TWI381200B - Alignment inspection method and apparatus - Google Patents

Description

Registration detection method and alignment detecting device

The present invention relates to a registration detecting method and a registration detecting device, and more particularly to a alignment detecting method and a registration detecting device for a wafer and a light-transmitting substrate.

In a manufacturing process such as a flat display panel, it is often necessary to bond a variety of different electronic components to a substrate. Taking the liquid crystal display module as an example, the assembly of the liquid crystal display module includes bonding the components such as the liquid crystal display panel, the driving circuit chip, the flexible circuit board, and the printed circuit board, and forming an electrical connection. When the driving circuit chip is disposed on the glass substrate of the liquid crystal display panel, a pair of bit detection is usually required to confirm whether the driving circuit wafer is accurately positioned on the glass substrate.

However, the current alignment method is to align the wafer alignment mark of the driving circuit wafer with the substrate alignment mark on the glass substrate, and then press-fix and fix it with an anisotropic conductive film (ACF). Therefore, after the driving circuit wafer and the glass substrate are pressed together, the position of the substrate alignment mark can be obtained only through the glass substrate, and the position of the wafer alignment mark cannot be obtained, and the substrate alignment mark and the wafer alignment mark cannot be compared. The position is to confirm whether the driver circuit wafer is accurately positioned on the glass substrate.

Therefore, an aspect of the present invention is to provide a registration detecting method and a registration detecting device for detecting whether a wafer (for example, a driving circuit wafer) is accurately positioned on a light-transmitting substrate, or estimating a pair between the wafer and the light-transmitting substrate. Bit offset.

Another aspect of the present invention is to provide a registration detection method and alignment The detecting device automatically adjusts the relative position between the wafer and the light-transmitting substrate according to the alignment detection result.

Yet another aspect of the present invention is to provide a registration detecting method and a registration detecting device for performing alignment detection or monitoring in an arbitrary process without being affected by a bonding layer between a wafer and a light-transmitting substrate.

According to an embodiment of the present invention, the alignment detecting method of the present invention comprises providing at least one wafer in which the wafer has a wafer alignment mark, a transparent substrate provided, wherein the transparent substrate is provided with a substrate alignment mark, and a wafer pair of the alignment wafer Marking on the substrate alignment mark of the transparent substrate; using the first detecting unit to penetrate the wafer to capture the position of the wafer alignment mark; using the second detecting unit to penetrate the transparent substrate, and picking the substrate pair The position of the quasi-mark; and the position of the aligned wafer alignment mark and the position of the substrate alignment mark.

Moreover, according to an embodiment of the present invention, the alignment detecting device of the present invention is configured to detect the alignment of the wafer on the transparent substrate, wherein the wafer has a wafer alignment mark, and the transparent substrate is provided with a substrate alignment mark, and the alignment The detecting device includes a first detecting unit, a second detecting unit, and a processing unit. The first detecting unit is configured to penetrate the wafer to capture the position of the wafer alignment mark, and the second detecting unit is configured to penetrate the transparent substrate to capture the position of the substrate alignment mark, and the processing unit is configured to compare the wafer Align the position of the mark with the position of the substrate alignment mark.

Moreover, according to an embodiment of the present invention, the alignment detecting method of the present invention is for detecting a alignment of a wafer on a light-transmitting substrate, wherein the wafer has a wafer alignment mark, and the transparent substrate is provided with a substrate alignment mark, The position detecting method comprises: using a first detecting unit to penetrate the wafer to capture the position of the wafer alignment mark; and using the second detecting unit to penetrate the transparent substrate to capture the position of the substrate alignment mark; The position of the wafer alignment mark is aligned with the position of the substrate alignment mark.

Moreover, according to an embodiment of the present invention, the alignment detecting method of the present invention is for detecting a positional alignment of a driving wafer on a display panel, wherein the driving wafer has a wafer alignment mark, and the display panel is provided with a substrate alignment mark, The bit detection method comprises: using a first detecting unit to penetrate the driving wafer to capture the position of the wafer alignment mark; using the second detecting unit to penetrate the display panel to capture the position of the substrate alignment mark; and comparing The position of the wafer alignment mark is aligned with the position of the substrate alignment mark.

Therefore, the alignment detecting method and the alignment detecting device of the present invention can surely detect whether the wafer is accurately positioned on the light-transmitting substrate, or estimate the offset of the alignment, and can automatically adjust the wafer and the transparent substrate. Relative position between. Moreover, the alignment detecting method and the registration detecting device of the present invention are not affected by the bonding layer between the wafer and the light-transmitting substrate.

The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. It is to be understood that the embodiments are not intended to limit the invention.

1 and FIG. 2, FIG. 1 is a side view showing a alignment detecting device according to a first embodiment of the present invention, and FIG. 2 is a view showing a wafer and a partially transparent substrate according to a first embodiment of the present invention. Schematic diagram. The alignment detecting method and the alignment detecting device 100 of the present embodiment are applicable to the alignment detection between the wafer 210 and the transparent substrate 220, and can be applied, for example, to the use of a chip on glass (COG). To detect whether the wafer is accurately bonded to the glass substrate. The wafer 210 comprises, for example, a germanium material or composition, such as a single crystal germanium (Single Crystal) Silicon), poly-silicon or Amorphous Silicon wafers. The light-transmitting substrate 220 is a substrate that allows light to pass through, such as a glass substrate, a plastic substrate, or a flexible substrate. Taking the transparent substrate 220 as a display panel as an example, the transparent substrate 220 is, for example, a thin film transistor (TFT) array substrate of a liquid crystal display device, and the wafer 210 is, for example, a driving wafer, which can utilize a glass flip chip bonding technology. The bonding is performed on the peripheral region of the transparent substrate 220, and a signal line (not shown) on the transparent substrate 220 is required.

As shown in FIG. 1 and FIG. 2, the alignment detecting device 100 of the present embodiment is configured to detect the alignment of the wafer 210 on the transparent substrate 220, wherein the wafer 210 has at least one wafer alignment mark 211 (as shown in FIG. 2). The dotted line is formed on the bonding surface 212 (such as the back surface) of the wafer 210. At this time, in the visible light range, the position (image) of the alignment mark 211 cannot be known (viewed) by looking down on the wafer 210. The transparent substrate 220 is provided with at least one substrate alignment mark 221 formed on the bonding surface 222 of the transparent substrate 220 to correspond to the wafer alignment mark 211. As shown in FIG. 2, in the present embodiment, the substrate alignment mark 221 is formed, for example, in a peripheral region of the light-transmitting substrate 220.

As shown in FIG. 1 , the alignment detecting apparatus 100 of the present embodiment includes a first detecting unit 110 , a second detecting unit 120 , a processing unit 130 , and a registration adjusting device 140 . Before the wafer 210 is bonded to the transparent substrate 220, first, the wafer 210 and the transparent substrate 220 are aligned, and the alignment adjusting device 140 of the alignment detecting device 100 can suck (or clamp) and position the wafer 210. Above the transparent substrate 220, at this time, the wafer alignment mark 211 is opposite to the substrate alignment mark 221, and the alignment detecting device 100 can detect the alignment condition between the wafer 210 and the transparent substrate 220. The first detecting unit 110 is disposed corresponding to the wafer 210 and can penetrate the wafer 210 to capture the position of the wafer alignment mark 211.

In this embodiment, the first detecting unit 110 is an infrared image capturing unit, such as an infrared charge-coupled device (IR CCD), an infrared camera or an infrared camera, which can penetrate the wafer 210 to capture the wafer. The associated image material of the mark 211 is aligned to obtain the position of the wafer alignment mark 211. At this time, the first detecting unit 110 may be provided with a microscope 111 and an infrared light source 112 for supplying infrared light to the wafer alignment mark 211 to generate an image for the microscope 111, and the microscope 111 is for transmitting And adjust the travel path of infrared light.

As shown in FIG. 1 , the second detecting unit 120 is disposed corresponding to the transparent substrate 220 and can penetrate the transparent substrate 220 to capture the position of the substrate alignment mark 221 . In this embodiment, the second detecting unit 120 is an image capturing unit, such as a charge-coupled device (CCD), a camera or a camera, which can penetrate the transparent substrate 220 to capture the substrate alignment mark 221 Related image data to obtain the position of the substrate alignment mark 221 . At this time, the second detecting unit 120 may be provided with a microscope 121 for providing visible light to the substrate alignment mark 221 to generate an image for the microscope 121, and a light source 122 for transmitting and adjusting visible light. The path of travel.

As shown in FIG. 1, the processing unit 130 is electrically connected to the first detecting unit 110 and the second detecting unit 120 for processing the detection results (data) of the first detecting unit 110 and the second detecting unit 120, and can be compared. The position of the wafer alignment mark 211 and the position of the substrate alignment mark 221 to detect whether the wafer alignment mark 211 is aligned with the substrate alignment mark 221, or between the wafer alignment mark 211 and the substrate alignment mark 221 can be estimated. The offset of the alignment. The processing unit 130 is, for example, a programmable controller (PLC), a single-chip microprocessor (MCU), a central processing unit (CPU), an embedded system, a programmable logic array, a computer, or any combination thereof.

As shown in FIG. 1 , the alignment adjusting device 140 is electrically connected to the processing unit 130 for comparing the position of the wafer alignment mark 211 and the substrate alignment mark 221 obtained by the processing unit 130 (alignment offset) The amount of relative position between the wafer 210 and the transparent substrate 220 is adjusted. In one embodiment, the alignment adjustment device 140 is, for example, a robot arm or a clamping mechanism for adjusting the position of the wafer 210 and the transparent substrate 220.

Referring to FIG. 3, a flow chart of a method for aligning a bit according to a first embodiment of the present invention is shown. When the alignment detecting method of the present embodiment is performed, first, the wafer 210 is provided (step 301), in which the wafer 210 has the wafer alignment mark 211. Next, a transparent substrate 220 is provided (step 302), wherein the transparent substrate 220 is provided with a substrate alignment mark 221 .

Next, as shown in FIGS. 1 and 3, the first detecting unit 110 is used to penetrate the wafer 210, and the position of the wafer alignment mark 211 is taken (step 303). In this embodiment, the first detecting unit 110 is, for example, an infrared image capturing unit, and the wafer 210 has, for example, a germanium material or a component. Since the infrared light is transparent to the germanium material, the first detecting unit 110 can penetrate the wafer 210. The position of the wafer alignment mark 211 is taken. And the second detecting unit 120 is used to penetrate the transparent substrate 220 to capture the position of the substrate alignment mark 221 (step 304). In this embodiment, the second detecting unit 120 is, for example, an image capturing unit, and the transparent substrate 220 is, for example, a glass substrate. Therefore, the second detecting unit 120 can penetrate the transparent substrate 220 to capture the position of the substrate alignment mark 221 . .

As shown in FIG. 1 , in the embodiment, when the wafer 210 is disposed on the transparent substrate 220 , the first detecting unit 110 may be disposed on one side of the wafer 210 , and the second detecting unit 120 may be disposed on the transparent substrate 220 . One side, and the first detecting unit 110 and the second detecting unit 120 can respectively acquire the wafers simultaneously or in any order. The position of the alignment mark 211 and the position of the substrate alignment mark 221 are aligned.

As shown in FIGS. 1 and 3, next, the position of the wafer alignment mark 211 is aligned with the position of the substrate alignment mark 221 (step 305). The processing unit 130 of the alignment detecting device 100 can perform an alignment according to the position of the wafer alignment mark 211 and the position of the substrate alignment mark 221 to detect whether the wafer alignment mark 211 is aligned with the substrate alignment mark 221, and thus Detecting whether the wafer 210 is accurately positioned on the light-transmissive substrate 220; alternatively, this step 306 can be used to estimate the amount of alignment offset between the wafer alignment mark 211 and the substrate alignment mark 221 .

As shown in FIG. 1 and FIG. 3, next, the relative position between the wafer 210 and the transparent substrate 220 is adjusted according to the position alignment result of the wafer alignment mark 211 and the substrate alignment mark 221 (step 306). The wafer 210 is on the light transmissive substrate 220. The alignment adjusting device 140 of the alignment detecting device 100 can adjust the relative position between the wafer 210 and the transparent substrate 220 according to the comparison result of the processing unit 130, so that the wafer 210 is accurately positioned on the transparent substrate 220.

Therefore, the alignment detecting method and the alignment detecting device 100 of the present embodiment can accurately align the wafer 210 on the transparent substrate 220.

Please refer to FIG. 4 and FIG. 5. FIG. 4 is a schematic side view of the alignment detecting device according to the second embodiment of the present invention, and FIG. 5 illustrates the alignment detecting device according to the second embodiment of the present invention. And a schematic side view of the wafer fixed on the light transmissive substrate. In the second embodiment, the alignment detecting device 100 further includes a pre-pressing head 150 for pre-pressing (false pressing) the wafer 210 on the transparent substrate 220 to initially fix the wafer 210 on the transparent substrate 220. In the second embodiment, the alignment detecting device 100 may include a pressing head (not shown) to firmly fix the wafer 210 on the transparent substrate 220. After the pre-pressing step, the pressure step can be performed again. Alternatively, the pre-pressing step may be replaced by the pressing step to firmly fix the wafer 210 to light. On the substrate 220. In the pre-pressing or pressing step, the bonding layer 230 is disposed between the wafer 210 and the transparent substrate 220 for bonding the wafer 210 and the transparent substrate 220. The bonding layer 230 is, for example, an anisotropic conductive film (ACF) or the like. Adhesive material.

As shown in FIG. 4 and FIG. 5, in the pre-pressing or pressing step, the device may be unstable or the like may cause a relative displacement between the wafer 210 and the transparent substrate 220. Therefore, after the pre-pressing or the pressing step, the alignment detecting device 100 can re-detect the alignment condition between the wafer 210 and the transparent substrate 220, thereby controlling the stability of the device and repairing the faulty product in time. At this time, the first detecting unit 110 can be used to penetrate the wafer 210 to capture the position of the wafer alignment mark 211 (step 303). And the second detecting unit 120 is used to penetrate the transparent substrate 220 to capture the position of the substrate alignment mark 221 (step 304). Next, the position of the wafer alignment mark 211 is aligned with the position of the substrate alignment mark 221 (step 305). Therefore, it is possible to surely detect whether the wafer 210 is located on the light-transmitting substrate 220 or to estimate the amount of alignment offset between the wafer 210 and the light-transmitting substrate 220. Even if the bonding layer 230 is provided between the wafer 210 and the light-transmitting substrate 220, detection can be performed.

As can be seen from the above description, as shown in FIG. 1, in the first embodiment, the alignment detecting method and the alignment detecting device 100 of the present invention can be used to detect whether the wafer 210 is accurately positioned on the light-transmitting substrate before the pre-pressing step. 220, and the relative position between the wafer 210 and the transparent substrate 220 can be adjusted before the pre-pressing step. At this time, steps 303, 304 and 305 can be performed before the pre-pressing step. In the second embodiment, the alignment detecting method and the alignment detecting device 100 of the present invention can also be used to detect whether the wafer 210 is accurately positioned on the transparent substrate 220 after the pre-pressing or pressing step, and the detection data ( The test results can be used to control the stability of the equipment and to find and repair faulty products in time. At this time, steps 303, 304, and 305 can be performed after the pre-pressing or this pressing step.

Please refer to FIG. 6, which is a side view of a alignment detecting device according to a third embodiment of the present invention. In the third embodiment, the alignment detecting method and the alignment detecting device 100 of the present invention can be used to instantly monitor the alignment of the wafer 210 and the transparent substrate 220. At this time, the alignment detecting device 100 may further be provided with a display 160 electrically connected to the processing unit 130. The first detecting unit 110 and the second detecting unit 120 can respectively capture position data (for example, image data) of the wafer alignment mark 211 and the substrate alignment mark 221 during the alignment of the wafer 210 and the transparent substrate 220, and then, The positional data of the wafer alignment mark 211 and the substrate alignment mark 221 are immediately aligned and processed (for example, overlapped) by the processing unit 130 and displayed on the display 160. Therefore, the user or the related person can immediately monitor the alignment of the wafer 210 and the transparent substrate 220 by the display 160 of the alignment detecting device 100. At this point, steps 303, 304, and 305 can be performed during the alignment process.

According to the various embodiments of the present invention, the alignment detecting method and the alignment detecting device of the present invention can surely detect whether the wafer is accurately positioned on the transparent substrate or estimate the alignment between the wafer and the transparent substrate. The shift amount and the relative position between the wafer and the light-transmitting substrate are automatically adjusted according to the alignment detection result to accurately align the wafer on the light-transmitting substrate. Furthermore, the alignment detecting method and the alignment detecting device of the present invention can perform alignment detection or monitoring before and after the pre-pressing step, before and after the pressing step, during the alignment process, or in any other process, without being affected by the wafer and the light transmission. The effect of the bonding layer between the substrates.

The present invention has been disclosed in the above embodiments, and is not intended to limit the present invention. Any one skilled in the art can make various modifications and retouchings without departing from the spirit and scope of the present invention. The scope of protection is subject to the definition of the scope of the patent application attached.

100‧‧‧ alignment detection device

110‧‧‧First detection unit

111‧‧‧Microscope

112‧‧‧Infrared source

120‧‧‧Second detection unit

121‧‧‧Microscope

122‧‧‧Light source

130‧‧‧Processing unit

140‧‧‧ alignment adjustment device

150‧‧‧Preloading head

160‧‧‧ display

210‧‧‧ wafer

211‧‧‧ wafer alignment mark

220‧‧‧Transparent substrate

221‧‧‧Substrate alignment mark

212, 222‧‧‧ joint surface

230‧‧‧ joint layer

301‧‧‧ Providing wafers

302‧‧‧ Providing a transparent substrate

303‧‧‧Use the first detection unit to penetrate the wafer and pick up the position of the wafer alignment mark

304‧‧‧Using the second detection unit to penetrate the transparent substrate and picking up the position of the substrate alignment mark

305‧‧‧ Align the position of the wafer alignment mark with the position of the substrate alignment mark

306‧‧‧Adjust the relative position between the wafer and the transparent substrate

The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; Side view.

2 is a schematic view showing a wafer and a partially transparent substrate according to a first embodiment of the present invention.

3 is a flow chart showing a method of the alignment detecting method according to the first embodiment of the present invention.

4 is a side elevational view showing the alignment detecting device in a preloading manner according to a second embodiment of the present invention.

FIG. 5 is a side view showing the alignment detecting device and the wafer fixed on the light-transmitting substrate according to the second embodiment of the present invention.

6 is a side view showing a alignment detecting device according to a third embodiment of the present invention.

100‧‧‧ alignment detection device

110‧‧‧First detection unit

111‧‧‧Microscope

112‧‧‧Infrared source

120‧‧‧Second detection unit

121‧‧‧Microscope

122‧‧‧Light source

130‧‧‧Processing unit

140‧‧‧ alignment adjustment device

210‧‧‧ wafer

220‧‧‧Transparent substrate

212, 222‧‧‧ joint surface

Claims (15)

A method for detecting a position, comprising: providing at least one wafer, wherein the wafer has at least one wafer alignment mark; providing a transparent substrate, wherein the transparent substrate is provided with at least one substrate alignment mark; The wafer is aligned on the substrate alignment mark of the transparent substrate; the first detecting unit is used to penetrate the wafer to capture the position of the wafer alignment mark; and the second detecting unit is used to penetrate the The substrate is permeable to the position of the substrate alignment mark; and the position of the alignment mark of the wafer and the position of the substrate alignment mark. The aligning detection method of claim 1, wherein the aligning step comprises: determining whether the wafer alignment mark is aligned with the substrate alignment mark. The alignment detecting method of claim 1, wherein the matching step comprises: estimating a registration offset between the wafer alignment mark and the substrate alignment mark. The method for detecting a registration according to the first aspect of the invention, further comprising: pre-pressing the wafer on the transparent substrate. The method for detecting a registration according to item 4 of the patent application scope, wherein the The step of taking the position of the wafer alignment mark, the step of capturing the position of the substrate alignment mark, and the comparing step are performed before the pre-compression step. The method of detecting a registration according to claim 4, wherein the step of capturing the position of the wafer alignment mark, the step of capturing the position of the substrate alignment mark, and the comparing step are in the pre-step After the pressure step. The method for detecting the alignment according to claim 3, further comprising: adjusting a relative position of the wafer and the transparent substrate according to the alignment offset. The method for detecting the alignment according to claim 1, further comprising: pressing the wafer on the transparent substrate. A aligning detecting device for detecting alignment of a wafer on a transparent substrate, wherein the wafer has at least one wafer alignment mark, and the transparent substrate is provided with at least one substrate alignment mark, and the alignment detection The device includes: a first detecting unit for penetrating the wafer to capture the position of the wafer alignment mark; and a second detecting unit for penetrating the transparent substrate to capture the position of the substrate alignment mark And a processing unit for aligning the position of the alignment mark with the substrate and the position of the substrate alignment mark. The registration detecting device according to claim 9, wherein the The first detecting unit comprises an infrared image capturing unit and a microscope; the second detecting unit comprises an image capturing unit and a microscope. The alignment detecting device of claim 9, wherein the processing unit determines whether the wafer alignment mark is aligned with the substrate according to a position comparison result of the wafer alignment mark and the substrate alignment mark. Align the mark. The alignment detecting device of claim 9, wherein the processing unit estimates the wafer alignment mark and the substrate alignment mark according to a position comparison result of the wafer alignment mark and the substrate alignment mark. A pair of bit offsets between. The aligning detection device of claim 12, further comprising: a pair of position adjusting means for adjusting a relative position of the wafer and the substrate according to the aligning offset. The alignment detecting device of claim 9, further comprising: a pre-pressing head for pre-pressing the wafer on the transparent substrate. The aligning detection device of claim 9, further comprising: a display electrically connected to the processing unit for displaying a position alignment result of the wafer alignment mark and the substrate alignment mark.