[go: up one dir, main page]

WO2009060687A1 - Adhesive sheet and method for manufacturing semiconductor device using the same - Google Patents

Adhesive sheet and method for manufacturing semiconductor device using the same Download PDF

Info

Publication number
WO2009060687A1
WO2009060687A1 PCT/JP2008/068340 JP2008068340W WO2009060687A1 WO 2009060687 A1 WO2009060687 A1 WO 2009060687A1 JP 2008068340 W JP2008068340 W JP 2008068340W WO 2009060687 A1 WO2009060687 A1 WO 2009060687A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive sheet
semiconductor wafer
semiconductor device
same
base film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/068340
Other languages
French (fr)
Japanese (ja)
Inventor
Yoshio Terada
Fumiteru Asai
Hirokuni Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007291254A external-priority patent/JP2009117718A/en
Priority claimed from JP2007291248A external-priority patent/JP5060249B2/en
Priority claimed from JP2007295526A external-priority patent/JP2009135124A/en
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to US12/513,316 priority Critical patent/US8048690B2/en
Priority to CN200880001164.9A priority patent/CN101568611B/en
Publication of WO2009060687A1 publication Critical patent/WO2009060687A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • H10P72/0442—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/26—Presence of textile or fabric
    • C09J2400/263—Presence of textile or fabric in the substrate

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)

Abstract

Disclosed is an adhesive sheet wherein an adhesive layer is formed on a base film. This adhesive sheet is characterized in that the base film is composed of conductive fibers and a path for electrical conduction is formed between the adhesive layer and the base film. Consequently, an inspection for electrical conduction can be performed even when the adhesive sheet is bonded to a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer. In addition, this adhesive sheet makes it possible to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection.
PCT/JP2008/068340 2007-11-08 2008-10-09 Adhesive sheet and method for manufacturing semiconductor device using the same Ceased WO2009060687A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/513,316 US8048690B2 (en) 2007-11-08 2008-10-09 Pressure-sensitive adhesive sheet and process for producing semiconductor device having same
CN200880001164.9A CN101568611B (en) 2007-11-08 2008-10-09 Adhesive sheet and method for manufacturing semiconductor device using the same

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2007291254A JP2009117718A (en) 2007-11-08 2007-11-08 Dicing adhesive sheet
JP2007291251 2007-11-08
JP2007-291251 2007-11-08
JP2007-291254 2007-11-08
JP2007-291248 2007-11-08
JP2007291248A JP5060249B2 (en) 2007-11-08 2007-11-08 Inspection adhesive sheet
JP2007-295526 2007-11-14
JP2007295526A JP2009135124A (en) 2007-11-08 2007-11-14 Dicing adhesive sheet

Publications (1)

Publication Number Publication Date
WO2009060687A1 true WO2009060687A1 (en) 2009-05-14

Family

ID=40625588

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068340 Ceased WO2009060687A1 (en) 2007-11-08 2008-10-09 Adhesive sheet and method for manufacturing semiconductor device using the same

Country Status (1)

Country Link
WO (1) WO2009060687A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130330546A1 (en) * 2011-03-03 2013-12-12 Nitto Denko Corporation Heat-peelable adhesive sheet
WO2016031788A1 (en) * 2014-08-28 2016-03-03 リンテック株式会社 Conductive adhesive sheet
WO2016031787A1 (en) * 2014-08-28 2016-03-03 リンテック株式会社 Conductive adhesive sheet
WO2016031786A1 (en) * 2014-08-28 2016-03-03 リンテック株式会社 Conductive adhesive sheet

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS526465A (en) * 1975-07-05 1977-01-18 Sankenshiya:Kk Manufacturing method of semi-conductor pellet slices for integrated ci rcuit
JPH07294585A (en) * 1994-04-21 1995-11-10 Hitachi Chem Co Ltd Electric continuity inspection method of electronic parts
JP2000290616A (en) * 1999-04-06 2000-10-17 Tomoegawa Paper Co Ltd A conductive adhesive composition, a conductive adhesive sheet, an electromagnetic wave shielding material using the same, and an electromagnetic wave shielding flexible printed board.
JP2003020462A (en) * 2001-07-09 2003-01-24 Somar Corp Conductive pressure-sensitive adhesive composition excellent in flame retardancy and pressure-sensitive adhesive product using the same
JP2005263876A (en) * 2004-03-16 2005-09-29 Lintec Corp Double-sided pressure-sensitive adhesive sheet and transfer method for brittle member

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS526465A (en) * 1975-07-05 1977-01-18 Sankenshiya:Kk Manufacturing method of semi-conductor pellet slices for integrated ci rcuit
JPH07294585A (en) * 1994-04-21 1995-11-10 Hitachi Chem Co Ltd Electric continuity inspection method of electronic parts
JP2000290616A (en) * 1999-04-06 2000-10-17 Tomoegawa Paper Co Ltd A conductive adhesive composition, a conductive adhesive sheet, an electromagnetic wave shielding material using the same, and an electromagnetic wave shielding flexible printed board.
JP2003020462A (en) * 2001-07-09 2003-01-24 Somar Corp Conductive pressure-sensitive adhesive composition excellent in flame retardancy and pressure-sensitive adhesive product using the same
JP2005263876A (en) * 2004-03-16 2005-09-29 Lintec Corp Double-sided pressure-sensitive adhesive sheet and transfer method for brittle member

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130330546A1 (en) * 2011-03-03 2013-12-12 Nitto Denko Corporation Heat-peelable adhesive sheet
WO2016031788A1 (en) * 2014-08-28 2016-03-03 リンテック株式会社 Conductive adhesive sheet
WO2016031787A1 (en) * 2014-08-28 2016-03-03 リンテック株式会社 Conductive adhesive sheet
WO2016031786A1 (en) * 2014-08-28 2016-03-03 リンテック株式会社 Conductive adhesive sheet
KR20170046659A (en) * 2014-08-28 2017-05-02 린텍 가부시키가이샤 Conductive adhesive sheet
JPWO2016031787A1 (en) * 2014-08-28 2017-06-15 リンテック株式会社 Conductive adhesive sheet
JPWO2016031788A1 (en) * 2014-08-28 2017-06-15 リンテック株式会社 Conductive adhesive sheet
JPWO2016031786A1 (en) * 2014-08-28 2017-06-15 リンテック株式会社 Conductive adhesive sheet
KR102390524B1 (en) 2014-08-28 2022-04-25 린텍 가부시키가이샤 Conductive adhesive sheet

Similar Documents

Publication Publication Date Title
WO2009060686A1 (en) Adhesive sheet for inspection
TW200942594A (en) Film for semiconductor, method for manufacturing semiconductor device and semiconductor device
WO2008102548A1 (en) Semiconductor light emitting element and method for manufacturing semiconductor light emitting device
EP1681713A4 (en) SURFACE PROTECTION SHEET AND METHOD FOR RODING SEMICONDUCTOR WAFERS
TW200943477A (en) Method for manufacturing SOI substrate
TW200744120A (en) Semiconductor structure, semiconductor wafer and method for fabricating the same
WO2009113831A3 (en) Multi-functional tape for semiconductor package and a method for manufacturing semiconductor device using the same
JP2009152565A5 (en)
WO2009014087A1 (en) Semiconductor device manufacturing method
TW200731518A (en) Semiconductor device and manufacturing method of the same
WO2009006284A3 (en) Semiconductor die having a redistribution layer
TW201130173A (en) Semiconductor light emitting device and method for manufacturing same
TW200746276A (en) Method for bonding a semiconductor substrate to a metal substrate
TW200608530A (en) Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus
WO2009032536A3 (en) Method for manufacturing a semiconductor die and a semiconductor device comprising the semiconductor die obtained thereby
EP1788621A3 (en) Method for manufacturing bonded substrate and bonded substrate manufactured by the method
WO2006095566A8 (en) Nitride semiconductor light-emitting device and method for fabrication thereof
TW200605227A (en) Semiconductor device and manufacturing method thereof
TW200727446A (en) Stack type semiconductor device manufacturing method and stack type electronic component manufacturing method
MY158034A (en) Method for manufacturing electronic component
WO2010127320A3 (en) Methods for wafer bonding, and for nucleating bonding nanophases
TW200701335A (en) Nitride semiconductor device and manufacturing mathod thereof
TWI861201B (en) Semiconductor device manufacturing method and chuck
WO2011090572A3 (en) A method to form lateral pad on edge of wafer
TWI256112B (en) Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880001164.9

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 1020097007261

Country of ref document: KR

WWE Wipo information: entry into national phase

Ref document number: 12513316

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08848271

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08848271

Country of ref document: EP

Kind code of ref document: A1