TWI854359B - Thermal process carrier and thermal process equipment - Google Patents
Thermal process carrier and thermal process equipment Download PDFInfo
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- 230000003287 optical effect Effects 0.000 claims description 24
- 230000005291 magnetic effect Effects 0.000 claims description 9
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- 238000001179 sorption measurement Methods 0.000 claims 1
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- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 2
- 239000002907 paramagnetic material Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
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- 239000003302 ferromagnetic material Substances 0.000 description 1
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Abstract
一種熱製程的承載裝置,包含:至少一軌道、複數架橋、一移動模組及一夾握模組,每個架橋具有一橫樑及至少一立柱,立柱的頂端垂直地連接橫樑,立柱的底端可滑移地連接軌道,移動模組設置於軌道的一側,移動模組提供平行軌道移動的動力,夾握模組連接移動模組,夾握模組在一夾握狀態夾握立柱並帶動架橋在軌道上移動。本發明還提出一種熱製程設備,包含前述的熱製程的承載裝置。本發明的熱製程的承載裝置與熱製程設備解決了先前技術的承載裝置難以通用於不同尺寸形狀的工件的問題。A thermal process supporting device includes: at least one rail, a plurality of bridges, a moving module and a clamping module. Each bridge has a crossbeam and at least one column. The top of the column is vertically connected to the crossbeam, and the bottom of the column is slidably connected to the rail. The moving module is arranged on one side of the rail. The moving module provides power for movement parallel to the rail. The clamping module is connected to the moving module. The clamping module clamps the column in a clamping state and drives the bridge to move on the rail. The present invention also proposes a thermal process equipment, including the aforementioned thermal process supporting device. The thermal process supporting device and thermal process equipment of the present invention solve the problem that the supporting device of the prior art is difficult to be used for workpieces of different sizes and shapes.
Description
本發明係關於一種熱製程設備,更特別的是關於一種熱製程的承載裝置與具有前述承載裝置的熱製程設備。The present invention relates to a thermal process equipment, and more particularly to a thermal process carrier and the thermal process equipment having the carrier.
熱製程為工業上常見的加工製程,特別是針對片狀物(例如玻璃、基板等)進行熱處理。傳統的熱製程的承載裝置其形狀與構造設計很大程度受限於要承載的工件之尺寸、形狀。一旦工件的形狀規格發生改變,既有的熱製程的承載裝置便不適用,需要因應新規格的工件而設計新的承載裝置,相當不便。Thermal processing is a common processing process in industry, especially heat treatment of sheet materials (such as glass, substrates, etc.). The shape and structure design of the traditional thermal process carrier are largely limited by the size and shape of the workpiece to be carried. Once the shape and specifications of the workpiece change, the existing thermal process carrier is no longer applicable, and a new carrier needs to be designed to meet the new specifications of the workpiece, which is quite inconvenient.
因此,為解決習知熱製程的承載裝置的種種問題,本發明提出一種可改變承載面的熱製程的承載裝置。Therefore, in order to solve various problems of conventional thermal process carriers, the present invention provides a thermal process carrier with a changeable carrier surface.
為達上述目的及其他目的,本發明提出一種熱製程的承載裝置,其包含:至少一軌道;複數架橋,每個該架橋具有一橫樑及至少一立柱,該立柱的頂端垂直地連接該橫樑,該立柱的底端可滑移地連接該軌道;一移動模組,設置於該軌道的一側,該移動模組提供平行該軌道移動的動力;以及一夾握模組,連接該移動模組,該夾握模組在一夾握狀態夾握該立柱並帶動該架橋在該軌道上移動。To achieve the above and other purposes, the present invention provides a thermal process support device, which includes: at least one rail; a plurality of bridges, each of which has a crossbeam and at least one column, the top of the column is vertically connected to the crossbeam, and the bottom of the column is slidably connected to the rail; a moving module, which is arranged on one side of the rail and provides power for moving parallel to the rail; and a clamping module, which is connected to the moving module, and the clamping module clamps the column in a clamping state and drives the bridge to move on the rail.
於本發明之一實施例中,更包括一控制模組,訊號連接該移動模組及該夾握模組,以控制該移動模組的位移以及控制該夾握模組在該夾握狀態及一張開狀態之間切換。In one embodiment of the present invention, a control module is further included, which is signal-connected to the moving module and the clamping module to control the displacement of the moving module and control the clamping module to switch between the clamping state and an open state.
於本發明之一實施例中,該軌道數量為二,該二軌道彼此平行,該立柱的數量為二,該二立柱的頂端分別垂直地連接該橫樑的兩端,該二立柱的底端分別可滑移地連接該二軌道,該夾握模組在該夾握狀態夾握其中一該立柱並帶動該架橋在該二軌道上移動。In one embodiment of the present invention, the number of the rails is two, the two rails are parallel to each other, the number of the columns is two, the top ends of the two columns are respectively vertically connected to the two ends of the crossbeam, and the bottom ends of the two columns are respectively slidably connected to the two rails. The clamping module clamps one of the columns in the clamping state and drives the bridge to move on the two rails.
於本發明之一實施例中,該複數架橋在該軌道上平行排列。In one embodiment of the present invention, the plurality of bridges are arranged in parallel on the track.
於本發明之一實施例中,更包括一光學定位模組,設置於該夾握模組。In one embodiment of the present invention, an optical positioning module is further included, which is disposed on the clamping module.
於本發明之一實施例中,更包括複數光學定位模組,設置於各該立柱。In one embodiment of the present invention, a plurality of optical positioning modules are further included, which are disposed on each of the columns.
於本發明之一實施例中,更包括一磁性尺,平行設置於該軌道。In one embodiment of the present invention, a magnetic ruler is further included, which is arranged parallel to the track.
於本發明之一實施例中,各該架橋更包括至少一支撐件,設置於該橫樑。In one embodiment of the present invention, each of the bridges further comprises at least one support member disposed on the crossbeam.
於本發明之一實施例中,該支撐件可滑移地設置於該橫樑。In one embodiment of the present invention, the support member is slidably disposed on the crossbeam.
於本發明之一實施例中,各該架橋更包括至少一延伸側翼,該延伸側翼連接於該支撐件,且該延伸側翼的延伸方向平行該軌道的方向。In one embodiment of the present invention, each of the bridges further comprises at least one extending wing, the extending wing is connected to the supporting member, and the extending direction of the extending wing is parallel to the direction of the track.
於本發明之一實施例中,該立柱與該橫樑以磁性吸附的方式連接。In one embodiment of the present invention, the column and the crossbeam are connected by magnetic attraction.
於本發明之一實施例中,各該架橋更包括一剎車箝制器,設置於該立柱的底端。In one embodiment of the present invention, each of the bridges further comprises a brake clamp disposed at the bottom end of the column.
本發明又提出一種熱製程設備,其包含:一箱體;如前述之熱製程的承載裝置,設置於該箱體中;以及至少一熱源,朝向該熱製程的承載裝置。The present invention further proposes a thermal process equipment, which includes: a box; a thermal process carrier as described above, which is arranged in the box; and at least one heat source, which faces the thermal process carrier.
藉此,本發明的熱製程的承載裝置及熱製程設備可藉由移動複數架橋而排列成不同尺寸大小的工件承載面,以適配各種規格尺寸的工件。本發明的熱製程的承載裝置及熱製程設備相對於先前技術,明顯更具優勢。Thus, the heat treatment process supporting device and heat treatment process equipment of the present invention can be arranged into workpiece supporting surfaces of different sizes by moving a plurality of bridges to adapt to workpieces of various specifications and sizes. The heat treatment process supporting device and heat treatment process equipment of the present invention are obviously more advantageous than the prior art.
為充分瞭解本發明,茲藉由下述具體之實施例,並配合所附之圖式,對本發明做一詳細說明。本領域技術人員可由本說明書所公開的內容瞭解本發明的目的、特徵及功效。須注意的是,本發明可透過其他不同的具體實施例加以施行或應用,本說明書中的各項細節亦可基於不同觀點與應用,在不悖離本發明的精神下進行各種修飾與變更。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的申請專利範圍。說明如後:In order to fully understand the present invention, the present invention is described in detail through the following specific embodiments and the attached drawings. Technical personnel in this field can understand the purpose, features and effects of the present invention from the contents disclosed in this specification. It should be noted that the present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. The following implementation method will further explain the relevant technical content of the present invention in detail, but the disclosed content is not used to limit the scope of the patent application of the present invention. The description is as follows:
如圖1至圖3所示,本發明實施例之熱製程的承載裝置100,其包含:至少一軌道1、複數架橋2、一移動模組3及一夾握模組4。As shown in FIG. 1 to FIG. 3 , the thermal
軌道1可為允許架橋2在其上移動的任意形式,例如溝槽、滑軌等。The
每個架橋2具有一橫樑21及至少一立柱22,立柱22的頂端垂直地連接橫樑21,立柱22的底端可滑移地連接軌道1。Each
在本實施例中,軌道1的數量為二且彼此平行,因此每個架橋2對應地也具有二立柱22,二立柱22的頂端分別垂直地連接橫樑21的兩端,二立柱22的底端分別可滑移地連接二軌道1。架橋2大致呈現一個ㄇ字形,然而本發明不限於此,橫樑21的兩端可繼續向外延伸,或每個架橋2可具有更多的立柱22,分別可滑移地連接數量對應的軌道1。在一個比較精簡的實施例中,架橋2可僅具有一立柱22,對應一軌道1。立柱22例如為頂端連接於橫樑21的中央(質量重心),整個架橋2呈T字形。In this embodiment, the number of
移動模組3設置於軌道1的一側,移動模組3提供夾握模組4以平行軌道1的方向移動的動力。在本實施例中,移動模組3例如是:伺服馬達31與螺桿32之組合,伺服馬達31提供旋轉動力(可為正向或逆向),螺桿32將旋轉動力轉換成沿平行軌道1的方向的直線動力。夾握模組4受螺桿32帶動而沿平行軌道1的方向前進或後退。然而本發明不限於此,移動模組3也可以為汽缸等等能提供往復移動動力的機構。任何能受電動控制移動行程的機構都可以作為本發明的移動模組3。除此之外,移動模組3可受一控制模組5或接受來自外部的控制指令而提供動力。The moving
夾握模組4連接移動模組3,夾握模組4在一夾握狀態夾握立柱22並帶動架橋2在軌道1上移動。在本實施例中,夾握模組4例如是氣壓式夾爪或電動夾爪,夾爪的部分可受到控制而旋轉外翻一定的角度(例如90度),搭配立柱22的尺寸、結構,可使夾爪握緊立柱22、或夾爪外翻而放開立柱22。而夾握模組4連接於移動模組3,當需要移動特定的立柱22時,使移動模組3驅動夾握模組4到特定立柱22的位置,再控制夾握模組4切換至夾握狀態以夾握立柱22,移動模組3帶動夾握模組4及架橋2,使架橋2在軌道1上移動至指定位置。The
在本實施例中,夾握模組4與移動模組3之組合與軌道1的數量為對應的,即每個軌道1的一側皆設有一組夾握模組4與移動模組3,若存在複數軌道1則各自的移動模組3同步驅動夾握模組4,各夾握模組4分別夾握一立柱22。然而本發明不限於此,在其他實施例中,可為複數立柱22、複數軌道1的情況下僅單一個軌道1的一側設有一組夾握模組4與移動模組3,單一的夾握模組4在夾握狀態夾握其中一立柱22並帶動架橋2在二軌道1上移動。In this embodiment, the combination of the
由於架橋2的數量為複數,可藉由移動複數架橋2而排列成不同尺寸大小的工件承載面,以適配各種規格尺寸的工件。例如,工件面積較小的情況下可使架橋2排列密集,以支撐較小的工件;若工件面積較大,則可擴大架橋2彼此之間的間距,以提供足夠的工件承載面。綜上所述,本發明的熱製程的承載裝置100相對於先前技術,明顯更具優勢。Since there are
進一步地,本發明的熱製程的承載裝置100更包括一控制模組5,訊號連接移動模組3及夾握模組4。控制模組5用以控制移動模組3提供的位移量以及控制夾握模組4在前述的夾握狀態及一張開狀態之間切換。控制模組5例如是控制晶片或控制電路。Furthermore, the
進一步地,複數架橋2在軌道1上平行排列。然而本發明不限於此,在其他實施例中,複數架橋2也可以不平行排列,以適配特殊的工件或工序。Furthermore, the plurality of
進一步地,本發明的熱製程的承載裝置100更包括一光學定位模組61,設置於夾握模組4。光學定位模組61例如包括光學感測器,光學感測器常態或每隔一段時間發出光學訊號,用以輔助判斷夾握模組4是否移動到定點。例如,光學定位模組61發出的光學訊號發生改變(光訊號遇到立柱22並反射回光學定位模組61的接收端),則可判定夾握模組4已移動至目標的立柱22,控制模組5可控制移動模組3停止驅動並命令夾握模組4切換至夾握狀態以夾握目標立柱22。Furthermore, the
在另一個例子中,本發明的熱製程的承載裝置100包括複數光學定位模組62。與前一個例子的光學定位模組61的差異在於,複數光學定位模組62分別設置於各個立柱22。光學定位模組62例如包括光學感測器,光學感測器常態或每隔一段時間發出光學訊號,用以輔助判斷是否有夾握模組4移動至該立柱22。例如,某一立柱22所裝設的光學定位模組62發出的光學訊號發生改變(光訊號遇到夾握模組4並反射回光學定位模組62的接收端),則可判定夾握模組4已移動至此立柱22的位置,藉此判斷夾握模組4是否移動到定點。若此立柱22為欲移動的立柱22,則控制模組5可控制移動模組3停止驅動並命令夾握模組4切換至夾握狀態以夾握此立柱22。In another example, the
在其他實施例中,熱製程的承載裝置100更包括一磁性尺7,平行設置於軌道1。磁性尺7的磁性訊號可用來輔助判斷夾握模組4的實際位置。In other embodiments, the
進一步地,如圖1及圖3所示,各架橋2更包括至少一支撐件23,設置於橫樑21。支撐件23立於橫樑21,支撐件23的頂端作為與工件(圖未示)的直接接觸點,以減少工件與架橋2的接觸面積。因此,支撐件23的頂端通常為尖端或圓點等形式。Furthermore, as shown in FIG. 1 and FIG. 3 , each
進一步地,支撐件23可滑移地設置於橫樑21,故支撐件23可以配合工件的形狀而在垂直於軌道1的方向上調整密度與間距。Furthermore, the
進一步地,如圖3所示,各架橋2更包括至少一延伸側翼24,延伸側翼24連接於支撐件23,且延伸側翼24的延伸方向平行軌道1的方向。延伸側翼24可防止複數架橋2在移動時,各橫樑21或各立柱22之間發生碰撞。Furthermore, as shown in FIG3 , each
進一步地,在本實施例中,立柱22與橫樑21以磁性吸附的方式連接,即二者之間至少一者為鐵磁材料、另一者為順磁材料,或二者之間設置磁鐵並吸附順磁材料的立柱22與橫樑21。藉此,立柱22與橫樑21可快速拆卸或組裝。然而本發明不限於此,在其他實施例中,立柱22與橫樑21可用卡合或其他方式組裝製造。Furthermore, in this embodiment, the
進一步地,如圖3所示,在本實施例中,各架橋2更包括一剎車箝制器25,設置於立柱22的底端。剎車箝制器25例如是氣動式的,防止立柱22不當地位移。Furthermore, as shown in FIG3 , in this embodiment, each
進一步地,如圖4所示,本發明又提出一種熱製程設備200,其包含:一箱體8、前述的熱製程的承載裝置100及至少一熱源9。Furthermore, as shown in FIG. 4 , the present invention further proposes a
熱製程的承載裝置100設置於箱體8中,至少一熱源9朝向熱製程的承載裝置100。藉此,可將熱製程的承載裝置100運用在熱製程設備200中。The
本發明在上文中已以實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以申請專利範圍所界定者為準。The present invention has been disclosed in the above by way of an embodiment, but those skilled in the art should understand that the embodiment is only used to describe the present invention and should not be interpreted as limiting the scope of the present invention. It should be noted that all changes and substitutions equivalent to the embodiment should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to that defined by the scope of the patent application.
100:熱製程的承載裝置 200:熱製程設備 1:軌道 2:架橋 21:橫樑 22:立柱 23:支撐件 24:延伸側翼 25:剎車箝制器 3:移動模組 31:伺服馬達 32:螺桿 4:夾握模組 5:控制模組 61:光學定位模組 62:光學定位模組 7:磁性尺 8:箱體 9:熱源 100: Thermal process support device 200: Thermal process equipment 1: Track 2: Bridge 21: Crossbeam 22: Column 23: Support 24: Extended side wing 25: Brake clamp 3: Moving module 31: Servo motor 32: Screw 4: Gripping module 5: Control module 61: Optical positioning module 62: Optical positioning module 7: Magnetic scale 8: Box 9: Heat source
圖1係為根據本發明實施例之熱製程的承載裝置之立體示意圖。 圖2係為根據本發明實施例之熱製程的承載裝置之方塊示意圖。 圖3係為圖1之部分放大示意圖。 圖4係為根據本發明實施例之熱製程設備之立體示意圖。 FIG. 1 is a three-dimensional schematic diagram of a support device for a thermal process according to an embodiment of the present invention. FIG. 2 is a block schematic diagram of a support device for a thermal process according to an embodiment of the present invention. FIG. 3 is a partially enlarged schematic diagram of FIG. 1. FIG. 4 is a three-dimensional schematic diagram of a thermal process equipment according to an embodiment of the present invention.
100:熱製程的承載裝置 100: Thermal process carrier
1:軌道 1:Track
2:架橋 2: Bridge building
21:橫樑 21: Beam
22:立柱 22: Pillar
3:移動模組 3: Mobile module
4:夾握模組 4: Gripping module
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| TW111142943A TWI854359B (en) | 2022-11-10 | 2022-11-10 | Thermal process carrier and thermal process equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111142943A TWI854359B (en) | 2022-11-10 | 2022-11-10 | Thermal process carrier and thermal process equipment |
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| Publication Number | Publication Date |
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| TW202419416A TW202419416A (en) | 2024-05-16 |
| TWI854359B true TWI854359B (en) | 2024-09-01 |
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| TWM443013U (en) * | 2012-05-11 | 2012-12-11 | Yu-Mei Wang | Cantilever adjustment mechanism for hot blast stove |
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| TWM461631U (en) * | 2013-05-24 | 2013-09-11 | C Sun Mfg Ltd | Furnace door open/close mechanism |
| CN103159402B (en) * | 2011-12-13 | 2015-08-26 | 高侨自动化科技股份有限公司 | Glass substrate transfer device |
| TW202039383A (en) * | 2019-04-19 | 2020-11-01 | 日商三星鑽石工業股份有限公司 | Apparatus for controlling slope of stage and apparatus for dividing substrate using the same |
| CN113754258A (en) * | 2020-06-04 | 2021-12-07 | 格雷斯海姆里根斯堡有限公司 | Device for modifying glassware |
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2022
- 2022-11-10 TW TW111142943A patent/TWI854359B/en active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101628784B (en) * | 2008-07-18 | 2013-07-24 | 白井科技股份有限公司 | LCD panel cutting device |
| CN103159402B (en) * | 2011-12-13 | 2015-08-26 | 高侨自动化科技股份有限公司 | Glass substrate transfer device |
| TWM443013U (en) * | 2012-05-11 | 2012-12-11 | Yu-Mei Wang | Cantilever adjustment mechanism for hot blast stove |
| TWM461631U (en) * | 2013-05-24 | 2013-09-11 | C Sun Mfg Ltd | Furnace door open/close mechanism |
| TW202039383A (en) * | 2019-04-19 | 2020-11-01 | 日商三星鑽石工業股份有限公司 | Apparatus for controlling slope of stage and apparatus for dividing substrate using the same |
| CN113754258A (en) * | 2020-06-04 | 2021-12-07 | 格雷斯海姆里根斯堡有限公司 | Device for modifying glassware |
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| Publication number | Publication date |
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| TW202419416A (en) | 2024-05-16 |
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