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TWI491994B - A photohardenable resin composition, a dry film and a cured product thereof, and a printed wiring board having a hardened film formed using the same - Google Patents

A photohardenable resin composition, a dry film and a cured product thereof, and a printed wiring board having a hardened film formed using the same Download PDF

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Publication number
TWI491994B
TWI491994B TW103108156A TW103108156A TWI491994B TW I491994 B TWI491994 B TW I491994B TW 103108156 A TW103108156 A TW 103108156A TW 103108156 A TW103108156 A TW 103108156A TW I491994 B TWI491994 B TW I491994B
Authority
TW
Taiwan
Prior art keywords
resin composition
resin
film
photocurable
compound
Prior art date
Application number
TW103108156A
Other languages
English (en)
Chinese (zh)
Other versions
TW201447493A (zh
Inventor
Manabu Akiyama
Yoko Shibasaki
Nobuhito Ito
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW201447493A publication Critical patent/TW201447493A/zh
Application granted granted Critical
Publication of TWI491994B publication Critical patent/TWI491994B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW103108156A 2013-03-11 2014-03-10 A photohardenable resin composition, a dry film and a cured product thereof, and a printed wiring board having a hardened film formed using the same TWI491994B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013047548 2013-03-11
JP2013241855A JP5458215B1 (ja) 2013-03-11 2013-11-22 光硬化性樹脂組成物、そのドライフィルムおよび硬化物、並びにそれらを用いて形成された硬化皮膜を有するプリント配線板

Publications (2)

Publication Number Publication Date
TW201447493A TW201447493A (zh) 2014-12-16
TWI491994B true TWI491994B (zh) 2015-07-11

Family

ID=50619260

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103108156A TWI491994B (zh) 2013-03-11 2014-03-10 A photohardenable resin composition, a dry film and a cured product thereof, and a printed wiring board having a hardened film formed using the same

Country Status (4)

Country Link
JP (1) JP5458215B1 (ja)
KR (1) KR101476586B1 (ja)
CN (1) CN104049456B (ja)
TW (1) TWI491994B (ja)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015025925A1 (ja) * 2013-08-23 2015-02-26 味の素株式会社 感光性樹脂組成物
KR20160102986A (ko) * 2013-12-27 2016-08-31 요코하마 고무 가부시키가이샤 자외선 경화형 수지 조성물 및 적층체
JP5876182B1 (ja) 2014-09-30 2016-03-02 太陽インキ製造株式会社 硬化性樹脂組成物、そのドライフィルムおよび硬化物、並びにこれを有するプリント配線板
JP6138976B2 (ja) * 2015-01-23 2017-05-31 株式会社タムラ製作所 感光性樹脂組成物
WO2016129507A1 (ja) * 2015-02-13 2016-08-18 三菱化学株式会社 硬化性組成物、硬化物及び積層体
JP6321059B2 (ja) * 2015-02-18 2018-05-09 株式会社タムラ製作所 感光性樹脂組成物
JP6538390B2 (ja) * 2015-03-24 2019-07-03 株式会社タムラ製作所 感光性樹脂組成物
KR102543357B1 (ko) * 2015-03-31 2023-06-15 다이요 홀딩스 가부시키가이샤 적층 필름
JP6837281B2 (ja) * 2015-03-31 2021-03-03 太陽インキ製造株式会社 積層フィルム
JP6594054B2 (ja) * 2015-06-18 2019-10-23 太陽インキ製造株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
KR102097261B1 (ko) * 2015-08-25 2020-04-06 아사히 가세이 가부시키가이샤 감광성 수지 조성물
JP7018168B2 (ja) * 2015-12-22 2022-02-10 昭和電工マテリアルズ株式会社 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法
JP7066634B2 (ja) * 2016-12-28 2022-05-13 太陽インキ製造株式会社 硬化性組成物、主剤および硬化剤、ドライフィルム、硬化物、および、プリント配線板
JP7210091B2 (ja) * 2017-03-28 2023-01-23 株式会社レゾナック 転写型感光性フィルム、硬化膜パターンの形成方法、硬化膜及びタッチパネル
CN108693702A (zh) * 2017-03-31 2018-10-23 太阳油墨制造株式会社 固化性树脂组合物、层叠结构体、其固化物和电子部件
JP6409106B1 (ja) * 2017-08-30 2018-10-17 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2019178305A (ja) * 2018-03-30 2019-10-17 太陽インキ製造株式会社 硬化性樹脂組成物、該組成物からなるドライフィルム、硬化物および該硬化物を有するプリント配線板
JP7316071B2 (ja) * 2019-03-18 2023-07-27 太陽ホールディングス株式会社 硬化性樹脂組成物、ドライフィルム、硬化物および電子部品
JP7133594B2 (ja) * 2019-09-19 2022-09-08 株式会社タムラ製作所 感光性樹脂組成物
CN112526823B (zh) * 2019-09-19 2025-02-18 株式会社田村制作所 感光性树脂组合物
WO2021065950A1 (ja) * 2019-09-30 2021-04-08 太陽インキ製造株式会社 硬化被膜
KR20230018585A (ko) 2021-07-30 2023-02-07 (주)케이에프엠 이형필름 수지층 형성용 조성물, 이형필름, 이의 제조방법 및 이를 이용한 합성 피혁의 제조방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200738075A (en) * 2005-08-12 2007-10-01 Taiyo Ink Mfg Co Ltd Insulating hardenable composite and its curing object, and printed wiring board using it

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11255865A (ja) * 1998-03-10 1999-09-21 Nippon Kayaku Co Ltd 樹脂組成物、フレキシブルプリント配線板用レジストインキ組成物及びその硬化物
US20070134596A1 (en) * 2005-12-08 2007-06-14 Adrian Lungu Photosensitive printing element having nanoparticles and method for preparing the printing element
JP4976931B2 (ja) * 2006-09-22 2012-07-18 富士フイルム株式会社 感光性組成物、感光性フィルム、永久パターン形成方法、及びプリント基板
JP5472692B2 (ja) * 2009-07-06 2014-04-16 日立化成株式会社 アルカリ現像可能な感光性樹脂組成物及びそれを用いた感光性フィルム
JP5632146B2 (ja) * 2009-09-02 2014-11-26 太陽ホールディングス株式会社 硬化性樹脂組成物
JP5535781B2 (ja) 2010-06-11 2014-07-02 株式会社ニフコ カップホルダ
JP2012073601A (ja) * 2010-08-31 2012-04-12 Fujifilm Corp 感光性組成物、並びに、感光性フィルム、永久パターン、永久パターン形成方法、及びプリント基板
JP2012073600A (ja) * 2010-08-31 2012-04-12 Fujifilm Corp 感光性組成物、並びに、感光性フィルム、永久パターン、永久パターン形成方法、及びプリント基板
KR20160003294A (ko) * 2010-12-28 2016-01-08 다이요 잉키 세이조 가부시키가이샤 광 경화성 수지 조성물, 그의 드라이 필름 및 경화물, 및 이들을 이용한 인쇄 배선판
KR101604557B1 (ko) * 2011-06-17 2016-03-17 다이요 잉키 세이조 가부시키가이샤 광경화성 열경화성 수지 조성물
CN103619960B (zh) * 2011-06-17 2016-11-16 太阳油墨制造株式会社 阻燃性固化性树脂组合物、使用其的干膜及印刷电路板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200738075A (en) * 2005-08-12 2007-10-01 Taiyo Ink Mfg Co Ltd Insulating hardenable composite and its curing object, and printed wiring board using it

Also Published As

Publication number Publication date
KR101476586B1 (ko) 2014-12-24
CN104049456A (zh) 2014-09-17
CN104049456B (zh) 2016-04-20
KR20140111603A (ko) 2014-09-19
JP5458215B1 (ja) 2014-04-02
JP2014199414A (ja) 2014-10-23
TW201447493A (zh) 2014-12-16

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