TWI462351B - Led light module and manufacturing method thereof - Google Patents

Description

Light-emitting diode light-emitting module and manufacturing method thereof

The invention relates to a light emitting diode light emitting module and a manufacturing method thereof.

Many electronic products are currently composed of electronic components mounted on a printed circuit board. Electronic product design tends to be thin and light, and the size of internal printed circuit boards or electronic components needs to be relatively reduced. Because the size of the electronic components is too small to be soldered to the printed circuit board manually. At present, the solder paste is printed on a predetermined position on the printed circuit board by a solder paste printing machine, and then the electronic component is taken by the plug-in dressing machine and inserted into the printed circuit board. In order to ensure the accuracy of the insertion, the visual system is equipped with a vision system to assist the positioning. Finally, the solder is heated by a reflow oven to melt the solder to fix the electronic components.

The reflow process described above is currently the most commonly used method of mass-applying electronic components to a circuit board. However, because the reflow process needs to heat the entire electronic module, even if the temperature of the reflow process is not high, for some electronic modules, the electronic module may be damaged or deformed, or the electronic module may be Design creates limits.

In view of the above problems, it is necessary to design an improved manufacturing process for these electronic modules that are not suitable for the reflow process.

Accordingly, it is an object of the present invention to provide a light-emitting diode light-emitting module that does not use a reflow process and a method of fabricating the same, thereby solving the above problems.

According to the above object, a method for manufacturing a light-emitting diode light-emitting module without using a reflow process is provided, which basically consists of the following steps. A module substrate is provided having a thermally conductive substrate. The bare die of the integrated circuit and the bare die of the LED are sequentially crystallized and wired on the module substrate. The bare die of the driving integrated circuit is sealed on the module substrate together with the bare die of the LED.

According to an embodiment of the invention, the thermally conductive substrate comprises an aluminum substrate, a copper substrate or a ceramic substrate.

According to another embodiment of the present invention, the bare die of the driving integrated circuit is a linear constant current driving circuit.

According to another embodiment of the present invention, the module substrate further includes an insulating layer, a copper foil layer, a solder resist paint, and a high-rise layer. The insulating layer covers the thermally conductive substrate. The copper foil layer covers the insulating layer. The solder mask is covered on the copper foil layer. The high-rise layer is covered on the solder resist paint, wherein the upper layer has a plurality of recessed exposed copper foil layers, so as to drive the bare crystal grains of the integrated circuit and the bare crystal grains of the light-emitting diode to be fixed and lined in the recesses.

According to another embodiment of the present invention, the manufacturing method further includes mounting an optical lens on the bare die of the light emitting diode.

In accordance with the above objects, a light-emitting diode lighting module that does not use a reflow process is provided, which basically consists of the following components. A module substrate has a thermally conductive substrate. The bare LEDs of the plurality of LEDs are connected to the module substrate by gold wires. The bare die of the complex drive integrated circuit is connected to the module substrate by a gold wire. An adhesive material encapsulates the bare die of the LED and the bare die of the driving integrated circuit on the module substrate.

According to an embodiment of the invention, the thermally conductive substrate comprises an aluminum substrate, a copper substrate or a ceramic substrate.

According to another embodiment of the present invention, the bare die of the driving integrated circuit is a linear constant current driving circuit.

According to another embodiment of the present invention, the module substrate further includes an insulating layer, a copper foil layer, a solder resist paint, and a high-rise layer. The insulating layer covers the thermally conductive substrate. The copper foil layer covers the insulating layer. The solder mask is covered on the copper foil layer. The high-rise layer is covered on the solder resist paint, wherein the upper layer has a plurality of recessed exposed copper foil layers, so as to drive the integrated circuit and the bare die of the light-emitting diode to solidify and wire in the recesses.

According to another embodiment of the invention, the LED module further includes an optical lens on the bare die of the LED.

The invention provides a light-emitting diode light source module without using a reflow soldering process and a manufacturing method thereof. Since the light-emitting diode light source module is partially deformed or damaged by the heating of the reflow process, the use of the reflow process can improve the manufacturing yield of the light-emitting diode light source module and the design of the process. Can be more flexible. Please refer to the following examples and descriptions to understand the details of the present invention.

Please refer to FIG. 1 , which illustrates a light emitting diode light source module according to an embodiment of the invention. The light-emitting diode light source module 100 directly encapsulates the bare die of the light-emitting diode and the driving integrated circuit on the module substrate 100a, thereby eliminating the reflow process. The integrated circuit is driven to convert the external power source into a power source capable of driving the light emitting diode. In this embodiment, the driving integrated circuit may be different types of driving circuits, but the linear constant current driving circuit is convenient in practice, and the use of the linear constant current driving circuit does not require the addition of passive components (such as inductors or capacitors). ), it is easier to achieve the purpose of eliminating the reflow process. For example, the bare die of the light emitting diode can be crystallized, wired, and encapsulated in the package region 102a, and the bare die of the driving die can be crystallized, wired, and encapsulated in the package region 102b. The advantage of this method is that the bare die of the LED and the driving chip do not need to be “first packaged on the lead frame and then fixed on the module substrate 100a by a reflow process”, thereby avoiding the “reflow process”. Disadvantages also save the cost of "the bare die of the light-emitting diode and the driver chip are first packaged on the lead frame". The light-emitting diode light source module does not need to be assembled to any circuit board, and the light-emitting diode packaged therein can be illuminated as long as the commercial power is supplied.

As is well known, one of the functions of the wafer structure is to protect the wafer from various external factors (such as external force, water, moisture, chemical damage or corrosion), and another function is to construct a complete current path. To provide current to drive the circuit operation of the wafer. For the above two functions, "constructed on the lead frame" or "constructed on the module substrate of the present invention" can achieve the desired purpose.

Please refer to Fig. 2, which is a cross-sectional view taken along line 2-2' of Fig. 1. In this figure, only one exposed die of a light-emitting diode and a package profile of a bare die of a driving die are drawn. The LED die 108a is packaged in a recess 114a of the module substrate, and the driver die die 108b is packaged in another recess 114b of the module substrate.

The composition of the module substrate includes a thermally conductive substrate 101, an insulating layer 103, a copper foil layer 105, a solder resist 107, and a raised layer 109 (from bottom to top). The heat conducting base plate 101 can be an aluminum bottom plate, a copper bottom plate or a ceramic bottom plate, thereby increasing the heat dissipation area of the light emitting diode light source module. The copper foil layer 105 is used to form a current path of the light emitting diode light source module, thereby providing current to drive the circuit operation of the wafer. The insulating layer 103 is interposed between the copper foil layer 105 and the thermally conductive substrate 101, thereby electrically blocking both. The solder resist 107 is placed on the copper foil layer 105 to protect the copper foil layer 105. The recesses 114a and 114b are formed on the opaque upper layer 109. The sidewalls of the recesses 114a and 114b have a reflective function, thereby improving the overall light-emitting efficiency of the light source module.

The LED die 108a is solidified on the copper foil layer 105 in the recess 114a by the die bonding glue 106, and drives the integrated circuit bare die 108b to be solidified in the copper foil layer in the recess 114b by the die bonding glue 106. At 105, the two are respectively connected to the copper foil layer 105 by a gold wire 113. Finally, the LED die 108a and the driver integrated circuit die 108b are respectively encapsulated in the recess 114a/114b with the encapsulant 110. In the LED die 108a, the optical lens 112 can be added at the same time as the package, thereby increasing the luminous flux and the light extraction rate of the light source.

Another function of the wafer structure is to "effectively remove the thermal energy generated by the internal wafer circuit during operation". In the case of the light-emitting diode light source module, the bare die is directly encapsulated in the recess of the module substrate, and the heat generated by the bare die is transmitted to the heat-conductive substrate 101 in the shortest path, and the heat is quickly dissipated by the large-area bottom surface. The heat dissipation effect of the design in this embodiment is better than that of the conventional "first packaged on the lead frame and then soldered to the circuit substrate", whether it is the light emitting diode bare die 108a or the driving integrated circuit bare die 108b. . If the integrated circuit is "packaged in the lead frame and then soldered to the circuit substrate", even if the thermal conductivity of the package material is good, the heat transfer path is always lengthened, so the heat dissipation performance is deteriorated. Therefore, for the high-power light-emitting diode, the design of the embodiment contributes to the heat dissipation of the light-emitting diode, so that the service life of the light-emitting diode can be effectively lengthened.

Please refer to FIG. 3, which is a flow chart of a method 300 for fabricating a light-emitting diode light-emitting module using a reflow process in accordance with the present invention. In step 302, a module substrate is first provided. The preferred substrate is a module substrate having a good heat dissipation design (for example, a module substrate having an aluminum substrate, a copper substrate, or a ceramic substrate). In step 304, the bare die of the integrated circuit and the bare die of the LED are directly crystallized and wired on the module substrate. This method does not package the die on the lead frame, so no reflow is required. The structure of the process welding die. In the final step 306, the bare die of the integrated circuit and the bare die of the LED are mounted on the module substrate. The copper foil layer forms a current path on the module substrate, so a structure like a lead frame is not required. The light-emitting diode light source module does not need to be assembled to any circuit board, and the light-emitting diode packaged therein can be operated as long as the utility power is supplied.

It can be seen from the above embodiments of the present invention that the LED light source module and the manufacturing method thereof of the present invention can avoid the use of a "reflow process" on the light emitting diode light source module. For the heat dissipation performance of the light-emitting diode, the light-emitting diode light source module of the present invention is also superior to the design that the light-emitting diode is first packaged in the lead frame and then soldered to the circuit substrate.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

100‧‧‧Lighting diode light source module

100a‧‧‧Module substrate

102a‧‧‧Packing area

102b‧‧‧Packing area

101‧‧‧ Thermal base plate

103‧‧‧Insulation

105‧‧‧copper layer

106‧‧‧solid glue

107‧‧‧Anti-welding paint

108a‧‧‧Lighting diode bare die

108b‧‧‧Drive integrated circuit bare die

109‧‧‧

110‧‧‧ Sealing material

112‧‧‧ optical lens

113‧‧‧ Gold wire

114a‧‧‧ dent

114b‧‧‧ dent

300‧‧‧Manufacture method

302-306‧‧‧Steps

The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; group.

Fig. 2 is a cross-sectional view taken along line 2-2' of Fig. 1.

3 is a flow chart showing a method of manufacturing a light-emitting diode light-emitting module using a reflow process according to the present invention.

300. . . Production method

302-306. . . step

Claims (10)

A light-emitting diode light-emitting module includes: a module substrate having a first recess and a second recess separated from each other; a bare die of the light-emitting diode, fixed in the first recess, and electrically Connected to the module substrate; a driving integrated circuit bare die, fixed in the second recess, and electrically connected to the module substrate; a first sealing material covering the bare die of the light emitting diode And a second sealing material covering the bare die of the driving integrated circuit and separated from the first sealing material. The illuminating diode lighting module of claim 1, wherein the module substrate comprises an aluminum bottom plate, a copper bottom plate or a ceramic bottom plate. The illuminating diode illuminating module of claim 1, wherein the module substrate comprises a thermally conductive bottom plate and a raised upper layer on the thermally conductive bottom plate, wherein the first recess and the second recess are located in the elevated layer . The LED module of claim 1, wherein the module substrate comprises a thermally conductive substrate, a copper foil layer, and an insulating layer between the thermally conductive substrate and the copper foil layer. The light-emitting diode light-emitting module of claim 4, wherein the light-emitting diode bare die or the driver integrated circuit bare die is connected to the copper foil layer. The illuminating diode lighting module of claim 1, wherein the bare die of the driving integrated circuit comprises a linear constant current driving circuit. The light-emitting diode lighting module of claim 1, further comprising an optical lens on the bare die of the light-emitting diode. The illuminating diode lighting module of claim 7, wherein the optical lens does not cover the bare die of the driving integrated circuit. The illuminating diode lighting module of claim 1, wherein the first recess comprises a reflective sidewall. The light-emitting diode light-emitting module of claim 1 , wherein the bare die of the light-emitting diode or the bare die of the driving integrated circuit is connected to the module substrate through a gold wire.