1337514 九、發明說明： 【發明所屬之技術頜域】 本發明係關於具有一樣且細微的直徑之貫穿孔的玻璃 零件及其製造方法。 【先前技術】 近年來，具細微貫穿孔之玻璃基板或玻璃零件，已應用 於印刷電路基板、噴墨印刷用噴頭、或氣體流量計等方面， 特別係玻璃材料，使用感光性玻璃者備受矚目。作為在感 光性玻璃中形成貫穿孔的方法，已知有如專利文獻 1、專 利文獻2所揭示的方法。 圖8所示係專利文獻1所揭示之具貫穿孔的玻璃零件之 製造方法之説明圖。以下，參照圖8，說明專利文獻1所 揭示之具貫穿孔的玻璃零件之製造方法。圊8所示係在形 成基板狀的感光性玻璃中形成貫穿孔的步驟流程圖、及各 步驟的狀態示意側剖面圖。圖申，元件符號1 0 0係感光性 玻璃，1 0 1 a係曝光結晶化部，1 0 1係貫穿孔，1 0 2係光罩， 1 0 2 a係光罩遮光膜，1 0 3係已準直之紫外光。另外，遮光 膜 ]0 2 a係作為所需之貫穿孔的形狀與對應其排列之圖案 而形成於光罩102上。 首先，如圖8(a)所示，在感光性玻璃100上設置光罩， 並照射已準直之紫外光1 0 3。藉由此紫外光照射，在感光 性玻璃1 0 0内，使曝光結晶化部1 0 1 a形成作為潛像。潛像 的圖案係如圖8 ( a )所示，對應於光罩之遮光膜1 0 2 a圖案 的負型圊案。對已形成潛像的感光性玻璃1 〇 〇施行加熱熱 5 312XP/發明說明書(補件)/94-01 /93丨29974 1337514 處理之後，再對曝光結晶化部1 Ο 1 a、即所謂形成潛像的 域，利用氩氟酸系溶液施行蝕刻去除，獲得圖8 ( b )所示 所需之貫穿孔圖案。 再者，專利文獻2所揭示的方法係合併使用上述專利 獻1所揭示之方法 '及利用雷射加工之貫穿孔形成方法 方法。亦即，利用雷射加工法，預先形成較所需貫穿孔 更小的貫穿孔，然後，經過利用上述紫外光照射而形成 像、熱處理、蝕刻等各步驟而形成貫穿孔。預先形成的 穿礼係在熱處理後施行之蝕刻去除之際，具有改善蝕刻 在貫穿孔内之循環的作用。 專利文獻1 :日本專利特開2 Ο Ο 1 - 4 4 6 3 9號公報 專利文獻2 :日本專利特開2 Ο Ο 1 - 1 0 5 3 9 8號公報 【發明内容】 (發明所欲解決之問題） 但是，印刷電路基板的高密度化、或印刷影像的高精 化之技術潮流不斷地在進展，呼應此現象，對具細微貫 孔之玻璃零件的要求便日益增強。可是，如上述，習知 在感光性玻璃上形成貫穿孔的方法，係使用具有所需貫 孔形狀、或對應於排列圖案的光罩，且係沿襲微影技術 圖案形成法，就貫穿孔細微化方面而言，尚無法充分地 應。 圖6所示係習知之使用光罩的利用紫外線曝光施行潛 形成步驟的説明圖。圖6 ( a )所示係利用紫外線曝光形成 像之狀況的示意概略剖面圖，圊中，元件符號1 0 2 b係光 312XP/發明說明書(補件)/94-01 /93129974 的 文 的 徑 潛 貫 液 細 穿 之 穿 的 對 像 潛 罩 6 1337514 開口部，8 1係表示潛像形成區域的包絡曲線，A A ’係表示 感光性玻璃1 0 0的表面位置之線，B B ’、C C ’係表示基板内 部任意位置的線，C C ’係位於較B B ’更遠離光罩1 0 2之處。 其他元件符號的部分係如上述。另外，圖6 ( a )所示係在光 罩1 0 2與感光性玻璃呈密接狀態下施行曝光，即所謂密接 曝光方式的情況。 再者，圖6 ( b )至（d )所示係沿A A ’、B B ’及C C ’線方向的 曝光量分布示意分布曲線，橫軸為距離，縱軸為曝光量。 其中，原點0係對應於光罩之開口部1 0 2 b中心的位置。穿 透過開口部的紫外光（未圖示），係依循感光性玻璃基板内 部的行進，滲透入相當於遮光膜 1 0 2 a正下方的部分，結 果，直到被遮光膜 1 0 2 a所覆蓋的部分為止均被曝光（以 下，在本說明書中，將光滲出現象稱為「滲出效果」）。圖 6 ( b )至圊6 ( d )所示此狀況的示意圖。 圖6 ( b )所示係感光性玻璃1 0 0表面（A A ’線）處的曝光量 分布。如上述，因為光罩102與感光性玻璃100密接著， 所以，表面的曝光量分布係以箱車型函數（boxcar function)表示。此情況，曝光量分布的寬度係等於開口部 102b之寬度，遮光膜102a正下方所對應的部分並未被曝 光。遠離光罩的BB’位置處，如圖6(c)所示，因光滲透效 果，使曝光量的分布寬度變廣，且因感光性玻璃基板内的 光吸收，使曝光量衰減。此狀況係如圖6 ( d )所示，在C C ’ 位置處更為明顯化。 圖7所示係在形成潛像之後，經加熱熱處理而將潛像形 7 312XP/發明說明書(補件)/94-01/93129974 1337514 成區域蝕刻去除之情況所形成之孔的示意圖。圖7所示係 蝕刻去除後的形狀之概略侧剖面圖，元件符號9 1係孔。一 般而言，蝕刻係從基板表面開始進行。又，未形成潛像之 部分的蝕刻速度係較小於形成有潛像之區域的速度，但是 並非完全為零，且會被蝕刻液所侵蝕。未形成潛像之部分 的蝕刻速度係潛像形成部的約1 / 5 0左右。依此，隨潛像形 成區域的蝕刻之進行，亦在感光性玻璃表面上配合進行平 面蝕刻，結果便如圖7所示，貫穿孔徑朝其深度方向分布。 依此，在應用習知曝光方法的貫穿孔形成步驟中，貫穿 孔徑係依存於光罩的開口部徑與光滲出效果二者。當然， 若縮小光罩開口徑的話，所獲得之貫穿孔的最小值亦將減 少。但是，如下述所說明，隨貫穿孔徑的減少，對其深度 方向的一致性將相對地受損。光的滲出效果係由所照射之 光的平行度、光繞射效果、或於感光性玻璃100内部的散 射等要素而決定的。又，該等要素幾乎未依存於光罩之開 口部102b的大小，換言之，未依存於貫穿孔徑。即，當貫 穿孔徑充分地大的情況，貫穿孔徑與因光滲出效果所引起 的貫穿孔徑之擴大量之比率，或貫穿孔徑與貫穿孔徑之一 致性的欠缺量的比率將變小。所以，於貫穿孔徑充分地大 的情況，因光滲出效果所引起的該等貫穿孔徑變動為可忽 視程度的數值。但是，隨貫穿孔徑的減少，該比率將增加， 結果，便極難進行具有相同直徑的貫穿孔之形成。 如上所述，在上述習知方法中，隨貫穿孔徑的減少，因 為光繞射效果，極難在貫穿孔深度方向形成具有相同直徑 8 312XP/發明說明書(補件)/94-01 /93129974 1337514 的貫穿孔。當然，在貫穿礼深度較淺的情況，亦即在 性玻璃基板之厚度較薄的情況，雖可容易地形成具 μ m直徑的貫穿礼，但是，此情況的基板厚度將達數Η 左右。在此種狀況下，難以避免具有貫穿孔的玻璃零 機械耐久性之降低，其用途極受限制。例如，在可確 械強度之基板厚度3 5 0 y m之情況，換句話說，在貫穿 度為3 5 0 " m的情況，採用上述習知方法，便極難形成 直徑約 3 0 // m以下，即以寬深比（a s p e c t r a t i 〇貫穿 度除以直徑的數值）而言約1 2以上，且在深度方向具 同直徑的貫穿孔。本發明乃有鑑於上述問題點而完成 目的在於提供一種以感光性玻璃基板為基體材料，形 寬深比，且直徑3 0 // m以下之相同細微貫穿孔的玻璃 及其製造方法。 (解決問題之手段） 由本發明所提供的玻璃零件係具有貫穿孔的玻 件，其特徵在於： 在具有貫穿孔的玻璃零件中，上述玻璃零件的基體 感光性玻璃所構成，且上述貫穿孔之直徑並未因貫穿 部位不同而異，係維持大致一定之狀態，貫穿孔之長； 與貫穿孔之直徑（d)的比率（L/d)在15以上，且直徑（ 3 Ο μ m以下。 再者，由本發明所提供的玻璃零件係為， 上述感光性玻璃係含有選自 0 . 0 0 1〜0 . 0 5重量％的 0 . 0 0 1 〜0 . 5 重量 ％ 的 A g、0 . 0 0 1 〜1 重量 ％ 的 C u 2 0、0 . 0 0 1 312XP/發明說明書(補件)/94-01 /93129974 感光 有數 μ m 件之 保機 孔深 具有 孔深 有相 ，其 成高 零件 璃零 係由 孔的 ί (L) d)在 A u、 9 1337514 重量％的p t中之任1種以上作為感光性材料，此外，含有 0 . 0 0 0 . 2重量％的C e 0 2作為光增感劑。 製造上述玻璃零件的第1手段，係一種具有貫穿孔之玻 璃零件的製造方法，其特徵在於包含有： 在感光性玻璃基體形成貫穿孔的部分，照射聚光光束而 形成潛像的第1步驟；對在第1步驟中經聚光光束照射的 感光性玻璃施行熱處理，使已形成潛像的部分結晶化的第 2步驟；以及將在第2步驟中結晶化的部分溶解去除，藉 以形成貫穿孔的第3步驟。 第2手段係一種具有貫穿孔之玻璃零件的製造方法，其 係在第1手段的具有貫穿孔之玻璃零件的製造方法中，當 於上述第1步驟中照射聚光光束之際，該聚光光束的光束 腰位於上述感光性玻璃内部。 第3手段係一種具有貫穿孔之玻璃零件的製造方法，其 係在第1手段的具有貫穿孔之玻璃零件的製造方法中，當 於上述第1步驟中照射聚光光束之際，使該聚光光束的光 束腰位置沿該聚光光束的光軸間歇或連續地在上述感光性 玻璃基體内部移動，並且間歇或連續地照射上述聚光光束。 (發明效果） 在感光性玻璃上形成貫穿孔的方法中，在以施行光照射 而形成潛像、及將已形成潛像的部分蝕刻去除的方法為基 礎之情況，貫穿孔徑、寬深比、或直徑之深度方向的一致 性之貫穿孔形狀，會依存於潛像的形成步驟與蝕刻去除步 驟等二個條件因子，依情況之不同，後者的影響可能大於 10 3 12XP/發明說明書(補件)/94-01/93129974 1337514 前者。本發明者等針對上述二因子進行深入探討，結 現，當形成細微貫穿孔之際，在決定能實現貫穿孔徑 值之方面，上述潛像形成步驟的諸因子相較於蝕刻去 驟的諸因子較具支配性，遂根據此結果而完成本發明 由本發明，可在感光性玻璃上形成孔徑一致且細微的 高寬深比（該比值在15以上）的貫穿孔，且可提供以具 貫穿孔之感光性玻璃為基體的玻璃零件。 【實施方式】 圖1所示係本發明第1實施形態的具有貫穿孔之玻 件的製造方法之説明圖。圖1 ( a )所示係曝光時的光照 態之示意概略側剖面圖，圖1 ( b )所示係感光性玻璃的 位之曝光量分布示意圖。圖中，元件符號2 1係聚光光 21a係聚光光束的光束腰，AA’係指形成基板狀的感光 璃1 0 0中央處之線，B B ’係指感光性玻璃1 0 0表面位 線，C C ’係指感光性玻璃1 0 0背面位置之線，2 2係沿 線方向的曝光量分布，23係沿該 BB’線方向的曝光 布，E、R係指曝光量分布2 2與2 3交點處的曝光量與七 另外，圖1 ( b)中，原點（距離為0的位置）係對應相當 光光束2 1之光軸與A A ’或B B ’線的交點位置，橫軸為沾 或B B ’線的距離（距原點的距離），縱轴為曝光量。 本實施形態與上述習知技術的重要相異點在於，曝 並未使用光罩，且未使用經準直之光束，而是使用利 鏡等光學系統進行聚束的聚光光束21。一般而言，利 光光束所形成的曝光量分布係經由高斯分布而近似。 312XP/發明說明書(補件)/94-01/93129974 果發 最小 除步 。藉 具有 有該 璃零 射狀 各部 束， 性玻 置之 AA’ 量分 :置。 於聚 AA’ 光時 用透 用聚 如圖 11 1337514 1中元件符號22所示，光束腰21a之位置 的分布最尖銳，曝光量的尖峰值亦最大。 光束腰2 1 a之位置的地方，例如於對應基 位置處，會形成如圖1 ( b )中元件符號2 3 布寬度擴大，且曝光量的尖峰值亦降低。 再者，曝光量分布係為以光束腰位置為 稱關係，例如沿 CC’線的曝光量分布係等 布。圖2所示係在將利用圖1之聚光光束 E設定於感光性玻璃1 0 0的潛像形成所必 之情況，所形成之潛像，以及根據此潛像 的説明圖。其中，圖2 ( a )所示係曝光後死 圖2 ( b )所示係將潛像蝕刻去除後的狀態。 3 1 a係潛像形成區域，3 1係所形成的貫穿 如圖](b )所示，曝光量達E的位置在：¾ 玻璃之内部中心部、沿 BB’線的基板表面 線的感光性玻璃之背面部中，均為位置R。 所示，形成在感光性玻璃100的厚度方向 的圓柱狀之潛像區域3 1 a。將此狀態的感 熱熱處理之後，藉由施行蝕刻，形成具有 裁面形狀的貫穿孔31。另外，在感光性玻 附近，貫穿孔3 1的直徑擴大的原因係如前 潛像的區域亦有潛像形成區域的蝕刻之進 性玻璃1 0 0表面的平面蝕刻亦一起進行。 此情況，針對孔徑擴大之部分，若利用$ 312XP/發明說明書(補件)/94-01 /93129974 :(對應於A A ’線） 另一方面，遠離 .板表面BB’線的 所示之形狀，分 對稱中心的點對 於沿 BB’線的分 21形成的曝光量 要的曝光臨界值 所形成之貫穿孔 ί成潛像的狀態， 圖中，元件符號 r AA’線的感光性 部、以及沿 CC’ 由此，如圖2 ( a ) 具有相同半徑R 光性玻璃1 0 0加 如圖2(b)所示之 璃1 0 0之表背面 「所述，在未形成 行，同時，感光 汗削或研磨（1 a ρ ) 12 1337514 法等機械力π工法、或者離子研磨（i ο n m i 1 1 i n g )法或 RIE(Reactive Ion Etching，反應式離子蚀刻）法等乾式蚀 刻法等而去除，便可獲得具有相同貫穿孔徑的玻璃基板。 又，此情況，嚴格而言，基板内部所有位置的曝光量分布 並非交於一點。例如，在圖1 ( a )中，位於 A A ’線與B B ’線 間之部位的曝光量分布成為圖1(b)中曝光量分布22與23 的中間形狀所示之分布，此分布與曝光量分布22與23之 交點，在曝光量E中並非距離R，而是形成不同數值。但 是，偏離距離R的量極少，幾乎如圖2 (b)所示般，形成具 有相同直徑的圓柱狀潛像。 圖3所示係本發明之第2實施形態的具有貫穿孔之玻璃 零件的製造方法之説明圖。圖3 ( a )所示係曝光時的光照射 狀態示意概略側剖面圖，圖3 ( b )所示係將感光性玻璃各部 位的曝光量分布複合表示。圖中 DD’係表示距感光性玻璃 100之表面相當於感光性玻璃厚度的1/4距離處的線，EE’ 係表示距感光性破璃 1 0 0表面相當於感光性玻璃厚度的 3 / 4距離處的線，2 4係沿D D ’線的曝光量分布，4 1 a係潛像 形成區域，E2<系曝光量分布24的尖峰值，R2係曝光量分 布22中曝光量達E2的位置。 再者，聚光光束21的光束腰2 1 a係位於A A ’線上。潛像 形成領域4 1 a係將E 2設定於與用以在感光性玻璃1 0 0中形 成潛像的臨界曝光量一致的數值，且在以曝光量E2曝光之 情況所獲得的潛像。此情況，所形成的潛像形成區域 4 1 a 之形狀係大致旋轉橢圓體形狀，其短徑與R2 —致。此外， 13 312XP/發明說明書(補件)/94-01 /93129974 1337514 此R 2係小於第I實施形態的R。但是，此潛像狀態並無法 形成屬於連通基板之表背面之孔的貫穿孔。 於是，感光性玻璃的曝光可有效地以下述説明之2階段 製程實施。圖4所示係2階段曝光製程之説明圖，圖5所 示係利用2階段曝光所形成的潛像圖。圖中，元件符號5 1、 5 1 a、5 1 b係潛像形成區域。圖 4 ( a )所示係當將聚光光束 2 1的光束腰2 ] a設定成位於D D ’線上並施行曝光之情況的 示意圖，圓4 ( b )所示係將該光束腰2 1 a設定成位於E E ’線 上並曝光之情況的示意圖。另外，曝光量係如同上述，為 E2。亦即，所謂2階段曝光製程係指利用第1階段的曝光 製程，如圖4 ( a )所示，從感光性玻璃1 0 0之表面側起橫跨 中央部而形成潛像 5 1，接著，如圖 4 ( b )所示，利用第 2 階段的曝光製程，從感光性玻璃1 0 0之中央部起橫跨底面 形成潛像5〗b。 藉由經過上述所說明的 2階段曝光製程，便如圖 5所 示，可獲得從感光性玻璃表面起橫跨底面的連續潛像形成 區域。1 0 0如同第1實施形態，對感光性玻璃施行熱處理， 並將潛像形成區域施行蝕刻去除，藉此，相較於第1實施 形態，可獲得具有較小直徑的貫穿孔。另外，相關本第 2 實施形態，雖針對2階段曝光製程進行說明，但是並不限 於2階段，亦可採2階段以上的曝光製程。亦即，在多階 段曝光製程中，配合其照射曝光量，便可將聚光光束的光 束位置，設定於沿光軸的基板内部之任意位置，且於必要 情況，亦可將光束腰之位置設定於基板外部。又，相關使 14 312XP/發明說明書(補件)/94-01/931299?4 1337514 光束腰位置變化的方法，亦可間歇或連續地變化。 再者，在本發明實施形態中，雷射光或普通紫外光均可 使用作為光源。以下，針對本發明根據實施例進行更詳盡 的說明。 (實施例1 ) 此實施例係上述實施形態1的實施例。感光性玻璃1 0 0 係使用具有下述組成，且厚度 0 . 5 m m的玻璃基板（商品 名：HOYA股份有限公司製PEG3)。1337514 IX. Description of the invention: [Technical jaw region to which the invention pertains] The present invention relates to a glass member having a through hole having the same and fine diameter and a method of manufacturing the same. [Prior Art] In recent years, glass substrates or glass parts having fine through-holes have been used in printed circuit boards, inkjet printing heads, gas flow meters, etc., especially glass materials, and those who use photosensitive glass have been Attention. As a method of forming a through hole in a photosensitive glass, a method disclosed in Patent Document 1 and Patent Document 2 is known. Fig. 8 is an explanatory view showing a method of manufacturing a glass member having a through hole disclosed in Patent Document 1. Hereinafter, a method of manufacturing a glass member having a through hole disclosed in Patent Document 1 will be described with reference to Fig. 8 .圊8 is a flow chart showing a step of forming a through hole in the photosensitive glass in the form of a substrate, and a side cross-sectional view showing the state of each step. Tushen, component symbol 1 0 0 is photosensitive glass, 1 0 1 a is exposure crystallization, 1 0 1 is a through hole, 1 0 2 is a mask, 1 0 2 a is a mask, 1 0 3 It is a collimated ultraviolet light. Further, the light-shielding film [0 2 a] is formed on the photomask 102 as a shape of a desired through-hole and a pattern corresponding to the arrangement. First, as shown in FIG. 8(a), a photomask is placed on the photosensitive glass 100, and the collimated ultraviolet light 1 0 3 is irradiated. By exposure to ultraviolet light, the exposure crystallization portion 10 1 a was formed as a latent image in the photosensitive glass 100. The pattern of the latent image is as shown in Fig. 8(a), which corresponds to the negative pattern of the pattern of the light-shielding film of the mask. The photosensitive glass 1 which has formed the latent image is heated to heat 5 312XP / invention manual (supplement) /94-01 /93丨29974 1337514, and then the exposure crystallization part 1 Ο 1 a, so-called formation The domain of the latent image was subjected to etching removal using an argon fluoride-based solution to obtain a desired through-hole pattern as shown in Fig. 8(b). Further, the method disclosed in Patent Document 2 incorporates the method disclosed in the above Patent No. 1 and the through hole forming method using laser processing. That is, a through hole having a smaller through hole than that required is formed in advance by a laser processing method, and then a through hole is formed by performing steps such as image formation, heat treatment, and etching by irradiation with the ultraviolet light. The pre-formed dressing function has an effect of improving the circulation of the etching in the through hole when the etching is performed after the heat treatment. Patent Document 1: Japanese Patent Laid-Open No. Hei 2 - 4 4 6 3 9 Patent Document 2: Japanese Patent Laid-Open No. Hei 2 - 1 0 5 3 9 8 [Invention Summary] However, the trend of increasing the density of printed circuit boards or the refinement of printed images is continually progressing, echoing this phenomenon, and the demand for glass parts having fine through holes is increasing. However, as described above, a conventional method of forming a through hole in a photosensitive glass is to use a mask having a desired through hole shape or a pattern corresponding to the arrangement pattern, and is a pattern forming method according to the lithography technique, and the through hole is fine. In terms of terms, it is still not fully adequate. Fig. 6 is an explanatory view showing a conventional step of performing a latent formation by ultraviolet light exposure using a photomask. Fig. 6(a) is a schematic schematic cross-sectional view showing a state in which an image is formed by ultraviolet exposure, in which the symbol of the symbol 1 0 2 b is light 312XP / invention specification (supplement) / 94-01 /93129974 The imaging submerged cover 6 1337514 is opened by the latent liquid, and the 8 1 system represents the envelope curve of the latent image forming region, and the AA ' represents the line of the surface position of the photosensitive glass 100, BB ', CC ' It is a line indicating any position inside the substrate, and CC ' is located farther away from the mask 1 0 2 than BB '. The parts of other component symbols are as described above. Further, Fig. 6(a) shows a case where the exposure is performed in a state where the reticle 102 and the photosensitive glass are in close contact with each other, that is, the so-called close exposure method. Further, Fig. 6 (b) to (d) show a distribution curve of the exposure amount distribution along the line A A ', B B ' and C C ', the horizontal axis is the distance, and the vertical axis is the exposure amount. The origin 0 corresponds to the position of the center of the opening 1 0 2 b of the reticle. The ultraviolet light (not shown) that has passed through the opening passes through the inside of the photosensitive glass substrate, and penetrates into a portion directly below the light-shielding film 10 2 a, and as a result, is covered by the light-shielding film 1 0 2 a. All of the parts have been exposed (hereinafter, in the present specification, the phenomenon of light seepage is referred to as "exudation effect"). Figure 6 (b) to 圊 6 (d) shows a schematic diagram of this situation. Fig. 6 (b) shows the exposure amount distribution at the surface of the photosensitive glass 100 (A A ' line). As described above, since the photomask 102 is closely attached to the photosensitive glass 100, the exposure amount distribution of the surface is expressed by a boxcar function. In this case, the width of the exposure amount distribution is equal to the width of the opening portion 102b, and the portion directly under the light shielding film 102a is not exposed. As shown in Fig. 6(c), the BB' position away from the mask increases the distribution width of the exposure amount due to the light permeation effect, and attenuates the exposure amount due to light absorption in the photosensitive glass substrate. This condition is more pronounced at the C C ' position as shown in Figure 6 (d). Fig. 7 is a schematic view showing a hole formed by subjecting a latent image to a latent image, and heat-treating to form a latent image shape 7 312 XP / invention specification (supplement) / 94-01 / 93129974 1337514. Fig. 7 is a schematic side cross-sectional view showing the shape after etching removal, and the element symbol 9 1 is a hole. In general, the etching is performed from the surface of the substrate. Further, the etching speed of the portion where the latent image is not formed is smaller than the speed at which the latent image is formed, but it is not completely zero and is eroded by the etching liquid. The etching rate of the portion where the latent image is not formed is about 1 / 50 of the latent image forming portion. Accordingly, as the etching of the latent image forming region progresses, planar etching is also performed on the surface of the photosensitive glass, and as a result, as shown in Fig. 7, the through hole is distributed in the depth direction. Accordingly, in the through hole forming step in which the conventional exposure method is applied, the through hole diameter depends on both the opening diameter of the mask and the light oozing effect. Of course, if the opening diameter of the mask is reduced, the minimum value of the through hole obtained will also be reduced. However, as explained below, the consistency in the depth direction will be relatively impaired as the through aperture is reduced. The light oozing effect is determined by factors such as the parallelism of the irradiated light, the light diffraction effect, or the scattering inside the photosensitive glass 100. Moreover, these elements hardly depend on the size of the opening portion 102b of the mask, in other words, do not depend on the through hole. That is, when the penetration aperture is sufficiently large, the ratio of the penetration aperture to the amount of expansion of the through hole caused by the light oozing effect, or the ratio of the penetration aperture to the defect of the through aperture becomes small. Therefore, in the case where the through hole diameter is sufficiently large, the penetration diameter variation caused by the light oozing effect is a value which can be ignored. However, as the through-pore diameter decreases, the ratio will increase, and as a result, it is extremely difficult to form the through-holes having the same diameter. As described above, in the above-described conventional method, as the through-pore diameter is reduced, it is extremely difficult to form the same diameter in the depth direction of the through hole due to the light diffraction effect. 8 312XP / Invention Specification (supplement) /94-01 /93129974 1337514 Through hole. Of course, in the case where the penetration depth is shallow, that is, when the thickness of the glass substrate is thin, the penetration of μ m diameter can be easily formed, but the thickness of the substrate in this case is about several 。. Under such circumstances, it is difficult to avoid a decrease in the mechanical durability of the glass having the through holes, and its use is extremely limited. For example, in the case where the substrate thickness of the achievable strength is 350 ym, in other words, in the case where the penetration is 550 " m, it is extremely difficult to form a diameter of about 3 0 by using the above-mentioned conventional method. m or less, that is, a through hole having a width and a depth ratio (aspectrati 〇 penetration divided by a diameter) of about 12 or more and having the same diameter in the depth direction. The present invention has been made in view of the above problems, and an object of the invention is to provide a glass having a photosensitive glass substrate as a base material, a shape-to-depth ratio, and the same fine through-holes having a diameter of 3 0 // m or less and a method for producing the same. (Means for Solving the Problem) The glass member provided by the present invention is a glass member having a through hole, wherein the glass member having the through hole is formed of a base photosensitive glass of the glass member, and the through hole is The diameter does not vary depending on the penetration portion, and is maintained in a substantially constant state, the length of the through hole; the ratio (L/d) to the diameter (d) of the through hole is 15 or more, and the diameter (3 Ο μ m or less). Further, in the glass component according to the present invention, the photosensitive glass is selected from the group consisting of 0. 0 0 1 to 0. 0 5 wt% of 0. 0 0 1 to 0. 5 wt% of A g, 0 0 0 1 〜1% by weight C u 2 0,0 . 0 0 1 312XP/Invention manual (supplement)/94-01 /93129974 The protective hole depth of the photosensitive μm piece has a hole depth and a phase. The height of the part of the glass is determined by ί (L) d) of the hole, and at least one of A u, 9 1337514% by weight of pt is used as the photosensitive material, and further contains 0.0% by weight of C. e 0 2 acts as a photosensitizer. The first means for producing the glass member is a method for producing a glass member having a through hole, comprising: a first step of forming a latent image by irradiating a light beam in a portion where the through hole is formed in the photosensitive glass substrate; a second step of heat-treating the photosensitive glass irradiated by the concentrated beam in the first step to crystallize a portion where the latent image has been formed; and dissolving and removing the portion crystallized in the second step, thereby forming a through-through The third step of the hole. The second method is a method for producing a glass member having a through hole, which is a method for producing a glass member having a through hole according to the first aspect, wherein the condensing beam is irradiated when the condensing beam is irradiated in the first step The beam waist of the beam is located inside the photosensitive glass. The third method is a method for producing a glass member having a through hole, wherein in the method for producing a glass member having a through hole according to the first aspect, when the light beam is irradiated in the first step, the polymerization is performed The beam waist position of the light beam is intermittently or continuously moved inside the photosensitive glass substrate along the optical axis of the collecting beam, and the collecting beam is intermittently or continuously irradiated. (Effect of the Invention) In the method of forming a through hole in a photosensitive glass, the method of forming a latent image by performing light irradiation and etching and removing a portion where a latent image has been formed is based on the aperture, the aspect ratio, and the aspect ratio. Or the shape of the through hole in the depth direction of the diameter depends on two condition factors such as the formation step of the latent image and the etching removal step. Depending on the situation, the influence of the latter may be greater than 10 3 12XP/Invention Manual (Repair ) /94-01/93129974 1337514 The former. The inventors of the present invention have intensively studied the above two factors, and realized that when the fine through-holes are formed, the factors of the latent image forming step are compared with the factors of the etching step in determining the value of the through-hole diameter. According to the present invention, the present invention can form a through hole having a uniform aperture and a fine aspect ratio (the ratio is 15 or more) on the photosensitive glass, and can be provided with a through hole. The photosensitive glass is a glass component of a substrate. [Embodiment] FIG. 1 is an explanatory view showing a method of manufacturing a glass member having a through hole according to a first embodiment of the present invention. Fig. 1 (a) is a schematic side cross-sectional view showing the illumination state at the time of exposure, and Fig. 1 (b) is a schematic diagram showing the distribution of the exposure amount of the photosensitive glass. In the figure, the component symbol 2 1 is the beam waist of the condensed light beam of the condensed light 21a, the AA' is the line at the center of the photosensitive glass 1000, and the BB' is the surface of the photosensitive glass 100. Bit line, CC ' refers to the line of the back surface of the photosensitive glass 100, 2 2 is the exposure amount distribution along the line direction, 23 is the exposure cloth along the BB' line direction, and E, R means the exposure amount distribution 2 2 The exposure amount at the intersection with 2 3 is different from that of Fig. 1 (b). The origin (the position at the distance of 0) corresponds to the intersection of the optical axis of the light beam 2 1 and the line AA ' or BB '. The axis is the distance from the BB' line (the distance from the origin), and the vertical axis is the exposure. The present embodiment differs from the above-described prior art in that it does not use a photomask and does not use a collimated beam, but a concentrated beam 21 that is concentrated by an optical system such as a lens. In general, the exposure amount distribution formed by the beam of light is approximated by a Gaussian distribution. 312XP / invention manual (supplement) / 94-01 / 93129974 fruit hair minimum step. By having the beam of the glass, the AA' of the glass is placed: In the case of poly AA' light, as shown by the symbol 22 in Fig. 11 1337514 1, the position of the beam waist 21a is sharpest, and the peak value of the exposure amount is also the largest. Where the beam waist is 2 1 a, for example, at the corresponding base position, the width of the component symbol 2 3 in Fig. 1 (b) is enlarged, and the peak value of the exposure amount is also lowered. Further, the exposure amount distribution is a relationship in which the beam waist position is in a relationship, for example, an exposure amount distribution along the CC' line. Fig. 2 is a view showing a latent image formed by forming a latent image in which the condensed light beam E of Fig. 1 is set in the photosensitive glass 100, and an explanatory view based on the latent image. Among them, Figure 2 (a) shows the state of death after exposure. Figure 2 (b) shows the state after the latent image is etched away. 3 1 a is a latent image forming area, and the penetration formed by the 3 1 series is as shown in Fig. (b), and the exposure amount reaches the position of E: 3⁄4 sensitization of the inner surface of the glass and the surface line of the substrate along the BB' line In the back portion of the glass, the position R is the same. As shown, a cylindrical latent image region 3 1 a is formed in the thickness direction of the photosensitive glass 100. After the heat-sensitive heat treatment in this state, the through hole 31 having the cut surface shape is formed by etching. Further, in the vicinity of the photosensitive glass, the reason why the diameter of the through hole 31 is enlarged is that the etching of the surface of the etched glass of the latent image forming region and the surface of the latent image forming region is also performed together. In this case, for the enlarged aperture part, if using $312XP/invention specification (supplement)/94-01/93129974: (corresponding to AA' line), on the other hand, away from the shape shown on the BB' line of the board surface a point in which the point of the symmetry center is a latent image formed by the exposure threshold formed by the exposure threshold formed by the amount of exposure of the minute 21 of the BB' line, in the figure, the photosensitive portion of the line symbol r AA ', and Along CC', thus, as shown in Fig. 2(a), the same radius R is used to light the glass 100, and as shown in Fig. 2(b), the back surface of the glass 1 0 0 is described as "the line is not formed, at the same time, Photosensitive sweating or grinding (1 a ρ ) 12 1337514 method or other mechanical force π method, or ion milling (i ο nmi 1 1 ing) method or RIE (Reactive Ion Etching, reactive ion etching) method, etc. After removal, a glass substrate having the same through-aperture can be obtained. In this case, strictly speaking, the exposure amount distribution at all positions inside the substrate is not a point. For example, in Fig. 1 (a), it is located at the AA' line and The exposure distribution of the part between BB 'lines becomes 1(b) The distribution shown by the intermediate shape of the exposure amount distributions 22 and 23, the intersection of this distribution and the exposure amount distributions 22 and 23, is not the distance R in the exposure amount E, but forms a different value. However, the amount of the deviation distance R is extremely small. As shown in Fig. 2(b), a cylindrical latent image having the same diameter is formed. Fig. 3 is an explanatory view showing a method of manufacturing a glass member having a through hole according to a second embodiment of the present invention. a) is a schematic side cross-sectional view showing the light irradiation state at the time of exposure, and Fig. 3 (b) is a composite display of the exposure amount distribution of each portion of the photosensitive glass. In the figure, DD' indicates the distance from the photosensitive glass 100. The surface corresponds to a line at a distance of 1/4 of the thickness of the photosensitive glass, and EE' indicates a line at a distance of 3 / 4 from the surface of the photosensitive glass of 100% of the thickness of the photosensitive glass, and 2 4 lines along the DD ' The exposure amount distribution of the line, the 4 1 a-based latent image forming region, the peak value of the exposure amount distribution 24 of E2 < the position of the exposure amount of the R2-based exposure amount distribution 22 up to E2. Further, the beam of the concentrated light beam 21 The waist 2 1 a is located on the AA 'line. The latent image formation area 4 1 a E 2 is set to a value corresponding to a critical exposure amount for forming a latent image in the photosensitive glass 100, and a latent image obtained in the case of exposure with an exposure amount E2. In this case, the formed latent image The shape of the formation region 4 1 a is a substantially spheroidal shape having a short diameter which is coincident with R 2 . Further, 13 312 XP / invention specification (supplement) / 94-01 /93129974 1337514 This R 2 system is smaller than that of the first embodiment. R. However, this latent image state does not form a through hole belonging to a hole that connects the front and back surfaces of the substrate. Thus, the exposure of the photosensitive glass can be effectively carried out in a two-stage process as described below. Fig. 4 is an explanatory view showing a two-stage exposure process, and Fig. 5 is a view showing a latent image formed by two-stage exposure. In the figure, the component symbols 5 1 , 5 1 a, and 5 1 b are latent image forming regions. Figure 4 (a) is a schematic diagram showing the case where the beam waist 2 ] a of the collecting beam 2 1 is set to be on the DD ' line and exposure is performed, and the circle 4 (b) is shown as the beam waist 2 1 a is set as a schematic diagram of the situation on the EE 'line and exposure. Further, the exposure amount is as described above and is E2. In other words, the two-stage exposure process means that the first stage of the exposure process is performed, and as shown in FIG. 4(a), the latent image 51 is formed from the surface side of the photosensitive glass 100 to form a latent image 5, and then As shown in FIG. 4(b), the latent image 5'b is formed across the bottom surface from the central portion of the photosensitive glass 100 by the exposure process of the second stage. By the two-stage exposure process described above, as shown in Fig. 5, a continuous latent image forming region across the bottom surface from the surface of the photosensitive glass can be obtained. In the first embodiment, the photosensitive glass is subjected to heat treatment, and the latent image forming region is etched and removed, whereby a through hole having a small diameter can be obtained as compared with the first embodiment. Further, in the second embodiment, the two-stage exposure process will be described, but the second-stage exposure process is not limited to two stages, and two or more stages of exposure processes may be employed. That is, in the multi-stage exposure process, the beam position of the condensed beam can be set at any position inside the substrate along the optical axis in accordance with the exposure amount, and if necessary, the beam waist can also be used. The position is set outside the substrate. Further, the method of changing the beam waist position of the 14 312XP/invention specification (supplement)/94-01/931299?4 1337514 may also be changed intermittently or continuously. Further, in the embodiment of the present invention, either laser light or ordinary ultraviolet light can be used as the light source. Hereinafter, the present invention will be described in more detail based on the embodiments. (Embodiment 1) This embodiment is an embodiment of Embodiment 1 described above. As the photosensitive glass, a glass substrate having the following composition and having a thickness of 0.5 m was used (trade name: PEG 3 manufactured by HOYA Co., Ltd.).
Si〇2:78.0 重量 ％ L i 2 0 : 1 0 . 0 重量 ％ AI2〇3:6.0 重量％ K 2 0 : 4 . 0 重量 ％Si〇2: 78.0 wt% L i 2 0 : 1 0 . 0 wt % AI2〇3: 6.0 wt% K 2 0 : 4 . 0 wt %
Na2〇 : 1 . 0 重量 ％ Ζ η 0 : 1 . 0 t # %Na2〇 : 1 . 0 wt % Ζ η 0 : 1 . 0 t # %
Au:0.003 重量％Au: 0.003 wt%
Ag : 0. 08 重量 ％ C e 0 : 0 . 0 8 重量 °/〇 所使用的光源係波長3 5 5 nm的YAG雷射之3倍高諧波， 當使用該光對感光性玻璃基板施行曝光時，係將聚光光束 的N A設為 0. 4。又，在施行曝光時，係使用脈衝光（脈衝 寬度：約 6 n s e c )，藉由控制照射次數而控制積分曝光量。 另外，聚光光束的光束腰係設定成位於感光性玻璃之内部 中央部（距基板表面0.25mm的位置處）。經利用下述之既定 的積分光量施行曝光之後，將感光性玻璃基板整體在580 15 312XP/發明說明書(補件)/94-01/93129974 1337514 °C中施行4小時的熱處理。 此時的昇溫速度係1°C /分，降溫速度係0 . 2 °C /分。經 熱處理後，使用作為蝕刻液的稀氫氟酸水溶液（約7 % )，將 該蝕刻液喷灑於感光性玻璃基板的表背面，形成貫穿孔。 此時，蝕刻液的溫度並未特別控制。表1所示係積分曝 光量與感光性玻璃之基板中央部附近的貫穿孔徑及寬深比 間之關係。另外，本實施例中，所形成之貫穿扎的形狀係 如同圖2 ( b )所示形狀，基板表背面附近的孔徑大於基板中 央部附近，且可獲得相同貫穿孔徑的部分係從基板表背面 深入内側約7 5 // m的部分。此原因乃如上述，未形成潛像 的區域亦隨潛像形成區域的蝕刻之進行，在感光性玻璃表 面進行平面钱刻。 所以，表1所示寬深比係以基板厚度為0 . 3 5 m m所計算 出的。如同表中所示，隨積分曝光量的增加，貫穿孔徑亦 擴大。此乃因隨積分曝光量的增加，形成潛像的區域擴大 所致^ [表1] 積分曝光量 (m J / c m2 ) 貫穿孔徑 (am) 寬深比 條件1 4 5 0 0 13 26.9 條件2 9 0 0 0 15 23.3 (實施例2 ) 此實施例係上述實施形態2的實施例。本實施例的貫穿 孔形成條件，除了曝光製程之外，其餘均如同實施例1中 所述條件。在本實施例中，將感光性玻璃基板的曝光分為 第1與第2曝光製程而進行。在第1曝光製程中，如圖所 16 312XP/發明說明書(補件)/94-01 /93129974 1337514 示，係將聚光光束的光束腰之位置設定於距感光性玻 板表面為基板厚度1/4的位置並施行曝光，在第2曝 程中，如圖4 ( b )所示，係將該位置設定於距感光性玻 板表面為基板厚度3 / 4的位置並施行曝光。另外，第 第2積分曝光量等曝光條件係相同。表2中所示係積 光量與感光性玻璃基板中央部的貫穿孔徑及寬深比間 係。寬深比的求取方法係如同實施例1。 [表2 ] 積分曝光量 (m J / c m2 ) 貫穿孔徑 (V m ) 寬深比 條件3 1 5 0 0 (第1、第2均同） 10 35 條件4 2300(第1、第2均同） 12 29.2 (產業上之可利用性） 本發明係關於具有一樣且細微的直徑之貫穿孔的 零件及其製造方法，可使用為印刷電路基板、喷射印 用喷頭、或氣體流量計用的零件。 【圖式簡單說明】 圖1 ( a )、（ b )為本發明第1實施形態的具貫穿孔之 零件的製造方法說明圖。 圖2(a)、（b)為將以圖1之聚光光束2]所形成之曝 E設定於感光性玻璃1 0 0在潛像形成時所必需之曝光 值之情況，所形成之潛像及根據此潛像所形成之貫穿 説明圖。 圖3(a)、（b)為本發明第2實施形態的具貫穿孔之 零件的製造方法說明圖。 圖4 ( a )、（ b )為2階段曝光製程的說明圖。 312XP/發明說明書(補件)/94-01/93129974 璃基 光製 璃基 1與 分曝 之關 玻璃 表機 玻璃 光量 臨界 孔的 玻璃 17 1337514 圖5為2階段曝光製程的說明圖。 圖 6 ( a )〜（d )為使用習知光罩之利用紫外線曝光所施行 的潛像形成步驟的說明圖。 圖7為在形成潛像之後，經加熱熱處理並將潛像形成區 域蝕刻去除之情況所形成之孔的示意圖。 圖8(a)、（b)為專利文獻1所揭之具貫穿孔之玻璃零件 的製造方法說明圖。 【主要元件符號說明】 2 1 聚 光 光 束 2 1a 光 束 腰 22 沿 AA' 線 的 曝 光 量 分 布 23 沿 BB' 線 的 曝 光 量 分 布 24 沿 DD' 線 的 曝 光 量 分 布 3 1 貫 穿 孔 3 1a 潛 像 形 成 域 4 1a 潛 像 形 成 域 5 1 潛 像 形 成 區 域 5 1a 潛 像 形 成 區 域 5 1b 潛 像 形 成 區 域 8 1 潛 像 形 成 區 域 的 包 層 91 孔 1 00 感 光 性 玻 璃 10 1 貫 穿 孔 10 1a 曝 光 結 晶 化 部 312XP/發明說明書(補件)/94-0丨/93丨29974 18 1337514 10 2 光 罩 10 2a 遮 光 膜 10 2b 開 口 部 10 3 紫 外 光 E2 曝 光 量 19 312XP/發明說明書(補件)/94-01/93129974Ag : 0. 08% by weight C e 0 : 0 . 0 8 Weight ° / 〇 The light source used is a 3 times higher harmonic of the YAG laser with a wavelength of 3 5 5 nm. When using this light, the photosensitive glass substrate is applied. 4。 When the exposure, the NA of the concentrated beam is set to 0.4. Further, when exposure is performed, pulsed light (pulse width: about 6 n s e c ) is used, and the integrated exposure amount is controlled by controlling the number of irradiations. Further, the beam waist of the collecting beam was set to be located at the inner portion of the photosensitive glass (at a position of 0.25 mm from the surface of the substrate). After the exposure was carried out by using the predetermined integrated light amount described below, the entire photosensitive glass substrate was subjected to heat treatment for 4 hours in 580 15 312 XP/invention specification (supplement)/94-01/93129974 1337514 °C. The heating rate at this time was 1 ° C / min, and the cooling rate was 0.2 ° C / min. After the heat treatment, a dilute hydrofluoric acid aqueous solution (about 7 %) as an etching solution was used, and the etching liquid was sprayed on the front and back surfaces of the photosensitive glass substrate to form a through hole. At this time, the temperature of the etching liquid is not particularly controlled. Table 1 shows the relationship between the integral exposure amount and the penetration diameter and the aspect ratio in the vicinity of the central portion of the substrate of the photosensitive glass. In addition, in the present embodiment, the shape formed by the penetrating is like the shape shown in FIG. 2(b), the hole diameter near the back surface of the substrate is larger than the vicinity of the central portion of the substrate, and the portion having the same through hole diameter is obtained from the back surface of the substrate. Deep into the inner part of about 7 5 // m. The reason for this is as described above, and the region where the latent image is not formed is also subjected to etching by the latent image forming region, and the surface of the photosensitive glass is inscribed. Therefore, the aspect ratio shown in Table 1 is calculated based on the substrate thickness of 0.35 m m. As shown in the table, as the integrated exposure increases, the through aperture also increases. This is because the area of the latent image is enlarged as the integral exposure increases. [Table 1] Integrated exposure (m J / c m2 ) Through-hole (am) Width-to-depth ratio Condition 1 4 5 0 0 13 26.9 Conditions 2 9 0 0 15 15 23.3 (Embodiment 2) This embodiment is an embodiment of Embodiment 2 described above. The through hole forming conditions of this embodiment were the same as those described in Example 1 except for the exposure process. In the present embodiment, the exposure of the photosensitive glass substrate is carried out by dividing into the first and second exposure processes. In the first exposure process, as shown in FIG. 16 312XP/invention specification (supplement)/94-01/93129974 1337514, the position of the beam waist of the collecting beam is set to be the thickness of the substrate from the surface of the photosensitive glass plate. At the position of 1/4 and exposure, in the second exposure, as shown in Fig. 4 (b), the position was set to a position of 3 / 4 of the substrate thickness from the surface of the photosensitive glass plate and exposure was performed. Further, the exposure conditions such as the second integral exposure amount are the same. The amount of accumulated light shown in Table 2 is such as the penetration diameter and the aspect ratio at the central portion of the photosensitive glass substrate. The method of obtaining the aspect ratio is as in the first embodiment. [Table 2] Integral exposure (m J / c m2 ) Through-hole diameter (V m ) Wide-depth ratio condition 3 1 5 0 0 (1st and 2nd same) 10 35 Condition 4 2300 (1st, 2nd 12) 29. 29. Industrial Applicability The present invention relates to a through-hole having the same and fine diameter and a method of manufacturing the same, which can be used for a printed circuit board, a jet head, or a gas flow meter. Parts. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 (a) and (b) are explanatory views showing a method of manufacturing a component having a through hole according to a first embodiment of the present invention. 2(a) and 2(b) show the exposure formed by the condensed light beam 2] of Fig. 1 set to the exposure value necessary for the formation of the latent image of the photosensitive glass 100. Like and based on this latent image formed through the explanatory diagram. Figs. 3(a) and 3(b) are explanatory views showing a method of manufacturing a component having a through hole according to a second embodiment of the present invention. Figure 4 (a) and (b) are explanatory diagrams of the 2-stage exposure process. 312XP/Inventive Manual (Supplement)/94-01/93129974 Glass-based Optical Glass Foundation 1 and Exposure Glass Glass Glass Light Critical Hole Glass 17 1337514 Figure 5 is an explanatory diagram of the 2-stage exposure process. Fig. 6 (a) to (d) are explanatory views of a latent image forming step performed by ultraviolet exposure using a conventional mask. Fig. 7 is a schematic view showing a hole formed by heat treatment after heat treatment and etching removal of a latent image forming region. 8(a) and 8(b) are explanatory views showing a method of manufacturing a glass member having a through hole disclosed in Patent Document 1. [Main component symbol description] 2 1 Concentrating beam 2 1a Beam waist 22 Exposure amount distribution along AA' line 23 Exposure amount distribution along BB' line 24 Exposure amount distribution along DD' line 3 1 Through hole 3 1a Potential Image formation domain 4 1a Latent image formation domain 5 1 Latent image formation region 5 1a Latent image formation region 5 1b Latent image formation region 8 1 Latent image formation region cladding 91 Hole 1 00 Photosensitive glass 10 1 Through hole 10 1a Exposure Crystallization section 312XP / invention specification (supplement) / 94-0 丨 / 93 丨 29974 18 1337514 10 2 reticle 10 2a light shielding film 10 2b opening part 10 3 ultraviolet light E2 exposure amount 19 312XP / invention manual (supplement) /94-01/93129974