1325105 九、發明說明： 【發明所屬之技術領域】 • 本發明涉及一種散熱裝置，特別係一種用於電子元件 .的散熱裝置。 【先前技術】 隨著計算機的迅速普及和多媒體、3(1等技術應用的興 起’作為计异機顯示系統核心的顯示卡已從幕後走到了台 前，成為廣大用戶關注的焦點。然而，隨著顯示卡上的視 ，圖像適配器（GPU)等電子元件的處理工作能力的不斷 提升以及集成度的提高，其與中央處理器（cpu)相似， 都需要安裝散熱器來對其散熱，從此跟著cpu/Gpu的更新 發展，散熱器亦需要不斷改變而來滿足cpu/Gpu&散埶需 〇 ”、、 八中，夕數散熱益為了增加其散熱面積，延長散熱鰭 片的，向長度，如中國大陸專利第200510103968 8號該 ^熱态的散熱鰭片比較細長，其末端離熱源較遠且傳熱路 ϋ夠見’熱罝很難大量傳導至散熱鰭片末端部位，如此 1等散熱鰭片末端部位對於散熱器的散熱性能沒有太大幫 序介=外由於散熱鰭片較長而散熱縛片之間的氣流流道長 二二大導致風阻大影響散熱效率；還有—些散熱器 鲈片=其散熱面積而增加散熱籍片的密度’即減小散熱 二狀的二ΐ ’如中國大陸專利第02800004.8號，其由複數 …、〜片放射性紐'合而成’其離熱源較近的散熱鰭 5 二：間：且該部分的熱量較集中，更需要強制氣流 所能帶走的埶二間距小導致其風阻較大，降低風扇的氣流 所Μ走的熱量’直接影響其散熱效率。 料f如中國大陸專利第2(K)32G125_.3號所揭露 二：二 小散熱鰭片的氣流流道長度，將方形散 ::刀:”、：’形成具-定間距的兩個方形散熱鰭片組， 導埶广管的兩端部分別穿過兩組散熱鰭片，其底部與 上:、# ’而將風扇侧立設置於該兩組散熱鰭片之 二夕而減小散熱鰭片與風扇的距離。然而，該專利亦有 片交需要進—步改良：例如’氣流從-側的散熱鰭 、、且扇吸進來，與該散熱鰭片組換熱後，再從另-側 的=…片組D人出I，而吹向另—侧的散熱籍片組的氣流 已溫又不低，從而與該另一侧的散熱鰭片組的換熱量受到 t大〜響，㈣利的熱管冷凝段直接穿設在散熱韓片上的 牙孔内其中熱管與散熱鰭片有兩種方式可接合，一是先 在熱f上或散熱W的穿孔时錫膏，再熱管穿過散熱縛 片後商溫錫焊處理’但是此過程中熱管穿過穿孔時很容易 將錫膏挂損而高溫錫焊時導致錫f不均勻，其接合不良而 影響傳熱效率；二是直接干涉（過盈）配合，即熱管的直 徑稍^於穿孔的直徑，而將散熱鰭片直接壓合的方式套設 於熱官上，但是此過程不僅組裝成本（機台等）較高，産 品不良率亦較高，同時直接干涉（過盈）配合的熱管與散 熱鰭片之間的熱阻一般高於錫焊接合時的熱阻，因此不宜 選擇此種方式。還有，該專利的熱管與散熱鰭片之間直接 6 …105 傳熱’但是-般單片散熱^的厚度較薄，吸 整體上影響熱管的冷凝段與賴以間的換熱率、。 【發明内容】 月丈熱均勻之散熱 有鑒於此，有必要提供一種風阻低、 裝置。 入-種放熱裝置’包括：一導熱底座，其具有一用於姓 2熱源之平面；-散熱體，設置於該導熱底座的平面_ 散熱體包括至少二散熱趙片㉟，該等散熱鰭 片組包圍形成具有容置空間的筒狀結構 “複數平行間隔疊置的散熱㈣，每—散熱wit :分別對應設有一接合面；及至少一熱管，連接該導熱底 =與散熱體’該熱管的冷凝段被夾設於二相鄰散熱鰭片組 、對f接合面之間；其中該散熱裝置還包括-風扇，設置 於該容置空間内，該風扇為軸流風扇，該散熱體最靠向導 熱底座的一層散熱鰭片封閉該筒狀結構的底部。 相較於習知技術，該散熱裝置的氣流通道短，風阻低， 且散熱體上的熱量分佈較均勻，使得散熱裝置的散熱較均 勻’提高整體散熱效率。 【實施方式】 以下參照圖式，對本發明散熱裝置予以進一步說明。 凊參閱圖1至圖3 ’本發明第一實施例之散熱裝置包括 ，熱底座10、分別一端設置於該導熱底座10上的L型的二 *、.、b20、分別接合於二熱管2〇另一端的二導熱塊3〇、夾設 該熱管20和導熱塊3G而呈筒狀的散熱體懈容置於散孰體 40的内部容置空間的軸流風扇5〇。 導熱底座10係由銅、鋁或其合金等製成，其包括一平 ^ (未標示）用來與電子元件（未標示）接觸了該平面上 還安裝有用來將散熱裝置固定於電路板上的扣合部件Μ。 该導熱底座10與該平面相對的表面14上設有供熱管2〇結合 的二平行溝槽16 ’該溝槽16延伸至橫向穿過其所在的導熱 底座10表面14。 熱管20具有大致垂直彎折延伸的第一延伸段（吸埶段） 22和第二延伸段（冷凝段）24。其中，第—延伸段22位於 導熱底座ίο上的溝槽16内，其長度大於溝槽16的長度並其 自由端與該溝槽16—端平齊；第二延伸段24位於導熱底座 10侧方並垂直向上延伸。本實施例中，為了熱管職夠均 勻的分佈於導熱底座1〇周圍，二熱管2〇的第一延伸段以的 自由端延伸方向以相互平行交錯方式設置於導熱底座 上，而其冷凝段24位於導熱底座1〇相對兩侧。 導熱塊30亦係由銅、鋁或其合金等製成，其包括供散 2體40結合的二相對平面32、34。其_，平面32設有與熱 管20的冷凝段24結合的溝槽36 ,該溝槽36的深度與熱管2〇 的直徑相等或將熱管20的冷凝段24壓平後與導熱塊3〇的表 面平齊設置；還有，該熱管2〇的吸熱段22與冷凝段24之間 因彎折形成弧形彎曲部，所以為了熱管2〇與導熱塊3〇的接 觸面更大，該導熱塊30上的溝槽36一端形狀與熱管2〇弧形 彎曲部的形狀相應；另外，為了將電子元件的熱量更均勻 8 1325105 傳遞，該二導熱塊30的設有溝槽36的表面處於相反方向。 該散熱體40包括兩個均呈半筒狀的第一散熱鰭片組42 ，和第二散熱鰭片組44。該第一散熱鰭片組42和第二散熱鰭 •片組44位於二導熱塊30的相對兩側，將該二導熱塊3〇和熱 管20的第二延伸段24夾在二者中間而整體上形成筒狀結 構’其中部形成容置風扇50的圓柱形的容置空間。該第一 散熱縛片組42兩端形成二接合面43，一個與一導熱塊3〇的 平面32接合，另一個與另一導熱塊3〇的平面34接合，而第 二散熱鰭片組44兩端亦形成二接合面45，一個與該一導熱 塊30的平面34接合，另一個與該另一導熱塊3〇的平面32接 合0 第一政熱籍片組42係由被數散熱鰭片420間隔疊置而 成。該散熱鱗片420的主體大致呈半環形’其環形兩端的端 緣寬度與導熱塊30相應，其端緣分別同向彎折有折邊422 , 該折邊422上設有卡扣結構426，供與其疊置相鄰的散熱趙 片420—定間隔的相卡合’而該等折邊422組合之後形成上 述接合面43。第一散熱縛片組44亦係由複數散熱韓片440間 隔疊置而成。該散熱鰭片440的主體亦大致呈半環形，其兩 端的端緣寬度與導熱塊30相應，其端緣分別同向彎折有折 邊442 ’該折邊442上亦設有與卡扣結構426相同的卡扣结構 (圖未示）’供與其疊置相鄰的散熱鰭片44〇一定間隔的相 卡合，而該等折邊442組合之後形成上述接合面45。其中， 該散熱鰭片420的主體靠近兩端的外侧緣上對稱形成有圓 弧狀的内凹部以及向外延伸的二牛角形的凸刺，該散熱籍 9 1325105 片440的主體靠近兩端的外側緣上對稱的向外延伸有凸 片，二散熱鰭片420和440組合後形成牛頭似的外觀，尤其 風扇50等部件上安裝發光二極體（LED)時更具有美感。 另外，最靠向導熱底座10的一層散熱鰭片420與440分 別呈半圓形片體，二者對接後形成大致呈圓形的片體，其 對應導熱塊30的位置設有容槽和接合端，該一層散熱鰭片 420與440充當上述筒狀結構的底部，從而該散熱體40形成 了底部封閉、圍繞容置空間（風扇50 )形成複數向内外開 通的氣流通道的筒狀散熱結構。 風扇50藉由一固定架52固定於散熱體40的容置空間 内，該風扇50的軸線方向與散熱體40的氣流通道延伸方向 (散熱鰭片420、440的疊置方向）垂直。該固定架52包括一 圓圈形的托盤520，該托盤520邊緣相對兩側先向外延伸再 向上彎折延伸出二對稱的掛勾522，該掛勾522上端再向外 延伸形成固定端524並其上設有固定孔526。該托盤520的等 三分位置設有三個固定孔528，風扇50的下方延伸設有三個 固定腳54，該固定腳54上設有固定孔540，通過螺釘將風扇 50的固定腳54固定至托盤520上，再將托盤520通過其掛勾 522固定於導熱塊30上。該導熱塊30上.對應固定架52的固定 端524的位置設有螺孔。 請參閱圖4，以顯示卡為例對本發明散熱裝置的使用狀 態進行說明。將散熱裝置安裝於顯示卡60上並由導熱底座 10接觸於電子元件（GPU)上。當GPU運行時，其産生的熱 量通過導熱底座10吸收並傳給熱管20的吸熱段22，熱管20 1325105 的工作介質通過相變將熱量迅速傳導至與熱管20的冷凝段 24及其連接的導熱塊30及散熱體40，在通過風扇50強制進 行散熱。其中，由於熱管20的冷凝段24的熱量通過導熱塊 30吸收並傳給散熱體40，導熱塊30比散熱體40的散熱鰭片 420、440較厚，其吸熱量較大，且可均勻的再傳給與其接 合的散熱鰭片420、440，所以整個散熱裝置的各個部位熱 量分佈較均勻，有利於提高散熱效率；再由設置在散熱體 40中間的風扇50強制吹散熱鰭片420、440，由於散熱鰭片 420、440之間的氣流通道遠離風扇50的方向上較短，風阻 小，且該氣流通道在各個方向的長度較均勻，使散熱更均 勻。另外，氣流透過散熱體40後吹向GPU周圍的其他元件， 使顯示卡周圍空間溫度較均勻。 可以理解地，上述實施例中風扇50是軸流風扇，所以 散熱體40的底部設置有圓形的散熱鰭片420和440予以封 閉，以將氣流侧向導流於散熱鰭片420、440之間的氣流通 道内。當採用離心式風扇時，氣流可直接側向吹散熱鰭片 之間的氣流通道，故不必設置上述實施例中的最下層的圓 形散熱鰭片420和440，這樣亦可以讓部分氣流直接流通至 導熱底座10及電子元件周圍，有利於更好的散熱。另外， 上述實施例中，散熱鰭片組42和44之間夾設有導熱塊30， 為的是導熱塊30可大量吸收熱管20的冷凝段24的熱量並將 熱量通過大面積的傳給散熱鰭片420、440，另一方面導熱 塊30與熱管20接合時易控制其接合緊密度，不過本發明亦 可以將熱管20的冷凝段24直接與二散熱鰭片組42和44之間 11 1325105 央設，即散熱鰭片組42和44的接合面43和45上分別形成半 圓形凹槽，二者對接時組合形成將熱管夾設在其中的容置 孔，亦可以將熱管冷凝段進一步壓扁後與二散熱鰭片組之 間接合，同樣能夠控制熱管與散熱鰭片的接合緊密度。 還可以理解地，上述實施例中，散熱裝置包括兩個L字 形熱管20，所以亦有兩個散熱鰭片組42、44對接成圓筒狀 散熱體40,但本發明散熱裝置亦可包括三個L字形熱管並在 導熱底座上放射狀的佈置，而包括三個散熱韓片組組成圓 形或橢圓形散熱體，每兩個散熱鰭片組之間夹設一熱管的 冷2段，如此類推，本發明散熱裝置可根據需求適當增加 熱管和散熱H片組的數量；或本發明散熱裝置亦可包括兩 個大致呈U字形的熱管，該二熱管的底部（吸熱段）設置於 導熱底座上’其四個延伸段（冷凝段）均句分佈於導熱底 座上方周圍，而包括四個散熱韓片組組成圓形或糖圓形散 熱體’每兩個散熱韓片組之間夾設—熱管的―冷凝段 本發明散熱裝置亦可包括L字形或U字形混合形狀的熱管。 之’如在匕设置的散熱裝置的熱量分佈更趨於均自，並且 增加熱管與散熱鰭片之間的傳熱率。 :上所述’本發明符合發明專利要件，爰依法提出專 央本二為本發明之較佳實施例’舉凡熟 ;化=;=在麦依本發明精神所作之等效修傅或 夂化白應涵盍於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明—實施例散熱裝置之立體分解圖。 12 1325105 圖2係圖1之部分立體組裝圖。 圖3係圖2之立體組裝圖。 圖4係本發明一實施例散熱裝置之使用狀態示意圖。 【主要元件符號說明】 導熱底座 10 扣合部件 12 底座表面 14 溝槽 16 ' 36 執管 ί、、、 口 20 第一延伸段22 第二延伸段 24 導熱塊 30 平面 32、34 散熱體 40 第一散熱鰭片組 42 散熱籍片 420 > 440 折邊 422 ' 442 卡扣結構 426 第二散熱鰭片組 44 接合面 43、45 風扇 50 固定架 52 托盤 520 掛勾 522 固定端 524 固定孔 526'528'540 固定腳 54 顯示卡 60 131325105 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for an electronic component. [Prior Art] With the rapid popularization of computers and the rise of multimedia, 3 (the rise of technology applications, etc.), the display card that is the core of the computer display system has gone from behind the scenes to the front of the stage, becoming the focus of attention of users. The processing capability of the electronic components such as the video adapter (GPU) on the display card is continuously improved and the integration is improved. Similar to the CPU (CPU), it is necessary to install a heat sink to dissipate heat. Following the development of cpu/Gpu, the heatsink needs to be constantly changed to meet the needs of cpu/Gpu& 埶 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 For example, in Chinese Patent No. 200510103968 No. 8, the heat-dissipating fins are relatively slender, and the ends are far from the heat source and the heat transfer path is sufficient. 'The heat is difficult to conduct a large amount to the end of the heat-dissipating fins. The end of the fin does not have much heat dissipation performance for the heat sink. In addition, due to the long heat dissipation fins, the air flow path between the heat dissipation tabs is long and second, resulting in wind resistance. Heat dissipation efficiency; as well as some radiator 鲈 = = its heat dissipation area and increase the density of heat dissipation film 'that is to reduce the heat dissipation two-shaped two ΐ 'such as the Chinese mainland patent No. 02800004.8, which is composed of plural ..., ~ piece of radioactive '合成' is a heat-dissipating fin that is closer to the heat source. 2: Between: and the heat of the part is more concentrated, and the smaller the distance between the two, which requires forced airflow, causes the wind resistance to be larger, reducing the airflow of the fan. The heat that is removed directly affects its heat dissipation efficiency. Material f is as disclosed in Chinese Patent No. 2(K)32G125_.3: The length of the airflow path of the two small fins will be square:: Knife:", : 'To form two square heat sink fins with a fixed spacing, the two ends of the guide tube pass through two sets of heat sink fins, and the bottom and upper:, # ' and the fan side stand on the two The heat sink fins reduce the distance between the heat sink fins and the fan. However, the patent also has a need for further improvement: for example, 'airflow from the side of the heat sink fin, and the fan sucks in, and After the heat sink fin group heats up, I will output I from the other side of the =... The airflow blown to the other side of the heat-dissipating group is not too low, so that the heat exchange amount with the heat-dissipating fin group on the other side is greatly increased, and the heat-condensing section of the heat pipe is directly disposed in the heat sink. There are two ways in which the heat pipe and the heat sink fin can be joined in the hole in the film. First, the solder paste is first applied on the heat f or the heat sink W, and then the heat pipe passes through the heat dissipation block and then the temperature is soldered. During the process, when the heat pipe passes through the perforation, the solder paste is easily damaged and the high temperature soldering causes the tin f to be uneven, and the poor bonding affects the heat transfer efficiency; the second is the direct interference (interference) fit, that is, the diameter of the heat pipe is slightly ^ The diameter of the perforation is set on the heat official by directly pressing the fins, but the process is not only high in assembly cost (machine, etc.), but also has high product defect rate and direct interference (interference). The thermal resistance between the heat pipe and the heat sink fin is generally higher than that of the solder joint, so this method should not be chosen. In addition, the heat pipe of the patent and the heat sink fins directly transfer heat by '105', but the thickness of the single-piece heat sink is thin, and the overall absorption affects the heat exchange rate between the condensation section of the heat pipe and the heat sink. SUMMARY OF THE INVENTION In view of this, it is necessary to provide a device with low wind resistance. The heat-dissipating device includes: a heat-conducting base having a plane for the heat source of the last name; a heat sink disposed on the plane of the heat-conducting base _ the heat sink includes at least two heat-dissipating fins 35, the heat-dissipating fins The group encloses a cylindrical structure having a accommodating space, "a plurality of parallel spaced heat dissipations (4), each of the heat dissipating wits: respectively correspondingly provided with a joint surface; and at least one heat pipe connecting the heat conducting bottom = the heat dissipating body 'the heat pipe The condensing section is disposed between the two adjacent heat dissipating fin sets and the pair of f-joining surfaces; wherein the heat dissipating device further includes a fan disposed in the accommodating space, the fan is an axial fan, and the heat dissipating body is the most A layer of heat-dissipating fins of the guide heat base closes the bottom of the tubular structure. Compared with the prior art, the heat-dissipating device has a short airflow passage, a low wind resistance, and a uniform heat distribution on the heat sink, so that the heat dissipation of the heat sink is relatively low. Uniformly improve the overall heat dissipation efficiency. [Embodiment] The heat dissipation device of the present invention will be further described below with reference to the drawings. Referring to Figures 1 to 3, the heat dissipation device of the first embodiment of the present invention The heat base 10 includes two L-shaped two, . . . , and b20 disposed at one end of the heat-conducting base 10, and two heat-conducting blocks 3 接合 respectively connected to the other end of the two heat pipes 2 , and the heat pipe 20 and the heat-conductive block are sandwiched. The 3G cylindrical heat dissipating body is placed in the axial fan 5〇 placed in the inner housing space of the bulk body 40. The heat conducting base 10 is made of copper, aluminum or an alloy thereof, and includes a flat ^ (not labeled a contact member for mounting the heat sink to the circuit board is also mounted on the plane for contacting the electronic component (not shown). The heat transfer base 10 is provided with a heat supply tube 2 on the surface 14 opposite to the plane. The second parallel groove 16' of the bead is joined to the surface 14 of the thermally conductive base 10 through which the heat pipe 20 is located. The heat pipe 20 has a first extension (suction section) 22 and a second extension extending substantially vertically. a section (condensing section) 24. wherein the first extending section 22 is located in the groove 16 on the heat conducting base ίο, the length of which is greater than the length of the groove 16 and the free end thereof is flush with the end of the groove 16; The segment 24 is located on the side of the heat-conducting base 10 and extends vertically upwards. This embodiment In order to distribute the heat pipe evenly around the heat-conducting base 1 , the first extension of the two heat pipes 2 以 is disposed on the heat-conducting base in a mutually parallel staggered manner, and the condensation section 24 is located on the heat-conducting base. The heat conducting block 30 is also made of copper, aluminum or an alloy thereof, etc., and includes two opposing planes 32, 34 for combining the two bodies 40. The plane 32 is provided with condensation with the heat pipe 20. The segment 24 is combined with a groove 36 having a depth equal to the diameter of the heat pipe 2〇 or flattening the condensation section 24 of the heat pipe 20 to be flush with the surface of the heat conducting block 3〇; and, the heat pipe 2〇 The curved portion of the heat absorbing section 22 and the condensing section 24 is bent by bending, so that the contact surface of the heat pipe 2 〇 and the heat conducting block 3 更大 is larger, and the shape of the groove 36 on the heat conducting block 30 is the same as that of the heat pipe 2 . The shape of the curved bend corresponds to each other; in addition, in order to transfer the heat of the electronic component more uniformly 8 1325105, the surfaces of the two heat conducting blocks 30 provided with the grooves 36 are in opposite directions. The heat sink 40 includes two first heat sink fin sets 42 each having a semi-cylindrical shape, and a second heat sink fin set 44. The first heat dissipation fin group 42 and the second heat dissipation fin group 44 are located on opposite sides of the two heat conduction blocks 30, and the two heat conduction blocks 3 and the second extension 24 of the heat pipe 20 are sandwiched therebetween. The cylindrical structure is formed on the upper portion thereof to form a cylindrical accommodation space in which the fan 50 is accommodated. The first heat dissipation tab group 42 has two joint faces 43 formed at one end thereof, one is engaged with the plane 32 of one heat conducting block 3〇, and the other is engaged with the plane 34 of the other heat conducting block 3〇, and the second heat sink fin group 44 is The two ends also form two joint faces 45, one is engaged with the plane 34 of the heat conducting block 30, and the other is engaged with the plane 32 of the other heat conducting block 3A. The sheets 420 are stacked one on another. The main body of the heat dissipating scale 420 has a substantially semi-annular shape, and the end edges of the annular ends have a width corresponding to the heat conducting block 30, and the end edges thereof are respectively bent with a folded edge 422. The folded edge 422 is provided with a buckle structure 426 for The heat dissipating slabs 420 adjacent to the superimposed ones are engaged with each other, and the hem 422 is combined to form the above-mentioned joint surface 43. The first heat-dissipating die set 44 is also formed by stacking a plurality of heat-dissipating Korean films 440. The main body of the heat dissipating fin 440 is also substantially semi-annular, and the end edges of the two ends are corresponding to the heat conducting block 30, and the end edges thereof are respectively bent in the same direction with a folded edge 442. The folded edge 442 is also provided with a buckle structure. The same snap structure (not shown) 426 is engaged with the heat dissipating fins 44 adjacent to the overlap, and the flanges 442 are combined to form the joint surface 45. The main body of the heat dissipating fin 420 is symmetrically formed with an arc-shaped inner concave portion and an outwardly extending two-horn-shaped convex rib on the outer edge of the two ends, and the main body of the heat radiating fin 9 1325105 440 is close to the outer edge of the two ends. The upper symmetrical outwardly extending tabs, the two heat sink fins 420 and 440 combine to form a bullish-like appearance, especially when a light-emitting diode (LED) is mounted on a component such as the fan 50. In addition, a layer of the heat dissipation fins 420 and 440 of the guide heat base 10 are respectively semi-circular sheets, and the two are butted to form a substantially circular sheet body, and the position of the heat-conducting block 30 is provided with a receiving groove and a joint. At the end, the heat dissipation fins 420 and 440 serve as the bottom of the cylindrical structure, so that the heat dissipation body 40 forms a cylindrical heat dissipation structure that is closed at the bottom and forms a plurality of airflow passages that open inward and outward around the accommodating space (the fan 50). The fan 50 is fixed in the accommodating space of the heat radiating body 40 by a fixing frame 52. The axial direction of the fan 50 is perpendicular to the extending direction of the airflow passage of the heat radiating body 40 (the overlapping direction of the heat radiating fins 420 and 440). The mounting bracket 52 includes a circle-shaped tray 520. The opposite ends of the tray 520 extend outwardly and then extend upwardly to extend two symmetric hooks 522. The upper end of the hook 522 extends outward to form a fixed end 524. A fixing hole 526 is provided thereon. The fixing position of the tray 520 is three. On the 520, the tray 520 is fixed to the heat conducting block 30 through its hook 522. The heat conducting block 30 is provided with a screw hole at a position corresponding to the fixed end 524 of the fixing frame 52. Referring to Fig. 4, the use state of the heat sink of the present invention will be described by taking a display card as an example. The heat sink is mounted on the display card 60 and is in contact with the electronic component (GPU) by the thermally conductive base 10. When the GPU is running, the heat generated by the GPU is absorbed by the heat-conducting base 10 and transmitted to the heat-absorbing section 22 of the heat pipe 20. The working medium of the heat pipe 20 1325105 rapidly conducts heat to the heat-conducting section 24 of the heat pipe 20 and the heat conduction thereof. The block 30 and the heat sink 40 are forcibly radiated by the fan 50. Wherein, since the heat of the condensation section 24 of the heat pipe 20 is absorbed by the heat conduction block 30 and transmitted to the heat dissipation body 40, the heat conduction block 30 is thicker than the heat dissipation fins 420 and 440 of the heat dissipation body 40, and the heat absorption amount thereof is large and uniform. The heat dissipation fins 420 and 440 are respectively transmitted to the heat dissipating fins 420 and 440. Therefore, the heat distribution of each part of the entire heat dissipating device is relatively uniform, which is advantageous for improving the heat dissipation efficiency. The fan 50 disposed in the middle of the heat dissipating body 40 forcibly blows the heat dissipating fins 420 and 440. Since the airflow passage between the heat dissipation fins 420 and 440 is shorter than the direction of the fan 50, the wind resistance is small, and the length of the airflow passage is uniform in all directions, so that the heat dissipation is more uniform. In addition, the airflow passes through the heat sink 40 and is blown to other components around the GPU to make the space around the display card relatively uniform. It can be understood that, in the above embodiment, the fan 50 is an axial flow fan, so that the bottom of the heat sink 40 is provided with circular heat dissipation fins 420 and 440 to be closed to guide the airflow side to the heat dissipation fins 420 and 440. Between the airflow channels. When a centrifugal fan is used, the airflow can directly blow the airflow passage between the fins, so that it is not necessary to provide the lowermost circular fins 420 and 440 in the above embodiment, so that part of the airflow can be directly circulated. It is beneficial to better heat dissipation to the heat-conducting base 10 and around the electronic components. In addition, in the above embodiment, the heat conducting block 30 is interposed between the heat dissipating fin sets 42 and 44, so that the heat conducting block 30 can absorb a large amount of heat of the condensation section 24 of the heat pipe 20 and transfer heat to the heat through a large area. The fins 420, 440, on the other hand, the heat-conducting block 30 is easy to control the tightness when it is joined to the heat pipe 20. However, the present invention can also directly connect the condensation section 24 of the heat pipe 20 to the two heat-dissipating fin sets 42 and 44 11 1325105 The central portions, that is, the joint faces 43 and 45 of the heat dissipation fin sets 42 and 44 respectively form semi-circular grooves, which are combined to form a receiving hole in which the heat pipe is sandwiched, and the heat pipe condensation section can be further extended. After being flattened and bonded to the two fins, the tightness of the heat pipe and the fins can be controlled. It is also understood that, in the above embodiment, the heat dissipating device includes two L-shaped heat pipes 20, so that two heat dissipating fin sets 42, 44 are butted into a cylindrical heat dissipating body 40, but the heat dissipating device of the present invention may also include three An L-shaped heat pipe is arranged radially on the heat-conducting base, and includes three heat-dissipating Korean film groups to form a circular or elliptical heat-dissipating body, and a cold tube of a heat pipe is sandwiched between each two heat-dissipating fin groups, Similarly, the heat dissipating device of the present invention can appropriately increase the number of heat pipes and heat-dissipating H-piece groups according to requirements; or the heat-dissipating device of the present invention can also include two heat pipes having a substantially U-shape, and the bottom portion (heat-absorbing portion) of the two heat pipes is disposed on the heat-conductive base The upper four segments (condensing segments) are distributed around the top of the heat-conducting base, and include four heat-dissipating Korean groups to form a circular or sugar-shaped heat sink. The "condensing section" of the heat pipe The heat sink of the present invention may also include a heat pipe of an L-shaped or U-shaped mixed shape. The heat distribution of the heat sink as set in the crucible tends to be more uniform and increases the heat transfer rate between the heat pipe and the fins. : The above description is in accordance with the requirements of the invention patent, and is proposed according to law. The second embodiment of the present invention is a preferred embodiment of the present invention, which is a mature embodiment of the invention. Bai Yinghan is within the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an exploded perspective view of a heat dissipating device of the present invention. 12 1325105 Figure 2 is a partial assembled view of Figure 1. Figure 3 is a perspective assembled view of Figure 2. 4 is a schematic view showing the state of use of a heat sink according to an embodiment of the present invention. [Main component symbol description] Thermal base 10 Fastening part 12 Base surface 14 Groove 16 ' 36 ί, 、, Port 20 First extension 22 Second extension 24 Thermal block 30 Plane 32, 34 Heat sink 40 A heat sink fin group 42 heat sink 420 > 440 flange 422 ' 442 snap structure 426 second heat sink fin set 44 joint surface 43, 45 fan 50 mount 52 tray 520 hook 522 fixed end 524 fixing hole 526 '528'540 Fixed foot 54 Display card 60 13