CN201267082Y - Thin heat radiator - Google Patents

Abstract

A thin heat sink comprises a heat pipe, a heat sink assembly, and two heat conducting bases; the heat pipe has one integral pipe body with two evaporating ends and one condensing section in the local part of the pipe body for the heat dissipating assembly to set on the condensing section and two heat conducting bases set on the evaporating ends; the utility model provides a slim heat abstractor makes radiator unit only need be connected with single heat pipe to reduce the required volume space that occupies of radiator unit.

Description

Thin heat sink

technical field

The utility model relates to a radiator, in particular to a thin heat dissipation device through heat exchange technology.

Background technique

It is a common technical means to help the radiator on the computer to dissipate heat through a heat pipe (Heat pipe). Especially in occasions such as notebook computers where the internal space is limited, the heat pipe takes up less space due to its characteristics of no movable components, heat transfer when the pipe body is stationary, and bendability.

As shown in FIG. 1 , it is a cooling device 1 a used in a notebook computer. The heat dissipation device 1a has two heat pipes 10a, and the condensation ends of the two heat pipes 10a are connected to a heat dissipation assembly 11a formed by stacking fins, and the evaporation ends of the two heat pipes 10a are respectively connected to a heat conduction base 12a. Through the above structure, the two heat-conducting bases 12a can be made to correspond to an electronic heating source, such as the south bridge and the north bridge, so that the heat generated by the two electronic heating sources is first conducted to the heat dissipation assembly 11a through the two heat pipes 10a respectively. , and then use the heat dissipation assembly 11a to dissipate heat.

However, since the two heat pipes 10a need to be thermally bonded to the heat sink assembly 11a, the heat sink assembly 11a must also provide two contact locations so that the two heat pipes 10a can be thermally bonded to the heat sink assembly 11a. However, as mentioned above, such a cooling device is often used in occasions where the internal space is limited, such as a notebook computer. If the cooling unit 11a has to occupy a large volume space, there may be problems such as being unsuitable for the application. The size of the fan that can be installed will also be affected due to the limited space.

Contents of the invention

The main purpose of this utility model is to provide a thin heat dissipation device, which uses a single heat pipe to provide two heat conduction bases to be connected in series, which means that the two ends of the heat pipe are used as the evaporation end, and an appropriate position is selected at the middle of the heat pipe to provide A heat dissipation component is provided as a condensing section; in this way, the heat dissipation component only needs to be connected with a single heat pipe to reduce the volume space it needs to occupy.

In order to achieve the above purpose, the utility model provides a thin heat dissipation device, which includes a heat pipe, a heat dissipation assembly, and two heat conduction bases; wherein, the body of the heat pipe is integrally formed, and has two The evaporating end and a condensing section located on a part of the tube body are used for the heat dissipation component to be arranged on the condensing section, and the two heat conduction bases are respectively arranged on the two evaporating ends; for this reason, a The thin heat dissipation device achieves the above-mentioned purpose.

The beneficial effect of the utility model is that the thin heat dissipation device only needs to connect the heat dissipation component with a single heat pipe, so as to reduce the volume space occupied by the heat dissipation component.

The utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the utility model.

Description of drawings

FIG. 1 is a schematic diagram of the appearance of a conventional heat dissipation device;

Fig. 2 is a three-dimensional exploded view of the first embodiment of the utility model;

Fig. 3 is a three-dimensional combined view of the first embodiment of the utility model;

Fig. 4 is a partial use state diagram of the first embodiment of the utility model;

Fig. 5 is a sectional view of section 5-5 of Fig. 4;

Fig. 6 is a sectional view of the second embodiment of the utility model;

Fig. 7 is a sectional view of the third embodiment of the utility model.

Among them, reference signs

current technology

Heat sink 1a

Heat pipe 10a radiating assembly 11a

Thermal base 12a

The utility model

Heat sink 1

Heat pipe 10 evaporator 100

Condensation section 101 Heat dissipation components 11

Fin 110 Notch 111

Notch 112 Perforation 113

Heat conduction base 12 groove groove 120

notebook computer 2

Air outlet 20

Electronic heating source 3

Detailed ways

In order for your review committee to further understand the features and technical content of the utility model, please refer to the following detailed description and drawings of the utility model. limit.

Please refer to FIG. 2 and FIG. 3 , which are respectively a three-dimensional exploded view and a three-dimensional assembled view of the first embodiment of the present invention. The utility model provides a thin heat dissipation device, the heat dissipation device 1 includes a heat pipe 10, a heat dissipation assembly 11, and two heat conduction bases 12; wherein:

The heat pipe (Heat pipe) 10 is a heat conduction component with a vacuum in the pipe body and has capillary tissue and working fluid. End 100, and a specific local position on the pipe body is used as a condensation section 101. In addition, the heat pipe 10 can be flat at least at the pipe body at the two evaporation ends 100 and the first condensation section 101, so as to make a large area of heat conduction contact with the aforementioned heat dissipation component 11 and heat conduction base 12 respectively; In all the embodiments of the present invention, all the tube bodies of the heat pipe 10 are flat. Of course, the tube body of the heat pipe 10 can also maintain its original circular tube shape.

The heat dissipation component 11 is thermally connected to the condensation section 101 of the heat pipe 10 so as to provide cooling for the condensation section 101 . In each embodiment of the utility model, the heat dissipation assembly 11 is a stacked heat sink formed by a plurality of fins 110 arranged laterally; and in this embodiment, each fin 110 can be placed on one of A notch 111 is recessed inward on the side edge, and the shape of the notch 111 is just in line with the flat surface shape of the heat pipe 10, so that after the fins 110 are stacked, the notch 111 forms the condensation section 101 for the heat pipe 10 The surface of the notch 112 for heat transfer is located on the upper half of the surface of the condensation section 101 .

The two heat conduction bases 12 are thermally connected to the two evaporation ends 100 of the above-mentioned heat pipe 10 respectively, and by the extension and bending of the heat pipe 10 body, the two heat conduction bases 12 can be used to respectively correspond to a desired heat dissipation. On the electronic heating source 3 (as shown in FIG. 4 ), the heat generated by the two electronic heating sources 3 is conducted simultaneously through the heat pipe 10 , and the heat dissipation component 2 is used to provide cooling. In each embodiment of the utility model, the two heat conduction bases 12 are all recessed with a groove 120 embedded in the evaporation end 100 of the heat supply pipe 10, so that the evaporation end 100 can be in contact with the heat conduction base. The seat 12 combines and increases the contact area between the two to facilitate heat conduction.

Therefore, the thin heat dissipation device of the present invention can be obtained by the above-mentioned structure.

Accordingly, as shown in FIG. 4 and FIG. 5, when the heat dissipation device 1 is applied to occasions where the height and space of the notebook computer 2 are limited, since it adopts a single heat pipe 10 to provide two heat conduction bases 12 Therefore, the heat dissipation assembly 11 only needs to be in heat transfer contact with the single condensation section 101 of the heat pipe 10, and will not have to correspond to the two heat pipes because of the two heat conduction bases 12, causing the heat dissipation assembly 11 to The increase in volume and space will affect the limitations of its applicable occasions, so as to avoid occupying the internal space of the notebook computer 2 . And, the heat dissipation assembly 11 is arranged at positions corresponding to the air outlet 20 of the notebook computer 2, and a centrifugal cooling fan 13 can be further installed to drive away the hot air flow to the heat dissipation assembly 11, so that The heat dissipation assembly 13 can transfer the heat from the heat pipe 10 from the evaporating end 100 to the condensation section 101 , and the heat is forced out through the air outlet 20 through the heat dissipation fan 13 .

Furthermore, since the heat dissipation assembly 11 only needs a single condensation section 101 of the heat pipe 10 for heat transfer contact, the joint structure between the heat pipe 10 and the heat dissipation assembly 11 is relatively simple. As shown in Figure 6, another heat dissipation assembly 11 is further added to the condensation section 101 of the heat pipe 10, so as to be arranged on the lower half of the surface of the condensation section 101, so that the two heat dissipation assemblies 11 can condense the heat pipe 10 through the gap 112. Segment 101 is sandwiched up and down; in addition, as shown in Figure 7, the cooling assembly 11 can also be directly provided with a perforation 113 on each of its fins 110, so as to pass through the perforation 113 of each fin 110 and pass through the On the condensation section 101 of the heat pipe 10 .

Therefore, by the thin heat dissipation device of the present invention, since the two heat conduction bases 12 are connected in series through the single heat pipe 10, the heat dissipation assembly 12 only needs to be connected with the single heat pipe 10, so as to reduce the required volume of the heat dissipation assembly 12. space.

Of course, the utility model can also have other various embodiments, and those skilled in the art can make various corresponding changes and deformations according to the utility model without departing from the spirit and essence of the utility model, but These corresponding changes and deformations should all belong to the protection scope of the appended claims of the present utility model.

Claims (10)

1, a kind of thin heat radiation device is characterized in that, comprising:

One heat pipe, its pipe shaft is one-body molded, and has two evaporation ends that lay respectively at its two ends place and be positioned at the condensation segment that its pipe shaft one part is located;

One radiating subassembly is located on the condensation segment of this heat pipe; And

Two heat conducting bases are located at respectively on two evaporation ends of this heat pipe.

2, thin heat radiation device according to claim 1 is characterized in that, the pipe shaft of this heat pipe all is flat in described two evaporation ends and described condensation segment place.

3, thin heat radiation device according to claim 2 is characterized in that, the pipe shaft of this heat pipe all is flat in remainder.

4, thin heat radiation device according to claim 1 is characterized in that, this radiating subassembly is one with the transversely arranged stacking-type radiator that forms of a plurality of fins.

5, thin heat radiation device according to claim 4 is characterized in that, respectively this fin is provided with a perforation, and the condensation segment of this heat pipe wears this perforation and this radiating subassembly is located on the described condensation segment.

6, thin heat radiation device according to claim 4, it is characterized in that, respectively this fin inwardly concaves a breach on the one lateral margin, the shape of this breach conforms to the surface configuration of the pipe shaft of this heat pipe, these breach form a notch part, and this notch part contacts with the condensation segment surface work heat biography of this heat pipe.

7, thin heat radiation device according to claim 6 is characterized in that, this radiating subassembly is positioned at the first half on described condensation segment surface.

8, thin heat radiation device according to claim 7 is characterized in that, also further comprises another radiating subassembly, and this radiating subassembly is positioned at the Lower Half on described condensation segment surface.

9, thin heat radiation device according to claim 1 is characterized in that, all is concaved with a groove on this two heat conducting base, and two evaporation ends of this heat pipe are imbedded the groove of this two heat conducting base respectively.

10, thin heat radiation device according to claim 1 is characterized in that, also comprises a radiator fan, and this radiating subassembly is provided with relatively.

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