CN203553161U - Upside-down mounting LED lamp strip - Google Patents

Abstract

The utility model discloses an inverted LED lamp bar, which comprises: a glass circuit board, at least one LED chip and a protective layer, wherein the bottom of each LED chip is provided with an N-type electrode and a P-type electrode, and the N-type electrode and P-type electrodes are respectively connected to one side of the glass circuit board, and the protective layer is wrapped on the LED chip. The utility model makes full use of the LED light source to achieve all-round light; the glass circuit board has high heat resistance, high temperature resistance and heat dissipation performance, and prolongs the service life of the LED light bar to a certain extent.

Description

An inverted LED light bar

technical field

The utility model relates to the field of LEDs, in particular to an inverted LED lamp bar.

Background technique

Due to the high power density of LED chips in existing LED light bars, designers and manufacturers of LED chip devices must optimize the heat dissipation system in terms of structure and materials.

With the gradual development of high-power LED chips, the technology for effectively discharging the heat generated in LED chips has also been developed. In order to improve the heat dissipation efficiency of LED chips, LED chips are usually packaged on a substrate. The substrate is usually made of metal material, and the electrical connection between the LED chip and the substrate is realized through wire bonding.

However, since the insulating layer formed on the metal substrate has poor thermal conductivity, the problem of low thermal conductivity cannot be avoided even if a metal substrate is used. Moreover, most of the current circuit boards of the LED light bar are PCB circuit boards, which do not have light transmission. It is impossible to make the LED package emit light in all directions.

Therefore, if the heat dissipation of the LED chip cannot be realized normally, the LED chip as a semiconductor component will have a yellowing phenomenon due to a change in the heat dissipation wavelength, or the light emission efficiency will be reduced, and when operating at a high temperature, the LED package The lifespan of the LED chip may be shortened, so improving the heat dissipation structure of the LED chip is the core of the packaging structure and process.

Utility model content

The purpose of the utility model is to provide an upside-down LED light bar, which can realize all-round lighting of LEDs.

In order to achieve the above object, the utility model adopts the following technical solutions:

A flip-chip LED light bar, which includes: a glass circuit board, at least one LED chip and a protective layer, wherein the bottom of each LED chip is provided with an N-type electrode and a P-type electrode, and the N-type electrode and the P-type electrode They are respectively connected to one side of the glass circuit board, and the protective layer is wrapped on the LED chip.

Preferably, the LED light bar further includes a phosphor layer, and the phosphor layer is disposed between each LED chip and the protective layer.

Preferably, the N-type electrode and the P-type electrode are respectively connected to one side of the glass circuit board through solder connection, eutectic connection or crystal bonding connection.

Preferably, the LED light bar further includes a phosphor layer, and the phosphor layer is provided on the other surface of the glass circuit board.

Preferably, a glass protection plate is further provided on the top surface of the LED light bar, and the protection layer is filled in the gap between the glass circuit board and the glass protection plate.

Preferably, the LED light bar further includes a phosphor layer, and the phosphor layer is respectively provided on the surface of the glass circuit board and the glass protection plate facing away from the LED chips.

The utility model adopts the above technical scheme, by directly packaging the LED chip on the glass circuit board, compared with the original LED chip, which needs to be packaged on the metal substrate first, and then packaged on the PCB circuit board, which saves process steps and costs , and can achieve all-round light emission of the LED chip, which improves the brightness of the LED chip; in addition, the glass circuit board has high heat resistance and high temperature resistance, which prolongs the service life of the LED light bar to a certain extent. At the same time, the glass circuit board Also has better heat dissipation performance.

Description of drawings

Fig. 1 is the structural representation of the utility model embodiment one;

Fig. 2 is the structural representation of the second embodiment of the utility model;

Fig. 3 is the structural representation of the utility model embodiment three;

Fig. 4 is a schematic structural diagram of Embodiment 4 of the present utility model.

Detailed ways

In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model.

As shown in Figure 1, the utility model provides a flip-chip LED light bar, which includes: a glass circuit board 1; an LED chip 2 arranged on one side of the glass circuit board 1, wherein the bottom of the LED chip 2 is provided with a N A type electrode 21 and a P type electrode 22, the N type electrode 21 and the P type electrode 22 are respectively fixed on one side of the glass circuit board 1 by solder 3; protective layer 4: the protective layer 4 is wrapped on the LED chip 2; Phosphor powder layer 6 , the phosphor powder layer 6 is arranged between the LED chip 2 and the protection layer 4 . The N-type electrode 21 and the P-type electrode 22 in the present invention can also be connected to one side of the glass circuit board 1 through eutectic connection or crystal-bonding connection respectively.

Embodiment two:

As shown in Figure 2, different from the first embodiment, the LED light bar of the second embodiment is also equipped with a glass protective plate 8 on the top of the LED light bar, and the protective layer 4 is filled in the glass circuit board 1 and the glass The gap between the glass protection plates 8.

Embodiment three:

As shown in FIG. 3 , different from the first embodiment, the phosphor layer 6 in the third embodiment is disposed on the surface of the glass circuit board 5 facing away from the flip-chip LED chip.

Embodiment four:

As shown in Figure 4, different from the first embodiment, the LED light bar in the fourth embodiment is also provided with a glass protective plate 8 on the top of the LED light bar, and the protective layer 4 is filled in the glass circuit board 1 and the At the gap between the glass protection plates 8 , the phosphor layer 6 is disposed on the surface of the glass circuit board 1 and the glass protection plate 8 facing away from the flip-chip LED chip.

The utility model realizes the all-round light emission of the inverted LED chip by adopting the glass circuit board 1 and the glass protection plate 8, and improves the brightness of the inverted LED chip; in addition, the glass circuit board 1 has higher heat resistance and High temperature resistance prolongs the service life of the LED light bar to a certain extent.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present utility model shall be included in this utility model. within the scope of protection of utility models.

Claims (6)

1. the LED lamp bar of a upside-down mounting; it is characterized in that; comprise: glass wiring board; at least one LED chip and protective layer; wherein the bottom of each LED chip is provided with N-type electrode and P type electrode; described N-type electrode is connected with the one side of glass wiring board respectively with P type electrode, and described protective layer is wrapped on LED chip.

2. LED lamp bar according to claim 1, is characterized in that: described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located between LED chip and protective layer.

3. LED lamp bar according to claim 1, is characterized in that: described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located on the another side of glass wiring board.

4. LED lamp bar according to claim 1, is characterized in that: described N-type electrode and P type electrode respectively by scolder be connected, eutectic connects or die bond connects and is connected with the one side of glass wiring board.

5. LED lamp bar according to claim 1, is characterized in that: the end face of described LED lamp bar is also provided with protector plate for glass, and described protective layer is filled in the place, gap between glass wiring board and protector plate for glass.

6. LED lamp bar according to claim 5, is characterized in that: described LED lamp bar also comprises phosphor powder layer, and described phosphor powder layer is located at respectively glass wiring board and protector plate for glass on the face of LED chip.

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