TWI441786B - - Google Patents
Info
- Publication number
- TWI441786B TWI441786B TW98122542A TW98122542A TWI441786B TW I441786 B TWI441786 B TW I441786B TW 98122542 A TW98122542 A TW 98122542A TW 98122542 A TW98122542 A TW 98122542A TW I441786 B TWI441786 B TW I441786B
- Authority
- TW
- Taiwan
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008187858A JP5256554B2 (en) | 2008-07-18 | 2008-07-18 | LCD panel cleaving device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201004879A TW201004879A (en) | 2010-02-01 |
| TWI441786B true TWI441786B (en) | 2014-06-21 |
Family
ID=41574090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98122542A TW201004879A (en) | 2008-07-18 | 2009-07-03 | Cutting device for liquid crystal panel |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5256554B2 (en) |
| CN (1) | CN101628784B (en) |
| TW (1) | TW201004879A (en) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5550107B2 (en) * | 2010-03-15 | 2014-07-16 | 株式会社シライテック | LCD panel UV-curing substrate edge cutting device |
| JP5583478B2 (en) * | 2010-05-25 | 2014-09-03 | 株式会社シライテック | Panel splitting device |
| KR101449487B1 (en) * | 2012-06-01 | 2014-10-14 | 한국미쯔보시다이아몬드공업(주) | Panel cutting device and method of transferring panel in the same |
| CN102749748B (en) * | 2012-07-11 | 2015-02-11 | 深圳市华星光电技术有限公司 | Liquid crystal base plate cutting device and cutter head monitoring method thereof |
| JP6163341B2 (en) * | 2013-04-02 | 2017-07-12 | 三星ダイヤモンド工業株式会社 | Break device |
| JP5806702B2 (en) * | 2013-05-16 | 2015-11-10 | 川崎重工業株式会社 | Plate cutting machine with clean function |
| CN104227570A (en) * | 2013-06-17 | 2014-12-24 | 株式会社太星技研 | Unitary armorplate glass processing system for forming G2-mode touch sensors of cell units |
| JP6331454B2 (en) * | 2014-02-20 | 2018-05-30 | 三星ダイヤモンド工業株式会社 | Scribing equipment |
| KR101659454B1 (en) * | 2014-08-21 | 2016-09-23 | 한국미쯔보시다이아몬드공업(주) | Breaking apparatus for substrate |
| JP3195489U (en) * | 2014-11-05 | 2015-01-22 | 株式会社シライテック | Panel splitting device |
| KR20160123454A (en) * | 2015-04-15 | 2016-10-26 | 주식회사 탑 엔지니어링 | Scribing apparatus |
| JP6402940B2 (en) * | 2015-10-09 | 2018-10-10 | 三星ダイヤモンド工業株式会社 | Scribing equipment |
| CN106405887B (en) * | 2016-06-13 | 2023-06-20 | 江西合力泰科技有限公司 | Strip breaking device and strip breaking method for liquid crystal display panel strip breaking equipment |
| CN105911726B (en) * | 2016-06-13 | 2022-12-13 | 江西合力泰科技有限公司 | Automatic bar breaking equipment and method for liquid crystal display panel |
| CN106735880A (en) * | 2017-01-13 | 2017-05-31 | 武汉华星光电技术有限公司 | The cutting method and cutter sweep of a kind of flexible display panels |
| JP2017144740A (en) * | 2017-03-24 | 2017-08-24 | 三星ダイヤモンド工業株式会社 | Break device |
| CN107417083B (en) * | 2017-05-08 | 2019-11-22 | 东旭科技集团有限公司 | Glass substrate scribing and cutting equipment |
| CN109375394B (en) * | 2018-11-20 | 2021-03-23 | Tcl华星光电技术有限公司 | Cutting device and cutting method |
| CN110434485B (en) * | 2019-08-14 | 2021-04-13 | 福建晟哲自动化科技有限公司 | A high-efficiency automatic cutting machine |
| KR102328420B1 (en) * | 2020-02-28 | 2021-11-18 | 한국미쯔보시다이아몬드공업(주) | Support device for brittle substrate scribing process |
| CN113199544B (en) * | 2021-04-28 | 2023-05-12 | 江西中科高博科技服务有限公司 | High-precision gypsum board slitting mechanism |
| CN114311094B (en) * | 2021-12-31 | 2023-10-20 | 福建晟哲自动化科技有限公司 | Splitting and turning machine for liquid crystal display panel |
| TWI854359B (en) * | 2022-11-10 | 2024-09-01 | 志聖工業股份有限公司 | Thermal process carrier and thermal process equipment |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55116635A (en) * | 1979-02-28 | 1980-09-08 | Mitsuboshi Daiyamondo Kogyo Kk | Cutting method for plate glass or the like |
| JP2687534B2 (en) * | 1989-01-06 | 1997-12-08 | 坂東機工株式会社 | Glass plate processing machine |
| JPH08208257A (en) * | 1995-01-31 | 1996-08-13 | Bando Kiko Kk | Glass plate processing equipment |
| JPH08208256A (en) * | 1995-01-31 | 1996-08-13 | Bando Kiko Kk | Glass plate processing equipment |
| JPH08231238A (en) * | 1995-02-24 | 1996-09-10 | Bando Kiko Kk | Glass plate processing equipment |
| JPH09309737A (en) * | 1996-05-23 | 1997-12-02 | Shirai Tekkosho:Kk | Cutter for plate glass |
| JP2001330820A (en) * | 2000-03-14 | 2001-11-30 | Shirai Tekkosho:Kk | Snapping and cutting device for liquid crystal panel |
| JP4433555B2 (en) * | 2000-03-23 | 2010-03-17 | 坂東機工株式会社 | Glass plate processing method and apparatus |
| JP3969992B2 (en) * | 2001-10-15 | 2007-09-05 | 株式会社シライテック | LCD panel cutting system |
| JP3759450B2 (en) * | 2001-12-19 | 2006-03-22 | 株式会社白井▲鉄▼工所 | LCD panel folding device |
| JP4189992B2 (en) * | 2002-10-22 | 2008-12-03 | 株式会社シライテック | Glass substrate cutting device |
| JP4131853B2 (en) * | 2003-04-28 | 2008-08-13 | 株式会社 日立ディスプレイズ | Display device manufacturing method and manufacturing apparatus |
| JP5107514B2 (en) * | 2005-09-15 | 2012-12-26 | 株式会社シライテック | Sorting substrate sorting and picking device |
| JP4904036B2 (en) * | 2005-09-15 | 2012-03-28 | 三星ダイヤモンド工業株式会社 | Substrate cutting system |
-
2008
- 2008-07-18 JP JP2008187858A patent/JP5256554B2/en active Active
-
2009
- 2009-07-03 TW TW98122542A patent/TW201004879A/en unknown
- 2009-07-09 CN CN 200910159128 patent/CN101628784B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101628784A (en) | 2010-01-20 |
| JP5256554B2 (en) | 2013-08-07 |
| CN101628784B (en) | 2013-07-24 |
| TW201004879A (en) | 2010-02-01 |
| JP2010026267A (en) | 2010-02-04 |