1328123 九、發明說明： 【發明所屬之技術領域】 本發明係獅-轉位鱗細 一種電子元伽縣對象 H職置，特別是 裝置。 對象時之對位偏移檢測方法及其檢測 【先前技街】 液晶顯示器是藉由驅動晶片Qc 透過高溫高壓的壓合製程，n驅動晶片是 上爾前會有對準的動作，藉對應位置 :構’轉触嫩 或=誤差’因而造成失準偏移的情況。因此，於每=械 仍須人為觀察偏移狀況。 σ時 在玻璃覆晶封裝（chip_on_glass; C0G)製程中，傳統之 =板與晶>1壓合的偏移狀況檢測評估方法，係彻顯微鏡 ，察分別位於晶片與相對之基板上的對位標記之間的相對位置。 日日片上的對位標記與基板上的對位標記兩者之間有固定且相對的 尺寸及形狀。細，由於兩對位標記之間並非完全密合的狀態， 因此當發生偏移時’僅能初略的估計偏移狀況，無法較明確ς知 曉偏移的量。當機台進行雛時，只能以初略的方式進行調整， 如此往往t要乡次的調校，村制鮮顧結果。 另一種方式係應用於玻璃基板之接觸墊與晶片之凸塊的壓合 檢測’ ^測時’利用—側向光源照射玻璃基板，並藉由來自壓合 區和非μ合區之反射光具有不同之亮度，藉以躺麵基板與晶 片壓合之偏移量。此方法仍是僅以一初略估計之偏移量進行調 5 1328123 校’且利狀射光的亮度來判斷偏移量必須經由換算的過程來評 估結果，故此檢測方法也較為複雜。 【發明内容】 :狄社的_，树明提供奸叙雜偏移檢測 方法及其檢測裝置，藉以解決先前技術所揭露檢測方法複雜且不 準確的問題。 為達上述目的，本發明揭露一種電子元件之對位偏移檢測方 法，用以檢測-電子it件貼附至—貼附對象時的對位偏移狀態， •貼附對象具有-_區以_電子元件，檢測方法包括：將第一 導線連接至位於貼附區外圍之導電標記；將第二導線連接至電子 元件；將信號輸出元件連接第一導線及第二導線其中之一條；提 供電壓訊號給第-導線及第二導線其中之H以及將電子元 件職至刺區。當發生對⑽糾，f子元件與導電標記產生 .短路，以將電壓訊號傳輸至信號輸出元件，因而致使信號輸出元 件發出警示信號。 • 根據本發明’可將信號輸出元件連接至第-導線，而將電壓 訊號提供給第二導線；或是將信號輸出元件連接至第二導線，而 將電壓訊號提供給第一導線。 根據本發明，於電子元件與貼附對象貼合前，可先於貼附對 象的貼合區上貼附一異向性導電膜（ACF)，再透過此異向性導電 膜而與電子元件相互貼附。 田電子元件係為積體電路（ic)時，電麼訊號可由此積體電 路提供，或由另一積體電路或一外部治具連接至第一或第二導 線’以提供所需的電壓訊號。 6 1328123 若電子元件為親’舰電子元件_由健電路 塊貼附至貼附對象的貼附區，第—或第二導線中之—係連接至該 積體電路之-非魏性凸塊（d_y bump)。於此貼附對象^ 為玻璃基板’而導電標記則可由玻璃基板上諸如銦錫氧化 等導電材料所組成。1328123 IX. Description of the invention: [Technical field to which the invention pertains] The present invention is a lion-translocation scale. An electronic meta-Gamian object H position, especially a device. Object-based alignment offset detection method and its detection [Previous technology street] The liquid crystal display is driven by a high-temperature and high-pressure pressing process by driving the wafer Qc, and the n-driven wafer is aligned before the upper electrode, and the corresponding position is obtained. : The case of 'turning tender or = error' thus causing misalignment. Therefore, it is still necessary to observe the offset condition every time. In the process of sigma-clad crystal encapsulation (chip_on_glass; C0G), the traditional method of measuring the offset state of the plate and the crystal>1 is performed by a microscope to check the alignment between the wafer and the opposite substrate. The relative position between the markers. There is a fixed and relative size and shape between the alignment mark on the day wafer and the alignment mark on the substrate. Fine, because the two pairs of marks are not completely in close contact with each other, when the offset occurs, the estimated offset state can only be estimated, and the amount of the offset cannot be clearly defined. When the machine is in the early stage, it can only be adjusted in the initial way. This is often the case for the adjustment of the township. Another method is applied to the contact detection of the contact pads of the glass substrate and the bumps of the wafer, and the lateral light source is used to illuminate the glass substrate, and the reflected light from the nip area and the non-μ junction area has Different brightness, by which the offset of the lying substrate and the wafer is pressed. This method still uses only a slightly estimated offset to adjust the brightness of the illuminating light to determine the offset. The result must be evaluated by the conversion process. Therefore, the detection method is also complicated. SUMMARY OF THE INVENTION: Di She's _, Shu Ming provides a method for detecting and detecting fraud and its detection device, thereby solving the problem that the detection method disclosed in the prior art is complicated and inaccurate. In order to achieve the above object, the present invention discloses a method for detecting a registration offset of an electronic component for detecting a registration offset state when an electronic component is attached to an attached object, and the attached object has a -_ region. _ electronic component, the detecting method comprises: connecting the first wire to the conductive mark located at the periphery of the attaching area; connecting the second wire to the electronic component; connecting the signal output component to one of the first wire and the second wire; providing a voltage The signal is given to the H-th and the second wire, and the electronic component is placed in the thorn zone. When the (10) correction occurs, the f sub-element and the conductive mark generate a short circuit to transmit the voltage signal to the signal output element, thereby causing the signal output element to issue a warning signal. • According to the invention, the signal output element can be connected to the first conductor and the voltage signal can be supplied to the second conductor; or the signal output component can be connected to the second conductor and the voltage signal can be supplied to the first conductor. According to the present invention, before the electronic component is attached to the attached object, an anisotropic conductive film (ACF) may be attached to the bonding area of the attached object, and then the anisotropic conductive film may be used to communicate with the electronic component. Attached to each other. When the field electronic component is an integrated circuit (ic), the electrical signal can be provided by the integrated circuit, or connected to the first or second wire by another integrated circuit or an external fixture to provide the required voltage. Signal. 6 1328123 If the electronic component is a pro-ship electronic component _ attached to the attachment area of the attached object by the health circuit block, the first or second wire is connected to the non-transformed bump of the integrated circuit (d_y bump). The attached object ^ is a glass substrate' and the conductive mark may be composed of a conductive material such as indium tin oxide on the glass substrate.
當電子元件為軟性電路板（FPC)時，則藉由軟性電路板上的 連接墊（pad)貼附至貼附對象的貼附區，兩導線中之一則連接至 連接墊。於此，貼附對象可為印刷電路板（pcBA)，而導電標記則 可由印刷電路板上諸如銅等導電材料所組成。 根據本發明，當檢測出發生對位偏移時，還可根據電子元件 與導電標記的位置計算偏移量，然後再依據該偏移量調整電子元 件與貼附對象的相對位置。 本發明所揭露之電子元件之對位偏移檢測裝置，用以檢測一 電子元件貼附至一貼附對象時的對位偏移狀態，貼附對象具有一 貼附區以貼附電子元件，檢測裝置包括：導電標記、第一導線和 第二導線。 \ 導電標記設置於貼附區的外圍。第一導線連接導電標記。第 二導線則連接電子元件，以接收電壓訊號。於電子元件貼附至貼 附區時’若發生對位偏移’電子元件與導電標記會產生短路，而 致使第二導線接收到之電壓訊號傳輸至導電標記。於此，導電標 記可環繞設置於貼附區的外圍。 根據本發明’第一導線還可連接至一信號輸出元件，以於發 生對位偏移時’經由電壓訊號的致動而發出警示信號。 再者’亦可將信號輸出元件連接至第二導線，而將電壓訊號 7 15 提供給第一導線。 相互ΓΓ。’於電子元件與軸縣之間可制—異向性導電膜而 田電子元件係為频魏時，電壓訊號可由此積體電路提 供丄抑或由另—積體電路或—外部治具連接至第—或第二導線， 以提供所需的電壓訊號。 有關本發㈣概與實作’茲以較佳實施顺合圖式詳細說 明如下。 【實施方式】 以下舉a紐實施取詳細綱本發明之内容，並以圖式作 為輔助說明。·巾提及之符雜參_式符號。 參照第1®及第2 ®，係為根據本發明—實施例之電子元件 ff立偏移檢測裝置，其係用以檢測電子元件，貼附至貼附對 象100時的對位偏移狀態。貼附對& 1〇〇具有一貼附區脱，用以 貼附電子το件130。於此’為明確表示，圖中僅繪出電子元件別 貼合部位，其他部位則省略未繪出。 對位偏移檢測裝置包括：導電標記11G、第-導線120和第 二導線132。 、導電標記110設置於貼附區102的外圍。在此，需注意的是： 雖然圖情示的導電標記11()和貼附區1〇2的形狀均為矩形，但 本發明的實施方式並不限於具特定形狀的導電標記11〇或貼附區 102。第一導線120連接導電標記110。第二導線132則連接電子 元件130，以接收電壓訊號。當電子元件13〇貼附至貼附區1〇2 且發生對位偏移（即電子元件與貼崎象細時對位偏移超出一 既定偏移量）時，電子元件130與導電標記則會產生短路而導 通’進而將第二導線132接收到之電壓訊號傳輸至導電標記⑽。 於此，導電標記11〇可環繞設置於貼· 1〇2的外圍。關於導電 標記no的設置方式，熟習此項技藝者當可依照實際所需的精確 度而採取適當的設置方式。 參照第3圖還可連接至—信號輸出元件14〇。 當電子元件m貼附至貼附區1()2且發生對位偏移時，電子元件 130與導電標記no會產生短路而導通，致使第二導線132接收到 之電壓訊號Vs會經由電子元件13〇而傳輸至導電標記11Q，進而 致使=號輸出元件140發出警示信號。信號輸出播14G包含一 警示單元142，以透過警示單元142發出警示信號。在一實施例 中’警示單元142 $指示燈，電壓訊號Vs會致使信號輸出元件 14〇透過警示單元142發出燈光。在另一實施例中，警示單元142 可為一蜂鳴H ’電壓訊號Vs會致使信號輸出元件14(]透過警示單 元142發出聲響。如熟習此技藝者所知，警示單元142亦可為其 他具有警示個的元件。如此—來，可簡單且準確地檢測出電子 元件的對位偏移狀態。 —舉例來說’將-積體電路（IC)貼附至―玻璃基板上時，電 子^件130可為積體電路，而貼附對象1〇〇即可為玻璃基板，導 電標記110則可由玻璃基板上諸如銦錫氧化物（IT〇)等導電材料 所組成。於此’係將積體電路的凸塊（bump)贿至玻璃基板的 貼附區，第二導線132餘接連接至積體電路之一非魏性凸塊。 於此’電壓訊號Vs可由積體電路本身提供。此外，亦可將第二導 線132的另一端連接至另一積體電路或一外部治具，藉以提供電 1328123 壓訊號Vs給第二導線132。 在另一實施例中，將一軟性電路板（FPC)貼附至一印刷電路 板（PCBA)上，此電子元件130為軟性電路板，而貼附對象1〇〇 即為印刷電路板，導電標記110則可由印刷電路板上諸如銅等導 電材料所組成。於此，係將軟性電路板的連接墊（pad)貼附至印 刷電路板的貼附區’因此第二導線132將連接至連接墊。第一導 線120係利用印刷電路板上已有的線路。於此，電壓訊號vs可經 由將第二導線132的另一端連接至一積體電路或一外部治具，來 •藉以提供電壓訊號Vs給第二導線132。 此外’於電子元件130與貼附對象100之間可透過一異向性 導電膜（ACF)而相互貼附。 如第1圖、第2圖及第4圖所示，亦可由第一導線12〇接收 電壓訊號Vs ’並將第二導線132連接至信號輸出元件14〇。當電 子元件130貼附至貼附區1〇2發生對位偏移時，電子元件13〇與 導電彳示δ己110會產生短路，因而將第一導線12〇接收到之電壓訊 φ 號Vs會、、^'由導電標兄110而傳輸至電子元件bo，進而經由第二 導線132致使信號輸出元件14〇透過警示單元142發出警示信號。 參…、第5圖，可透過偵測模組150操取電子元件13〇與導電 標記1=的影像，藉以债測出電子元件13〇與導電標記⑽的位 置再措由计异模組16〇依據債測模組bo價測得之位置計算出 偏差量X、γ，並傳送給機台以進行電子元件13〇與貼附對刚 之相對位置的調校。 、…第6圖’係為根據本發明—實關之電子元件之對位偏 移仏測方:¾•其伽崎測電子元件貼附至_縣時的對位偏 1328123 移狀:〃中貼瞬象具有—貼隱，肋細電子元件。 圍 附區外=帛導線連接至導電標記，且此導電標記係位於貼 1 (^驟21〇a)。於此’導電標記可環繞設置於貼附區的外 並且將第一導線連接至電子元件（步驟210b)。 再將乜號輸出元件連接第一導線（步驟)。 後，將電壓汛號提供給第二導線（步驟23〇)。When the electronic component is a flexible circuit board (FPC), it is attached to the attachment area of the attached object by a pad on the flexible circuit board, and one of the two wires is connected to the connection pad. Here, the attached object may be a printed circuit board (pcBA), and the conductive mark may be composed of a conductive material such as copper on a printed circuit board. According to the present invention, when the registration offset is detected, the offset can be calculated based on the position of the electronic component and the conductive mark, and then the relative position of the electronic component and the attached object can be adjusted according to the offset. The alignment offset detecting device for an electronic component disclosed in the present invention is configured to detect a registration offset state when an electronic component is attached to an attached object, and the attachment object has an attachment area for attaching the electronic component. The detecting device comprises: a conductive mark, a first wire and a second wire. \ Conductive markers are placed on the periphery of the attachment area. The first wire is connected to the conductive mark. The second wire is connected to the electronic component to receive the voltage signal. When the electronic component is attached to the attaching area, the electronic component and the conductive mark are short-circuited, and the voltage signal received by the second wire is transmitted to the conductive mark. Here, the conductive mark can be disposed around the periphery of the attachment area. In accordance with the present invention, the first wire can also be coupled to a signal output component to provide an alert signal via actuation of the voltage signal when a registration offset occurs. Furthermore, the signal output element can be connected to the second conductor and the voltage signal 7 15 can be supplied to the first conductor. Intertwined with each other. 'Between the electronic components and the axis can be made - the anisotropic conductive film and the field electronic components are frequency Wei, the voltage signal can be provided by the integrated circuit or by another integrated circuit or - external fixture connected to The first or second conductor to provide the desired voltage signal. The general and actual implementation of this issue (4) is explained in detail below with the best implementation. [Embodiment] The following is a detailed description of the present invention, and is illustrated by the drawings. · The towel refers to the symbol _ type symbol. Referring to Figs. 1 and 2, an electronic component ff vertical offset detecting device according to the present invention is used for detecting an electronic component and attaching it to a registration offset state when the object 100 is attached. The attached pair & 1 has an attachment area for attaching the electronic τ piece 130. Here, it is clearly shown that only the electronic component bonding portions are drawn in the drawing, and other portions are omitted and not shown. The registration offset detecting device includes a conductive mark 11G, a first wire 120, and a second wire 132. The conductive mark 110 is disposed on the periphery of the attachment area 102. Here, it should be noted that although the shape of the conductive mark 11 () and the attaching area 1 〇 2 are both rectangular, the embodiment of the present invention is not limited to the conductive mark 11 贴 or paste of a specific shape. Attachment 102. The first wire 120 is connected to the conductive mark 110. The second wire 132 is connected to the electronic component 130 to receive the voltage signal. When the electronic component 13 〇 is attached to the attachment area 1 〇 2 and the alignment offset occurs (ie, the alignment offset of the electronic component and the smear image is more than a predetermined offset), the electronic component 130 and the conductive marker are A short circuit is generated and turned on, and the voltage signal received by the second wire 132 is transmitted to the conductive mark (10). Here, the conductive mark 11〇 can be disposed around the periphery of the sticker 1〇2. Regarding the manner in which the conductive mark no is set, those skilled in the art can take appropriate settings in accordance with the accuracy required. It can also be connected to the signal output element 14A with reference to FIG. When the electronic component m is attached to the attaching area 1 () 2 and the alignment offset occurs, the electronic component 130 and the conductive mark no are short-circuited and turned on, so that the voltage signal Vs received by the second wire 132 passes through the electronic component. 13〇 is transmitted to the conductive mark 11Q, thereby causing the = output element 140 to issue an alert signal. The signal output broadcast 14G includes an alert unit 142 for transmitting an alert signal through the alert unit 142. In an embodiment, the alert unit 142 $ indicator, the voltage signal Vs causes the signal output component 14 to emit light through the alert unit 142. In another embodiment, the alert unit 142 can be a beep H' voltage signal Vs that causes the signal output component 14 (] to sound through the alert unit 142. As is known to those skilled in the art, the alert unit 142 can also be other The component has a warning. In this way, the alignment offset state of the electronic component can be detected simply and accurately. - For example, when the -integrated circuit (IC) is attached to the "glass substrate", the electron ^ The device 130 can be an integrated circuit, and the attached object 1 can be a glass substrate, and the conductive mark 110 can be composed of a conductive material such as indium tin oxide (IT〇) on the glass substrate. The bump of the body circuit is bribed to the attachment area of the glass substrate, and the second wire 132 is connected to one of the non-well bumps of the integrated circuit. Here, the voltage signal Vs can be provided by the integrated circuit itself. Alternatively, the other end of the second wire 132 may be connected to another integrated circuit or an external fixture to provide a voltage 1328123 voltage Vs to the second wire 132. In another embodiment, a flexible circuit board ( FPC) attached to a printed circuit board ( On PCBA), the electronic component 130 is a flexible circuit board, and the attached object 1 is a printed circuit board, and the conductive mark 110 can be composed of a conductive material such as copper on a printed circuit board. A pad of the board is attached to the attachment area of the printed circuit board. Thus the second wire 132 will be connected to the connection pad. The first wire 120 utilizes the existing circuitry on the printed circuit board. Here, the voltage signal vs. The second wire 132 can be supplied with a voltage signal Vs by connecting the other end of the second wire 132 to an integrated circuit or an external fixture. Further, the electronic component 130 and the attached object 100 are permeable. An anisotropic conductive film (ACF) is attached to each other. As shown in FIGS. 1 , 2 , and 4 , the voltage signal Vs ' can also be received by the first wire 12 并将 and the second wire 132 can be connected to the signal. The output element 14 〇. When the electronic component 130 is attached to the attachment area 1 〇 2, the electronic component 13 〇 and the conductive δ 己 110 110 will short-circuit, thus receiving the first wire 12 〇 Voltage signal φ No. Vs will be, ^' by conductive standard brother 110 The signal is transmitted to the electronic component bo, and the signal output component 14 is transmitted through the warning unit 142 via the second wire 132. The fifth signal can be used to operate the electronic component 13 and the conductive mark 1 through the detecting module 150. = image, by the debt to measure the position of the electronic component 13 〇 and the conductive mark (10), and then the difference module X 计算 according to the position measured by the debt test module bo calculated the deviation amount X, γ, and transmitted to the machine The table is used to adjust the relative position of the electronic component 13 〇 and the attached pair. [Fig. 6] is the alignment offset of the electronic component according to the present invention - 3⁄4• Its gamma When the electronic component is attached to the _ county, the alignment is offset 1328123. The stencil is attached to the stencil. Outside the enclosure = the 帛 wire is connected to the conductive mark, and this conductive mark is located on the sticker 1 (^21〇a). Here, the conductive mark may be disposed around the outside of the attachment area and connect the first wire to the electronic component (step 210b). Then connect the nickname output component to the first wire (step). Thereafter, the voltage nickname is supplied to the second wire (step 23A).
如此即可透過^號輸出元件得之電子元件與貼附對象貼合 (步驟24〇)時是否有發生至對位偏移（步驟242)。換言之，若 發生對位偏移（即電子元件無晒象_時對賴移超出一既 定偏移量）時，由於電子元件與導記產生短路，因而將電壓 訊號傳輸至信號輸出元件（步驟25〇)，進而致使信號輸出元件發 出一警示信號（步驟252)。若未發生對位偏移（即，電子元件與 貼附對象貼附時對位偏移未超出一既定偏移量或無偏移），則信號 輪出元件不會發出警示信號（步驟26〇)。如此一來，即可簡單且 準確地檢測出電子元件的對位偏移。 舉例來說，欲將一積體電路貼附至玻璃基板上，此電子元件 可為積體電路，而貼附對象即可為玻璃基板，導電標記則可由玻 璃基板上諸如銦錫氧化物之導電材料所组成。於此，係將積體電 路的凸塊貼附至玻璃基板的貼附區’第二導線可直接連接至積體 電路之一非功能性凸塊（dummy bump)。於此，電壓訊號可由積體 電路本身提供。亦可將第二導線的另一端連接至另一積體電路或 外部治具，來藉以提供電壓訊號給第二導線。 在另一實施例中，將一軟性電路板貼附至一印刷電路板上 1328123 時，此電子元件可為軟性電路板，而貼附對象即可為印刷電路板， 導電標記則可由印刷電路板上諸如鋼之導電材料所組成。於此， 係將軟性電路板的連接墊貼附至印刷電路板的軸區，因此第二 導線將連接至連接墊。第-導線可直接__電路板上的線 路。於此，龍喊可經由將第二導_另—端連接至積體電路 或外部治具，藉以提供電壓訊號給第二導線。 在-實施例巾，於電子元件無睛象貼合前，可先於貼附 對象的貼合區上貼附異向性導電膜（步驟235)，再透過此異向性 導電膜而與電子it件相互貼附（步驟24G)，如第7圖所示。 請再參照第8圖，亦可提健號勸耕以連鮮二導線(步 驟222 )，並將電壓訊號提供給第一導線（步驟232 )。 於電子元件無附對象貼合（步驟24〇)時，是若發生對位 偏移（即f子元件與朗縣貼㈣對位偏移超出—既定偏移量） 時’由於電子元件與導電標記產生短路，因而將訊號將依序 經由第H導電標記、電子元件及第二導線而傳輸至信號輸 出兀件（步驟250)’進而致使信號輸出元件發出警示信號（步驟 252)。 再參照第9圖’當發生對位偏移時，可根據電子元件與導電 標記的位置計算偏移量（步驟27G)，再依據計算得之偏移量調整 電子元件與貼附對象的相對位置（步驟28〇)。 —雖然本發明以前述之較佳實施例揭露如上，然其並非用以限 疋本發明。任何熟習糊技藝者，在不脫離本發明之精神和範圍 内’當可作些許之更動與潤飾。因此，本發明之專利保護範圍須 視本說明書觸之㈣專概_界定者為準。 12Thus, whether or not the electronic component obtained by the ^ output member is attached to the attached object (step 24A) is generated to the registration offset (step 242). In other words, if a registration offset occurs (ie, the electronic component does not have a predetermined offset when the image is removed), the voltage signal is transmitted to the signal output component due to a short circuit between the electronic component and the guide (step 25). 〇), which in turn causes the signal output component to emit an alert signal (step 252). If the registration offset does not occur (ie, the alignment offset does not exceed a predetermined offset or no offset when the electronic component is attached to the attached object), the signal rotation component does not emit an alert signal (step 26〇 ). In this way, the alignment offset of the electronic component can be detected simply and accurately. For example, if an integrated circuit is to be attached to a glass substrate, the electronic component may be an integrated circuit, and the attached object may be a glass substrate, and the conductive mark may be electrically conductive such as indium tin oxide on the glass substrate. Made up of materials. Here, the bump of the integrated circuit is attached to the attaching region of the glass substrate. The second wire can be directly connected to one of the integrator bumps of the integrated circuit. Here, the voltage signal can be supplied by the integrated circuit itself. The other end of the second wire may be connected to another integrated circuit or an external fixture to provide a voltage signal to the second wire. In another embodiment, when a flexible circuit board is attached to a printed circuit board 1328123, the electronic component can be a flexible circuit board, and the attached object can be a printed circuit board, and the conductive mark can be a printed circuit board. It consists of a conductive material such as steel. Here, the connection pads of the flexible circuit board are attached to the shaft area of the printed circuit board, so the second wire will be connected to the connection pad. The first conductor can be routed directly to the __ board. Here, the dragon shout can provide a voltage signal to the second wire by connecting the second terminal to the integrated circuit or the external fixture. In the embodiment, before the electronic component is attached to the electronic component, the anisotropic conductive film may be attached to the bonding area of the attached object (step 235), and the electron conductive film may be transmitted through the anisotropic conductive film. The it pieces are attached to each other (step 24G) as shown in Fig. 7. Referring again to Figure 8, the health indicator can be used to connect the two wires (step 222) and the voltage signal is supplied to the first wire (step 232). When the electronic component is attached without an object attached (step 24〇), if the registration offset occurs (ie, the offset between the f sub-element and the Langxian sticker (4) exceeds the specified offset), the electronic component and the conductive The mark creates a short circuit, and thus the signal will be transmitted to the signal output component (step 250) via the Hth conductive mark, the electronic component and the second wire in sequence, thereby causing the signal output component to issue an alert signal (step 252). Referring again to FIG. 9 'when the registration offset occurs, the offset can be calculated according to the position of the electronic component and the conductive mark (step 27G), and then the relative position of the electronic component and the attached object can be adjusted according to the calculated offset. (Step 28〇). The present invention has been disclosed above in the foregoing preferred embodiments, which are not intended to limit the invention. Anyone skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the definition of (4) in the specification. 12
丄J乙01ZJ 【圖式簡單說明】 裝置為根縣㈣—實關之1子元叙·偏移檢測 測裝置第之根據本發邮—實施例之電子元件之對位偏移檢 檢測裴 置^^意=_本發蚊另—實施狀電子元件之對位偏移 檢測裝第置4之圖=_她|細㈣爾之對位偏移 檢測縣發蚊^實補之電子林之對位偏移 方法據本㈣—實補之電付叙騎偏移檢測 =7圖係為根據本發明另—實施例之電子元件之對 測方法之流程圖； 第8圖係為根據本發明又另-實施例之電子元件 檢測方法之流程圖；以及 丁偏移 第9圖係為根據本發明又另一實施例之電子元件之對位 檢測方法之流程圖。 【主要元件符號說明】 100.............................. 附對象 102..............................貼附區 110.............................. 電標記 120.............................. 一導線 13 1328123 130..............................電子元件 132..............................第二導線 140..............................信號輸出元件 142..............................警示單元 150..............................偵測模組 160..............................計算模組丄J B 01ZJ [Simple description of the diagram] The device is the root county (four) - the real one of the sub-element and the offset detection device. According to the present postal - the electronic component of the alignment offset detection device ^^意=_This hairy mosquito--the implementation of the electronic component of the alignment offset detection device set 4 map = _ her | fine (four) er to the offset offset detection of the county mosquitoes ^ actual compensation of the electronic forest The bit offset method according to the present invention is a flowchart of a method for measuring an electronic component according to another embodiment of the present invention; FIG. 8 is a flowchart according to the present invention. A flowchart of an electronic component detecting method according to another embodiment; and a butyl shifting FIG. 9 is a flowchart of a method for detecting alignment of an electronic component according to still another embodiment of the present invention. [Explanation of main component symbols] 100.............................. Attached to object 102.......... ....................attachment area 110.......................... .... electric marking 120.............................. A wire 13 1328123 130........ ......................electronic components 132......................... .....Second wire 140........................ Signal output element 142....... .......................Warning unit 150........................ ...detection module 160..............................computing module
Vs...............................檢測信號Vs....................................Detection signal
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