TWI464841B - - Google Patents

Info

Publication number: TWI464841B
Authority: TW; Taiwan

Application number

TW097129440A

Other versions

TW201007902A (en

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2008-08-01

Filing date

2008-08-01

Publication date

2014-12-11

2008-08-01 Application filed filed Critical

2008-08-01 Priority to TW097129440A priority Critical patent/TW201007902A/zh

2010-02-16 Publication of TW201007902A publication Critical patent/TW201007902A/zh

2014-12-11 Application granted granted Critical

2014-12-11 Publication of TWI464841B publication Critical patent/TWI464841B/zh

Classifications

- H10W72/073—
- H10W72/075—
- H10W72/884—
- H10W90/724—
- H10W90/734—
- H10W90/754—

TW097129440A 2008-08-01 2008-08-01 Semiconductor chip structure TW201007902A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
TW097129440A TW201007902A (en)	2008-08-01	2008-08-01	Semiconductor chip structure

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
TW097129440A TW201007902A (en)	2008-08-01	2008-08-01	Semiconductor chip structure

Publications (2)

Publication Number	Publication Date
TW201007902A TW201007902A (en)	2010-02-16
TWI464841B true TWI464841B (zh)	2014-12-11

Family

ID=44827245

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW097129440A TW201007902A (en)	2008-08-01	2008-08-01	Semiconductor chip structure

Country Status (1)

Country	Link
TW (1)	TW201007902A (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW200731477A (en) *	2005-11-10	2007-08-16	Int Rectifier Corp	Semiconductor package including a semiconductor die having redistributed pads

2008
- 2008-08-01 TW TW097129440A patent/TW201007902A/zh not_active IP Right Cessation

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW200731477A (en) *	2005-11-10	2007-08-16	Int Rectifier Corp	Semiconductor package including a semiconductor die having redistributed pads

Also Published As

Publication number	Publication date
TW201007902A (en)	2010-02-16

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Legal Events

Date	Code	Title	Description
2023-09-11	MM4A	Annulment or lapse of patent due to non-payment of fees