| JP2002292315A (ja) * | 2001-03-29 | 2002-10-08 | Kyocera Corp | 噴霧装置およびそれを用いた現像方法 |
| KR100652044B1 (ko) * | 2001-12-18 | 2006-11-30 | 엘지.필립스 엘시디 주식회사 | 스트립 장치 |
| JP2003218502A (ja) * | 2002-01-22 | 2003-07-31 | Fujikura Ltd | 回路基板製造処理装置 |
| DE10225848A1 (de) * | 2002-06-04 | 2003-12-24 | Schmid Gmbh & Co Geb | Vorrichtung und Verfahren zum Lösen von Schichten von der Oberseite von flächigen Substraten |
| JP2004327962A (ja) * | 2003-04-07 | 2004-11-18 | Matsushita Electric Ind Co Ltd | レジストの剥離装置及び剥離方法 |
| DE102004002421A1 (de) * | 2004-01-16 | 2005-08-18 | Atotech Deutschland Gmbh | Düsenanordnung |
| JP4099489B2 (ja) * | 2005-04-15 | 2008-06-11 | 東京化工機株式会社 | レジスト回収装置 |
| JP4481865B2 (ja) * | 2005-04-15 | 2010-06-16 | 株式会社フジクラ | 現像機におけるスカム除去方法およびその装置 |
| JP2008013389A (ja) * | 2006-07-04 | 2008-01-24 | Nec Corp | エッチング装置及び薄型ガラス基板の製造方法 |
| JP2008085119A (ja) * | 2006-09-28 | 2008-04-10 | Tokyo Kakoki Kk | 薬液処理装置 |
| JP2008137733A (ja) * | 2006-11-30 | 2008-06-19 | Tokyo Kakoki Kk | 表面処理装置のコンベア |
| DE102007063202A1 (de) * | 2007-12-19 | 2009-06-25 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zur Behandlung von Silizium-Wafern |
-
2009
- 2009-07-06 DE DE102009032217A patent/DE102009032217A1/de not_active Withdrawn
-
2010
- 2010-07-05 ES ES10728247T patent/ES2426567T3/es active Active
- 2010-07-05 KR KR1020127000222A patent/KR101717261B1/ko active Active
- 2010-07-05 WO PCT/EP2010/059589 patent/WO2011003880A2/de not_active Ceased
- 2010-07-05 CN CN201080031214.5A patent/CN102576199B/zh active Active
- 2010-07-05 SG SG2011097201A patent/SG177420A1/en unknown
- 2010-07-05 AU AU2010270288A patent/AU2010270288A1/en not_active Abandoned
- 2010-07-05 JP JP2012518953A patent/JP2012532471A/ja active Pending
- 2010-07-05 EP EP10728247.7A patent/EP2452356B1/de active Active
- 2010-07-05 MY MYPI2012000056D patent/MY154759A/en unknown
- 2010-07-05 CA CA2765288A patent/CA2765288A1/en not_active Abandoned
- 2010-07-05 MX MX2012000344A patent/MX2012000344A/es not_active Application Discontinuation
- 2010-07-06 TW TW099122210A patent/TWI493730B/zh active
-
2011
- 2011-12-29 US US13/340,269 patent/US20120097188A1/en not_active Abandoned
-
2012
- 2012-01-02 IL IL217326A patent/IL217326A0/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4519690A (en) * | 1982-08-06 | 1985-05-28 | Hitachi Chemical Company, Ltd. | Process for developing or peeling alkali-type photosensitive film and apparatus used therein |
| TW200832549A (en) * | 2006-10-23 | 2008-08-01 | Samsung Electronics Co Ltd | Removing photoresist from substrates by means of treatment liquid, and processing treatment liquid with ozone |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101717261B1 (ko) | 2017-03-16 |
| SG177420A1 (en) | 2012-02-28 |
| WO2011003880A3 (de) | 2011-07-07 |
| TW201115636A (en) | 2011-05-01 |
| MX2012000344A (es) | 2012-04-10 |
| EP2452356B1 (de) | 2013-06-05 |
| IL217326A0 (en) | 2012-02-29 |
| JP2012532471A (ja) | 2012-12-13 |
| EP2452356A2 (de) | 2012-05-16 |
| CN102576199B (zh) | 2015-05-06 |
| AU2010270288A1 (en) | 2012-01-12 |
| KR20120102033A (ko) | 2012-09-17 |
| CN102576199A (zh) | 2012-07-11 |
| CA2765288A1 (en) | 2011-01-13 |
| WO2011003880A2 (de) | 2011-01-13 |
| MY154759A (en) | 2015-07-15 |
| ES2426567T3 (es) | 2013-10-24 |
| US20120097188A1 (en) | 2012-04-26 |
| DE102009032217A1 (de) | 2011-01-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101983415B (zh) | 处理硅晶片的方法和装置 | |
| KR20110108223A (ko) | 반송식 기판 처리 장치에 있어서의 절수형 세정 시스템 | |
| WO2010087435A1 (ja) | 基板処理装置 | |
| JP5020369B2 (ja) | 酸性ミストの除去処理方法、及びその除去処理装置 | |
| KR102088632B1 (ko) | 세정 방법 및 세정 장치 | |
| TWI493730B (zh) | 處理基板之方法及裝置 | |
| CN101607150A (zh) | 降低泡沫的装置及方法 | |
| KR20110089255A (ko) | 기판 처리 장치 | |
| JP4035165B2 (ja) | フィルム剥離方法 | |
| CN102244984B (zh) | 除泡装置 | |
| TWI539029B (zh) | 用於欲處理之平坦材料之濕式化學處理的裝置及方法 | |
| KR101514421B1 (ko) | 기판 처리장치 | |
| JP2008227195A (ja) | 液処理装置 | |
| KR200487444Y1 (ko) | 케미컬 탱크의 기포 제거장치 | |
| KR101358914B1 (ko) | 포토레지스트 박리장치 | |
| RU2505337C2 (ru) | Подающая распределительная система резервуара для обработки жидкости | |
| KR100580873B1 (ko) | 식각장치 | |
| KR20090077932A (ko) | 수산화테트라알킬암모늄 함유 현상 폐액의 중화방법 | |
| CN220491850U (zh) | 湿法刻蚀清洗设备 | |
| KR20080005942U (ko) | 기판 세정용 이류체 공급모듈 및 이를 이용한 세정장치 | |
| JP4481865B2 (ja) | 現像機におけるスカム除去方法およびその装置 | |
| CN206438184U (zh) | 一种防渗酸洗池 | |
| KR100812096B1 (ko) | 글라스 식각장치 및 식각방법 | |
| JP2009087971A (ja) | 剥離装置 | |
| JP5515366B2 (ja) | 基板の水平搬送処理装置 |