TWI478173B - Row decoding circuit - Google Patents
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Description
本發明是有關於一種記憶體裝置,且特別是有關於一種記憶體裝置的列解碼電路。The present invention relates to a memory device, and more particularly to a column decoding circuit for a memory device.
記憶體裝置中的記憶體陣列係由多個記憶胞所組成。當多個資料要被儲存在記憶體陣列中,或從記憶體陣列中讀取資料時,記憶體裝置依據各個資料所對應的記憶體位址致能對應的列選擇信號,以開啟對應的字元線上的記憶胞,藉此可儲存這些資料到對應的記憶胞中,或是從對應的記憶胞中讀取資料。因此,在記憶體技術的應用中,會利用多個列解碼器產生多個列選擇信號,且列解碼器會依據記憶體位址決定列選擇信號的電壓位準。The memory array in the memory device is composed of a plurality of memory cells. When a plurality of materials are to be stored in the memory array or read from the memory array, the memory device enables the corresponding column selection signal according to the memory address corresponding to each data to enable the corresponding character. The memory cells on the line can store the data into the corresponding memory cells or read the data from the corresponding memory cells. Therefore, in the application of the memory technology, a plurality of column decoders are used to generate a plurality of column selection signals, and the column decoder determines the voltage level of the column selection signals according to the memory address.
一般而言,列解碼器通常是利用疊接(cascode)的多個電晶體來構成,而電晶體的次臨界漏電流(Sub-Threshold Leakage)、閘極漏電流(Gate Direct Tunneling Leakage)以及閘極引發汲極漏電流(Gate Induce Drain Leakage,GIDL)會影響列解碼器的電力消耗。因此,如何降低電晶體的漏電流則成為設計記憶體裝置的列解碼器的一個重要課題。In general, a column decoder is usually constructed by using a plurality of cascode transistors, and the sub-Threshold Leakage of the transistor, the Gate Direct Tunneling Leakage, and the gate. The Gate Induce Drain Leakage (GIDL) affects the power consumption of the column decoder. Therefore, how to reduce the leakage current of the transistor becomes an important issue in the design of the column decoder of the memory device.
本發明提供一種列解碼電路,其可在不增加電路面積 的條件下,有效地抑制列解碼器的漏電流現象。The invention provides a column decoding circuit which can increase the circuit area without increasing Under the condition, the leakage current phenomenon of the column decoder is effectively suppressed.
本發明提出一種列解碼電路,其適用於記憶體裝置並且包括多個列解碼區塊。這些列解碼區塊分別包括多個列解碼器。這些列解碼器分別接收對應的預充電信號,且各個列解碼器包括反相器、選擇電晶體以及至少一個開關電晶體。反相器接收對應的預充電信號,並輸出第一控制信號。選擇電晶體的第一源/汲極耦接系統高電壓。選擇電晶體的閘極接收第一控制信號,並且選擇電晶體的第二源/汲極輸出對應的列選擇信號至記憶體裝置的記憶體陣列。這些開關電晶體相互串聯耦接於選擇電晶體的第二源/汲極與對應的第一參考信號之間,並且這些開關電晶體的閘極分別接收對應的第二控制信號。其中,當選擇電晶體受控於第一控制信號而導通時,設定第一參考信號為高位準。The present invention proposes a column decoding circuit that is suitable for use in a memory device and that includes a plurality of column decoding blocks. These column decoding blocks each include a plurality of column decoders. The column decoders respectively receive corresponding pre-charge signals, and each column decoder includes an inverter, a selection transistor, and at least one switching transistor. The inverter receives the corresponding precharge signal and outputs a first control signal. The first source/drain of the transistor is selected to couple the system high voltage. The gate of the selected transistor receives the first control signal and selects the column select signal corresponding to the second source/drain output of the transistor to the memory array of the memory device. The switching transistors are coupled in series with each other between the second source/drain of the selection transistor and the corresponding first reference signal, and the gates of the switching transistors respectively receive the corresponding second control signals. Wherein, when the selected transistor is controlled to be turned on by the first control signal, the first reference signal is set to a high level.
基於上述,本發明實施例提出一種列解碼電路,其在列解碼器輸出為高位準的列選擇信號時,提供高位準的第一參考信號,藉以抑制開關電晶體的次臨界漏電流,進而降低漏電流對列選擇信號的電壓位準的影響及降低記憶體裝置的功耗。Based on the above, the embodiment of the present invention provides a column decoding circuit, which provides a high-level first reference signal when the column decoder outputs a high-level column selection signal, thereby suppressing the sub-critical leakage current of the switching transistor, thereby reducing The effect of leakage current on the voltage level of the column select signal and the power consumption of the memory device.
為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖1為依據本發明一實施例之列解碼電路的示意圖。在本實施例中,列解碼電路100可適用在各種記憶體裝 置,例如動態隨機存取記憶體或靜態隨機存取記憶體等,用以解碼記憶體位址後產生多個列選擇信號(如s_rsel11~s_rsel1n),以驅動記憶體裝置的記憶體陣列。1 is a schematic diagram of a column decoding circuit in accordance with an embodiment of the present invention. In this embodiment, the column decoding circuit 100 can be applied to various memory devices. For example, a dynamic random access memory or a static random access memory or the like is used to decode a memory address to generate a plurality of column selection signals (such as s_rsel11~s_rsel1n) to drive the memory array of the memory device.
請參照圖1,在本實施例中,列解碼電路100包括多個列解碼區塊110_1~110_m、多個位址設定單元120_1~120_m以及多個區塊解碼器130_1~130_m。其中,區塊解碼器130_1~130_m依據記憶體位址AP的第一部分AP1分別產生對應於各個列解碼區塊110_1~110_m的區塊選擇信號s_blk1~s_blkm。位址設定單元120_1~120_m分別接收對應的區塊選擇信號s_blk1~s_blkm及記憶體位址AP的第二部分AP2且對應地產生多個位址參考信號s_rd11~s_rd1q、s_rd21~s_rd2q、...、s_rdm1~s_rdmq及多個預充電信號s_prch1~s_prchm。Referring to FIG. 1, in the embodiment, the column decoding circuit 100 includes a plurality of column decoding blocks 110_1 110 110_m, a plurality of address setting units 120_1 120 120_m, and a plurality of block decoders 130_1 130 130_m. The block decoders 130_1~130_m respectively generate block selection signals s_blk1~s_blkm corresponding to the respective column decoding blocks 110_1~110_m according to the first part AP1 of the memory address AP. The address setting units 120_1~120_m respectively receive the corresponding block selection signals s_blk1~s_blkm and the second part AP2 of the memory address AP and correspondingly generate a plurality of address reference signals s_rd11~s_rd1q, s_rd21~s_rd2q, ..., S_rdm1~s_rdmq and a plurality of precharge signals s_prch1~s_prchm.
在此,記憶體位址AP的第一部分AP1與第二部份AP2可分別為高位元部分的記憶體位址AP與低位元部分的記憶體位址AP,例如當記憶體位址AP由多個記憶體位址位元(例如A0~Ak)所構成時,第一部分AP1(高位元部分)可由記憶體位址位元A6~Ak所構成,第二部份AP2(低位元部分)可由記憶體位址位元A0~A5所構成,其中k為正整數。此外,所述之m、n值可依據記憶體裝置的記憶體陣列大小及電路設計而定。Here, the first part AP1 and the second part AP2 of the memory address AP may be the memory address AP of the high-order part and the memory address AP of the low-order part, for example, when the memory address AP is composed of multiple memory addresses. When the bit element (for example, A0~Ak) is formed, the first part AP1 (higher bit part) can be composed of the memory address bits A6~Ak, and the second part AP2 (lower bit part) can be composed of the memory address bit A0~ A5 is constructed, where k is a positive integer. In addition, the m and n values may be determined according to the memory array size and circuit design of the memory device.
列解碼區塊110_1~110_m分別包括多個列解碼器(如112_1~112_n)以及多個控制信號產生單元(如114_1~114_n)。在本實施例中,各個列解碼區塊 110_1~110_m的架構皆大致相同,故在此以列解碼區塊110_1來進行說明。列解碼區塊110_1包括列解碼器112_1~112_n以及控制信號產生單元114_1~114_n。其中,每一控制信號產生單元(如114_1~114_n)分別耦接對應的位址設定單元(如120_1~120_m)以接收對應的的位址參考信號(如s_rd11~s_rd1q、s_rd21~s_rd2q、s_rdm1~s_rdmq)輸出多個第二控制信號(如s_c2),其中q值可依據列解碼器(如112_1~112_n)的電路設計而定。因此,每個列解碼器(如112_1~112_n)可依據對應的預充電信號(如s_prch1~s_prchm)及對應的第二控制信號(如s_c2)產生對應的列選擇信號(如s_rsel11~s_rsel1n)。The column decoding blocks 110_1~110_m respectively include a plurality of column decoders (such as 112_1~112_n) and a plurality of control signal generating units (such as 114_1~114_n). In this embodiment, each column decoding block The architectures of 110_1~110_m are substantially the same, so the description will be made here by the column decoding block 110_1. The column decoding block 110_1 includes column decoders 112_1 to 112_n and control signal generating units 114_1 to 114_n. Each control signal generating unit (such as 114_1~114_n) is respectively coupled to a corresponding address setting unit (such as 120_1~120_m) to receive a corresponding address reference signal (such as s_rd11~s_rd1q, s_rd21~s_rd2q, s_rdm1~) S_rdmq) outputs a plurality of second control signals (such as s_c2), wherein the value of q can be determined according to the circuit design of the column decoder (such as 112_1~112_n). Therefore, each column decoder (such as 112_1~112_n) can generate a corresponding column selection signal (such as s_rsel11~s_rsel1n) according to the corresponding pre-charge signal (such as s_prch1~s_prchm) and the corresponding second control signal (such as s_c2).
圖2為依照圖1一實施例之列解碼器的示意圖。列解碼器112_1~112_n的電路架構大致相同,在此以列解碼器112_1為例。請同時參照圖1與圖2,在本實施例中,列解碼器112_1包括反相器INV、選擇電晶體Ms以及三個開關電晶體(如M1~M3),其中選擇電晶體Ms例如為P型電晶體,開關電晶體M1~M3例如為N型電晶體。此外,開關電晶體(如M1~M3)的數量可依據電路設計的需求而變更為一個或多個,但本發明實施例不以此為限。2 is a schematic diagram of a column decoder in accordance with an embodiment of FIG. 1. The circuit structures of the column decoders 112_1~112_n are substantially the same, and the column decoder 112_1 is taken as an example here. Referring to FIG. 1 and FIG. 2 simultaneously, in the embodiment, the column decoder 112_1 includes an inverter INV, a selection transistor Ms, and three switching transistors (such as M1~M3), wherein the selection transistor Ms is, for example, P. The type of transistor, the switching transistors M1 to M3 are, for example, N-type transistors. In addition, the number of the switching transistors (such as M1 to M3) may be changed to one or more according to the requirements of the circuit design, but the embodiment of the present invention is not limited thereto.
反相器INV接收對應的預充電信號s_prch1,並輸出第一控制信號s_c1。選擇電晶體Ms的第一源/汲極耦接系統高電壓VPP,選擇電晶體Ms的閘極接收第一控制信號s_c1,並且選擇電晶體Ms的第二源/汲極輸出對應的列選 擇信號r_sel11。開關電晶體M1~M3相互串聯耦接於選擇電晶體Ms的第二源/汲極與對應的第一參考信號s_ref1之間,並且各個開關電晶體M1~M3的閘極分別由控制信號產生單元114_1接收對應的第二控制信號s_c21~s_c23。其中,開關電晶體M3的第二源/汲極接收對應的第一參考信號s_ref1。The inverter INV receives the corresponding precharge signal s_prch1 and outputs a first control signal s_c1. Selecting the first source/drain of the transistor Ms to couple the system high voltage VPP, selecting the gate of the transistor Ms to receive the first control signal s_c1, and selecting the column corresponding to the second source/drain output of the transistor Ms Select the signal r_sel11. The switching transistors M1 M M3 are coupled in series with each other between the second source/drain of the selection transistor Ms and the corresponding first reference signal s_ref1, and the gates of the respective switching transistors M1 M M3 are respectively controlled by the control signal generating unit 114_1 receives the corresponding second control signals s_c21~s_c23. The second source/drain of the switching transistor M3 receives the corresponding first reference signal s_ref1.
需注意的是,本發明並不限定選擇電晶體Ms與開關電晶體M1~M3之類型,在其他實施例中,選擇電晶體Ms及開關電晶體M1~M3也可以透過相同類型電晶體或不同類型電晶體來實現。除此之外,圖2所繪示之列解碼器112_1的電路架構僅為範例。在實際的應用中,各個列解碼器112_1~112_n可共用同一反相器INV以接收第一控制信號s_sc1。換言之,本發明並不限定每一列解碼器112_1~112_n皆須包括反相器INV。It should be noted that the present invention does not limit the type of the selected transistor Ms and the switching transistors M1 to M3. In other embodiments, the selection transistor Ms and the switching transistors M1 to M3 may also pass through the same type of transistor or different. Type transistor to achieve. In addition, the circuit architecture of the column decoder 112_1 illustrated in FIG. 2 is merely an example. In a practical application, each of the column decoders 112_1~112_n may share the same inverter INV to receive the first control signal s_sc1. In other words, the present invention does not limit each of the column decoders 112_1~112_n to include the inverter INV.
具體而言,列解碼電路100會依據記憶體位址AP的第一部分AP1而選擇列解碼區塊110_1~110_m,且進一步依據記憶體位址AP的第二部分AP2致能所選擇的列解碼區塊110_1~110_m的列解碼器(如112_1~112_n)所產生的多個列選擇信號(如s_rsel11~s_rsel1n)的其中之一。在本實施例中,致能的列選擇信號(如s_rsel11~s_rsel1n)例如為低位準,禁能的列選擇信號(如s_rsel11~s_rsel1n)例如為高位準。Specifically, the column decoding circuit 100 selects the column decoding blocks 110_1 110 110_m according to the first portion AP1 of the memory address AP, and further enables the selected column decoding block 110_1 according to the second portion AP2 of the memory address AP. One of a plurality of column selection signals (such as s_rsel11~s_rsel1n) generated by a column decoder of ~110_m (such as 112_1~112_n). In this embodiment, the enabled column select signal (such as s_rsel11~s_rsel1n) is, for example, a low level, and the disabled column select signal (such as s_rsel11~s_rsel1n) is, for example, a high level.
圖3A~3D為依據本發明一實施例之列解碼器的信號時序圖。請同時參照圖1、圖2與圖3A,圖3A表示列解 碼器112_1所對應的列解碼區塊110_1未被選擇的狀況之各個信號的電壓位準的一實施例。當列解碼區塊110_1為未被選擇時,區塊解碼器130_1會依據記憶體位址AP的第一部分AP1輸出低位準的區塊選擇信號s_blk1至位址設定單元120_1。此時,位址設定單元120_1對應的輸出高位準的位址參考信號s_rd11~s_rd1q至控制信號產生單元114_1~114_n並輸出高位準的預充電信號s_prch1(即禁能的預充電信號s_prch1)至列解碼器112_1~112_n,而控制信號產生單元114_1~114_n依據對應高位準的位址參考信號s_rd11~s_rd1q產生高位準的第二控制信號s_c21~s_c23。3A-3D are signal timing diagrams of a column decoder in accordance with an embodiment of the present invention. Please refer to FIG. 1 , FIG. 2 and FIG. 3A simultaneously, and FIG. 3A shows the column solution. An embodiment of the voltage level of each signal of the condition that the column decoding block 110_1 corresponding to the decoder 112_1 is not selected. When the column decoding block 110_1 is not selected, the block decoder 130_1 outputs the low level block selection signal s_blk1 to the address setting unit 120_1 according to the first portion AP1 of the memory address AP. At this time, the address setting unit 120_1 outputs the high-level address reference signals s_rd11~s_rd1q to the control signal generating units 114_1~114_n and outputs the high-level pre-charge signal s_prch1 (ie, the disabled pre-charge signal s_prch1) to the column. The decoders 112_1~112_n, and the control signal generating units 114_1~114_n generate high level second control signals s_c21~s_c23 according to the corresponding high level address reference signals s_rd11~s_rd1q.
在本發明的實施例中,第一參考信號s_ref1可由區塊解碼器130_1或位址設定單元120_1產生,並且根據高位準的區塊選擇信號s_blk1而被設定為高位準。其中,第一參考信號s_ref1的高位準與低位準可分別對應於電晶體導通電壓VTT與接地電壓GND,預充電信號s_prch1的高位準與低位準可分別對應於系統高電壓VPP及接地電壓GND,第二控制信號s_c21~s_c23的高位準與低位準可分別對應於電晶體導通電壓VTT及接地電壓GND。其中所述之電晶體導通電壓VTT低於系統高電壓VPP且高於開關電晶體(如M1~M3)的臨界電壓(threshold voltage)。In an embodiment of the present invention, the first reference signal s_ref1 may be generated by the block decoder 130_1 or the address setting unit 120_1, and set to a high level according to the high-order block selection signal s_blk1. The high level and the low level of the first reference signal s_ref1 may respectively correspond to the transistor turn-on voltage VTT and the ground voltage GND, and the high level and the low level of the pre-charge signal s_prch1 may correspond to the system high voltage VPP and the ground voltage GND, respectively. The high level and the low level of the second control signals s_c21 to s_c23 may correspond to the transistor turn-on voltage VTT and the ground voltage GND, respectively. The transistor turn-on voltage VTT is lower than the system high voltage VPP and higher than the threshold voltage of the switching transistor (eg, M1~M3).
此時,反相器INV接收高位準的預充電信號s_prch1並輸出具有低位準的第一控制信號s_c1至選擇電晶體Ms的閘極以導通選擇電晶體Ms。並且,由於開關電晶體M3 的第二源/汲極所接收的第一參考信號s_ref1被設定為高位準,並且開關電晶體M1~M3的所接收的第二控制信號s_c21~s_c23為高位準,因此開關電晶體M1~M3會截止。因此,列選擇信號s_rsel11會為高位準(即系統高電壓VPP)。At this time, the inverter INV receives the high-level precharge signal s_prch1 and outputs the first control signal s_c1 having the low level to the gate of the selection transistor Ms to turn on the selection transistor Ms. And, due to the switching transistor M3 The first reference signal s_ref1 received by the second source/drain is set to a high level, and the received second control signals s_c21~s_c23 of the switching transistors M1 M M3 are at a high level, so the switching transistors M1~M3 Will be closed. Therefore, the column selection signal s_rsel11 will be at a high level (ie, system high voltage VPP).
換言之,當各個列解碼器112_1~112_n於對應的列解碼區塊110_1依據記憶體位址AP的第一部分AP1而未被選擇時,各個列解碼器112_1~112_n所對應的預充電信號s_prch1、對應的第一參考信號s_ref1及對應的第二控制信號s_c21~s_c23會為高位準,並且選擇電晶體Ms受控於第一控制信號s_c1而導通。此時,開關電晶體M1的第一源/汲極與開關電晶體M3的第二源/汲極之間的電壓差會降低,各個開關電晶體M1~M3的第一源/汲極與其閘極之間的電壓差會降低,藉此可降低開關電晶體M1~M3的漏電流,例如次臨界漏電流、閘極漏電流以及閘極引發汲極漏電流。In other words, when the respective column decoders 112_1~112_n are not selected according to the first portion AP1 of the memory address AP in the corresponding column decoding block 110_1, the pre-charge signals s_prch1 corresponding to the respective column decoders 112_1~112_n correspond to The first reference signal s_ref1 and the corresponding second control signals s_c21~s_c23 will be at a high level, and the selection transistor Ms is turned on by the first control signal s_c1. At this time, the voltage difference between the first source/drain of the switching transistor M1 and the second source/drain of the switching transistor M3 is lowered, and the first source/drain of each of the switching transistors M1 to M3 is connected to the gate thereof. The voltage difference between the poles is reduced, thereby reducing leakage currents of the switching transistors M1 to M3, such as sub-critical leakage current, gate leakage current, and gate-induced drain leakage current.
圖3B表示列解碼器112_1所對應的列解碼區塊110_1未被選擇的狀況之各個信號的電壓位準的另一實施例。在本實施例中,其與前述圖3A實施例的差異在於控制信號產生單元114_1會於列解碼區塊110_1未被選擇的情況下產生皆為低位準的第二控制信號s_c21~s_c23,但在開關電晶體M1的第一源/汲極與開關電晶體M3的第二源/汲極之間的電壓差降低的情況下,仍可改善開關電晶體M1~M3的漏電流。FIG. 3B shows another embodiment of the voltage level of each signal of the state in which the column decoding block 110_1 corresponding to the column decoder 112_1 is not selected. In this embodiment, the difference from the foregoing embodiment of FIG. 3A is that the control signal generating unit 114_1 generates the second control signals s_c21~s_c23, which are all low level, if the column decoding block 110_1 is not selected, but In the case where the voltage difference between the first source/drain of the switching transistor M1 and the second source/drain of the switching transistor M3 is lowered, the leakage currents of the switching transistors M1 to M3 can still be improved.
請同時參照圖1、圖2及圖3C,其中圖3C表示列解碼器112_1所對應的列解碼區塊110_1被選擇,且列解碼器112_1未被選擇的狀況之各個信號的電壓位準。當列解碼器112_1所對應的列解碼區塊110_1被選擇且列解碼器112_1未被選擇時,對應於列解碼區塊110_1的區塊解碼器130_1會依據記憶體位址AP的第一部分AP1輸出高位準的區塊選擇信號s_blk1至位址設定單元120_1。Please refer to FIG. 1 , FIG. 2 and FIG. 3C simultaneously, wherein FIG. 3C shows the voltage level of each signal of the state in which the column decoding block 110_1 corresponding to the column decoder 112_1 is selected and the column decoder 112_1 is not selected. When the column decoding block 110_1 corresponding to the column decoder 112_1 is selected and the column decoder 112_1 is not selected, the block decoder 130_1 corresponding to the column decoding block 110_1 outputs a high level according to the first portion AP1 of the memory address AP. The quasi-block selection signal s_blk1 to the address setting unit 120_1.
此時,位址設定單元120_1對應的輸出記憶體位址AP的第二部分AP2至對應的控制信號產生單元114_1~114_n以作為位址參考信號s_rd11~s_rd1q,並輸出低位準的預充電信號s_prch1(即致能的預充電信號s_prch1)至列解碼區塊110_1。At this time, the second portion AP2 of the output memory address AP corresponding to the address setting unit 120_1 to the corresponding control signal generating units 114_1~114_n serves as the address reference signals s_rd11~s_rd1q, and outputs the low-level pre-charge signal s_prch1 ( That is, the enabled pre-charge signal s_prch1) to the column decoding block 110_1.
控制信號產生單元114_1會依據對應的位址參考信號s_rd11~s_rd1q產生第二控制信號s_c21~s_c23,並且第一參考信號s_ref1會根據低位準的預充電信號s_prch1而被設定為低位準。由於列解碼器112_1未被選擇,因此控制信號產生單元114_1受控於位址參考信號s_rd11~s_rd1q所產生第二控制信號s_c21~s_c23的至少其中之一為低位準,在此以第二控制信號s_c23為例,但本發明不以此為限。The control signal generating unit 114_1 generates the second control signals s_c21~s_c23 according to the corresponding address reference signals s_rd11~s_rd1q, and the first reference signal s_ref1 is set to a low level according to the low-level pre-charge signal s_prch1. Since the column decoder 112_1 is not selected, the control signal generating unit 114_1 is controlled by at least one of the second control signals s_c21~s_c23 generated by the address reference signals s_rd11~s_rd1q to be a low level, where the second control signal is used. S_c23 is taken as an example, but the invention is not limited thereto.
當反相器INV接收到低位準的預充電信號s_prch1時,會輸出具有高位準的第一控制信號s_c1至選擇電晶體Ms的閘極,以截止選擇電晶體Ms。此時,開關電晶體M3的第二源/汲極所接收的第一參考信號s_ref1會對應地 被設定為低位準,但由於控制信號產生單元114_1會產生至少其中之一為低位準的第二控制信號s_c21~s_c23來截止開關電晶體M1~M3的至少其中之一,因此列解碼器112_1所輸出的列選擇信號s_rsel11仍會被認為是高位準。When the inverter INV receives the low-level pre-charge signal s_prch1, it outputs a first control signal s_c1 having a high level to the gate of the selection transistor Ms to turn off the selection transistor Ms. At this time, the first reference signal s_ref1 received by the second source/drain of the switching transistor M3 corresponds to It is set to a low level, but since the control signal generating unit 114_1 generates at least one of the low-level second control signals s_c21 to s_c23 to turn off at least one of the switching transistors M1 M M3, the column decoder 112_1 The output column selection signal s_rsel11 will still be considered a high level.
另一方面,若是列解碼器112_1被選擇時,則其所輸出的列選擇信號s_rsel11會被致能(如為低位準)。請同時參照圖1、圖2及圖3D,其中圖3D表示列解碼器112_1所對應的列解碼區塊110_1被選擇,且列解碼器112_1被選擇的狀況之各個信號的電壓位準。當列解碼區塊110_1被選擇且列解碼器112_1被選擇時,位址設定單元120_1會輸出低位準的預充電信號s_prch1至列解碼區塊110_1,而控制信號產生單元114_1會依據位址參考信號s_rd11~s_rd1q而產生皆為高位準的第二控制信號s_c21~s_c23,並且第一參考信號s_ref1會對應低位準的預充電信號s_prch1而被設定為低位準。On the other hand, if the column decoder 112_1 is selected, the column selection signal s_rsel11 outputted by it will be enabled (e.g., low level). Please refer to FIG. 1 , FIG. 2 and FIG. 3D simultaneously, wherein FIG. 3D shows the voltage level of each signal of the state in which the column decoding block 110_1 corresponding to the column decoder 112_1 is selected and the column decoder 112_1 is selected. When the column decoding block 110_1 is selected and the column decoder 112_1 is selected, the address setting unit 120_1 outputs the low level pre-charge signal s_prch1 to the column decoding block 110_1, and the control signal generating unit 114_1 according to the address reference signal S_rd11~s_rd1q generates second control signals s_c21~s_c23 which are all high level, and the first reference signal s_ref1 is set to a low level corresponding to the low level pre-charge signal s_prch1.
當反相器INV接收到低位準的預充電信號s_prch1時,會輸出具有高位準的第一控制信號s_c1至選擇電晶體Ms的閘極,以截止選擇電晶體Ms。此時,由於第一參考信號s_ref1被設定為低位準,且第二控制信號s_c21~s_c23皆為高位準,使得開關電晶體M1~M3皆導通。因此,列選擇信號s_rsel1的電壓位準被下拉至接地電壓GND(即低位準)。When the inverter INV receives the low-level pre-charge signal s_prch1, it outputs a first control signal s_c1 having a high level to the gate of the selection transistor Ms to turn off the selection transistor Ms. At this time, since the first reference signal s_ref1 is set to a low level, and the second control signals s_c21 to s_c23 are all at a high level, the switching transistors M1 to M3 are all turned on. Therefore, the voltage level of the column selection signal s_rsel1 is pulled down to the ground voltage GND (ie, the low level).
此外,在本實施例中,各個開關電晶體M1~M3的基底可耦接至對應的第二源/汲極或耦接至接地電壓GND, 其中開關電晶體M1~M3的基底耦接至接地電壓GND可避免各個開關電晶體M1~M3的臨界電壓受到第一參考信號s_ref1的電壓位準變動的影響而改變。In addition, in this embodiment, the base of each of the switch transistors M1 M M3 can be coupled to the corresponding second source/drain or to the ground voltage GND. The base of the switching transistors M1 M M3 is coupled to the ground voltage GND to prevent the threshold voltage of each of the switching transistors M1 M M3 from being affected by the voltage level variation of the first reference signal s_ref1.
圖4為依據本發明另一實施例之列解碼器的示意圖。請參照圖4,在本實施例中,列解碼器412包括反相器INV、選擇電晶體Ms以及開關電晶體M1~M3,其中選擇電晶體Ms為P型電晶體且開關電晶體M1~M3為N型電晶體,其架構與操作方式大致與前述圖2實施例相同。本實施例與前述圖2實施例不同之處在於列解碼器412係藉由將開關電晶體M3的第二源/汲極耦接至反相器INV的輸入端以接收預充電信號s_prch1的方式來設定第一參考信號s_ref1的電壓位準。4 is a schematic diagram of a column decoder in accordance with another embodiment of the present invention. Referring to FIG. 4, in the embodiment, the column decoder 412 includes an inverter INV, a selection transistor Ms, and switching transistors M1 M M3, wherein the selection transistor Ms is a P-type transistor and the switching transistors M1 M M3 The structure and operation of the N-type transistor are substantially the same as those of the previous embodiment of FIG. 2. This embodiment differs from the foregoing embodiment of FIG. 2 in that the column decoder 412 is configured to receive the precharge signal s_prch1 by coupling the second source/drain of the switching transistor M3 to the input of the inverter INV. The voltage level of the first reference signal s_ref1 is set.
換言之,列解碼器412所接收的第一參考信號s_ref1即為預充電信號s_prch1,故在前述的操作方式中,第一參考信號s_ref1的高位準會對應至系統高電壓VPP。In other words, the first reference signal s_ref1 received by the column decoder 412 is the pre-charge signal s_prch1, so in the foregoing operation mode, the high level of the first reference signal s_ref1 corresponds to the system high voltage VPP.
在此架構下,開關電晶體M1的第一源/汲極與開關電晶體M3的第二源/汲極的電壓差可更進一步地趨近於0。因此,在列解碼器512的電路架構下亦可有效地抑制各個開關電晶體M1~M3的次臨界漏電流的問題。Under this architecture, the voltage difference between the first source/drain of the switching transistor M1 and the second source/drain of the switching transistor M3 can further approach zero. Therefore, the problem of the sub-critical leakage current of each of the switching transistors M1 to M3 can be effectively suppressed under the circuit structure of the column decoder 512.
值得注意的是,在第一參考信號s_ref為預充電信號s_prch1的情況下,各個第二控制信號s_c21~s_c23的高位準可對應至系統高電壓VPP或電晶體導通電壓VTT。此外,列解碼器412的信號時序及操作方式皆可參照圖2及圖3A~3D的說明,故於此不再贅述。It should be noted that, in the case that the first reference signal s_ref is the pre-charge signal s_prch1, the high level of each of the second control signals s_c21 s s_c23 may correspond to the system high voltage VPP or the transistor turn-on voltage VTT. In addition, the signal timing and operation mode of the column decoder 412 can be referred to the description of FIG. 2 and FIG. 3A to FIG. 3D, and thus will not be further described herein.
綜上所述,本發明實施例提出一種列解碼電路,其在列解碼器輸出為高位準的列選擇信號時,提供高位準的第一參考信號,藉以抑制開關電晶體可能產生的次臨界漏電流。此外,本發明實施例之列解碼電路亦可藉由提供高位準的第二控制信號至開關電晶體的方式來防止各個開關電晶體的閘極漏電流以及閘極引發汲極漏電流,進而降低漏電流對列選擇信號的電壓位準的影響及降低記憶體裝置的功耗。In summary, the embodiment of the present invention provides a column decoding circuit that provides a high-level first reference signal when the column decoder outputs a high-level column selection signal, thereby suppressing a sub-critical leakage that may occur in the switching transistor. Current. In addition, the column decoding circuit of the embodiment of the present invention can also prevent the gate leakage current of each switching transistor and the gate leakage current caused by the gate by providing a high level of the second control signal to the switching transistor, thereby reducing The effect of leakage current on the voltage level of the column select signal and the power consumption of the memory device.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100、500‧‧‧列解碼電路100, 500‧‧‧ column decoding circuit
110_1~110_m‧‧‧列解碼區塊110_1~110_m‧‧‧ column decoding block
112_1~112_n、412、512_1~512_n‧‧‧列解碼器112_1~112_n, 412, 512_1~512_n‧‧‧ column decoder
114_1~114_n‧‧‧控制信號產生單元114_1~114_n‧‧‧Control signal generation unit
120_1~120_m‧‧‧位址設定單元120_1~120_m‧‧‧ address setting unit
130_1~130_m‧‧‧區塊解碼器130_1~130_m‧‧‧block decoder
AG1、AG2‧‧‧及閘AG1, AG2‧‧‧ and gate
AP‧‧‧記憶體位址AP‧‧‧ memory address
AP1‧‧‧第一部分AP1‧‧‧Part 1
AP2‧‧‧第二部分AP2‧‧‧ Part II
A0‧‧‧最低位元A0‧‧‧ lowest bit
bs_blk1‧‧‧反相信號Bs_blk1‧‧‧ inverted signal
GND‧‧‧接地電壓GND‧‧‧ Grounding voltage
Ms‧‧‧選擇電晶體Ms‧‧‧Selected crystal
M1、M2、M3‧‧‧開關電晶體M1, M2, M3‧‧‧ switch transistor
INV‧‧‧反相器INV‧‧‧Inverter
H‧‧‧高電壓位準H‧‧‧High voltage level
L‧‧‧低電壓位準L‧‧‧Low voltage level
VPP‧‧‧系統高電壓VPP‧‧‧ system high voltage
s_blk1~s_blkm‧‧‧區塊選擇信號S_blk1~s_blkm‧‧‧block selection signal
s_c1‧‧‧第一控制信號S_c1‧‧‧First control signal
s_c21~s_c23‧‧‧第二控制信號S_c21~s_c23‧‧‧second control signal
s_prch1~s_prchm‧‧‧預充電信號S_prch1~s_prchm‧‧‧Precharge signal
s_rd11~s_rd1q、s_rd21~s_rd2q、...、s_rdm1~s_rdmq‧‧‧ 位址參考信號S_rd11~s_rd1q, s_rd21~s_rd2q,..., s_rdm1~s_rdmq‧‧ Address reference signal
s_ref1‧‧‧第一參考信號S_ref1‧‧‧First reference signal
s_rsel11~s_rsel1n‧‧‧列選擇信號S_rsel11~s_rsel1n‧‧‧ column selection signal
圖1為依據本發明一實施例之列解碼電路的示意圖。1 is a schematic diagram of a column decoding circuit in accordance with an embodiment of the present invention.
圖2為依據本發明一實施例之列解碼器的示意圖。2 is a schematic diagram of a column decoder in accordance with an embodiment of the present invention.
圖3A~3D為本發明一實施例之列解碼器的信號時序圖。3A-3D are signal timing diagrams of a column decoder according to an embodiment of the present invention.
圖4為依據本發明另一實施例之列解碼器的示意圖。4 is a schematic diagram of a column decoder in accordance with another embodiment of the present invention.
112_1‧‧‧列解碼器112_1‧‧‧ column decoder
Ms‧‧‧選擇電晶體Ms‧‧‧Selected crystal
M1~M3‧‧‧開關電晶體M1~M3‧‧‧Switching transistor
INV‧‧‧反相器INV‧‧‧Inverter
VPP‧‧‧系統高電壓VPP‧‧‧ system high voltage
s_c1‧‧‧第一控制信號S_c1‧‧‧First control signal
s_c21~s_c23‧‧‧第二控制信號S_c21~s_c23‧‧‧second control signal
s_prch1‧‧‧預充電信號S_prch1‧‧‧Precharge signal
s_ref1‧‧‧第一參考信號S_ref1‧‧‧First reference signal
s_rsel11‧‧‧列選擇信號S_rsel11‧‧‧ column selection signal
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| TW101144590A TWI478173B (en) | 2012-11-28 | 2012-11-28 | Row decoding circuit |
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| IT201900001947A1 (en) * | 2019-02-11 | 2020-08-11 | Sk Hynix Inc | Decoder structure for a memory architecture |
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| TW201421488A (en) | 2014-06-01 |
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