•1306061 * 九、發明說明： 【發明所屬之技術領域】 本發明係有關於厚膜製程之印刷技術，特別係有關於一 種多層式金屬印刷模板。 【先前技術】 在積層陶兗電容（Multi-layer Ceramic Capacitor, MLCC)、太陽能電池、其它積層式或薄膜型電子產品之製作 ^ 技術中’針對其内部多層金屬膜/絕緣膜之形成方式主要區 分為薄膜製程（Thin film technique)與厚膜製程（Thick film technique)。其中，薄膜製程所指者為一般的物理沉積（ρν〇) 與化學沉積（CVD) ’不但沉積速度慢且在每一次金屬膜的圖 案化成形過程均需要至少一道微影成像的步驟，成本相當 咼，不適用於低成本快速量產。以往的厚膜製程則是一種製 作成本低、設備要求少的技術，主要是藉由網板印刷（screen printing)的方式，將構成有金屬顆粒、鍵結劑與分散劑等之 • 導電油墨通過一網板以塗覆於一基材上，再燒結成一圖案化 金屬膜。然目前的厚膜網印的金屬膜之最小厚度僅可到達 5〇μιη ’無法更加薄化且厚度不均勻。此外，隨著重覆網印的 次數越多，網板之網目會伸縮產生越來越大的尺寸誤差，使 得重覆網印的再現性誤差達到1 〇%以上。 本國專利公告第369482號「製造網版印刷模板的方法及 一含有一經塗覆網狀織物的網版印刷布」，利用塑膠細絲質 網狀織物塗覆一乳劑，使其浸潤於網狀織物内，該乳劑為感 光性經曝光顯影之後得到一具有印刷圖案之網版印刷布。然 5 1306061 * 而網狀織物在細絲交錯疊點的厚度約是細絲直徑的兩倍，產 生厚度差異。故使用該網版印刷布進行網板印刷形成之導電 油墨厚度會有誤差變化，影響電子產品的電性效能。因此， 習知的印刷網板無法兼顧薄化與均勻膜厚之需求，同時亦存 在有再現性誤差大的問題。 【發明内容】 本發明之主要目的係在於解決上述問題，提供一種多層BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printing technique for a thick film process, and more particularly to a multi-layer metal printing template. [Prior Art] In the fabrication of Multi-layer Ceramic Capacitors (MLCC), solar cells, other laminated or thin-film electronic products, the main methods for forming the internal multilayer metal film/insulating film are distinguished. It is a thin film technique and a thick film technique. Among them, the film process refers to the general physical deposition (ρν〇) and chemical deposition (CVD). Not only the deposition rate is slow, but also requires at least one lithography imaging process in each metal film patterning process, and the cost is equivalent. Oh, it is not suitable for low-cost, fast mass production. The conventional thick film process is a technology with low manufacturing cost and low equipment requirements, mainly through the use of screen printing to pass conductive inks composed of metal particles, bonding agents and dispersants. A screen is applied to a substrate and then sintered into a patterned metal film. However, the current thickness of the thick film screen printed metal film can only reach 5 〇μιη ′, which cannot be thinner and the thickness is not uniform. In addition, as the number of repeated screen printings increases, the mesh of the stencil expands and contracts to produce more and more dimensional errors, resulting in reproducibility errors of overprinted screen printing of more than 1%. National Patent Publication No. 369482, "Method for Producing Screen Printing Template, and Screen Printing Cloth Containing a Coated Fabric," Coating an Emulsion with a Plastic Filament Mesh Fabric to Infiltrate the Mesh Fabric The emulsion is photosensitive developed by exposure to obtain a screen printing cloth having a printed pattern. However, 5 1306061 * The thickness of the mesh fabric at the point where the filaments are staggered is about twice the diameter of the filament, resulting in a difference in thickness. Therefore, the thickness of the conductive ink formed by the screen printing using the screen printing cloth may have an error variation, which affects the electrical performance of the electronic product. Therefore, the conventional printing stencil cannot meet the demand for thinning and uniform film thickness, and there is also a problem that the reproducibility error is large. SUMMARY OF THE INVENTION The main object of the present invention is to solve the above problems and to provide a multilayer
式金屬印刷模板，在一膜片狀電鑄主體上形成有一金屬覆蓋 層，該電鑄主體之材質為鎳或鎳合金並具有等距排列的微 孔，以取代習知的網版印刷之網狀織物（screen)，該金屬覆 蓋層係遮蓋部份之該些微孔並具有至少一鏤空區，以取代習 知的網版印刷之圖案化感光性乳劑’更具有均句厚度，解決 織物交錯疊點厚度差之問題，並提供印刷材料（導電油墨或 非導電油墨)加熱後形成之圖案化膜層能更薄更均句並具有 良好製程再現性。 本發明之次一目的係在於捤供一 穴供種多層式金屬印刷模 板’能防止在印刷時微孔受到刮 』刀推力導致孔變形甚至破裂 本發明之再一目的係在於提 爽供種多層式金屬印刷模 板’有助於鋼板印刷後油墨脫離 & ,， 、 .. 雕模板，能減少油墨沾黏於模 板之殘留量，使油墨受熱濕潤 、 膜層。 ]彬成一更完整更均厚之圖案化 本發明的目的及解決其技術閉 實題是採用以下技術方案來 貫現的。依據本發明揭示之—種 裡夕層式金屬印刷模板，主要 6 1306061 膜片狀電鑄主體以及一金屬覆蓋層。該電鑄主體之材 質係為鎳或鎳合金並具有複數個等距排列的微孔，且該些微 孔之孔深係介於3〜15〇微米。該金屬覆蓋層係形成於該電鑄 主體上，以遮蓋部份之該些微孔，該金屬覆蓋層係具有至少 該錐二&之顯露區域係涵蓋該些微孔其中之至少 *固或兩個以上。本發明另揭示該多層式金屬印刷模板之製 造方法。 Φ 本I月的目的及解決其技術問題還可採用以下技術措施 進一步實現。 於前述的多層式金屬印刷模板中，其中該金屬覆蓋層之 厚度係小於該電鑄主體之膜厚。 於前述的多層式金屬印刷模板中，其中該金屬覆蓋層係 與該電鑄主體為同一材質。 於前述的多層式金屬印刷模板中，其中被遮蓋之該些微 孔係不被該金屬覆蓋層所填滿而為盲孔型態。 •於前述的多層式金屬印刷模板中，其中該金屬覆蓋層與 该電鑄主體之間係形成有一減鍵層。 於前述的多層式金屬印刷模板中，其中該些微孔之節距 係小於100微米，且該些微孔之孔徑係不小於該些微孔之節 距之二分之一。 於前述的多層式金屬印刷模板中，其中其十該些微孔之 孔深係介於5 ~ 5 0微米。 於前述的多層式金屬印㈣板中，其中該些微孔係為圓 柱形孔。 7 1306061 於則述的多層式金屬印刷模板中，丨中該電鍀主體係具 有一第—表面與-第二表面，該些微孔朝向該第二表面之〆 端係為擴大口，且該金屬覆蓋層係形成於該第二表面上。 於前述的多層式金屬印刷模板令，其中該些微孔係為交 錯排列，以使内層排列之微孔等距等肖相隔有六個最鄰近之 微孔。 於前述的多層式金屬印刷模板中，其中該電铸主體之材 男係為鎳鈷合金。 【實施方式】 在本發明之一具體實施例中，帛1圖係為-種多層式金 屬印刷模板（metal printing加⑴放大約三百倍之局部立體 透視圖’第2圖係為該多層式金屬印刷模板之局部表面示竟 圖，第3圖係為該多層式金屬印刷模板之局部截面示意圖二 如第1、2及3圖所示，該多層式金屬印刷模板係 含—膜片狀電鑄主體10及一合屈霜甚屉，Λ 篮及金屬覆蓋層20，該電鑄主體10 材貝係為鎳或鎳合金並具有一第一表面U、一 12與複數個等距排列的微孔⑹ n . J其中該些微孔 深係介於3〜150微米（㈣並貫穿該第-表面U與該 樹二表面12。更具體地，該些微孔13之孔深應介於5〜50 ,:^ )以供厚膜製程之薄膜鋼板印刷。在本實施例中， 表面11係為電鑄開始之起始面，該第二 電鑄終止之外矣 衣曲12係為 之外表面。該電鑄主體10之材質除了可以是鎳， 缚錄鐵、祕、錄嫣等鎮合金。較佳地，該電 之材質係為鎳鈷（Ni-Co)合金，較為硬質且光滑， 8 1306061Metal-printing template, a metal coating layer is formed on a diaphragm-shaped electroforming body, and the electroforming main body is made of nickel or nickel alloy and has micropores arranged equidistantly to replace the conventional screen printing network. a screen covering the micropores of the portion and having at least one hollowed out area to replace the conventional screen printing photosensitive emulsion, which has a uniform thickness and solves the interlacing of the fabric. The problem of poor overlap thickness and the provision of a printed material (conductive ink or non-conductive ink) to form a patterned film layer can be thinner and more uniform and has good process reproducibility. The second object of the present invention is to provide a multi-layer metal printing template for a hole to prevent micropores from being scratched during printing. The blade thrust causes deformation or even cracking of the hole. The metal printing template 'helps the ink to detach from the steel plate after printing, and the .. carving template can reduce the residual amount of ink adhering to the template, so that the ink is heated and wet, and the film layer. ] Bin Cheng a more complete and more uniform patterning The purpose of the present invention and solving the technical problem is to use the following technical solutions to achieve. According to the invention, a layered metal printing template is disclosed, mainly a 61306061 diaphragm-shaped electroformed body and a metal coating. The electroformed body is made of nickel or a nickel alloy and has a plurality of equidistantly arranged micropores, and the pores of the micropores are between 3 and 15 microns. The metal coating layer is formed on the electroforming body to cover a portion of the micropores, the metal coating layer having at least the exposed area of the cone 2 & More than two. The invention further discloses a method of making the multilayer metal print template. Φ The purpose of this month and the resolution of its technical problems can be further realized by the following technical measures. In the above multilayer metal printing stencil, wherein the thickness of the metal coating layer is smaller than the film thickness of the electroformed body. In the above multi-layer metal printing template, the metal coating layer is made of the same material as the electroforming body. In the foregoing multi-layer metal printing template, the micropores covered therein are not filled with the metal coating layer and are in a blind hole type. • In the foregoing multi-layer metallographic stencil, wherein a reduced bond layer is formed between the metal cover layer and the electroformed body. In the above multi-layer metal printing template, the pitch of the micropores is less than 100 micrometers, and the apertures of the microholes are not less than one-half of the pitch of the microholes. In the above multi-layer metal printing template, the pore depth of the micropores is between 5 and 50 micrometers. In the above multi-layered metal (four) plate, the micropores are cylindrical holes. 7 1306061 In the multi-layer metal printing template described in the above, the main system of the electric raft has a first surface and a second surface, and the micropores are enlarged toward the end of the second surface, and the A metal cover layer is formed on the second surface. In the foregoing multi-layer metal printing template, wherein the micropores are arranged in an interlaced manner, so that the micropores of the inner layer are equidistantly spaced apart from each other by six nearest neighboring micropores. In the above multi-layer metal printing template, wherein the electroforming main body is a nickel-cobalt alloy. [Embodiment] In one embodiment of the present invention, the 帛1 image is a multi-layer metal printing template (metal printing plus (1) is placed about three hundred times of a partial perspective view] and the second figure is the multi-layer The partial surface of the metal printing template is shown in Fig. 3, and the third drawing is a partial cross-sectional view of the multi-layer metal printing template. As shown in Figures 1, 2 and 3, the multi-layer metal printing template contains a film-like electricity. The casting body 10 and the blister, the basket and the metal covering layer 20, the electroforming body 10 is made of nickel or nickel alloy and has a first surface U, a 12 and a plurality of equidistantly arranged micro Holes (6) n. J wherein the micropores are deep in the range of 3 to 150 μm ((4) and penetrate the first surface U and the surface 12 of the tree. More specifically, the pores of the micropores 13 should be between 5 〜50 , :^ ) is printed on a film steel sheet for a thick film process. In this embodiment, the surface 11 is the starting surface of the electroforming start, and the second electroforming is terminated except for the 矣衣曲12 series. The surface of the electroforming main body 10 may be nickel, and is bound to a town alloy such as iron, secret, or ruthenium. Preferably, The material of this electricity is nickel-cobalt (Ni-Co) alloy, which is relatively hard and smooth, 8 1306061
月匕減少印刷時油墨之沾黏與殘留，有助於鋼板印刷之作業 性。而較佳地，該些微孔i3之節距係可小於1 〇〇微米（μιη)， 且該些微孔13之孔徑應不小於該些微孔13之節距之二分之 一 ’儘可能使該些微孔13為高密度等距排列。在本實施例 中’該些微孔13之節距係約為80微米，該些微孔13之孔 徑約為5 0微米（即不小於微孔節距之二分之一），也就是說， 在一平方公分的面積中可以排列一萬個以上的微孔。而所謂 節距」（pitch)係指微孔之中心點至微孔之中心點之長度， 所。月孔控」係指微孔内壁間之最大距離，所謂「等距排列」 係指在該電鑄主體10之表面上定義一適當直線，就該直線 所通過該些微孔中心點之微孔13數目中，兩兩相鄰的微孔 1 3具有相同之節距，故本發明中微孔丨3之等距排列方式至 少包含了多排交錯排列與矩陣排列等等。另在製程中，通常 該些微孔13係全面形成於該電铸主體1〇，而使該電鑄主體 10不會有留白區域。 該金屬覆蓋層20係形成於該電鑄主體1〇之該第二表面 12上，以遮蓋部份之該些微孔13(如第2及3圖所示之盲孔 型微孔13 A);在本實施例中，被遮蓋之該些微孔13係不被 該金屬覆蓋層20所填滿而為盲孔型態，可以減輕重量且容 易離模。該金屬覆蓋層20係具有至少一鏤空區21，該鏤空 區21之顯露區域係涵蓋該些微孔π其中之至少兩個或兩個 以上（如第3圖所示之貫通微孔13B)。通常顯露在單一鏤空 區21内之微孔13數目約為數十甚至數千以上。該金屬覆= 層20之厚度係可小於該電鑄主體1〇之膜厚。該金屬覆蓋層 1306061 :〇係可與該電铸主體10為同-材質，能利用同一類型之電 鑄設備製作該電鑄域1G㈣金屬t蓋層2G，崎低成本。 在上述之多層式金屬印刷模板中，該些微孔13係能模擬 成習知網印織布之網目’更具有耐重覆刷印之優點，不會有 變形之問題。因此，該多層式金屬印刷模板之該電鑄主體10 能取代習知網版印刷之網印織布（screen)，該金屬覆蓋層20 此取代S知網版印刷之圖案化感光性乳劑，更具有製程整合Lunar New Year reduces the stickiness and residue of the ink during printing, which contributes to the workability of the printing of the steel sheet. Preferably, the pitch of the microholes i3 is less than 1 〇〇 micron (μιη), and the apertures of the microholes 13 are not less than one-half of the pitch of the microholes 13 It is possible that the micropores 13 are arranged in a high density equidistant arrangement. In the present embodiment, the pitch of the micropores 13 is about 80 micrometers, and the pores of the micropores 13 are about 50 micrometers (that is, not less than one-half of the micropore pitch), that is, , more than 10,000 micropores can be arranged in a square centimeter area. The so-called "pitch" refers to the length from the center point of the micropore to the center point of the micropore. "Month hole control" refers to the maximum distance between the inner walls of the micropores. The so-called "equal spacing" means defining a suitable line on the surface of the electroforming body 10, and the micro holes passing through the center points of the micro holes. Among the 13 numbers, the two adjacent micropores 13 have the same pitch, so the equidistant arrangement of the micropores 3 in the present invention includes at least a plurality of rows of staggered arrays and matrix arrangements and the like. In the process, usually, the micropores 13 are integrally formed in the electroformed body 1 so that the electroformed body 10 does not have a white space. The metal cover layer 20 is formed on the second surface 12 of the electroformed body 1 to cover a portion of the micro holes 13 (such as the blind hole type micro holes 13 A shown in FIGS. 2 and 3). In the present embodiment, the micropores 13 that are covered are not filled by the metal cover layer 20 and are in a blind hole type, which can reduce the weight and easily release the mold. The metal cover layer 20 has at least one hollowed out region 21, and the exposed area of the hollowed out region 21 covers at least two or more of the micropores π (such as the through micropores 13B shown in Fig. 3). The number of micropores 13 which are usually revealed in a single hollow region 21 is about tens or even thousands. The thickness of the metal coating layer 20 may be less than the film thickness of the electroformed body 1 . The metal covering layer 1306061: the lanthanum system can be made of the same material as the electroforming main body 10, and the electroforming domain 1G (four) metal t-cladding layer 2G can be produced by the same type of electroforming equipment. In the multi-layered metal printing template described above, the micropores 13 can simulate the mesh of the conventional screen printing woven fabric, which is more resistant to repeated brushing without the problem of deformation. Therefore, the electroformed body 10 of the multi-layer metal printing template can replace the screen printing screen of the conventional screen printing, and the metal coating layer 20 replaces the patterned photosensitive emulsion of the screen printing. Process integration
之功效。如第5A至5C圖所示，該多層式金屬印刷模板在 使用用途上能解決織物交錯叠點厚度差之問題，印刷形成之 膜層具有更均句厚度、更薄並具有良好製程再現性，可運用 於積層陶瓷電容(MLCC)或太陽能電池等之圖案化金屬膜製 作（容後詳述）。 再如第1與2圖所示，該些微孔13之形狀較佳為圓柱形 孔，減少應力集中點，可防止在印刷時該些微孔13受到刮 刀推力而孔變形甚至.破裂之情事。再如第卜2及3圖所示， 邊些微孔13朝向該第二表面12之一端係為擴大口 14，也就 疋說，該些微孔13之擴大口 14之口徑係大於該些微孔13 之孔徑，可為弧角或倒角，具有使油墨容易離模之功效，減 少油墨沾黏於模板之殘留量。 再如第2圖所示，在前述的多層式金屬印刷模板中，該 些微孔13係較佳為交錯排列，以使内層排列之微孔13等距 等角相隔有六個最鄰近之微孔n，達到高密度排列。 此外，配合參閱第4八至4〇圖，進一步揭示前述的多層 式金屬印刷模板之其中一種製造方法。首先，如第4A圖所 J306061 示，在一不鏽鋼板其它或導電板等之母模110上形成—第一 光阻120,如固片狀乾膜或液態光阻，並利用一光罩13〇(或 底片）進行曝光顯影，以使該第一光阻12〇被移除且顯露至 該母模110的凹陷圖案形狀對應於該電鑄主體10之形狀（如 第4B圖所示）。在本實施例中，該第一光阻12〇係包含有負 型光阻劑，該光罩1 30之開孔圖案係大致相同於該電鑄主體 ίο之該些微孔13,故被曝光的部位將可被保留。如第4b圖 • 所示，該第一光阻120在曝光顯影之後形成複數個電鑄遮柱 1 2 1，佔據預疋形成該些微孔1 3之空間，並利用曝光技術， 使該些電鑄遮柱121具有對應於微孔擴大口 14之上方擴大 端，例如弧角擴大端。接著’如第4C圖所示，利用電鍍的 原理，將鎳金屬或鎳合金，沈積在該母模11〇上，累積到需 要的厚度，構成上述之電鑷主體1〇，其中該第一表面11係 貼齊於該母模11〇,該第二表面12係為顯露狀該些微孔 13之形狀係依該些電鑄遮柱121之形狀而形成。較佳地，另 #包含有一表面平坦化的步驟，使得該電鑄主體10與該些電 鱗遮柱121具有共平面之顯露表面。 二後如第4D圖所示，形成一第二光阻i 4〇於該電鑄主 體1〇與該些電鏵遮柱121上。如第4E圖所示，經曝光顯影 之後，該第二光阻140保留的部位係成為至少一遮罩部 /、形狀對應於如第3圖所示之該金屬覆蓋層2〇之該鏤 空區21。夕祕 — ’可以直接電鍍以形成該金屬覆蓋層2〇，或 成極薄之晶種層再電鍵到該金屬覆蓋層20所需 要的厚度。^^ 苐4F圖所示，利用濺鍍技術形成一濺鍍層3〇 11 J306O61 於該電鑄主體10上 ^ 以作為晶種層。之後，如第4G圖所示， 進仃一電鍍步驟，以彡 y ο金屬覆蓋層20。最後，利用捲收 或其它剝離方式，合且女± 7具有該電鑄主體10、該金屬覆蓋層20' 該些電鑄遮柱121鱼 ” 遮罩°卩M1之組合件脫離該母模 =再使心液或習知綠洗劑同㈣除該些_遮柱i2i 二遮罩部141，即可得到如第3圖所示之多層式金屬印刷 棋板。較佳地’可以附加超音波震_快速洗㈣些電禱遮 柱121與該遮罩部ίο。 、第5A^ SC圖係有關於該多層式金屬印刷模板之使用方 法’能應用於厚膜製程之3〜15〇微米均厚薄膜之製作。首 先，如第5A圖所示，上述多層式金屬印刷模板（即覆蓋有該 金屬覆蓋層20之電铸主體1〇)壓貼至一待印刷基材，其 中4電碡主體1〇之該第__表面丨丨係朝向該待印刷基材 21〇 ’該金屬覆蓋層2G係顯露於外。在本實施例中，該待印 刷基材210係為一 MLCC基板或是一太陽能電池基板。之 後透過°亥夕層式金屬印刷模板印刷上導電油墨2 2 〇，例如 銀膏、錫膏或其它金屬膏，或可為非導電油墨，該導電油墨 220係通過該鏤空區21填滿於該些貫通微孔i3B。之後，如 第5Β圖所示，移除該多層式金屬印刷模板（即該電鑄主體1〇 與該金屬覆蓋層20)，留下導電油墨22〇在該待印刷基材22〇 上’其中利用該擴大口 14能加速該導電油墨2 2 〇之流動並 減少殘留量。最後，如第5C圖所示，加熱該導電油墨22〇 使内含金屬顆粒燒結以形成一可更薄化且均厚之圖案金屬 膜2 21。此外，在重覆鋼板印刷的操作中，後續形成之圖案 12 、l3〇6〇6l 金屬膜221亦具有良好之再現性。 明作所34 ’僅是本發明的較佳實施例而已’並非對本發 上:何形式上的限制，雖然本發明已以較佳實施例揭露如 :而並非用以限定本發明，任何熟悉本項技術者在不 性變化：:：申請專利範圍内’所作的任何簡單修改、等效 k化與修飾，皆涵蓋於本發明的技術範圍内。 【圖式簡單說明】 百倍之 第1圖.本發明之一種多層式金屬印刷模板放大約 局部立體透視圖。 :2圖：該多層式金屬印刷模板之局部表面示意圖。 3圖.該多層式金屬印刷模板之局部截面示意圖。 4八至扣圖：依據本發明之一具體實施例，該多層式金 4印刷模板於-製程中之截面示意圖。 5A至5C圖··依據本發明之一具體實施例，使用該多層 4金屬印職板於―鋼板印刷過程中之示意圖。 【主要元件符號說明】 10電鑄主體 U第—表面 12第二表面The effect. As shown in Figures 5A to 5C, the multi-layer metal printing template can solve the problem of the difference in the thickness of the interlaced overlap of the fabric in use, and the film formed by the printing has a more uniform thickness, a thinner and a good process reproducibility. It can be used in the fabrication of patterned metal films such as multilayer ceramic capacitors (MLCC) or solar cells (detailed later). Further, as shown in FIGS. 1 and 2, the shape of the micropores 13 is preferably a cylindrical hole, which reduces stress concentration points, and prevents the micropores 13 from being subjected to blade thrust and deformation or even cracking during printing. . Further, as shown in the second and third figures, the micropores 13 are enlarged toward the end of the second surface 12, that is, the diameter of the enlarged opening 14 of the micropores 13 is larger than that. The pore size of the micropores 13 can be an arc angle or a chamfer, which has the effect of allowing the ink to be easily released from the mold, and reducing the amount of ink sticking to the template. Further, as shown in FIG. 2, in the foregoing multi-layer metal printing template, the micropores 13 are preferably staggered so that the micropores 13 arranged in the inner layer are equidistantly equiangularly separated by six nearest neighbors. Hole n, reaching a high density arrangement. Further, in conjunction with Figs. 4-8 to 4, a method of manufacturing one of the foregoing multi-layer metal printing stencils is further disclosed. First, as shown in Fig. 4A, reference numeral J306061, a first photoresist 120, such as a solid film or a liquid photoresist, is formed on a mother mold 110 of another stainless steel plate or a conductive plate or the like, and a photomask 13 is used. (or a negative film) exposure development is performed such that the first photoresist 12 is removed and the shape of the recess pattern exposed to the master 110 corresponds to the shape of the electroformed body 10 (as shown in FIG. 4B). In this embodiment, the first photoresist 12 includes a negative photoresist, and the opening pattern of the mask 130 is substantially the same as the micro holes 13 of the electroforming body, so that it is exposed. The part will be retained. As shown in FIG. 4b, the first photoresist 120 forms a plurality of electroformed spacers 1 2 after exposure and development, and occupies a space for pre-forming the micropores 13 and uses an exposure technique to make the The electroformed stud 121 has an enlarged end corresponding to the enlarged opening 14 of the microhole, such as an enlarged end of the arc angle. Then, as shown in FIG. 4C, a nickel metal or a nickel alloy is deposited on the master mold 11 by the principle of electroplating, and accumulated to a desired thickness to constitute the above-mentioned electric body 1〇, wherein the first surface The 11 series is attached to the female mold 11〇, and the second surface 12 is exposed. The shape of the micropores 13 is formed according to the shape of the electroformed blocks 121. Preferably, the other step includes a step of planarizing the surface such that the electroformed body 10 and the scale spacers 121 have coplanar exposed surfaces. Then, as shown in Fig. 4D, a second photoresist i 4 is formed on the electroforming main body 1 and the electric shields 121. As shown in FIG. 4E, after exposure and development, the portion of the second photoresist 140 remains as at least one mask portion/the shape corresponding to the hollow region of the metal cladding layer 2 as shown in FIG. twenty one. The secret can be directly electroplated to form the metal cap layer 2, or a very thin seed layer and then electrically bonded to the desired thickness of the metal cap layer 20. ^^ 苐4F shows a sputtering layer 3 〇 11 J306O61 on the electroformed body 10 as a seed layer by sputtering technique. Thereafter, as shown in Fig. 4G, a plating step is performed to cover the layer 20 with a metal layer. Finally, using the retracting or other peeling method, the female ± 7 has the electroforming main body 10, the metal covering layer 20', the electroformed shielding column 121 fish", the cover of the mask 卩M1 is separated from the female mold = Then, the core liquid or the conventional green lotion is combined with (4) to remove the masks i2i and the second mask portion 141, thereby obtaining a multi-layered metal printed board as shown in Fig. 3. Preferably, the ultrasonic wave can be attached. Shock _ fast wash (four) some electric prayer cover 121 and the mask part ίο., 5A ^ SC picture about the use of the multi-layer metal printing template 'can be applied to the thick film process of 3~15 〇 micron First, as shown in FIG. 5A, the above-mentioned multi-layer metal printing template (that is, the electroformed body 1 covered with the metal coating layer 20) is pressed against a substrate to be printed, wherein the electric body is 4 The __ surface 丨丨 is exposed to the substrate to be printed 21 〇 'the metal cover layer 2G is exposed. In the embodiment, the substrate to be printed 210 is an MLCC substrate or a a solar cell substrate. The conductive ink is then printed through a layered metal print stencil, such as silver. a paste, solder paste or other metal paste, or may be a non-conductive ink, the conductive ink 220 is filled in the through-holes i3B through the hollowed-out area 21. Thereafter, as shown in FIG. a metal printing template (ie, the electroforming main body 1 and the metal coating layer 20), leaving a conductive ink 22 on the substrate 22 to be printed, wherein the enlarged opening 14 can accelerate the conductive ink 2 2 Flowing and reducing the amount of residue. Finally, as shown in Fig. 5C, the conductive ink 22 is heated to sinter the inner metal particles to form a thinner and thicker patterned metal film 221. Further, in the re-coated steel sheet In the printing operation, the subsequently formed pattern 12, 13 〇 6 〇 6l metal film 221 also has good reproducibility. The exemplified 34' is only a preferred embodiment of the present invention and is not for the present invention: what form The present invention has been disclosed in its preferred embodiments, and is not intended to limit the invention, and any skilled person skilled in the art will be able to make any simple modifications, equivalent k, within the scope of the patent application. And modifications are encompassed by the present invention [Technical scope] [Simplified description of the drawing] Figure 1 is a hundred times. A multi-layer metal printing template of the present invention is placed in a partial perspective view. 2: a partial surface schematic of the multi-layer metal printing template. A schematic partial cross-sectional view of the multi-layer metal printing template. 4-8 buckle diagram: a schematic cross-sectional view of the multi-layer gold 4 printing template in the process according to an embodiment of the present invention. 5A to 5C diagram · According to the present invention A specific embodiment, using the multi-layer 4 metal stamping board in the "steel sheet printing process". [Main component symbol description] 10 electroforming main body U - surface 12 second surface
13 微孔 13A t H H H 目札型微孔 13B貫通微孔 14 擴大口 20 金屬覆蓋層 21 鏤空 110 母模 120 第一 130 光罩 140 第二 210 待印刷基材 220 導電 區 30 濺鍍層 光阻 121 電缚遮柱 光阻 141 遮罩部 油墨 221 圖案化金屬膜 1313 Micropores 13A t HHH Mesh-type micropores 13B through micropores 14 Enlargement port 20 Metal cover layer 21 Hollow 110 Master die 120 First 130 Photomask 140 Second 210 To be printed substrate 220 Conductive zone 30 Sputtered photoresist 121 Electrode-blocking photoresist 141 Masking ink 221 Patterned metal film 13