TWI464067B - Metal printing stencil for forming different coating thicknesses in single time printing - Google Patents
Metal printing stencil for forming different coating thicknesses in single time printing Download PDFInfo
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- TWI464067B TWI464067B TW101102610A TW101102610A TWI464067B TW I464067 B TWI464067 B TW I464067B TW 101102610 A TW101102610 A TW 101102610A TW 101102610 A TW101102610 A TW 101102610A TW I464067 B TWI464067 B TW I464067B
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- 238000007639 printing Methods 0.000 title claims description 121
- 229910052751 metal Inorganic materials 0.000 title claims description 95
- 239000002184 metal Substances 0.000 title claims description 95
- 238000000576 coating method Methods 0.000 title claims description 82
- 239000011248 coating agent Substances 0.000 title claims description 81
- 230000001050 lubricating effect Effects 0.000 claims description 23
- 239000007787 solid Substances 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 239000010408 film Substances 0.000 description 134
- 239000010410 layer Substances 0.000 description 30
- 239000011247 coating layer Substances 0.000 description 18
- 239000000463 material Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 11
- 239000003973 paint Substances 0.000 description 7
- 239000007888 film coating Substances 0.000 description 5
- 238000009501 film coating Methods 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- Printing Plates And Materials Therefor (AREA)
Description
本發明係有關於用以形成精密塗層之印刷治具,特別係有關於一種一次印刷形成不同膜厚之金屬印刷模板。The present invention relates to a printing jig for forming a precision coating, and more particularly to a metal printing template which is formed by one printing to form different film thicknesses.
在傳統的電子元件製程中,以網版印刷(screen printing)與模版印刷(stencil printing)為成本較低的圖案形成技術,特別可適用於太陽能電池、積層陶瓷電容、其它積層式或薄膜型電子產品之大量生產。然而,網版印刷因使用的網版有網線與網線交錯的結目導致印刷形成之圖案再現性、精準度與解析度無法進一度提高。因而,申請人揭示本國專利I299304「金屬印刷模板及其使用方法」、本國專利I306061「多層式金屬印刷模板及其製造方法」、以及本國專利M388414「金屬印刷模板」,提供多種可高精密模版印刷的治具,其主體為精密電鑄之單層或多層金屬膜,皆在於改善傳統網版印刷的缺點。In the traditional electronic component process, screen printing and stencil printing are lower cost pattern forming techniques, especially for solar cells, laminated ceramic capacitors, other laminated or thin film types. Mass production of products. However, the screen printing used in the screen printing has the result that the network line and the network line are interlaced, and the pattern reproducibility, precision and resolution of the printing cannot be further improved. Therefore, the applicant discloses a domestic patent I299304 "metal printing template and its use method", national patent I306061 "multi-layer metal printing template and its manufacturing method", and national patent M388414 "metal printing template", providing a variety of high precision stencil printing The fixture is mainly made of precision electroformed single or multi-layer metal film, which is to improve the shortcomings of traditional screen printing.
此外,在特定電子產品會有印刷圖案塗層要求具有不同厚度之需要,依現行的網版印刷技術則需要設計兩套不同圖案的網版並進行兩(多)道印刷操作,第一次印刷的網版同時具有較薄膜厚塗佈層與較厚膜厚塗佈層之對應圖案,經烘乾之後再進行第二次印刷,第二次印刷的網版僅具有較厚膜厚塗佈層之對應圖案,第二次印刷之後亦需要再次烘乾,不但製程效率較差,並且兩次印刷的對位誤差亦會造成較厚膜厚塗佈層的厚度不足與線徑變寬。因此,在圖案形成之高精密模版印刷製程中客戶端希望能有以一次印刷形成不同厚度印刷圖案塗層之需要。In addition, in certain electronic products, there is a need for different thicknesses of the printed pattern coating. According to the current screen printing technology, it is necessary to design two sets of different patterns of the screen and perform two (multi) printing operations, the first printing. The screen has a corresponding pattern of a thick film coating layer and a thicker film coating layer, and is subjected to a second printing after drying, and the second printing screen has only a thick film coating layer. The corresponding pattern needs to be dried again after the second printing, which not only has poor process efficiency, but also the alignment error of the two printings causes the thickness of the thick film coating layer to be insufficient and the wire diameter to be widened. Therefore, in the high precision stencil printing process of patterning, the client desires to have the need to form a printed coating of different thicknesses in one print.
有鑒於此,本發明之主要目的係在於提供一種一次印刷形成不同膜厚之金屬印刷模板,能達到一次印刷形成兩(多)種不同膜厚之圖案化塗層之功效。In view of the above, the main object of the present invention is to provide a metal printing template for forming different film thicknesses in one printing, which can achieve the effect of forming two (multiple) patterned coatings of different film thicknesses in one printing.
本發明之次一目的係在於提供一種一次印刷形成不同膜厚之金屬印刷模板,以金屬膜片內較厚膜厚塗佈區容易張裂變形之問題。A second object of the present invention is to provide a metal printing template having different film thicknesses in one printing, which is susceptible to cracking and deformation in a thick film thickness coating region in a metal film.
本發明之再一目的係在於提供一種一次印刷形成不同膜厚之金屬印刷模板,以改善印刷塗料容易積存沾黏在使形成不同膜厚塗佈區之特殊結構內,如陣列微孔、連結天橋之填料缺口…等。A further object of the present invention is to provide a metal printing template for forming different film thicknesses in one printing, so as to improve the printing material to be easily deposited in a special structure for forming coating regions of different film thicknesses, such as array micropores and connecting bridges. Filling gaps...etc.
本發明的目的及解決其技術問題是採用以下技術方案來實現的。本發明揭示一種一次印刷形成不同膜厚之金屬印刷模板,主要包含一金屬膜片,係具有一貼附面與一印刷面,並定義有不同印刷膜厚之一第一膜厚塗佈區與一第二膜厚塗佈區,其中該第一膜厚塗佈區係為一貫穿該貼附面與該印刷面之等面積開孔,該第二膜厚塗佈區內係包含有複數個陣列微孔,該些陣列微孔的開孔率係佔該第二膜厚塗佈區之40%~90%面積比。The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. The invention discloses a metal printing template which is formed by one printing to form different film thicknesses, and mainly comprises a metal film sheet having a bonding surface and a printing surface, and defining one of different printing film thicknesses, a first film thickness coating area and a second film thickness coating zone, wherein the first film thickness coating zone is an equal-area opening through the bonding surface and the printing surface, and the second film thickness coating zone comprises a plurality of Array micropores, the open porosity of the array micropores is 40% to 90% of the area ratio of the second film thickness coating zone.
本發明的目的及解決其技術問題還可採用以下技術措施進一步實現。The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures.
在前述的金屬印刷模板中,該金屬膜片在該些陣列微孔之間的實體條寬度係可不大於該些陣列微孔之間中心點至中心點之節距之二分之一。In the foregoing metal printing template, the width of the solid strip of the metal film between the array micropores may be no more than one-half of the pitch of the center point to the center point between the array micro holes.
在前述的金屬印刷模板中,該等面積開孔係可為一長槽孔。In the aforementioned metal printing template, the area opening may be a long slot.
在前述的金屬印刷模板中,可另包含複數個連結天橋,其係一體連接於該金屬膜片之該等面積開孔之兩對稱長邊,以防止在拉張該金屬膜片時造成長槽孔之張裂,並且該些連結天橋係不突出於該印刷面,並且該些連結天橋之厚度係可小於該金屬膜片由該貼附面至該印刷面之厚度,使得每一連結天橋在朝向該貼附面之部位係形成有一填料缺口。In the foregoing metal printing template, a plurality of connecting bridges may be further included, which are integrally connected to the two symmetric long sides of the area openings of the metal diaphragm to prevent long grooves when the metal diaphragm is stretched. The joints of the holes are not protruded from the printing surface, and the thickness of the connecting bridges may be smaller than the thickness of the metal film from the attaching surface to the printing surface, so that each connecting bridge is A filler notch is formed in the portion facing the attachment surface.
在前述的金屬印刷模板中,該等面積開孔係可具有一延伸至該第二膜厚塗佈區內之連接端。In the foregoing metal printing stencil, the area opening may have a connecting end extending into the second film thickness coating zone.
在前述的金屬印刷模板中,該等面積開孔之該連接端係可位於最鄰近排之兩陣列微孔之間。In the aforementioned metal printing template, the connecting end of the area opening may be located between the two array micro holes of the nearest row.
在前述的金屬印刷模板中,該等面積開孔係可貫穿該第二膜厚塗佈區。In the aforementioned metal printing stencil, the equal area openings may extend through the second film thickness coating zone.
在前述的金屬印刷模板中,該金屬膜片係可為一電鑄鋼版,其厚度係介於15~300微米。In the foregoing metal printing template, the metal diaphragm may be an electroformed steel plate having a thickness of 15 to 300 micrometers.
在前述的金屬印刷模板中,可另包含:一第一潤滑膜層,係形成於該印刷面上;一第二潤滑膜層,係形成於該等面積開孔之孔壁內;以及一第三潤滑膜層,係形成於該些陣列微孔之孔壁內。In the foregoing metal printing template, the method further includes: a first lubricating film layer formed on the printing surface; a second lubricating film layer formed in the hole wall of the area opening; and a first A three-lubricating film layer is formed in the pore walls of the array of micropores.
在前述的金屬印刷模板中,該等面積開孔係可為一長槽孔而具有兩對稱長邊,該金屬印刷模板係可另包含:複數個連結天橋,其係一體連接於該金屬膜片之該等面積開孔之該兩對稱長邊;以及一第四潤滑膜層,係形成於該些連結天橋顯露在該等面積開孔內之側面與底面。In the above metal printing template, the area opening may be a long slot having two symmetric long sides, and the metal printing template may further comprise: a plurality of connecting bridges integrally connected to the metal diaphragm The two symmetric long sides of the area openings; and a fourth lubricating film layer are formed on the side surfaces and the bottom surfaces of the connecting bridges exposed in the openings of the areas.
以下將配合所附圖示詳細說明本發明之實施例,然應注意的是,該些圖示均為簡化之示意圖,僅以示意方法來說明本發明之基本架構或實施方法,故僅顯示與本案有關之元件與組合關係,圖中所顯示之元件並非以實際實施之數目、形狀、尺寸做等比例繪製,某些尺寸比例與其他相關尺寸比例或已誇張或是簡化處理,以提供更清楚的描述。實際實施之數目、形狀及尺寸比例為一種選置性之設計,詳細之元件佈局可能更為複雜。The embodiments of the present invention will be described in detail below with reference to the accompanying drawings in which FIG. The components and combinations related to this case, the components shown in the figure are not drawn in proportion to the actual number, shape and size of the actual implementation. Some size ratios are proportional to other related sizes or have been exaggerated or simplified to provide clearer description of. The actual number, shape and size ratio of the implementation is an optional design, and the detailed component layout may be more complicated.
依據本發明之第一具體實施例,一種一次印刷形成不同膜厚之金屬印刷模板舉例說明於第1圖之平面示意圖、第2圖之局部平面示意圖、第3圖之在兩膜厚塗佈區處之平面放大示意圖、第4圖之在第3圖之立體示意圖、以及第5圖之沿第4圖5-5線之剖切示意圖。本發明揭示一種一次印刷形成不同膜厚之金屬印刷模板100,主要包含一金屬膜片110,該金屬膜片110係具有一貼附面111與一印刷面112,並定義有不同印刷膜厚之一第一膜厚塗佈區113與一第二膜厚塗佈區114。通常該金屬膜片110係伸張貼設於一框型模板130下,該金屬膜片110之印刷面112係顯露於該框型模板130之一開口131中。該貼附面111係用以貼附至一待印刷物310(如第6A圖所示),而該待印刷物310係可為一電子元件之母片,如太陽能電池基板、發光二極體晶圓、積體電路晶圓、被動元件陶瓷母片、或封裝基板母片…等等。該印刷面112係為刮刀320之刮磨表面,即可供塗料330填入之表面(如第6A圖所示),該塗料330係可為導電膏,例如銀膏或銅膏等等。在本實施例中,該金屬膜片110係可為一電鑄鋼版,其具有之一第一厚度T1係介於15~300微米,即該金屬膜片110係為無網層之精密電鑄膜結構,可為單層結構。而該金屬膜片110之材質係為鎳或鎳鈷(Ni-Co)合金,較為硬質且光滑,能減少印刷時油墨之沾黏,有助於鋼板印刷之作業性。According to a first embodiment of the present invention, a metal printing template for forming different film thicknesses in one printing is illustrated in a schematic plan view of FIG. 1, a partial plan view of FIG. 2, and a plan view of a film thickness of two layers in a film thickness of FIG. The schematic view of the plane enlarged, the perspective view of Fig. 4 in Fig. 3, and the cutaway view of Fig. 5 along line 5-5 of Fig. 4. The invention discloses a metal printing template 100 which is formed by one printing to form different film thicknesses, and mainly comprises a metal film 110 having a bonding surface 111 and a printing surface 112 and defining different printing film thicknesses. A first film thickness coating zone 113 and a second film thickness coating zone 114. Generally, the metal film 110 is stretched and attached to a frame template 130. The printing surface 112 of the metal film 110 is exposed in one of the openings 131 of the frame template 130. The attachment surface 111 is attached to a to-be-printed object 310 (as shown in FIG. 6A), and the to-be-printed object 310 can be a master of an electronic component, such as a solar cell substrate or a light-emitting diode wafer. , integrated circuit wafers, passive component ceramic masters, or packaged substrate masters...etc. The printing surface 112 is a scratching surface of the doctor blade 320, that is, a surface that can be filled with the coating material 330 (as shown in FIG. 6A), and the coating material 330 can be a conductive paste such as a silver paste or a copper paste or the like. In this embodiment, the metal diaphragm 110 can be an electroformed steel plate having a first thickness T1 of 15 to 300 micrometers, that is, the metal diaphragm 110 is a precision layer without a mesh layer. The cast film structure can be a single layer structure. The material of the metal diaphragm 110 is nickel or nickel-cobalt (Ni-Co) alloy, which is relatively hard and smooth, can reduce the adhesion of the ink during printing, and contributes to the workability of the steel plate printing.
該第一膜厚塗佈區113係為一貫穿該貼附面111與該印刷面112之等面積開孔,換言之,該第一膜厚塗佈區113之面積尺寸係由該等面積開孔所定義,該等面積開孔之孔壁係作為該第一膜厚塗佈區113之邊緣。在本實施例中,該等面積開孔係可為一長槽孔而具有兩對稱長邊,一般而言為長槽孔形態之等面積開孔(即該第一膜厚塗佈區113)可具有一狹窄的寬度,即該兩對稱長邊之間隙距離,可約在1~10000微米(可低於1公分),更具體可介於10~100微米。如第3及4圖所示,該等面積開孔(即該第一膜厚塗佈區113)之寬度係小於該第二膜厚塗佈區114內複數個陣列微孔115之節距P,而接近該些陣列微孔115之平行向邊緣或孔徑,例如:當該等面積開孔(即該第一膜厚塗佈區113)提供作為太陽能電池的線路形成,該等面積開孔(即該第一膜厚塗佈區113)之寬度具體可為50~70微米。此外,該等面積開孔(即該第一膜厚塗佈區113)之該兩對稱長邊之長度係達到數公分至數十公分,可依產品需求作適當長度之延伸變化或連接。如第2圖所示,複數個等面積開孔(即該第一膜厚塗佈區113)可連接成梳狀槽孔。The first film thickness coating area 113 is an area opening through the bonding surface 111 and the printing surface 112. In other words, the area size of the first film thickness coating area 113 is such that the area is opened. As defined, the walls of the apertures of the area are the edges of the first film thickness coating zone 113. In this embodiment, the equal-area opening system may be a long slotted hole and has two symmetric long sides, generally an equal-area opening in the form of a long slotted hole (ie, the first film thickness coating area 113) It may have a narrow width, that is, a gap distance between the two symmetric long sides, which may be about 1 to 10000 micrometers (may be less than 1 cm), and more specifically between 10 and 100 micrometers. As shown in FIGS. 3 and 4, the width of the area opening (ie, the first film thickness coating area 113) is smaller than the pitch P of the plurality of array micro holes 115 in the second film thickness coating area 114. And approaching the parallel edges or apertures of the array of micropores 115, for example, when the area openings (ie, the first film thickness coating area 113) provide line formation as a solar cell, the area openings ( That is, the width of the first film thickness coating region 113) may specifically be 50 to 70 micrometers. In addition, the lengths of the two symmetric long sides of the area opening (ie, the first film thickness coating area 113) are several centimeters to several tens of centimeters, and may be extended or connected according to the needs of the product. As shown in Fig. 2, a plurality of equal-area openings (i.e., the first film-thick coating area 113) can be joined into comb-like slots.
該第二膜厚塗佈區114內係包含有該複數個陣列微孔115,該些陣列微孔115的開孔率係佔該第二膜厚塗佈區114之40%~90%面積比,其中所謂的開孔率係以該些陣列微孔115的所有孔面積之總合作為子數並以該第二膜厚塗佈區114之面積為母數,子數除以母數得到之百分比。而該第二膜厚塗佈區114之面積尺寸係由該些陣列微孔115最邊緣的排與列之四周外圍邊線所定義。該些陣列微孔115的開孔率應對應塗料黏性而限定在一特定範圍,當該些陣列微孔115的開孔率過高(如細網狀結構)或孔深不足時,將無法達到所預定的薄化塗層,並且,在拉伸該金屬膜片110或刮刀刮刷時,該些陣列微孔115之間將容易斷裂;反之,當該些陣列微孔115的開孔率過低時,表示該些陣列微孔115之間的實體條寬度過大,由該些陣列微孔115內導出的塗料將不易拓散連接成一塗層。更具體地,該些陣列微孔115的開孔率係佔該第二膜厚塗佈區114之50%~80%面積比。此外,該些陣列微孔115之間係具有中心點至中心點之一固定節距P。通常該些陣列微孔115之節距P係可不大於100微米(μm),該些陣列微孔115之孔徑或長邊係可不小於該些陣列微孔115之節距P之二分之一,例如約為50微米,以達到密集化排列。在本實施例中,該些陣列微孔115係為方形孔。更具體地,請參閱第4及5圖,該金屬膜片110在該些陣列微孔115之間的實體條寬度W1係可不大於該些陣列微孔115之間中心點至中心點之節距P之二分之一,可確保該金屬膜片110在印刷後由於待印刷物脫離時原本在該些陣列微孔115內的塗料可在待印刷物上拓散連接成一薄化塗層。此外,該些陣列微孔115之孔深係可相當於該金屬膜片110由該貼附面111至該印刷面112之第一厚度T1。而該等面積開孔(即該第一膜厚塗佈區113)之長邊長度亦為該些陣列微孔115之孔徑或長邊之數十倍以上,甚至可達千倍。在本實施例中,上述包含有該複數個陣列微孔115該第二膜厚塗佈區114係可提供作為太陽能電池的線路匯流排(bus)之形成。The plurality of array micropores 115 are included in the second film thickness coating region 114. The aperture ratio of the array micropores 115 is 40% to 90% of the area ratio of the second film thickness coating region 114. The so-called open cell ratio is obtained by dividing the total cooperation of all the hole areas of the array micropores 115 into a sub-number and the area of the second film thickness coating area 114 as a parent number, and dividing the number of sub-divisions by the number of the mothers. percentage. The area size of the second film thickness coating region 114 is defined by the peripheral edges of the outermost rows and columns of the array micropores 115. The opening ratio of the array of micropores 115 should be limited to a specific range corresponding to the viscosity of the coating. When the aperture ratio of the array of micropores 115 is too high (such as a fine mesh structure) or the pore depth is insufficient, The predetermined thinned coating layer is reached, and when the metal film sheet 110 or the doctor blade is stretched, the array micropores 115 will be easily broken; otherwise, when the array micropores 115 have an opening ratio When the temperature is too low, it indicates that the width of the solid strips between the array micropores 115 is too large, and the paints derived from the array micropores 115 will not be easily connected to form a coating. More specifically, the aperture ratio of the array of micropores 115 is 50% to 80% of the area ratio of the second film thickness coating region 114. In addition, the array microholes 115 have a fixed pitch P from one of the center point to the center point. Generally, the pitch P of the array micro-holes 115 may be no more than 100 micrometers (μm), and the apertures or long sides of the array micro-holes 115 may be not less than one-half of the pitch P of the array micro-holes 115. For example, it is about 50 microns to achieve a dense arrangement. In this embodiment, the array microholes 115 are square holes. More specifically, referring to FIGS. 4 and 5, the strip width W1 of the metal film 110 between the array micropores 115 may not be greater than the pitch from the center point to the center point between the array micro holes 115. One-half of P can ensure that the metal film 110 can be loosely connected to a thin coating on the object to be printed after the printing is released due to the detachment of the object to be printed. In addition, the hole depth of the array of micropores 115 may correspond to the first thickness T1 of the metal film 110 from the attaching surface 111 to the printing surface 112. The length of the long side of the area opening (ie, the first film thickness coating area 113) is also several ten times or more, or even thousands of times, the aperture or the long side of the array micro holes 115. In this embodiment, the plurality of array micropores 115 are included to provide the formation of a bus as a solar cell.
如第6A圖所示,在使用該金屬印刷模板100進行模版印刷時,該金屬膜片110之該貼附面111係貼附至該待印刷物310,利用該刮刀320在該金屬膜片110之該印刷面112上刮刷,使塗料330填入至該等面積開孔(即第一膜厚塗佈區113)內與該第二膜厚塗佈區114內之該些陣列微孔115內。如第6B圖所示,在脫離該金屬印刷模板100之後,在該等面積開孔內塗料330將在該待印刷物310上形成為一第一膜厚塗佈層331,在該些陣列微孔115內塗料330將在該待印刷物310上相互拓散連接而形成為一第二膜厚塗佈層332,並連接至該第一膜厚塗佈層331,其中該第二膜厚塗佈層332之厚度係可顯著地小於該第一膜厚塗佈層331之厚度,例如在該第一膜厚塗佈層331之厚度之三分之二以下。在本實施例中,該第一膜厚塗佈層331之厚度約可在31~50微米,該第二膜厚塗佈層332之厚度約可在10~30微米。因此,利用本發明之金屬印刷模板100可以在一次印刷中形成不同膜厚之塗佈層331、332,可以節省習知多次印刷之製程時間與成本,也不會有習知多次印刷中塗佈層對不準的位移偏差。As shown in FIG. 6A, when the metal printing template 100 is used for stencil printing, the attaching surface 111 of the metal film 110 is attached to the object to be printed 310, and the metal film 110 is used by the doctor blade 320. The printing surface 112 is scraped to fill the coating material 330 into the array openings (ie, the first film thickness coating region 113) and the array pores 115 in the second film thickness coating region 114. . As shown in FIG. 6B, after the metal printing template 100 is detached, the coating material 330 is formed on the to-be-printed object 310 as a first film thickness coating layer 331 in the array opening micro-holes. 115 inner coating material 330 is connected to each other on the object to be printed 310 to form a second film thickness coating layer 332, and is connected to the first film thickness coating layer 331, wherein the second film thickness coating layer The thickness of 332 can be significantly less than the thickness of the first film thickness coating layer 331, for example, less than two-thirds of the thickness of the first film thickness coating layer 331. In this embodiment, the thickness of the first film thickness coating layer 331 may be about 31 to 50 micrometers, and the thickness of the second film thickness coating layer 332 may be about 10 to 30 micrometers. Therefore, with the metal printing template 100 of the present invention, the coating layers 331 and 332 of different film thickness can be formed in one printing, which can save the processing time and cost of the conventional printing, and there is no conventional coating in multiple printing. Uncertain displacement deviation of the layer.
較佳地,該金屬印刷模板100係可另包含複數個連結天橋120,其係一體連接於該金屬膜片110之該等面積開孔之該兩對稱長邊,以防止在拉張該金屬膜片110時造成長槽孔之張裂,即用以改善該金屬膜片110內用以形成較厚膜厚之第一膜厚塗佈區113容易張裂變形之問題。並且,該些連結天橋120係較佳為不突出於該印刷面112,以不影響刮刀之作業。較佳地,該些連結天橋120係可共平面地對齊於該印刷面112,令在製造該些連結天橋120時與印刷作業時能更方便地進行,並且在印刷作業時能防止塗料沾黏在該些連結天橋120之上方。並且,每一連結天橋120在朝向該貼附面111之部位係形成有一填料缺口121,即該些連結天橋120之一第二厚度T2係小於該金屬膜片110由該貼附面111至該印刷面112之第一厚度T1,由該貼附面111方向觀視該第一膜厚塗佈區113(即該等面積開孔),其係具有連通之孔邊緣,以確保塗料在待印刷物上線路圖案的連續形成,而由該印刷面112觀視該第一膜厚塗佈區113(即等面積開孔),其係可為斷續狀長槽孔形態。具體而言,該些連結天橋120係可如同該金屬膜片110這般在電鑄製程中被製作。具體而論,該些連結天橋120之材質係可選自於鎳、鎳合金、銅、銅合金之其中之一,與該金屬膜片110係可為相同或不相同之材質,由於該些連結天橋120亦可利用電鑄製程製作,故可輕易地在該等面積開孔內製作出單層或是複合層之金屬結構。此外,該些連結天橋120具有一與該等面積開孔之兩對稱長邊同向之寬度,其係可不大於對應第一膜厚塗佈區113在該兩對稱長邊之間隙(即為呈長槽孔形態之該等面積開孔之寬度),以減少對應第一膜厚塗佈區113被該些連結天橋120遮蔽的單元最大面積,有利於塗料快速填入並填滿對應之填料缺口121。更具體地,該些連結天橋120之第二厚度T2係可介於該金屬膜片110之第一厚度T1之六分之一至三分之二之間,可相對地界定出該填料缺口121的深度。在本實施例中,該金屬膜片110之厚度約為50微米,而該些連結天橋120之厚度係可介於20~25微米或更低。此外,較佳地,該些連結天橋120係可為等間距排列在每一第一膜厚塗佈區113內,以均勻地承受應力。因此,該些連結天橋120之下方可供塗料通過以流佈至該貼附面111之水平面,並能強化與支撐該等面積開孔之長槽孔結構,故具有防止在模版印刷時該第一膜厚塗佈區113之兩對稱長邊產生間隙變化或是長槽孔張裂之功效。Preferably, the metal printing template 100 further includes a plurality of connecting bridges 120 integrally connected to the two symmetric long sides of the area openings of the metal diaphragm 110 to prevent the metal film from being stretched. The sheet 110 causes cracking of the long slot, that is, the problem that the first film thickness coating region 113 for forming a thick film thickness in the metal film 110 is easily cracked and deformed. Moreover, the connecting bridges 120 are preferably not protruded from the printing surface 112 so as not to affect the operation of the blade. Preferably, the connecting bridges 120 are coplanarly aligned with the printing surface 112, which makes it easier to manufacture the connecting bridges 120 during printing operations, and prevents paint from sticking during printing operations. Above the connecting bridges 120. And a filler notch 121 is formed in a portion of the connecting bridge 120 facing the attaching surface 111, that is, a second thickness T2 of the connecting bridges 120 is smaller than the metal diaphragm 110 from the attaching surface 111 to the The first thickness T1 of the printing surface 112 is viewed from the direction of the attachment surface 111 by the first film thickness coating area 113 (ie, the area opening), which has a communicating hole edge to ensure the paint is to be printed. The upper line pattern is continuously formed, and the first film thickness coating area 113 (i.e., the equal area opening) is viewed from the printing surface 112, which may be in the form of an intermittent long slot. Specifically, the joint bridges 120 can be fabricated in the electroforming process as the metal diaphragm 110. Specifically, the materials of the connecting bridges 120 may be selected from one of nickel, nickel alloy, copper, and copper alloys, and the metal diaphragms 110 may be the same or different materials due to the links. The flyover 120 can also be fabricated by an electroforming process, so that a single or composite metal structure can be easily fabricated in the openings of the areas. In addition, the connecting bridges 120 have a width in the same direction as the two symmetric long sides of the equal-area openings, which may be no more than a gap between the two symmetric long sides of the corresponding first film thickness coating region 113 (ie, The width of the opening of the area of the long slot is reduced to reduce the maximum area of the unit corresponding to the first film thickness coating area 113 being shielded by the connecting bridges 120, which facilitates rapid filling and filling of the corresponding filling gap. 121. More specifically, the second thickness T2 of the connecting bridges 120 may be between one sixth and two thirds of the first thickness T1 of the metal diaphragm 110, and the filling gap 121 may be relatively defined. depth. In this embodiment, the thickness of the metal diaphragm 110 is about 50 micrometers, and the thickness of the connecting bridges 120 can be between 20 and 25 micrometers or less. In addition, preferably, the connecting bridges 120 may be equally spaced in each of the first film thickness coating regions 113 to uniformly withstand stress. Therefore, the underside of the connecting bridge 120 allows the paint to pass through to the horizontal plane of the attaching surface 111, and can strengthen and support the long slot structure of the opening of the area, thereby preventing the first in the stencil printing. The two symmetric long sides of the film thickness coating zone 113 produce a gap change or a long slot hole crack.
較佳地,該等面積開孔(即該第一膜厚塗佈區113)係可具有一延伸至該第二膜厚塗佈區114內之連接端116。在本發明之一更具體結構中,該等面積開孔之該連接端116係可位於最鄰近排之兩陣列微孔115A之間,使得該連接端116至最鄰近陣列微孔115B之距離W2係不大於該金屬膜片110在該些陣列微孔115之間的實體條寬度W1。因此,如第6B圖所示,此一結構便得以確保該第一膜厚塗佈層331與該第二膜厚塗佈層332的相互拓散連接,在加熱燒結後,該第一膜厚塗佈層331係可成為較厚且可較細之導電線路,該第二膜厚塗佈層332係可成為較薄且較寬之電性導接匯流排(bus),並且兩者相互電性連接。Preferably, the area openings (ie, the first film thickness coating zone 113) may have a connection end 116 extending into the second film thickness coating zone 114. In a more specific configuration of the present invention, the connection end 116 of the area opening may be located between the two array micro holes 115A of the nearest row such that the distance from the connection end 116 to the nearest array aperture 115B is W2. It is not greater than the width W1 of the solid strip of the metal film 110 between the array of micropores 115. Therefore, as shown in FIG. 6B, the structure ensures the mutual diffusion connection between the first film thickness coating layer 331 and the second film thickness coating layer 332. After the heat sintering, the first film thickness is The coating layer 331 can be a thick and thin conductive line, and the second film thickness coating layer 332 can be a thin and wide electrical conductive bus, and the two are electrically connected to each other. Sexual connection.
如第5圖所示,在一較佳具體實施例中,該金屬印刷模板100係可另包含一形成於該印刷面112上之第一潤滑膜層141、一形成於該等面積開孔之孔壁之第二潤滑膜層142、以及一形成於該些陣列微孔115之孔壁內第三潤滑膜層143。該些潤滑膜層141、142、143係可為相同的對塗料具不沾黏特性之有機或無機潤滑材質(例如鐵弗龍、氧化鉬、氧化鋁、滑石粉等)並且以適當之表面處理方式形成使其厚度得以控制介於0.1~20微米,更具體地可控制在0.5~5微米,藉以提供於該等面積開孔與該些陣列微孔115等孔內不沾黏塗料以利脫模時多數塗料能印刷在待印刷物310之作用以及使該印刷面112耐刮刀刮磨之作用,故可以進一步控制好該第一膜厚塗佈層331與該第二膜厚塗佈層332兩者預定的膜厚差。其中,關於該些潤滑膜層141、142、143之具體形成方法,可利用複合鍍(或可為析鍍)方式形成具有該些潤滑膜層141、142、143,即在鍍液中加入有機或無機顆粒在附著在該等面積開孔與該些陣列微孔115等孔內。或者,該些潤滑膜層141、142、143係亦可為對塗料具不沾黏特性之金屬潤滑材質,而能以電鍍方式形成於該金屬膜片110之表面與孔壁內。例如,在該些潤滑膜層141、142、143之另一具體形成方法中,當該些潤滑膜層141、142、143之材質係為金屬氧化物時,可先鍍上對應金屬再予以氧化處理即可,例如鋁或鋁合金之陽極處理。As shown in FIG. 5, in a preferred embodiment, the metal printing template 100 can further include a first lubricating film layer 141 formed on the printing surface 112, and a hole formed in the area. A second lubricating film layer 142 of the hole wall and a third lubricating film layer 143 formed in the hole walls of the array micropores 115. The lubricating film layers 141, 142, and 143 may be the same organic or inorganic lubricating materials (for example, Teflon, Molybdenum Oxide, Alumina, Talc, etc.) having non-stick properties to the coating material and treated with appropriate surface treatment. The method is formed such that the thickness thereof is controlled to be between 0.1 and 20 micrometers, and more specifically, it can be controlled to be between 0.5 and 5 micrometers, thereby providing the non-stick coating in the holes of the area and the micropores 115 of the array to facilitate the removal of the coating. In the mold, most of the paint can be printed on the object to be printed 310 and the print surface 112 is scratched. Therefore, the first film thickness coating layer 331 and the second film thickness coating layer 332 can be further controlled. The predetermined film thickness is poor. The specific formation method of the lubricating film layers 141, 142, and 143 may be formed by using a composite plating (or may be a plating) to form the lubricating film layers 141, 142, and 143, that is, adding organic substances to the plating solution. Or inorganic particles are attached to the holes of the area and the array of micropores 115. Alternatively, the lubricating film layers 141, 142, and 143 may be metal-lubricated materials having non-stick properties to the paint, and may be formed by plating on the surface of the metal film 110 and the walls of the holes. For example, in another specific forming method of the lubricating film layers 141, 142, and 143, when the materials of the lubricating film layers 141, 142, and 143 are metal oxides, the corresponding metals may be plated first and then oxidized. It can be treated, for example, anodized aluminum or aluminum alloy.
特別的是,再如第5圖所示,當該等面積開孔(即該第一膜厚塗佈區113)係可為一長槽孔而具有兩對稱短邊與兩對稱長邊時,除了較佳地包含有複數個連結天橋120,該金屬印刷模板100係可另包含一第四潤滑膜層144,係形成於該些連結天橋120顯露在該等面積開孔內之側面與底面。如第6A圖所示,利用該第四潤滑膜層144將有助於塗料330之流動以利填滿該些連結天橋120下方之填料缺口121。因此,本發明之金屬印刷模板係能改善印刷塗料容易積存沾黏在使形成不同膜厚塗佈區之特殊結構內,例如該些陣列微孔或該些連結天橋之填料缺口…等。In particular, as shown in FIG. 5, when the area opening (ie, the first film thickness coating area 113) is a long slot and has two symmetric short sides and two symmetric long sides, In addition to preferably including a plurality of connecting bridges 120, the metal printing template 100 may further include a fourth lubricating film layer 144 formed on the side and bottom surfaces of the connecting bridges 120 exposed in the openings of the areas. As shown in FIG. 6A, the use of the fourth lubricating film layer 144 will facilitate the flow of the coating 330 to fill the filler gaps 121 below the connecting bridges 120. Therefore, the metal printing template of the present invention can improve the printing material to easily accumulate in a special structure for forming coating regions of different film thicknesses, such as the array micropores or the filler gaps of the connecting bridges, and the like.
依據本發明之第二具體實施例,揭示另一種一次印刷形成不同膜厚之金屬印刷模板,舉例說明第7圖之局部平面示意圖、第8圖之在兩膜厚塗佈區處之平面放大示意圖、以及第9圖之在第8圖之立體示意圖。其中,與第一具體實施例相同名稱之元件將沿用相同圖號。該金屬印刷模板200係主要包含一金屬膜片110。如同第一具體實施例,主要包含一金屬膜片110,該金屬膜片110係具有一貼附面111與一印刷面112,並定義有不同印刷膜厚之一第一膜厚塗佈區113與一第二膜厚塗佈區114,其中該第一膜厚塗佈區113係為一貫穿該貼附面111與該印刷面112之等面積開孔,該第二膜厚塗佈區114內係包含有複數個陣列微孔115,該些陣列微孔115的開孔率係佔該第二膜厚塗佈區114之40%~90%面積比。在本實施例中,該等面積開孔(即該第一膜厚塗佈區113)係可貫穿該第二膜厚塗佈區114,以確保由該第一膜厚塗佈區113形成之較厚第一膜厚塗佈層連接至由該第二膜厚塗佈區114形成之較薄第二膜厚塗佈層。According to a second embodiment of the present invention, another metal printing template having different film thicknesses is formed by one printing, and a partial plan view of FIG. 7 and a plan enlarged view of the film thickness of the two film thicknesses of FIG. 8 are illustrated. And a perspective view of Fig. 9 in Fig. 8. Wherein, the same reference numerals will be used for the same elements as the first embodiment. The metal print template 200 mainly includes a metal film 110. As in the first embodiment, a metal film 110 is mainly included. The metal film 110 has a bonding surface 111 and a printing surface 112, and defines one of different printing film thicknesses. The first film thickness coating area 113 And a second film thickness coating area 114, wherein the first film thickness coating area 113 is an area opening through the bonding surface 111 and the printing surface 112, and the second film thickness coating area 114 The inner system includes a plurality of array micropores 115, and the aperture ratio of the array micropores 115 is 40% to 90% of the area ratio of the second film thickness coating region 114. In this embodiment, the area opening (ie, the first film thickness coating area 113) may penetrate the second film thickness coating area 114 to ensure formation by the first film thickness coating area 113. The thicker first film thickness coating layer is attached to the thinner second film thickness coating layer formed by the second film thickness coating zone 114.
以上所述,僅是本發明的較佳實施例而已,並非對本發明作任何形式上的限制,雖然本發明已以較佳實施例揭露如上,然而並非用以限定本發明,任何熟悉本項技術者,在不脫離本發明之技術範圍內,所作的任何簡單修改、等效性變化與修飾,均仍屬於本發明的技術範圍內。The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. Any simple modifications, equivalent changes and modifications made without departing from the technical scope of the present invention are still within the technical scope of the present invention.
5‧‧‧表現於第5圖之剖切線標記5‧‧‧ Cut line markings shown in Figure 5
100‧‧‧金屬印刷模板100‧‧‧metal printing template
110‧‧‧金屬膜片110‧‧‧Metal diaphragm
111‧‧‧貼附面111‧‧‧ Attachment
112‧‧‧印刷面112‧‧‧Printed surface
113‧‧‧第一膜厚塗佈區113‧‧‧First film thickness coating area
114‧‧‧第二膜厚塗佈區114‧‧‧Second film thickness coating area
115‧‧‧陣列微孔115‧‧‧Array micropores
115A‧‧‧最鄰近排之兩陣列微孔115A‧‧‧Two array micropores in the nearest row
115B‧‧‧最鄰近陣列微孔115B‧‧‧ Nearest Array Microwell
116‧‧‧連接端116‧‧‧Connected end
120‧‧‧連結天橋120‧‧‧Linked Flyover
121‧‧‧填料缺口121‧‧‧ Filling gap
130‧‧‧框型模板130‧‧‧Frame template
131‧‧‧開口131‧‧‧ openings
141‧‧‧第一潤滑膜層141‧‧‧First lubricating film layer
142‧‧‧第二潤滑膜層142‧‧‧Second lubricating film layer
143‧‧‧第三潤滑膜層143‧‧‧ Third lubricating film layer
144‧‧‧第四潤滑膜層144‧‧‧fourth lubricating film layer
200‧‧‧金屬印刷模板200‧‧‧metal printing template
310‧‧‧待印刷物310‧‧‧To be printed
320‧‧‧刮刀320‧‧‧ scraper
330‧‧‧塗料330‧‧‧ paint
331‧‧‧第一膜厚塗佈層331‧‧‧First film thickness coating
332‧‧‧第二膜厚塗佈層332‧‧‧Second film coating layer
P‧‧‧陣列微孔之間中心點至中心點之節距P‧‧‧pitch from center point to center point between array microwells
W1‧‧‧在陣列微孔之間的實體條寬度W1‧‧‧ Width of the solid strip between the array microwells
W2‧‧‧連接端至最鄰近陣列微孔之距離Distance from the W2‧‧‧ connection to the nearest array of microvias
T1‧‧‧由貼附面至印刷面之第一厚度T1‧‧‧ from the attachment surface to the first thickness of the printing surface
T2‧‧‧連結天橋之第二厚度The second thickness of the T2‧‧‧ link flyover
第1圖:依據本發明之一第一具體實施例的一種一次印刷形成不同膜厚之金屬印刷模板之平面示意圖。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a metal printing template having different film thicknesses in one printing according to a first embodiment of the present invention.
第2圖:依據本發明之一第一具體實施例的該金屬印刷模板之局部平面示意圖。Figure 2 is a partial plan view of the metal printing template in accordance with a first embodiment of the present invention.
第3圖:依據本發明之一第一具體實施例的該金屬印刷模板在兩膜厚塗佈區處之平面放大示意圖。Figure 3 is a plan enlarged view of the metal printing template at a two film thickness coating zone in accordance with a first embodiment of the present invention.
第4圖:依據本發明之一第一具體實施例的該金屬印刷模板在第3圖之立體示意圖。Figure 4 is a perspective view of the metal printing template according to a first embodiment of the present invention in Figure 3.
第5圖:依據本發明之一第一具體實施例的該金屬印刷模板沿第4圖5-5線之剖切示意圖。Fig. 5 is a cross-sectional view of the metal printing template according to a first embodiment of the present invention taken along line 5-5 of Fig. 4.
第6A與6B圖:依據本發明之一第一具體實施例的該金屬印刷模板在使用時與使用後在一基板上形成兩(多)種不同膜厚之圖案化塗層之截面示意圖。6A and 6B are schematic cross-sectional views showing a patterned coating of two (multiple) different film thicknesses on a substrate after use in accordance with a first embodiment of the present invention.
第7圖:依據本發明之一第二具體實施例的另一種一次印刷形成不同膜厚之金屬印刷模板之局部平面示意圖。Figure 7 is a partial plan view showing another metal printing template for forming different film thicknesses in one printing according to a second embodiment of the present invention.
第8圖:依據本發明之一第二具體實施例的該金屬印刷模板在兩膜厚塗佈區處之平面放大示意圖。Figure 8 is a plan enlarged view of the metal printing template at two film thickness coating zones in accordance with a second embodiment of the present invention.
第9圖:依據本發明之一第二具體實施例的該金屬印刷模板在第8圖之立體示意圖。Figure 9 is a perspective view of the metal printing template according to a second embodiment of the present invention in Figure 8.
5‧‧‧表現於第5圖之剖切線標記5‧‧‧ Cut line markings shown in Figure 5
110‧‧‧金屬膜片110‧‧‧Metal diaphragm
111‧‧‧貼附面111‧‧‧ Attachment
112‧‧‧印刷面112‧‧‧Printed surface
113‧‧‧第一膜厚塗佈區113‧‧‧First film thickness coating area
114‧‧‧第二膜厚塗佈區114‧‧‧Second film thickness coating area
115‧‧‧陣列微孔115‧‧‧Array micropores
115A‧‧‧最鄰近排之兩陣列微孔115A‧‧‧Two array micropores in the nearest row
115B‧‧‧最鄰近陣列微孔115B‧‧‧ Nearest Array Microwell
116‧‧‧連接端116‧‧‧Connected end
120‧‧‧連結天橋120‧‧‧Linked Flyover
121‧‧‧填料缺口121‧‧‧ Filling gap
P‧‧‧陣列微孔之間中心點至中心點之節距P‧‧‧pitch from center point to center point between array microwells
W1‧‧‧在陣列微孔之間的實體條寬度W1‧‧‧ Width of the solid strip between the array microwells
W2‧‧‧連接端至最鄰近陣列微孔之距離Distance from the W2‧‧‧ connection to the nearest array of microvias
T1‧‧‧由貼附面至印刷面之第一厚度T1‧‧‧ from the attachment surface to the first thickness of the printing surface
T2‧‧‧連結天橋之第二厚度The second thickness of the T2‧‧‧ link flyover
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101102610A TWI464067B (en) | 2012-01-20 | 2012-01-20 | Metal printing stencil for forming different coating thicknesses in single time printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101102610A TWI464067B (en) | 2012-01-20 | 2012-01-20 | Metal printing stencil for forming different coating thicknesses in single time printing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201331043A TW201331043A (en) | 2013-08-01 |
| TWI464067B true TWI464067B (en) | 2014-12-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101102610A TWI464067B (en) | 2012-01-20 | 2012-01-20 | Metal printing stencil for forming different coating thicknesses in single time printing |
Country Status (1)
| Country | Link |
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| TW (1) | TWI464067B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200744852A (en) * | 2006-03-28 | 2007-12-16 | Hitachi Plant Technologies Ltd | Screen printing equipment |
| TW200835418A (en) * | 2007-02-09 | 2008-08-16 | Dong-Ming Li | Masking, hole-fabricating and electroplating molding method for printed circuit board |
-
2012
- 2012-01-20 TW TW101102610A patent/TWI464067B/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200744852A (en) * | 2006-03-28 | 2007-12-16 | Hitachi Plant Technologies Ltd | Screen printing equipment |
| TW200835418A (en) * | 2007-02-09 | 2008-08-16 | Dong-Ming Li | Masking, hole-fabricating and electroplating molding method for printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201331043A (en) | 2013-08-01 |
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