TWI469839B - Ultrasonic vibration joint device - Google Patents

Description

Ultrasonic vibration joint device

The present invention relates to an ultrasonic vibration bonding apparatus, and the ultrasonic vibration bonding apparatus of the present invention can be utilized, for example, when ultrasonically vibrating bonding of a substrate to a thin substrate is performed.

In the technique for bonding a substrate to a target object such as a conductive member, there is a technique called ultrasonic vibration bonding (see, for example, Patent Documents 1 and 2).

The object to be processed is placed on the substrate, and a bonding tool is brought into contact with the object to be processed at a predetermined pressure, and the bonding tool is ultrasonically vibrated in the horizontal direction. Thereby, the object to be processed is bonded to the substrate.

In the field of solar cells, when forming an electrode layer bonding lead on a glass substrate, for example, the ultrasonic vibration bonding process can be considered.

(previous technical literature)

(Patent Literature)

Patent Document 1: Japanese Laid-Open Patent Publication No. 2008-155240.

Patent Document 2: Japanese Laid-Open Patent Publication No. H11-54678.

However, when a film forming process and/or a heat treatment is applied to a substrate having a thickness of several millimeters (mm) or less, localization or a wide range of deformation and/or warpage may occur. When the ultrasonic vibration bonding process is applied to the substrate on which the deformation or the like occurs, the ultrasonic vibration is abnormally transmitted, and the bonding failure occurs.

Although it is considered to correct the deformation and/or warpage of the substrate before the ultrasonic vibration bonding process. However, in order to perform the correction, it is necessary to give a very high pressure to the substrate, and for example, when the substrate is a glass substrate of a thin thickness or the like, the substrate may be damaged by the correction.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an ultrasonic vibration bonding apparatus which can cause damage to a substrate even if deformation and/or warpage occurs, for example, on a substrate. Ultrasonic vibration bonding of the object to be processed on the substrate is performed.

In order to achieve the above object, the ultrasonic bonding apparatus of the present invention can perform ultrasonic vibration bonding of a substrate to a substrate, and includes an ultrasonic vibration unit that can simultaneously perform pressure from the upper direction. Ultrasonic vibration in the direction is applied to the object to be processed; the stage is placed on the substrate; and the receiving portion is located at a position corresponding to the abutting portion of the ultrasonic vibrating portion and the object to be processed. The substrate is received from the lower side, and the ultrasonic vibration unit applies the ultrasonic vibration to the object to be processed in a state in which the substrate is received by the receiving portion.

The ultrasonic vibration bonding device of the present invention is capable of ultrasonically vibrating the substrate to be processed by the object to be processed, and includes an ultrasonic vibration unit that can simultaneously perform ultrasonic vibration in the horizontal direction from the upward direction. The object to be processed is placed on the substrate; the substrate is placed on the substrate; and the receiving portion is located at a position corresponding to the abutting portion of the ultrasonic vibration portion and the object to be processed, and is receivable from the bottom In the above-described substrate, the ultrasonic vibration unit applies the ultrasonic vibration to the object to be processed in a state in which the substrate is received by the receiving portion.

Therefore, the ultrasonic vibration bonding device of the present invention does not cause damage to the substrate even if, for example, the substrate is deformed and/or warped, and the ultrasonic vibration bonding can be normally performed on the substrate. body.

The objects, features, aspects and advantages of the present invention will become more apparent from

In the following embodiments, a case where ultrasonically vibrating bonding is performed as a conductive lead of a target object for a glass substrate having a thickness of less than 4 mm will be described as an example.

For example, a glass substrate used in a solar cell is subjected to a film formation process and/or a heat treatment in order to form a PN junction or the like. Due to the film formation treatment and/or heat treatment, various shapes and sizes of deformation and/or warpage are generated on a thin glass substrate.

In the following, a case will be described in which the electrode layer of the glass substrate on which the deformation and/or warpage is generated is bonded using the ultrasonic vibration bonding device of the present invention.

<First Embodiment>

Fig. 1 is a cross-sectional view showing the configuration of the ultrasonic vibration bonding apparatus 100 of the present embodiment. Further, in the example shown in Fig. 1, a local warp 1a is generated in the glass substrate 1. In the example shown in Fig. 1, the case where the glass substrate of the portion where the warpage 1a is generated is ultrasonically bonded to the lead wire 2 is shown.

The ultrasonic vibration bonding apparatus 100 is composed of a pressurizing mechanism 11, a bonding tool 12, an ultrasonic vibrator 13, a table 14, and a receiving portion 15. Among these, the ultrasonic mechanism is constituted by the pressurizing mechanism 11, the bonding tool 12, and the ultrasonic vibrator 13.

In the ultrasonic vibration units 11, 12, and 13, the pressurizing mechanism 11 can apply a predetermined pressure (for example, a pressure of about 50 kg (Kg)) downward from the upper direction of the first drawing to the bonding tool 12. Further, the ultrasonic vibrator 13 is capable of applying ultrasonic vibration to the bonding tool 12 in the horizontal direction (for example, 20 kHz in the front and back of the first drawing).

As shown in Fig. 1, in the ultrasonic vibration bonding process, the glass substrate 1 is placed and fixed on the stage 14, and the lead 2 is placed on a predetermined portion of the glass substrate 1. Next, the bonding tool 12 is abutted on the lead 2. Then, while the bonding tool 12 applies a predetermined pressure to the lead 2 from the upper direction, the bonding tool 12 is ultrasonically vibrated in the horizontal direction. Thereby, the ultrasonic vibration bonding lead 2 can be performed on the glass substrate.

A hole 14a having a desired size and shape is provided through the stage 14 on which the glass substrate 1 is placed. Further, unlike the shape of the hole 14a shown in Fig. 1, in the case where, for example, the wire lead 2 is joined, the bonding position of the lead 2 may be provided in the carrying table 14 so as to be penetrated. An elongated hole 14a.

The receiving portion 15 is movable in the vertical direction so as to be in contact with and in contact with the glass substrate 1. Further, the receiving portion 15 is located at a position where the bonding tool 12 is in contact with the lead 2, and can carry the glass substrate 1 from the lower direction. In the ultrasonic vibration bonding apparatus 100 of the present embodiment, the upper surface portion of the receiving portion 15 is in direct contact with the lower surface of the glass substrate 1 via the hole 14a, and the receiving portion 15 is received and fixed to the glass substrate 1 of the stage 14. Further, in the present embodiment, the stage 14 is fixed and does not move up and down.

As can be understood from the above configuration, in the ultrasonic vibration bonding apparatus 100, the receiving portion 15 moves in the upward direction during the ultrasonic vibration bonding processing. Moreover, the glass substrate 1 and the lead 2 are held in the joint portion via the hole 14a by the bonding tool 12 and the receiving portion 15. Then, in a state where the receiving portion 15 receives the lower surface of the glass substrate 1, the bonding tool 12 performs ultrasonic vibration while applying pressure to the lead 2.

The operation of the ultrasonic vibration bonding apparatus 100 of the present embodiment will be described.

First, the glass substrate 1 is placed and fixed on the stage 14 so that the lead 2 is placed at the bonding position on the glass substrate 1. Next, the receiving portion 15 is moved in the upward direction, and the upper surface portion of the receiving portion 15 is brought into contact with the lower surface of the glass substrate 1 via the hole 14a. The bonding tool 12 is repetitively abutted on the lead 2. As shown in Fig. 1, the glass substrate 1 and the lead 2 are held by the bonding tool 12 and the receiving portion 15 through the hole 14a in the joint portion by the operation up to this point.

In the foregoing state, the bonding tool 12 is applied with a predetermined pressure in the downward direction of the first drawing by the control of the pressurizing mechanism 11. Ultrasonic vibration (ultrasonic vibration bonding processing) in the horizontal direction of the first drawing is applied to the bonding tool 12 while the pressure is applied by the ultrasonic vibrator 13. By this ultrasonic vibration bonding process, the glass substrate 1 and the lead 2 can be joined to the bonding position.

After the ultrasonic vibration bonding process, the receiving portion 15 is moved in the downward direction of the first drawing to release the "bearing" of the glass substrate 1 by the receiving portion 15.

As described above, in the ultrasonic vibration bonding apparatus 100 of the present embodiment, the lower surface of the glass substrate 1 can be received by the receiving portion 15. Further, in the upper portion of the receiving portion 15, ultrasonic welding by the ultrasonic vibration portions 11, 12, and 13 can be performed on the lead wires 2 disposed on the glass substrate 1.

Therefore, even in the case where, for example, the glass substrate 1 is deformed and/or warped, the ultrasonic vibration bonding apparatus 100 does not damage the glass substrate 1, and the ultrasonic vibration bonding lead 2 can be normally performed on the glass substrate 1.

Further, in the case where a plurality of joints are to be joined to the object to be processed, a plurality of holes 14a may be provided in the stage 14 in such a manner that the plurality of joint positions are combined to open the hole 14 corresponding to the joint position in plan view. A hole 14a of a predetermined shape. For example, in the case where a plurality of portions of the wire lead 2 are subjected to the bonding process, a long hole 14a may be provided in the carrier table 14 to align the bonding position of the wire 2 (the hole 14a is tied to each bonding position). Corresponding position).

Thereby, the ultrasonic vibration vibrating portions 11, 12, 13, and the receiving portion 15, or the carrier 14 can be moved in the horizontal direction, and the ultrasonic vibration bonding processing at the plurality of points of the glass substrate 1 and the lead 2 can be continuously performed. .

<Second embodiment>

In the present embodiment, the control of the receiving portion 15 described in the first embodiment will be described.

The receiving portion 15 is constituted by an air cylinder or a hydraulic cylinder to perform the following control. Here, the vertical axis of Fig. 2 is the pressure applied to the glass substrate 1 by the receiving portion, and the horizontal axis of Fig. 2 is time.

First, when the ultrasonic vibration bonding process is performed, the receiving portion 15 is moved in the upward direction of the first drawing, and the upper surface of the receiving portion 15 is brought into contact (start of contact) via the hole 14a to be placed and fixed on the stage 14 The lower surface of the glass substrate 1. After the contact, the pressure in the upward direction of the glass substrate 1 is increased by the continuous movement in the upward direction.

Then, when the pressure is applied to the glass substrate 1 by the receiving portion 15 and reaches a predetermined pressure value set in advance, the movement in the upward direction of the receiving portion 15 is stopped (locked at a predetermined pressure value) (in other words, the foregoing Pressurization). Thereafter, the receiving portion 15 performs ultrasonic vibration bonding processing by the ultrasonic vibration portions 11, 12, and 13 in a state where the glass substrate 1 is carried at a predetermined pressure value.

Here, the predetermined pressure value is determined depending on the material and thickness of the glass substrate 1, and is determined without giving damage to the glass substrate 1.

After the ultrasonic vibration bonding process, the receiving portion 15 starts moving in the downward direction of the first drawing to release the glass substrate 1 by the receiving portion 15 (contact end). Further, the receiving portion 15 continues to move in the downward direction until the predetermined position.

By performing the control of the receiving portion 15 of the present embodiment, the ultrasonic vibration bonding apparatus 100 can carry the lead substrate 2 by the ultrasonic vibration units 11, 12, 13 while carrying the glass substrate 1 at a predetermined pressure value. Sonic vibration bonding processing.

<Third embodiment>

In the present embodiment, a sensor that detects contact between the receiving portion 15 and the glass substrate 1 will be described.

The third, fourth, and fifth figures are contact type sensors that are provided in contact with the receiving portion 15.

In the third drawing, the contact detecting sensor 20 such as a piezoelectric element is embedded in the receiving portion 15. The upper surface of the receiving portion 15 is flush with the upper surface of the contact detecting sensor 20, and the contact sensor 20 senses the contact between the lower surface of the glass substrate 1 and the receiving portion 15.

In Fig. 4, a pin-shaped contact detecting sensor 21 is disposed on the upper surface of the receiving portion 15. As shown in FIG. 5, when the lower surface of the glass substrate 1 is in contact with the receiving portion 15, the contact detecting sensor 21 is lowered into the receiving portion 15, thereby detecting the upper surface of the receiving portion 15 and the glass substrate 1 contact.

Further, although the contact type sensor has been described above, it is also possible to detect the contact between the glass substrate 1 and the receiving portion 15 by using, for example, a non-contact type such as a laser. Device.

In the present embodiment, when the receiving portion 15 is moved in the upward direction of the first drawing, and the sensors 20 and 21 are used, the upper surface of the receiving portion 15 and the lower surface of the glass substrate 1 fixed to the stage 14 are detected. At the time of contact, the receiving portion 15 stops the movement in the upward direction. Then, ultrasonic vibration bonding processing by the ultrasonic vibration units 11, 12, and 13 is performed in a state where the glass substrate 1 is in contact with the receiving portion 15.

After the ultrasonic vibration bonding process, the receiving portion 15 starts moving in the downward direction of the first drawing to release the glass substrate 1 by the receiving portion 15 (contact end). Further, the receiving portion 15 continues the movement in the downward direction until the predetermined position.

As described above, in the present embodiment, the receiving portion 15 is provided with a sensor for detecting contact with the glass substrate 1. Therefore, in the ultrasonic vibration bonding apparatus 100, the ultrasonic vibration unit 11, 12, and 13 can perform the ultrasonic vibration bonding processing on the lead 2 in a state where the receiving portion 15 is surely received by the glass substrate 1.

<Fourth embodiment>

Fig. 6 is a cross-sectional view showing the configuration of the ultrasonic vibration bonding apparatus 200 of the present embodiment. Further, in the example shown in Fig. 1, a local warp 1a is generated in the glass substrate 1.

The ultrasonic vibration bonding apparatus 200 of the present embodiment is different from the ultrasonic vibration bonding apparatus 100 of the first embodiment in the following points.

In other words, in the ultrasonic vibration bonding apparatus 200 of the present embodiment, the stage 31 composed of a hard resin having a small thickness (for example, 5 mm or less) is provided to take the tape stage 14. Further, in the stage 31 of the present embodiment, unlike the stage 14, the hole 14a is not provided. The other configuration is the same in the two ultrasonic vibration bonding devices 100 and 200.

As is apparent from the above configuration, in the ultrasonic vibration bonding apparatus 200, the receiving portion 15 moves in the upward direction during the ultrasonic vibration bonding processing. Further, in the joint portion, the carrier 31, the glass substrate 1, and the lead 2 are inserted by the bonding tool 12 and the receiving portion 15. On the other hand, the receiving portion 15 is in a state in which the lower surface of the glass substrate 1 is indirectly received by the spacer stage 31, and the bonding tool 12 performs ultrasonic vibration on the lead 2 while applying pressure.

Further, in the present embodiment, the receiving portion 15 is also moved in the vertical direction, but the stage 31 is fixed and does not move up and down.

The operation of the ultrasonic vibration bonding apparatus 200 of the present embodiment will be described.

First, the glass substrate 1 is placed and fixed on the stage 31, and the lead 2 is placed at the bonding position on the glass substrate 1. Next, the receiving portion 15 is moved in the upward direction. Thereby, as shown in Fig. 7, the stage 31 is deformed in a portion in contact with the upper surface of the receiving portion 15. Next, the upper surface portion of the receiving portion 15 is indirectly received and fixed to the lower surface of the glass substrate 1 of the stage 31 through the deformed stage 31.

The bonding tool 12 is repetitively abutted on the lead 2. As a result of the operation up to this point, as shown in FIG. 7, the bonding table 31, the glass substrate 1, and the lead 2 are inserted into the contact portion by the bonding tool 12 and the receiving portion 15.

In the foregoing state, the predetermined pressure in the direction of the lower side of Fig. 7 is applied to the bonding tool 12 by the control of the pressurizing mechanism 11. Ultrasonic vibration (ultrasonic vibration bonding processing) in the horizontal direction of Fig. 7 is applied to the bonding tool 12 by the ultrasonic vibrator 13 while applying the pressure. By the ultrasonic vibration bonding process, the glass substrate 1 and the lead 2 can be joined at the bonding position.

After the ultrasonic vibration bonding process, the receiving portion 150 is moved in the downward direction of FIG. 7 to release the "receiving" of the interface between the glass substrates 1 of the receiving portion 15. Further, as shown in Fig. 6, the "reduction" by the receiving portion 15 is released, and the "deformation" generated on the stage 31 is restored to its original state.

As described above, in the ultrasonic vibration bonding apparatus 200 of the present embodiment, the lower surface of the glass substrate 1 can be indirectly received by the receiving portion 15. Further, the lead wires 2 disposed on the glass substrate 1 can be ultrasonically vibrated by the ultrasonic vibration portions 11, 12, and 13 above the receiving portion 15.

Therefore, even if, for example, the glass substrate 1 is deformed and/or warped, the ultrasonic vibration bonding apparatus 200 does not cause damage to the glass substrate 1, and the ultrasonic vibration bonding lead 2 can be normally performed on the glass substrate 1.

Further, the stage 31 of the present embodiment is made of a hard resin having a small thickness. Therefore, since the stage 31 is easily deformed by the push from the receiving portion 15, it is not necessary to provide the hole 14a as described in the first embodiment on the stage 31.

Further, the ultrasonic vibration bonding process at the plurality of points of the glass substrate 1 and the lead 2 can be continuously performed by moving the ultrasonic vibration devices 11, 12, 13 and the receiving portion 15 in the horizontal direction, or the stage 31; In other words, by moving the ultrasonic vibration devices 11, 12, 13 and the receiving portion 15 in the horizontal direction, or the carrier 31, the glass substrate 1 and the lead 2 can be implemented in any portion of the stage 31. Sonic vibration bonding processing.

<Fifth Embodiment>

In the ultrasonic vibration bonding apparatus 200 of the fourth embodiment, the receiving portion 15 is moved in the vertical direction by the fixed stage 31, and the glass substrate 1 of the stage 31 through which the receiving portion 15 is transmitted and deformed is "received". "."

In the ultrasonic vibration bonding apparatus 300 of the fifth embodiment, the carrier 31 is moved in the vertical direction by the fixed receiving portion 15, and the glass substrate 1 of the stage 31 through which the receiving portion 15 is transmitted is deformed. Undertake". In addition to this operation, the configuration and operation of the two ultrasonic vibration bonding devices 200 and 300 are the same.

Hereinafter, the operation of the ultrasonic vibration bonding apparatus 300 of the present embodiment will be specifically described.

First, the glass substrate 1 is placed and fixed on the stage 31, and the lead 2 is placed at the bonding position on the glass substrate 1. Next, the stage 31 is moved in the downward direction. Thereby, as shown in Fig. 8, the stage 31 is deformed at a portion in contact with the upper surface of the receiving portion 15. Next, the upper surface portion of the receiving portion 15 is indirectly received and fixed to the lower surface of the glass substrate 1 of the stage 31 through the deformed stage 31.

The bonding tool 12 is repetitively abutted on the lead 2. As a result of the operation up to this point, as shown in Fig. 8, the bonding table 12, the glass substrate 1, and the lead 2 are inserted into the contact portion by the bonding tool 12 and the receiving portion 15.

In the foregoing state, the predetermined pressure in the direction below the eighth drawing is applied to the bonding tool 12 by the control of the pressurizing mechanism 11. Ultrasonic vibration (ultrasonic vibration bonding processing) in the horizontal direction of FIG. 8 is applied to the bonding tool 12 while the pressure is applied by the ultrasonic vibrator 13. By the ultrasonic vibration bonding process, the glass substrate 1 and the lead 2 can be joined at the bonding position.

After the ultrasonic vibration bonding process, the stage 31 is moved in the upward direction of FIG. 8 to release the "take" of the interface between the glass substrates 1 of the receiving portion 15. Further, as shown in Fig. 6, by "receiving" the receiving portion 15, the "deformation" generated on the stage 31 is restored to its original state.

As described above, in the ultrasonic vibration bonding apparatus 300 of the present embodiment, the lower surface of the glass substrate 1 can be indirectly received by the receiving portion 15. Further, the lead wires 2 disposed on the glass substrate 1 can be ultrasonically vibrated by the ultrasonic vibration portions 11, 12, and 13 above the receiving portion 15.

Therefore, even if, for example, the glass substrate 1 is deformed and/or warped, the ultrasonic vibration bonding apparatus 300 does not damage the glass substrate 1, and the ultrasonic vibration bonding lead 2 can be normally performed on the glass substrate 1.

Further, the stage 31 of the present embodiment is made of a hard resin having a small thickness. Therefore, since the stage 31 is easily deformed by the contact with the receiving portion 15, it is not necessary to provide the hole 14a as described in the first embodiment on the stage 31.

Further, in the present embodiment, since the stage 31 is moved in the vertical direction, for example, when the receiving portion 15 is difficult to move up and down due to the configuration of the device, the ultrasonic vibration bonding device 300 having the above-described effects can be configured.

Further, by moving the ultrasonic vibration devices 11, 12, 13 and the receiving portion 15 in the horizontal direction, or the stage 31, the ultrasonic vibration bonding process at the plurality of points of the glass substrate 1 and the lead 2 can be continuously performed. In other words, by moving the ultrasonic vibration devices 11, 12, 13 and the receiving portion 15 in the horizontal direction, or the carrier 31, the ultrasonic waves of the glass substrate 1 and the lead 2 can be performed at any portion of the stage 31. Vibration bonding treatment.

The present invention has been described in detail, but the foregoing description is intended to be illustrative, and the invention is not limited thereto. Numerous modifications that are not exemplified are to be understood as not departing from the scope of the invention.

1. . . glass substrate

1a. . . Warpage (or deformation)

2. . . lead

11. . . Pressurizing mechanism

12. . . Bonding tool

13. . . Ultrasonic vibrator

14, 31. . . Carrying platform

14a. . . hole

15. . . Bearing department

20, 21. . . Contact detection sensor

100, 200, 300. . . Ultrasonic vibration joint device

Fig. 1 is a cross-sectional view showing a schematic configuration of an ultrasonic vibration device 100 according to the first embodiment.

Fig. 2 is a view for explaining the control operation of the receiving portion 15 of the second embodiment.

Fig. 3 is an enlarged cross-sectional view showing the configuration of the receiving portion 15 provided with the contact detecting sensor 20 of the third embodiment.

Fig. 4 is an enlarged cross-sectional view showing the configuration of the receiving portion 15 provided with the contact detecting sensor 21 of the third embodiment.

Fig. 5 is an enlarged cross-sectional view for explaining the operation of the contact detecting sensor 21 disposed in the receiving portion 15.

Fig. 6 is a cross-sectional view showing a schematic configuration of the ultrasonic vibration bonding apparatus 200 of the fourth embodiment.

Fig. 7 is a cross-sectional view for explaining the operation of the ultrasonic vibration bonding apparatus 200 of the fourth embodiment.

Fig. 8 is a cross-sectional view showing a schematic configuration of the ultrasonic vibration bonding apparatus 300 of the fifth embodiment.

1. . . glass substrate

1a. . . Warpage (or deformation)

2. . . lead

11. . . Pressurizing mechanism

12. . . Bonding tool

13. . . Ultrasonic vibrator

14. . . Carrying platform

14a. . . hole

15. . . Bearing department

100. . . Ultrasonic vibration joint device

Claims (10)

An ultrasonic vibration bonding device capable of performing ultrasonic vibration bonding of a substrate to a substrate, and comprising: an ultrasonic vibration unit for simultaneously performing ultrasonic vibration in a horizontal direction from the upward direction of pressure a substrate to be processed; a stage for placing the substrate; and a receiving portion positioned at a position corresponding to the abutting portion of the ultrasonic vibrating portion and the object to be processed, and capable of receiving the aforementioned from the lower side The substrate; the ultrasonic vibration unit applies the ultrasonic vibration to the object to be processed after the substrate is brought into the receiving portion. The ultrasonic vibration bonding apparatus according to claim 1, wherein the mounting base is provided with a hole having a predetermined shape, and the receiving portion is in direct contact with the substrate via the hole. The ultrasonic vibration bonding apparatus according to claim 2, wherein the receiving portion is moved in the vertical direction so as to be in contact with and non-contact with the substrate. The ultrasonic vibration bonding apparatus according to claim 3, wherein the receiving portion rises in an upward direction until a pressure on the substrate reaches a predetermined pressure value, and stops after reaching the predetermined pressure value. The aforementioned rise is maintained while maintaining the predetermined pressure value. The ultrasonic vibration bonding apparatus according to claim 3, wherein the receiving portion is provided with a sensor for detecting contact with the substrate. The ultrasonic vibration bonding apparatus according to claim 1, wherein the carrier is made of a resin having a small thickness, and the receiving portion indirectly receives the substrate through the carrier. The ultrasonic vibration bonding apparatus according to claim 6, wherein the receiving portion is moved in the vertical direction so as to be in contact with and non-contact with the substrate. The ultrasonic vibration bonding apparatus according to claim 6, wherein the carrier is moved in the vertical direction so as to be in contact with and not in contact with the receiving portion. The ultrasonic vibration bonding apparatus according to the first aspect of the invention, wherein the ultrasonic vibration unit and the receiving unit are movable in a horizontal direction. The ultrasonic vibration bonding apparatus according to claim 1, wherein the carrier platform is movable in a horizontal direction.