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TWI492972B - 熱傳導性片材 - Google Patents

熱傳導性片材 Download PDF

Info

Publication number
TWI492972B
TWI492972B TW100103573A TW100103573A TWI492972B TW I492972 B TWI492972 B TW I492972B TW 100103573 A TW100103573 A TW 100103573A TW 100103573 A TW100103573 A TW 100103573A TW I492972 B TWI492972 B TW I492972B
Authority
TW
Taiwan
Prior art keywords
conductive sheet
thermally conductive
boron nitride
nitride particles
sheet
Prior art date
Application number
TW100103573A
Other languages
English (en)
Chinese (zh)
Other versions
TW201132691A (en
Inventor
泉谷誠治
內山壽惠
福岡孝博
原和孝
平野仁嗣
Original Assignee
日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工股份有限公司 filed Critical 日東電工股份有限公司
Publication of TW201132691A publication Critical patent/TW201132691A/zh
Application granted granted Critical
Publication of TWI492972B publication Critical patent/TWI492972B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW100103573A 2010-01-29 2011-01-28 熱傳導性片材 TWI492972B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2010018256 2010-01-29
JP2010090908 2010-04-09
JP2010161853 2010-07-16
JP2010161847 2010-07-16
JP2010161849 2010-07-16
JP2010161845 2010-07-16
JP2010161850 2010-07-16

Publications (2)

Publication Number Publication Date
TW201132691A TW201132691A (en) 2011-10-01
TWI492972B true TWI492972B (zh) 2015-07-21

Family

ID=44408060

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100103573A TWI492972B (zh) 2010-01-29 2011-01-28 熱傳導性片材

Country Status (5)

Country Link
US (1) US20110259569A1 (ja)
JP (1) JP2012039060A (ja)
KR (1) KR20110089096A (ja)
CN (1) CN102140257B (ja)
TW (1) TWI492972B (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5759191B2 (ja) 2010-01-29 2015-08-05 日東電工株式会社 パワーモジュール
TWI470705B (zh) * 2012-02-07 2015-01-21 Pram Technology Inc 封裝元件之封裝製程改善
JP6138814B2 (ja) 2012-10-24 2017-05-31 シャープ株式会社 発光装置および発光装置の製造方法
CN103059567B (zh) * 2013-01-23 2015-04-22 苏州大学 一种阻燃六方氮化硼/热固性树脂复合材料及其制备方法
JPWO2015105106A1 (ja) 2014-01-08 2017-03-23 Jnc株式会社 熱伝導性シート用樹脂組成物、熱伝導性シート、樹脂被膜金属、電子機器
JP6473597B2 (ja) * 2014-10-22 2019-02-20 株式会社Kri 高熱伝導有機無機コンポジット材料の製造方法
JP6795285B2 (ja) * 2015-02-26 2020-12-02 住友ベークライト株式会社 熱伝導性シート、熱伝導性シートの硬化物および半導体装置
US11884039B2 (en) 2017-05-10 2024-01-30 Sekisui Chemical Co., Ltd. Insulating sheet and laminate
WO2019065150A1 (ja) * 2017-09-28 2019-04-04 富士フイルム株式会社 放熱シートおよび放熱シート付きデバイス
CN110157153B (zh) * 2018-02-11 2022-02-08 中国科学院深圳先进技术研究院 一种环氧树脂/有序氮化硼复合材料及其制备方法
CN110047877A (zh) * 2019-03-27 2019-07-23 武汉华星光电半导体显示技术有限公司 一种有机发光二极管显示面板、显示模组及电子装置
US20220396065A1 (en) * 2019-11-07 2022-12-15 Teijin Limited Heat dissipation sheet and method for producing same
JP7446138B2 (ja) * 2020-03-27 2024-03-08 株式会社ノリタケカンパニーリミテド セラミックスシート、セラミックスシートの製造方法およびグリーンシート
CN118251309A (zh) * 2021-10-14 2024-06-25 圣戈本陶瓷及塑料股份有限公司 形成多层复合体的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008189818A (ja) * 2007-02-05 2008-08-21 Nitto Denko Corp 熱伝導性樹脂組成物および熱伝導性シートとその製造方法
JP2008280496A (ja) * 2007-04-11 2008-11-20 Hitachi Chem Co Ltd 熱伝導シート、その製造方法およびこれを用いた放熱装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6162849A (en) * 1999-01-11 2000-12-19 Ferro Corporation Thermally conductive thermoplastic
US6919504B2 (en) * 2002-12-19 2005-07-19 3M Innovative Properties Company Flexible heat sink
US20070259211A1 (en) * 2006-05-06 2007-11-08 Ning Wang Heat spread sheet with anisotropic thermal conductivity
JP4916764B2 (ja) * 2006-05-10 2012-04-18 電気化学工業株式会社 異方熱伝導積層型放熱部材
JP5002280B2 (ja) * 2007-02-14 2012-08-15 日東電工株式会社 樹脂成形品製造方法
US20080271832A1 (en) * 2007-05-04 2008-11-06 Tyco Electronics Corporation Thermo-conductive, heat-shrinkable, dual-wall tubing
JP5525682B2 (ja) * 2007-05-15 2014-06-18 出光ライオンコンポジット株式会社 ポリアリーレンサルファイド樹脂組成物及びそれからなる成形品
JP2009081253A (ja) * 2007-09-26 2009-04-16 Nitto Shinko Kk 絶縁シート
JP2009280650A (ja) * 2008-05-20 2009-12-03 Shin Kobe Electric Mach Co Ltd 熱可塑性樹脂組成物及び熱可塑性樹脂成形品
CN101343402B (zh) * 2008-08-27 2011-04-20 南亚塑胶工业股份有限公司 印刷电路板用高导热、高玻璃化转变温度的树脂组合物及其预浸渍体及涂层物
JP5330910B2 (ja) * 2009-07-03 2013-10-30 電気化学工業株式会社 樹脂組成物及びその用途
JP5513840B2 (ja) * 2009-10-22 2014-06-04 電気化学工業株式会社 絶縁シート、回路基板及び絶縁シートの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008189818A (ja) * 2007-02-05 2008-08-21 Nitto Denko Corp 熱伝導性樹脂組成物および熱伝導性シートとその製造方法
JP2008280496A (ja) * 2007-04-11 2008-11-20 Hitachi Chem Co Ltd 熱伝導シート、その製造方法およびこれを用いた放熱装置

Also Published As

Publication number Publication date
US20110259569A1 (en) 2011-10-27
KR20110089096A (ko) 2011-08-04
CN102140257A (zh) 2011-08-03
JP2012039060A (ja) 2012-02-23
TW201132691A (en) 2011-10-01
CN102140257B (zh) 2015-10-07

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Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees