CN201167092Y - Packaging structure of light emitting diode - Google Patents

Abstract

A package structure of a light emitting diode, the package structure at least comprising: the LED chip comprises a first ceramic substrate, a second ceramic substrate, at least one LED chip and a connector. The second ceramic substrate is arranged on the first ceramic substrate and is provided with at least one groove. The LED chips are arranged in the groove in a one-to-one mode. The connector is placed on the first ceramic substrate and electrically connected with the light-emitting diode chip, so that the light-emitting diode chip can be electrically connected to other electronic components. In addition, the first ceramic substrate and the second ceramic substrate are bonded using Low Temperature Co-fired ceramic technology (Low Temperature Co-fired Ceramics).

Description

Packaging Structure of Light Emitting Diodes

technical field

The utility model relates to a package structure of a light-emitting diode, in particular to a package structure of a light-emitting diode packaged on a ceramic substrate.

Background technique

With the advancement of technology and economy, people have higher and higher requirements for displays, so many displays start to use light-emitting diodes as light sources to meet people's needs. In the prior art, the diode bare chip is packaged into a package structure, and then the package structure is soldered on a printed circuit board, so that the diode bare chip is electrically connected to other peripheral circuits. However, this packaging structure will occupy a large area of the printed circuit board, crowding out the placement space of other components, and when soldering the packaging structure, the packaging structure usually cannot be accurately soldered in the graphic footprint of the printed circuit board. .

Contents of the invention

The technical problem to be solved by the utility model is to provide a packaging structure of light-emitting diodes, which can be directly used as a light source module without being soldered on a printed circuit board, thus occupying less area.

According to an embodiment of the present invention, the packaging structure of the light emitting diode at least includes a first ceramic substrate, a second ceramic substrate, at least one light emitting diode chip and a connector. The second ceramic substrate is placed on the first ceramic substrate, and the second ceramic substrate has at least one groove, and the LED chips are placed in the groove in a one-to-one manner. The connector is placed on the first ceramic substrate and electrically connected with the LED chip.

According to the above-mentioned embodiment, the bottom of the first ceramic substrate is covered with copper foil to increase the heat dissipation effect.

According to the above-mentioned embodiment, the packaging structure of the above-mentioned light-emitting diodes further includes at least one encapsulant, and these encapsulants cover the light-emitting diode chips in a one-to-one manner.

According to the above-mentioned embodiment, the above-mentioned first ceramic substrate and the second ceramic substrate are bonded by using low temperature co-fired ceramics technology (Low Temperature Co-fired Ceramics).

According to another embodiment of the present utility model, the above-mentioned first ceramic substrate and the second ceramic substrate are integrally formed.

In the utility model, the chip is packaged on the ceramic substrate, and then the connector is used to electrically connect the peripheral components. The manufacturing process of the light source module saves the space occupied by the existing package structure bracket and minimizes the volume. Furthermore, since the thermal expansion coefficients of the ceramic and the chip are very close, the package structure will not be adversely affected even in the case of drastic temperature changes.

The utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the utility model.

Description of drawings

FIG. 1 is a top view of a light-emitting diode packaging structure according to a first embodiment of the present invention;

Fig. 2 is a cross-sectional view of the A-A' structure of Fig. 1 .

Fig. 3 is a top view of the light emitting diode packaging structure of the second embodiment of the present invention;

Fig. 4 is a cross-sectional view of the B-B' structure of Fig. 3 .

FIG. 5 is a structural schematic diagram of a light emitting diode packaging structure according to a third embodiment of the present invention;

Fig. 6 is a cross-sectional view of the C-C' structure of Fig. 5 .

Among them, reference signs

100: Package structure 102: Ceramic substrate

104: LED chip 106: Connector

108: Wire 110: Groove

200: Encapsulation structure 112: Sealant

300: package structure 302a: ceramic substrate

302b: ceramic substrate 304: light emitting diode chip

306: Connector 308: Wire

310: Groove

Detailed ways

Please refer to FIG. 1 and FIG. 2 at the same time. FIG. 1 is a top view of a light-emitting diode packaging structure 100 according to the first embodiment of the present invention, and FIG. 2 is a cross-sectional view of the A-A' structure of the figure. The packaging structure 100 at least includes: a ceramic substrate 102 , an LED chip 104 and a connector 106 . The ceramic substrate 102 has a groove 110 , and the LED chips 104 are placed in the groove 110 in a one-to-one manner. The connector 106 is placed on the ceramic substrate 102 and is electrically connected to the LED chip 104 by a plurality of wires 108 . The connector 106 is used to electrically connect the package structure 100 with other peripheral electronic components.

In this embodiment, the chip is packaged on the ceramic substrate, and the advantages of using the connector to electrically connect the peripheral components are: the accuracy of the die bonding is high, which is beneficial to the design of the secondary optics, and the packaging and the bonding are completed at the same time. The manufacturing process of the light source module can be simplified, the space occupied by the support of the existing packaging structure can be saved, and the volume can be minimized. Furthermore, since the thermal expansion coefficients of the ceramic and the chip are very close, the packaging structure 100 will not be adversely affected even in the case of drastic temperature changes.

In addition, the bottom of the ceramic substrate 102 can be covered with copper foil, and the heat dissipation component can use the copper foil to connect with the ceramic substrate 102 to increase the heat dissipation capability of the package structure 100 .

Please refer to FIG. 3 and FIG. 4 at the same time. FIG. 3 is a top view of a light emitting diode packaging structure 200 according to the second embodiment of the present invention, and FIG. 4 is a cross-sectional view of the B-B' structure in FIG. 3 . The package structure 200 is similar to the package structure 100 , but the difference is that the package structure 200 further includes the encapsulant 112 . The encapsulant 112 is filled in the groove 110 in a one-to-one manner to increase the brightness of the LED chip 104 .

Please refer to FIG. 5 and FIG. 6 at the same time. FIG. 5 is a schematic structural diagram of a light emitting diode packaging structure 300 according to a third embodiment of the present invention, and FIG. 6 is a cross-sectional view of the C-C' structure in FIG. 5 . The packaging structure 300 is similar to the packaging structure 100 , and the LED packaging structure 300 at least includes: a ceramic substrate 302 a , a ceramic substrate 302 b , a LED chip 304 and a connector 306 . The ceramic substrate 302b is placed on the ceramic substrate 302a and has a groove 310, and the LED chips 304 are placed in the groove 310 in a one-to-one manner. The connector 306 is placed on the ceramic substrate 302 a and is electrically connected to the LED chip 304 by a plurality of wires 308 . The connector 306 is used to electrically connect the LED chip 304 with other electronic components.

The advantages of the package structure 300 are similar to those of the package structure 100, but in this embodiment, the groove 310 is formed on the ceramic substrate 302b, and then the ceramic substrates 302a and 302b are bonded using low temperature co-fired ceramics technology (Low Temperature Co-firedCeramics), In this way, the manufacturing process of the packaging structure can be simplified.

Of course, the utility model can also have other various embodiments, and those skilled in the art can make various corresponding changes and deformations according to the utility model without departing from the spirit and essence of the utility model, but These corresponding changes and deformations should all belong to the protection scope of the appended claims of the present utility model.

Claims (5)

1, a kind of encapsulating structure of light-emitting diode is characterized in that, comprises at least:

One first ceramic substrate;

One second ceramic substrate places on this first ceramic substrate, and wherein this second ceramic substrate has at least one groove:

At least one light-emitting diode chip for backlight unit, wherein this at least one light-emitting diode chip for backlight unit places in those grooves in man-to-man mode; And

A connector is put on this first ceramic substrate and is electrically connected with those light-emitting diode chip for backlight unit.

2, the encapsulating structure of light-emitting diode according to claim 1 is characterized in that, this first ceramic substrate has several surfaces, and this second ceramic substrate is positioned on one of those surfaces, and those surfaces all the other one of be covered with Copper Foil.

3, the encapsulating structure of light-emitting diode according to claim 1 is characterized in that, also comprises several adhesive bodies, and wherein those adhesive bodies cover those light-emitting diode chip for backlight unit in man-to-man mode.

4, the encapsulating structure of light-emitting diode according to claim 1 is characterized in that, this first ceramic substrate links to each other for utilizing LTCC Technology to engage with this second ceramic substrate.

5, the encapsulating structure of light-emitting diode according to claim 1 is characterized in that, this first ceramic substrate and this second ceramic substrate are one of the forming.

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