•1299304 九、發明說明： 【發明所屬之技術領域】 本發明係有關於厚膜製程之印刷技術，特別係有關於一 種金屬印刷模板。 【先前技術】 在積層陶瓷電容（Multi-layer Ceramic Capacitor， mlcc)、太陽能電池、其它積層式或薄膜型電子產品之製作 技術中，針對其内部多層金屬膜/絕緣膜之形成方式主要區 分為薄膜製程（Thin film technique)與厚膜製程（Thick film technique)。其中，薄膜製程所指者為一般的物理沉積 與化學沉積（CVD)，不但沉積速度慢且在每一次金屬膜的圖 案化成形過程均需要至少一道微影成像的步驟，成本相當 高，不適用於低成本快速量產。以往的厚膜製程則是一種製 作成本低、設備要求少的技術，主要是藉由網板印刷（screen printing)的方式，將構成有金屬顆粒 '鍵結劑與分散劑等之 導電油墨通過一網板以塗覆於一基材上，再燒結成一圖案化 金屬膜。然目前的厚膜網印的金屬膜之最小厚度僅可到達 5 0 μηι ’無法更加薄化且不均勻。此外，隨著重覆網印的次數 越多，網板之網目會伸縮產生越來越大的尺寸誤差，使得重 覆網印的再現性誤差達到10%以上。 本國專利公告第369482號「製造網版印刷模板的方法及 一含有一經塗覆網狀織物的網版印刷布」，利用塑膠細絲質 網狀織物塗以一層乳劑，其為感光性經曝光顯影之後形成為 一網版印刷布。然而網狀織物在細絲交錯疊點的厚度約是細 5 .1299304 絲直徑的兩倍，產生厚度差異。故使用該網版印刷布進行網 • 板印刷形成之導電油墨厚度會有誤差變化，影響電子產品的 • 電性效能。因此，習知的印刷網板無法兼顧薄化與均勻膜厚 之需求’同時亦存在有再現性誤差大的問題。 【發明内容】 . 本發明之主要目的係在於解決上述問題，提供一種金屬 印刷模板，其係一層材質為鎳或鎳合金之精密電鑄膜 (precision electrocasted layer)，並具有等距排列的微孔 • (mlCr〇 hole)，以取代習知的網版印刷之網狀織物（sereen)， 更具有均勻厚度，解決織物交錯疊點厚度差之問題，並提供 印刷材料（導電油墨或非導電油墨）加熱後形成之圖案化膜層 能更薄更均勻並具有良好製程再現性。 本發明之次一目的係在於提供一種金屬印刷模板，能防 止在印刷時微孔受到刮刀推力導致孔變形甚至破裂之情事。 本發明之再一目的係在於提供一種金屬印刷模板，有助 於鋼板印刷後油墨脫離模板，能減少油墨沾黏於模板之殘留 里，使扁墨受熱濕潤形成一更完整更均厚之圖案化臈層。 本毛明之另一目的係在於提供一種金屬印刷模板之使用 方法金屬印刷換板配合一乳劑，以供鋼板印刷方式形成一 圖案化膜層。 本發明的目的及解決其技術問題是採用以下技術方案來 實現的。依據本發明揭示之-種金屬印刷模板，其係為-層 鎳或錄。金之精密電鑄膜’並具有複數個等距排列的微孔， 其中該些微孔之孔深係介於3〜15G微米（_。 6 1299304 本發明的目的及解決其技術問題還可採用以下技術措施 進一步實現。 前述的金屬印刷模板，其中該些微孔之節距（pitch’或可 稱為間距）係小於1 〇〇微米（μηι)，且該些微孔之孔徑係不小 於該些微孔之節距之二分之一。 前述的金屬印刷模板，其中該些微孔係為圓柱形孔。 刚述的金屬印刷模板，其中該精密電鑄膜係具有一内表 面與一外表面，該些微孔朝向該外表面之一端係為擴大口。 前述的金屬印刷模板，其中該精密電鑄膜之該内表面係 作為印刷刮磨面。 前述的金屬印刷模板，其中該精密電鑄膜之該内表面與 該些微孔之間係形成為直角。 前述的金屬印刷模板，其中該些微孔係為交錯排列，以 使内層排列之微孔等距等角間隔有六個最鄰近之微孔。 前述的金屬印刷模板’其中該精密電鑄膜之材質係為鎳 始合金。 前述的金屬印刷模板’其中該精密電鑄膜係可捲收成 捲，以利搬儲。 前述的金屬印刷模板’另包含有乳劑，其係圖案化填充 於部分之該些微孔。 前述的金屬印刷模板，其中該乳劑係覆蓋於該外表面。 前述的金屬印刷模板’其十該些微孔係全面形成於該精 密電鑄膜而使其無留白區域。 【實施方式】 7 :1299304 在本發明之一具體實施例中，第1圖係為一種金屬印刷 模板（metal printing stencil)放大約三百倍之立體透視圖，第 • 2圖係為該金屬印刷模板之外表面之示意圖，第3圖係為該 金屬印刷模板之截面示意圖。 • 如第1、2及3圖所示，該金屬印刷模板係為一層鎳或鎳 合金之精密電鑷膜10(precision electrocasted layer)，並具有 一内表面11、一外表面12與複數個等距排列的微孔i3(micr〇 hole) ’其中該些微孔13之孔深係介於3〜15〇微米（μπι)並貫 ® 穿該内表面11與該外表面12,即該精密電鑄膜10之膜厚係 介於3〜150微米。更具體地，該些微孔13之孔深應介於5〜5〇 微米（μιη)，以供厚膜製程之薄膜鋼板印刷。其中，「内表面」 11所指為電鑄開始之起始面，「外表面丨2」所指為電鑄終止 之外露面。該精密電鑄膜1〇之材質除了可以是鎳，也可以 疋鎳錄、鎳鐵、鎳鐘、鎳鎢等鎳合金。較佳地，該精密電鑄 膜10之材質係為鎳鈷（Ni-Co)合金，較為硬質且光滑，能減 _ 少印刷時油墨之沾黏，有助於鋼板印刷之作業性。此外，較 佳地，該精密電鑄膜1〇係可捲收成捲（如笫4E圖所示），以 利搬儲。並且，該些微孔13之節距係可小於1〇〇微米（μιη)， 且該些微孔13之孔徑應不小於該些微孔13之節距之二分之 一，以高密度等距排列該些微孔13。在本實施例中，該些微 孔1 3之節距係約為80微米，該些微孔丨3之孔徑約為5〇微 米（即不小於微孔節距之二分之一），而所謂r節距」（phch) 係指微孔之中心點至微孔之中心點之長度，所謂「孔徑」係 指微孔内壁間之最大距離，所謂「等距排列」係指在該精密 8 1299304 第4 A至4E圖係關於前述的金屬印刷模板之一種製作方 法。首先，如第4A圖所示，在一不鏽鋼板其它或導電板等 之母模110上形成一感光性光阻層12〇，如固片狀乾膜或液 悲光阻，並利用一光罩13〇(或底片）進行曝光顯影，以使該 感光性光阻層120被移除且顯露至該母模11〇的圖案形狀對 應於該精密電鑄膜10。在本實施例中，該感光性光阻層12〇 係包含有負型光阻劑，該光罩13〇之開孔圖案係大致相同於 該精密電鑄膜10之該些微孔13，而被曝光的部位將可被保 留。如第4B圖所示，該感光性光阻層12〇在曝光顯影之後 形成複數個電鑄遮柱121，佔據預定形成該些微孔13之空 間，並利用曝光技術，使該些電鑄遮柱121具有對應於微孔BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printing technique for a thick film process, and more particularly to a metal printing template. [Prior Art] In the fabrication technology of multi-layer ceramic capacitors (Mcc), solar cells, other laminated or thin film electronic products, the formation method of the internal multilayer metal film/insulating film is mainly divided into thin films. Thin film technique and Thick film technique. Among them, the thin film process refers to general physical deposition and chemical deposition (CVD), which not only has a slow deposition rate but also requires at least one lithography imaging step in each patterning process of the metal film, and the cost is quite high, and is not applicable. Rapid mass production at low cost. The conventional thick film process is a technology with low manufacturing cost and low equipment requirements, mainly through a screen printing method, through which a conductive ink constituting a metal particle 'bonding agent and a dispersing agent is passed through The stencil is applied to a substrate and then sintered into a patterned metal film. However, the current thickness of the thick film screen printed metal film can only reach 50 μm, and it is not thinner and uneven. In addition, as the number of repeated screen printings increases, the mesh of the stencil will expand and contract to produce more and more dimensional errors, making the reprintability error of repeated screen printing more than 10%. National Patent Publication No. 369482 "Method for Producing Screen Printing Template and Screen Printing Cloth Containing a Coated Fabric", which is coated with a layer of emulsion using a plastic fine silk fabric, which is photosensitive developed by exposure It is then formed into a screen printing cloth. However, the thickness of the mesh fabric at the staggered cross-section of the filaments is about twice the diameter of the fine 5.129299 filaments, resulting in a difference in thickness. Therefore, the thickness of the conductive ink formed by the screen printing using the screen printing cloth may have an error variation, which affects the electrical performance of the electronic product. Therefore, the conventional printing stencil cannot satisfy the demand for thinning and uniform film thickness, and there is also a problem that reproducibility error is large. SUMMARY OF THE INVENTION The main object of the present invention is to solve the above problems, and to provide a metal printing template which is a precision electrocasted layer made of nickel or nickel alloy and has micropores arranged equidistantly. • (mlCr〇hole), in place of the conventional screen printing web (sereen), has a uniform thickness, solves the problem of fabric cross-stack thickness difference, and provides printed materials (conductive ink or non-conductive ink) The patterned film layer formed after heating can be thinner and more uniform and has good process reproducibility. A second object of the present invention is to provide a metal printing template which can prevent the micropores from being deformed or even broken by the blade thrust during printing. A further object of the present invention is to provide a metal printing template, which helps the ink to be detached from the template after the printing of the steel sheet, can reduce the adhesion of the ink to the residual of the template, and heat the wet ink to form a more complete and uniform patterning.臈 layer. Another object of the present invention is to provide a method of using a metal printing template. The metal printing plate is combined with an emulsion for forming a patterned film layer by steel plate printing. The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. A metal printing template disclosed in the present invention is a layer of nickel or recorded. The precision electroformed film of gold has a plurality of micropores arranged equidistantly, wherein the pores of the micropores are deep in the range of 3 to 15 Gm (_. 6 1299304. The object of the present invention and solving the technical problems thereof can also be adopted. The following technical measures are further achieved. The foregoing metal printing template, wherein the pitch of the micropores (pitch' or pitch) is less than 1 〇〇 micrometer (μηι), and the pore diameter of the micropores is not less than The metal printing template of the foregoing, wherein the micropores are cylindrical holes. The metal printing template just described, wherein the precision electroforming film has an inner surface and an outer surface. a surface of the microhole facing the outer surface as an enlarged opening. The metal printing template described above, wherein the inner surface of the precision electroformed film is used as a printing scraping surface. The foregoing metal printing template, wherein the precision electric The inner surface of the cast film and the micropores are formed at right angles. The metal printing template described above, wherein the micropores are staggered so that the inner layers are arranged with equidistant equiangular intervals of six Adjacent The metal printing template described above, wherein the material of the precision electroformed film is a nickel-based alloy. The metal printing template described above, wherein the precision electroformed film can be wound into a roll for storage. The aforementioned metal printing template The invention further comprises an emulsion which is patterned to fill the micropores of the portion. The metal printing template described above, wherein the emulsion covers the outer surface. The foregoing metal printing template 'the micropores are fully formed. The precision electroformed film has no white space. [Embodiment] 7:1299304 In one embodiment of the present invention, the first figure is a metal printing stencil placed about three hundred times. The perspective view of the metal print template is shown in Fig. 2, and the metal print template is shown in Fig. 3. The metal print template is shown in Figures 1, 2 and 3. It is a precision electrocasted layer of nickel or nickel alloy and has an inner surface 11, an outer surface 12 and a plurality of equidistantly arranged micropores i3 (micr〇hole) The pores of the micropores 13 are between 3 and 15 micrometers (μm) and penetrate the inner surface 11 and the outer surface 12, that is, the thickness of the precision electroformed film 10 is between 3 and 150 micrometers. More specifically, the pores of the micropores 13 should be between 5 and 5 micrometers (μm) for printing on a thick film process of the film steel sheet, wherein the "inner surface" 11 refers to the beginning of electroforming. At the beginning, the "outer surface 丨2" refers to the appearance of the electroforming finish. The material of the precision electroformed film 1 除了 can be nickel, or nickel alloy such as nickel, nickel, nickel, nickel or tungsten. Preferably, the precision electroformed film 10 is made of a nickel-cobalt (Ni-Co) alloy, which is relatively hard and smooth, and can reduce the stickiness of the ink during printing, and contributes to the workability of the steel plate printing. Further, preferably, the precision electroformed film 1 can be wound into a roll (as shown in Fig. 4E) for storage. Moreover, the pitch of the micropores 13 may be less than 1 〇〇 micron (μιη), and the pore diameter of the micropores 13 is not less than one-half of the pitch of the micropores 13, to a high density, etc. The micro holes 13 are arranged at a distance. In this embodiment, the pitch of the micropores 13 is about 80 micrometers, and the pore diameter of the micropores 3 is about 5 micrometers (that is, not less than one-half of the micropore pitch). The term "rp pitch" (phch) refers to the length from the center point of the micropore to the center point of the micropore. The so-called "aperture" refers to the maximum distance between the inner walls of the micropore. The so-called "equal arrangement" refers to the precision 8 1299304 Figures 4A through 4E are diagrams of a method of making the aforementioned metal print template. First, as shown in FIG. 4A, a photosensitive photoresist layer 12, such as a solid film or a liquid-resistance photoresist, is formed on a mother mold 110 of another stainless steel plate or a conductive plate, and a photomask is used. 13 〇 (or a negative film) is subjected to exposure development so that the photosensitive photoresist layer 120 is removed and the pattern shape revealed to the mother die 11 对应 corresponds to the precision electroformed film 10 . In this embodiment, the photosensitive photoresist layer 12 includes a negative photoresist, and the opening pattern of the mask 13 is substantially the same as the micropores 13 of the precision electroformed film 10, and The exposed area will be retained. As shown in FIG. 4B, the photosensitive photoresist layer 12 is formed into a plurality of electroformed spacers 121 after exposure and development, occupying a space in which the micropores 13 are formed, and using an exposure technique to cover the electroformed layers. Column 121 has a corresponding micropore
擴大14之上方擴大端，例如弧角擴大端。接著，如第4C 圖所示，利用電鍍的原理，將鎳金屬或鎳合金，沈積在該母 "、110上，累積到需要的厚度，即構成上述之精密電鑄膜 其中該内表面11係貼齊於該母模丨丨〇，該外表面12係 為員路狀，該些微孔13之形狀係依該些電鑄遮柱12 1之形 狀而形成。之後，如第4D圖所示，移除該些電铸遮柱121， 得到一精密電鑄膜10，其中該些微孔13朝向該外表面12 擴大 14係為顯露狀。最後，如第4E圖所示，脫離該母 模110,以取出該精密電鑄膜丨〇,可利用捲收方式收集該精 密電鑄膜1〇。 叼參考第5 A至5F圖，該金屬印刷模板之使用方法進一 '揭示如下’以能應用於厚膜製程之3〜150微米均厚薄膜之Expand the enlarged end above 14 , such as the enlarged end of the arc angle. Next, as shown in FIG. 4C, a nickel metal or a nickel alloy is deposited on the mother ", 110 by the principle of electroplating, and accumulated to a desired thickness, thereby forming the above-mentioned precision electroformed film in which the inner surface 11 The outer surface 12 is formed in a shape of a member, and the shape of the micro holes 13 is formed according to the shape of the electroformed blocks 12 1 . Thereafter, as shown in Fig. 4D, the electroformed blocks 121 are removed to obtain a precision electroformed film 10 in which the micropores 13 are enlarged toward the outer surface 12 to be revealed. Finally, as shown in Fig. 4E, the master mold 110 is detached to take out the precision electroformed film, and the fine electrodeposited film 1 can be collected by a winding method. Referring to Figures 5A to 5F, the method of using the metal printing template is further disclosed as follows: to be applied to a thick film process of 3 to 150 micron thick film.
製作。首I 无’如第5A圖所示，該精密電鑄膜1〇係置於一載 1299304 板210上，該内表面ii係接觸該載板210。之後，如第5B 圖所示，一乳劑20係塗覆於該外表面12，並使該乳劑20 係填充於該些微孔13，其中該乳劑20於該外表面12之上方 咼度應越低越好，通常是小於該精密電鑄膜1〇之厚度，又 以小於2分之1以下為較佳。當該乳劑20係為感光性，可 在塗覆之後以曝光顯影方式形成圖案，當該乳劑2〇係為非 感光性則另藉由一網板或是光阻劑之輔助使其在塗覆於該 精密電鑄膜10時同時便具有適當之圖案；如第5C圖所示， 該乳劑20在圖案化之後，能使部分之該些微孔1 3為貫通（如 第5C圖所示之貫通微孔13B)，而其餘的該些微孔η仍被 填充阻塞（如第5C圖所示之被填塞微孔13A)，並由該載板 210脫離之。在上述步驟中，該些貫通微孔13B之擴大口 14 係為裸露。因此，塗覆有圖案化乳劑2〇之該精密電縳膜i 〇 係能作為MLCC、太陽能電池與其它電子產品之厚膜製程之 鋼板印刷模板。如第5D圖所示，上述鋼板印刷模板（即塗覆 有圖案化乳劑20之精密電鑄膜10)壓貼至一待印刷基材 220 ’其中該精密電鑄膜10之該外表面12係朝向該待印刷 基材220,在表面之乳劑2〇係貼附至該待印刷基材22〇之印 刷面，並使該内表面n顯露於外。在本實施例中，該待印 刷基材220係為一 MLCC基板或是一太陽能電池基板。之 後，透過該鋼板印刷模板印刷上導電油墨23〇(或非導電油 墨），例如銀膏、錫膏或其它金屬膏，其係填滿於該些貫通 微孔13B。之後，如第5E圖所示，移除該鋼板印刷模板（即 該精密電鑄膜10與該乳劑2〇)，留下導電油墨23〇在該待印 ♦1299304 刷基材220上。最後，如第5F圖所示，加熱該導電油墨23〇 使内含金屬顆粒燒結以形成一圖案金屬膜231。由於該些微 孔13在朝向該外表面12(即朝向該待印刷基材220)之一開口 端係具有擴大口 14,有助於鋼板印刷後該導電油墨23〇脫離 該精密電鑄膜10,能減少該導電油墨23〇沾黏於該精密電鱗 膜10之微孔13Β内之殘留量，使由該導電油墨23〇形成之 该圖案化膜層23 1有著更完整一致的印刷量且厚更均勻。此 外’該導電油墨23〇之周緣間隔縮小（即相鄰微孔13之擴大 口 14邊緣至邊緣之間隔），加熱時該導電油墨〇更容易濕 潤炼合成一平坦的圖案金屬膜23 j。 以上所述，僅是本發明的較佳實施例而已，並非對本發 明作任何形式上的限制，雖然本發明已以較佳實施例揭露如 上，然而並非用以限定本發明，任何熟悉本項技術者，在不 脫離本發明之申請專利範圍内，所作的任何簡單修改、等效 随變化與修飾，皆涵蓋於本發明的技術範圍内。 【圖式簡單說明】 第1圖··本發明之一種金屬印刷模板放大約三百倍之立體透 視圖。Production. First I No As shown in Fig. 5A, the precision electroformed film 1 is placed on a 1299304 plate 210 which contacts the carrier 210. Thereafter, as shown in FIG. 5B, an emulsion 20 is applied to the outer surface 12, and the emulsion 20 is filled in the micropores 13, wherein the emulsion 20 is more above the outer surface 12. The lower the better, the smaller the thickness of the precision electroformed film, and less than one-half of the thickness. When the emulsion 20 is photosensitive, it can be patterned by exposure and development after coating, and when the emulsion 2 is non-photosensitive, it can be coated by a screen or a photoresist. At the same time, the precision electroformed film 10 has a proper pattern; as shown in FIG. 5C, after the patterning of the emulsion 20, a part of the micropores 13 can be penetrated (as shown in FIG. 5C). The micropores 13B) are passed through, and the remaining micropores η are still blocked by filling (as shown by the plugged micropores 13A shown in FIG. 5C), and are detached from the carrier 210. In the above steps, the enlarged openings 14 of the through micropores 13B are bare. Therefore, the precision electrical bonding film coated with the patterned emulsion 2 can be used as a plate printing template for a thick film process of MLCC, solar cells and other electronic products. As shown in FIG. 5D, the above-mentioned steel plate printing template (ie, the precision electroformed film 10 coated with the patterned emulsion 20) is pressed against a substrate to be printed 220', wherein the outer surface 12 of the precision electroformed film 10 is To the substrate to be printed 220, the emulsion 2 on the surface is attached to the printing surface of the substrate 22 to be printed, and the inner surface n is exposed. In this embodiment, the substrate to be printed 220 is an MLCC substrate or a solar cell substrate. Thereafter, a conductive ink 23 (or a non-conductive ink) such as a silver paste, a solder paste or another metal paste is printed through the steel plate printing stencil, which is filled in the through micropores 13B. Thereafter, as shown in Fig. 5E, the steel plate printing template (i.e., the precision electroformed film 10 and the emulsion 2) is removed, leaving a conductive ink 23 on the to-be-printed 12299304 brush substrate 220. Finally, as shown in Fig. 5F, the conductive ink 23 is heated to sinter the inner metal particles to form a patterned metal film 231. Since the micropores 13 have an enlarged opening 14 at an opening end facing the outer surface 12 (ie, toward the substrate to be printed 220), the conductive ink 23 is released from the precision electroformed film 10 after the printing of the steel sheet. The amount of residual conductive ink 23 〇 adhered to the micropores 13 该 of the precision electric scale film 10 can be reduced, so that the patterned film layer 23 1 formed by the conductive ink 23 有着 has a more complete and consistent printing amount. The thickness is more uniform. Further, the peripheral interval of the conductive ink 23 is reduced (i.e., the edge to the edge of the enlarged opening 14 of the adjacent micropores 13), and the conductive ink is more easily wet-smelted to form a flat patterned metal film 23j upon heating. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. Any simple modifications, equivalent changes, and modifications made within the scope of the present invention are included in the technical scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a three-dimensional perspective view of a metal printing template of the present invention.
••該金屬印刷模板之外表面之示意圖。 •該金屬印刷模板之截面示意圖。 -4Ε圖：依據本發明之一具體實施例，該金屬印刷模 板於一製程中之截面示意圖。 第5 Α至 .5F圖：依據本發明之一具體實施例，該金屬印刷模 板於一使用過程中之截面示意圖。 12 J 1299304 【主要元件符號說明】 10 精密電鑄膜 11 内表面 12 外表面 13 微孔 13A 被填充微孔 13B 貫通微孔 14 擴大口 20 乳劑 110 母模 120 感光性光阻層 121 電鑄遮柱 130 光罩 210 載板 220 待印刷基材 230 導電油墨 231 圖案化金屬膜 13• A schematic representation of the outer surface of the metal print template. • A schematic cross-sectional view of the metal print template. Figure 4 is a cross-sectional view of the metal printing template in a process in accordance with an embodiment of the present invention. 5th through .5F: A schematic cross-sectional view of the metal printed template in use during a process in accordance with an embodiment of the present invention. 12 J 1299304 [Description of main components] 10 Precision electroformed film 11 Inner surface 12 Outer surface 13 Micropores 13A Filled with micropores 13B Through micropores 14 Enlarged port 20 Emulsion 110 Master 120 Photosensitive photoresist layer 121 Electroformed Column 130 reticle 210 carrier plate 220 substrate to be printed 230 conductive ink 231 patterned metal film 13