TWI462641B - Device for removing film for laser induced thermal imaging - Google Patents
Device for removing film for laser induced thermal imaging Download PDFInfo
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- TWI462641B TWI462641B TW100121569A TW100121569A TWI462641B TW I462641 B TWI462641 B TW I462641B TW 100121569 A TW100121569 A TW 100121569A TW 100121569 A TW100121569 A TW 100121569A TW I462641 B TWI462641 B TW I462641B
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- thermal imaging
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- 238000001931 thermography Methods 0.000 title claims description 13
- 239000000758 substrate Substances 0.000 claims description 61
- 238000003825 pressing Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 11
- 239000010410 layer Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/40—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used characterised by the base backcoat, intermediate, or covering layers, e.g. for thermal transfer dye-donor or dye-receiver sheets; Heat, radiation filtering or absorbing means or layers; combined with other image registration layers or compositions; Special originals for reproduction by thermography
- B41M5/46—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used characterised by the base backcoat, intermediate, or covering layers, e.g. for thermal transfer dye-donor or dye-receiver sheets; Heat, radiation filtering or absorbing means or layers; combined with other image registration layers or compositions; Special originals for reproduction by thermography characterised by the light-to-heat converting means; characterised by the heat or radiation filtering or absorbing means or layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F16/00—Transfer printing apparatus
- B41F16/0006—Transfer printing apparatus for printing from an inked or preprinted foil or band
- B41F16/0093—Attachments or auxiliary devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/267—Marking of plastic artifacts, e.g. with laser
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electronic Switches (AREA)
- Laser Beam Processing (AREA)
- Electroluminescent Light Sources (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
本發明係有關於一種鐳射誘致熱成像(Laser Induced Thermal Imaging,LITI)用膜的去除裝置,尤其有關一種用於穩定去除設置於基板的鐳射誘致熱成像(LITI)用膜的裝置。The present invention relates to a device for removing a film for Laser Induced Thermal Imaging (LITI), and more particularly to a device for stably removing a film for laser induced thermal imaging (LITI) provided on a substrate.
平板顯示器中的有機電致發光顯示器具有的優點在於,無論尺寸如何,其均可作為運動圖像的顯示介質;這是因為其響應時間不超過1毫秒、功耗低,並且由於能夠自發光而具有出色的視角。此外,基於現有的半導體處理技術,能夠利用簡單的工藝在低溫條件下製造有機電致發光顯示器,因此,其作為下一代平板顯示器頗具吸引力。The organic electroluminescent display in the flat panel display has an advantage in that it can be used as a display medium for moving images regardless of the size; this is because the response time is less than 1 millisecond, the power consumption is low, and since it is self-illuminating Has an excellent viewing angle. Further, based on the existing semiconductor processing technology, an organic electroluminescence display can be manufactured under a low temperature condition by a simple process, and therefore, it is attractive as a next-generation flat panel display.
根據使用的材料和工藝,一般可以將有機電致發光顯示器分為採用濕法的聚合物型顯示器和採用沉積法的低分子量型顯示器。Depending on the materials and processes used, organic electroluminescent displays can generally be classified into a polymer type display using a wet method and a low molecular weight type display using a deposition method.
但是,在聚合物或低分子量發光層所採用的成圖法中,噴墨列印法具有的缺點在於,除發光層之外的有機層所採用的材料有限,並且噴墨列印所採用的結構必須形成在基板上。此外,採用沉積法對發光層成圖時,由於金屬掩膜的影響,難以製造大型顯示裝置。However, in the patterning method employed in the polymer or low molecular weight luminescent layer, the ink jet printing method has a disadvantage in that the organic layer other than the luminescent layer is made of a limited material and is used for ink jet printing. The structure must be formed on the substrate. Further, when the light-emitting layer is patterned by the deposition method, it is difficult to manufacture a large-sized display device due to the influence of the metal mask.
鐳射誘致熱成像(LITI)法,作為這種成圖法的可代替技術,最近才發展起來。Laser induced thermal imaging (LITI), as an alternative to this mapping method, has only recently developed.
LITI法是將光源發出的鐳射轉變成熱能,熱能依次將成圖材料轉移至靶基板,從而形成圖形。The LITI method converts the laser light emitted by the light source into heat energy, which in turn transfers the patterning material to the target substrate to form a pattern.
在LITI法中,供體薄膜覆蓋作為受體的整個基板,並且供體薄膜和基板固定於平臺上。此外,供體薄膜與基板通過層壓處理進一步相互結合,然後再進行鐳射成像,從而形成圖形。In the LITI method, a donor film covers the entire substrate as a receptor, and the donor film and substrate are fixed on a platform. Further, the donor film and the substrate are further bonded to each other by a lamination process, and then subjected to laser imaging to form a pattern.
應當注意的是上述內容僅用於理解背景技術,並非說明本領域的公知技術。It should be noted that the above is only for understanding the background art and is not a description of the art.
通常,從基板上去除供體薄膜時,會不可控地引入空氣,從而導致供體薄膜起皺並且損壞基板上已成像部分。因此,需要解決這個問題。Typically, when the donor film is removed from the substrate, air is introduced uncontrollably, causing the donor film to wrinkle and damage the imaged portion of the substrate. Therefore, we need to solve this problem.
本發明內容的一個方面在於提供一種根據輥子位置朝供體薄膜相繼噴射空氣從而將鐳射誘致熱成像用膜從基板上穩定地去除並同時調節空氣引入的裝置,從而防止了因不必要的空氣洩漏導致基板上出現缺陷。It is an aspect of the present invention to provide a device for continuously ejecting air toward a donor film according to a roller position to stably remove a laser-induced film for thermal imaging from a substrate while adjusting air introduction, thereby preventing unnecessary air leakage. This causes defects on the substrate.
根據本發明的一個方面,一種鐳射誘致熱成像用膜的去除裝置,包括:基板台,上述基板台上設置有基板;輥單元,用於壓制設置於上述基板台的供體薄膜;以及吸氣單元,設置於上述基板台並將上述供體薄膜與上述基板之間逸出的空氣去除。According to an aspect of the invention, a laser-induced film for thermal imaging film removal apparatus includes: a substrate stage on which a substrate is disposed; a roller unit for pressing a donor film disposed on the substrate stage; and an air suction The unit is disposed on the substrate stage and removes air escaping between the donor film and the substrate.
上述吸氣單元可以包括:穿過上述基板台的多個吸氣管、與上述吸氣管連通的集氣管、與上述集氣管連通的排氣管、以及與上述排氣管連通以抽吸空氣的排氣泵。The air suction unit may include: a plurality of air suction pipes passing through the substrate stage, a gas collecting pipe communicating with the air suction pipe, an exhaust pipe communicating with the gas collecting pipe, and communicating with the exhaust pipe to suck air Exhaust pump.
上述吸氣管可以圍繞上述基板設置。The suction duct may be disposed around the substrate.
上述吸氣單元可以根據上述輥單元的位置相繼抽吸空氣。The air suction unit may sequentially suck air according to the position of the roller unit.
通過下文並結合附圖對實施例的說明,本發明的上述及其它方面、特徵和優點將顯而易見。The above and other aspects, features, and advantages of the present invention will be apparent from the description of the appended claims.
下面將結合附圖詳細描述本發明的實施例。應當注意的是附圖並未按照精確比例繪製,為方便描述和清楚起見,線條厚度或元件尺寸可能被放大。此外,文中定義的術語考慮了本發明的功能,並可以根據使用人員和操作人員的習慣或意圖予以改變。因此,應根據本文所述的整個公開內容來確定術語的含義。Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the drawings are not drawn to exact scale, and the line thickness or element size may be exaggerated for convenience of description and clarity. Moreover, the terms defined herein take into account the functionality of the present invention and may vary depending on the habit or intent of the user and the operator. Therefore, the meaning of the terms should be determined in accordance with the entire disclosure as described herein.
圖1為根據本發明的示例性實施例的一種鐳射誘致熱成像(LITI)用膜的去除裝置的示意圖;圖2為根據本發明的示例性實施例的上述裝置的吸氣單元示意圖;圖3為根據本發明的示例性實施例的上述鐳射誘致熱成像(LITI)用膜的去除裝置的基板台示意圖,其中設置有基板和供體薄膜;圖4為根據本發明的示例性實施例的上述裝置的吸氣管排列示意圖。1 is a schematic view of a device for removing a film for laser induced thermal imaging (LITI) according to an exemplary embodiment of the present invention; FIG. 2 is a schematic view of a getter unit of the above device according to an exemplary embodiment of the present invention; A substrate stage schematic diagram of the above-described apparatus for removing a film for laser induced thermal imaging (LITI) according to an exemplary embodiment of the present invention, in which a substrate and a donor film are provided; FIG. 4 is the above according to an exemplary embodiment of the present invention. Schematic diagram of the suction pipe arrangement of the device.
由圖1-圖4可知,根據本發明的實施例的上述裝置1包括基板台10、輥單元20以及吸氣單元50。1 to 4, the above apparatus 1 according to an embodiment of the present invention includes a substrate stage 10, a roller unit 20, and a suction unit 50.
基板台10具有凹部,該凹部內設置有基板11和供體薄膜件12。The substrate stage 10 has a recess in which a substrate 11 and a donor film member 12 are disposed.
基板台10橫向移動,可以通過輪、導軌、長度可變的氣缸或其他各種結構來移動基板台10。The substrate stage 10 is laterally moved, and the substrate stage 10 can be moved by wheels, rails, variable length cylinders, or other various structures.
將雷射光束照射到供體薄膜件12時,供體薄膜件12的光熱轉換層將該雷射光束轉變成熱能,從而在散熱時膨脹。因此,有機層,即轉換層,也會膨脹,並與供體薄膜件12分離,從而在基板11上形成有機層。這裏,成圖材料根據鐳射的照射方向附著至基板11。When the laser beam is irradiated onto the donor film member 12, the photothermal conversion layer of the donor film member 12 converts the laser beam into thermal energy to expand upon heat dissipation. Therefore, the organic layer, that is, the conversion layer, also expands and is separated from the donor film member 12, thereby forming an organic layer on the substrate 11. Here, the patterning material is attached to the substrate 11 in accordance with the irradiation direction of the laser.
供體薄膜件12包括與激光反應的薄膜13以及連接至薄膜13邊緣的托架14。The donor film member 12 includes a film 13 that reacts with the laser and a carrier 14 that is attached to the edge of the film 13.
輥單元20壓制供體薄膜件12。輥單元20包括一對連接板21和輥子22,連接板21連接到某個結構(圖中未示出)。該對連接板21根據薄膜13的寬度彼此分開相應的距離。輥子22旋轉設置在該對連接板21之間,從而壓制薄膜13。The roller unit 20 presses the donor film member 12. The roller unit 20 includes a pair of connecting plates 21 and rollers 22 which are connected to a structure (not shown). The pair of webs 21 are separated from each other by a corresponding distance according to the width of the film 13. The roller 22 is rotatably disposed between the pair of connecting plates 21, thereby pressing the film 13.
吸氣單元50設置於基板台10並將供體薄膜件12與基板11之間逸出的空氣去除。The getter unit 50 is disposed on the substrate stage 10 and removes air escaping between the donor film member 12 and the substrate 11.
吸氣單元50包括吸氣管51、集氣管52、排氣管53以及排氣泵54。The air suction unit 50 includes an intake pipe 51, a gas collection pipe 52, an exhaust pipe 53, and an exhaust pump 54.
吸氣管51穿過基板台10。吸氣管51由多個管道構成,該管道設置於基板台10的與供體薄膜件12的薄膜13和托架14之間的部分相對應的部分。The suction pipe 51 passes through the substrate stage 10. The suction duct 51 is constituted by a plurality of ducts which are provided in a portion of the substrate stage 10 corresponding to a portion between the film 13 of the donor film member 12 and the bracket 14.
集氣管52設置於基板台10,用於與相應的吸氣管51連通。The gas collecting pipe 52 is disposed on the substrate stage 10 for communication with the corresponding suction pipe 51.
排氣管53設置於基板台10,用於與集氣管52連通。排氣管53穿過運動單元38,運動單元38設置於基板台10以便縱向運動。當運動單元38向上運動時,基板11與薄膜13之間的空氣被排出,而使基板11與薄膜13之間被排空。The exhaust pipe 53 is provided on the substrate stage 10 for communicating with the gas collecting pipe 52. The exhaust pipe 53 passes through the moving unit 38, and the moving unit 38 is disposed on the substrate stage 10 for longitudinal movement. When the moving unit 38 moves upward, the air between the substrate 11 and the film 13 is discharged, and the substrate 11 and the film 13 are evacuated.
排氣泵54連接至排氣管53。當排氣泵54被驅動時,空氣被排出,因此薄膜13和基板11所不需要的導入空氣被排出。The exhaust pump 54 is connected to the exhaust pipe 53. When the exhaust pump 54 is driven, the air is discharged, so that the introduced air which is unnecessary for the film 13 and the substrate 11 is discharged.
吸氣管51圍繞基板11設置,對基板11及薄膜13之間的導入空氣進行抽吸。The intake pipe 51 is provided around the substrate 11, and the intake air between the substrate 11 and the film 13 is sucked.
吸氣管51由多個管道構成,將該管道分成多個管組a、b、c及d,從而相繼抽吸空氣。The suction pipe 51 is composed of a plurality of pipes which are divided into a plurality of pipe groups a, b, c and d to sequentially suck air.
分組設置的吸氣管51可以根據輥單元20的位置相繼抽吸空氣。The suction ducts 51 arranged in groups may sequentially suck air according to the position of the roller unit 20.
吸氣管51分別與集氣管52連通,集氣管52與單獨的排氣管53連通,進而連接至排氣泵54,或者,集氣管52與帶有氣路換向閥的單個排氣管53連通。The suction pipes 51 are respectively connected to the gas collecting pipe 52, and the gas collecting pipe 52 is connected to the separate exhaust pipe 53, and is further connected to the exhaust pump 54, or the gas collecting pipe 52 and the single exhaust pipe 53 with the gas path switching valve. Connected.
下面將講述該鐳射誘致熱成像用膜的去除裝置的操作方法。Next, the operation method of the apparatus for removing the film for laser induced thermal imaging will be described.
當輥子22壓制薄膜13時,根據輥子22的位置,空氣被持續送入基板11與薄膜13之間,薄膜13與基板11分離。When the roller 22 presses the film 13, air is continuously fed between the substrate 11 and the film 13 in accordance with the position of the roller 22, and the film 13 is separated from the substrate 11.
此處,輥子22在對應於薄膜寬度的整個長度上壓制薄膜13,從而防止薄膜13由於氣壓過大而起皺。Here, the roller 22 presses the film 13 over the entire length corresponding to the width of the film, thereby preventing the film 13 from wrinkling due to excessive air pressure.
在持續將空氣送入基板11與薄膜13之間的過程中,一部分空氣被送入基板11與薄膜13之間的輥子22未經過的區域。In the process of continuously feeding air between the substrate 11 and the film 13, a part of the air is sent into a region where the roller 22 between the substrate 11 and the film 13 does not pass.
此處,驅動排氣泵54時,洩漏到不必要位置處的空氣通過吸氣管51、集氣管52和排氣管53排出。Here, when the exhaust pump 54 is driven, air leaking to an unnecessary position is discharged through the intake pipe 51, the header pipe 52, and the exhaust pipe 53.
即,當輥子22經過a組的吸氣管51時,通過b、c和d組的排氣管51抽吸薄膜13與基板11之間洩漏的空氣。That is, when the roller 22 passes through the suction pipes 51 of the group a, the air leaked between the film 13 and the substrate 11 is sucked by the exhaust pipes 51 of the groups b, c, and d.
然後,隨著基板台10的移動,當輥子22經過b組的吸氣管51時,通過c組和d組的吸氣管51抽吸薄膜13與基板11之間洩漏的空氣。Then, as the substrate stage 10 moves, when the roller 22 passes through the suction pipes 51 of the b group, the air leaked between the film 13 and the substrate 11 is sucked by the suction pipes 51 of the groups c and d.
此外,隨著基板台10的移動,當輥子22經過c組的吸氣管51時,通過d組的吸氣管51抽吸薄膜13與基板11之間洩漏的空氣。Further, as the substrate stage 10 moves, when the roller 22 passes through the group c suction pipe 51, the air leaked between the film 13 and the substrate 11 is sucked by the group d suction pipe 51.
同樣,根據這些實施例,該鐳射誘致熱成像用膜的去除裝置可以通過吸氣單元排出洩漏的空氣,從而防止薄膜因空氣洩漏而受損。Also, according to these embodiments, the laser-induced film for thermal imaging film removal device can discharge the leaked air through the suction unit, thereby preventing the film from being damaged by air leakage.
儘管本發明中已經講述了一些實施例,但應明白的是,這些實施例僅用於說明,而非限制本發明的範圍,並且在不背離本發明的精神的前提下,本領域的技術人員可以進行各種修改、變化和改變,本發明的精神及範圍僅由所附申請專利範圍予以限定。Although a few embodiments have been described in the present invention, it should be understood that these embodiments are intended to be illustrative only, and not to limit the scope of the invention Various modifications, changes and variations are possible, and the spirit and scope of the invention is limited only by the scope of the appended claims.
1...裝置1. . . Device
10...基板台10. . . Substrate table
11...基板11. . . Substrate
12...供體薄膜件12. . . Donor film
13...薄膜13. . . film
14...托架14. . . bracket
20...輥單元20. . . Roller unit
21...連接板twenty one. . . Connection plate
22...輥子twenty two. . . Roller
38...運動單元38. . . Motion unit
50...吸氣單元50. . . Suction unit
51...吸氣管51. . . Suction pipe
52...集氣管52. . . Gas collection tube
53...排氣管53. . . exhaust pipe
54...排氣泵54. . . Exhaust pump
圖1為根據本發明的示例性實施例的一種鐳射誘致熱成像(LITI)用膜的去除裝置的示意圖;1 is a schematic view of a device for removing a film for laser induced thermal imaging (LITI) according to an exemplary embodiment of the present invention;
圖2為根據本發明的示例性實施例的上述裝置的吸氣單元示意圖;2 is a schematic view of a getter unit of the above apparatus according to an exemplary embodiment of the present invention;
圖3為根據本發明的示例性實施例的上述鐳射誘致熱成像(LITI)用膜的去除裝置的基板台示意圖,其中設置有基板和供體薄膜;以及3 is a schematic diagram of a substrate stage of the above-described apparatus for removing a film for laser induced thermal imaging (LITI), in which a substrate and a donor film are disposed, according to an exemplary embodiment of the present invention;
圖4為根據本發明的示例性實施例的上述裝置的吸氣管排列示意圖。4 is a schematic view showing an arrangement of intake pipes of the above apparatus according to an exemplary embodiment of the present invention.
1...裝置1. . . Device
10...基板台10. . . Substrate table
11...基板11. . . Substrate
12...供體薄膜件12. . . Donor film
13...薄膜13. . . film
14...托架14. . . bracket
20...輥單元20. . . Roller unit
21...連接板twenty one. . . Connection plate
22...輥子twenty two. . . Roller
Claims (4)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100062732A KR101182171B1 (en) | 2010-06-30 | 2010-06-30 | Device of removing film for laser induced thermal imaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201204173A TW201204173A (en) | 2012-01-16 |
| TWI462641B true TWI462641B (en) | 2014-11-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100121569A TWI462641B (en) | 2010-06-30 | 2011-06-21 | Device for removing film for laser induced thermal imaging |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101182171B1 (en) |
| CN (1) | CN102332537B (en) |
| TW (1) | TWI462641B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200407202A (en) * | 2002-09-05 | 2004-05-16 | Samsung Corning Prec Glass Co | Apparatus and method for removing film of glass substrate |
| US20060081332A1 (en) * | 2004-10-20 | 2006-04-20 | Kang Tae-Min | Laser induced thermal imaging (LITI) apparatus |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100218269B1 (en) * | 1996-05-30 | 1999-09-01 | 윤종용 | Apparatus and method for removing residual gas in dry etcher |
| JP4910255B2 (en) | 2001-07-09 | 2012-04-04 | 大日本印刷株式会社 | Laser transfer color film manufacturing method, laser transfer method and apparatus |
| KR20050022207A (en) * | 2003-08-25 | 2005-03-07 | 주식회사 한국니코스 | Decoration board for building decoration and its manufacturing method |
| KR100959111B1 (en) | 2008-03-27 | 2010-05-25 | 삼성모바일디스플레이주식회사 | Manufacturing apparatus and manufacturing method of organic light emitting device |
| CN201311920Y (en) * | 2008-12-09 | 2009-09-16 | 北京有色金属研究总院 | Wafer surface oxide film removing device |
-
2010
- 2010-06-30 KR KR1020100062732A patent/KR101182171B1/en not_active Expired - Fee Related
-
2011
- 2011-06-21 TW TW100121569A patent/TWI462641B/en not_active IP Right Cessation
- 2011-06-28 CN CN201110176825.5A patent/CN102332537B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200407202A (en) * | 2002-09-05 | 2004-05-16 | Samsung Corning Prec Glass Co | Apparatus and method for removing film of glass substrate |
| US20060081332A1 (en) * | 2004-10-20 | 2006-04-20 | Kang Tae-Min | Laser induced thermal imaging (LITI) apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102332537B (en) | 2014-11-19 |
| KR101182171B1 (en) | 2012-09-12 |
| CN102332537A (en) | 2012-01-25 |
| KR20120002049A (en) | 2012-01-05 |
| TW201204173A (en) | 2012-01-16 |
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